Austin AS28F128J3MPBG-15/ET Plastic encapsulated microcircuit 128mb, x8 and x16 q-flash memory even sectored, single bit per cell architecture Datasheet

PEM
AS28F128J3M
Q-Flash
Austin Semiconductor, Inc.
PIN ASSIGNMENT
Plastic Encapsulated Microcircuit
128Mb, x8 and x16 Q-FLASH Memory
Even Sectored, Single Bit per Cell Architecture
B
•
•
•
•
•
•
C
•
•
•
•
•
100% Pin and Function compatible to Intel’s MLC Family
NOR Cell Architecture
2.7V to 3.6V VCC
2.7V to 3.6V or 5V VPEN (Programming Voltage)
Asynchronous Page Mode Reads
Manufacturer’s ID Code:
! MT28F128J3MRG
Micron
0x2Ch
Industry Standard Pin-Out
Fully compatible TTL Input and Outputs
Common Flash Interface [CFI]
Scalable Command Set
Automatic WRITE and ERASE Algorithms
5.6us per Byte effective programming time
128 bit protection register
! 64-bit unique device identifier
! 64-bit user programmable OTP cells
Enhanced data protection feature with use of VPEN=VSS
Security OTP block feature
100,000 ERASE cycles per BLOCK
Automatic Suspend Options:
! Block ERASE SUSPEND-to-READ
! Block ERASE SUSPEND-to-PROGRAM
! PROGRAM SUSPEND-to-READ
Available Operating Ranges:
[-ET] -40oC to +105oC
! Enhanced
! Mil-Temperature [-XT] -55oC to +125oC
3
4
5
6
7
8
A1
A6
A8
VPEN
A13
VCC
A18
A22
A2
VSS
A9
CE0
A14
A25
A19
CE1
A3
A7
A10
A12
A15
DNU
A20
A21
A4
A5
A11
RP\
DNU
DNU
A16
A17
DQ8
DQ1
DQ9
DQ3
DQ4
DNU
DQ15
STS
BYTE\
DQ0
DQ10
DQ11 DQ12
DNU
DNU
OE\
A23
A0
DQ2
VCCQ
DQ5
DQ6
DQ14
WE\
CE2
DNU
VCC
VSS
DQ13
VSS
DQ7
A24
D
E
F
G
H
64-Ball FBGA
For in-depth functional product detail and Timing Diagrams,
please reference Micron’s full product Datasheet:
MT28F640J3
2
A
Features
•
•
•
•
•
•
•
1
Rev. L Dated 04/16/04
A22
1
56
CE1
A21
A20
A19
2
55
NC
WE\
3
54
OE\
4
53
STS
5
52
A18
A17
6
51
7
50
DQ15
DQ7
DQ14
A16
VCC
8
49
9
48
A15
A14
10
47
11
46
A13
12
45
A12
CE0
13
44
DQ5
DQ12
DQ4
14
43
VCCQ
VPEN
15
42
VSS
RP\
A11
A10
16
41
17
40
18
39
A9
19
38
DQ11
DQ3
DQ10
DQ2
A8
VSS
20
37
VCC
21
36
DQ9
A7
22
35
DQ1
A6
A5
23
34
24
33
DQ8
DQ0
A4
25
32
A0
A3
A2
26
31
27
30
A1
28
29
BYTE\
A23
CE2
DQ6
VSS
DQ13
General Description
This device features in-system block locking. They also have a
Common FLASH Interface [CFI] that permits software algorithms
to be used for entire families of devices. The software is deviceindependent, JEDEC ID-independent with forward and backward
compatibility.
ASI’s, AS28F128J3M Enhanced or Mil-Temp variant of Micron’s
Q-Flash family of devices, is a nonvolatile, electrically blockerasable (FLASH), programmable memory device manufactured
using Micron’s 0.15um process technology.
This device
containing 134,217,728 bits organized as either 16,777,218 (x8)
or 8,388,608 bytes (x16). The device is uniformly sectored with
one hundred and twenty eight 128KB ERASE blocks.
AS28F128J3MRG
Revision 5.0 11/23/04
Austin Semiconductor, Inc. reserves the right to change products or modify product specifications with appropriate notification
For Additional Products and Information visit out Web site at www.austinsemiconductor.com
1
PEM
AS28F128J3M
Q-Flash
Austin Semiconductor, Inc.
Functional Block Diagram:
Input
Buffer
I/O
CNTL
Logic
128KB Memory Block (0)
128KB Memory Block (1)
128KB Memory Block (2)
128KB Memory Block (3)
ADDR
Buffer/
Latch
Power
(Current)
Control
X
Decode
Bus
Configuration
Register [BCR]
ADDR.
Counter
WRITE
Buffer
Block
Erase
Control
CEx
OE\
WE\
RP\
Command
Execution
Logic
[CEL]
128KB Memory Block (n)
ISM
DQ0-8 or
DQ0-15
WP\
Y
Dec.
CLK
Y - Select
Control
STS
VPEN
WAIT
Sense Amplifiers
WRITE/ERASE Bit
Compare and
Verify
VPP
Switch
Pump
Status
Register
Identification
Register
Query
Output
Buffer
Additionally, the Scaleable Command Set [SCS] allows a single,
simple software driver in all host systems to work with all SCS
compliant FLASH memory devices. The SCS provides the fastest
system/device data transfer rates and minimizes the device and
system-level implementation costs.
VPEN serves as an input with 2.7V, 3.3V or 5V levels for
application programming. VPEN in this Q-Flash device can
provide data protection when connected to ground. This pin also
enables PROGRAM or ERASE LOCKOUT functions/controls
during power transitions.
To optimize the processor-memory interface, the device
accommodates VPEN, which is switchable during BLOCK
ERASE, PROGRAM, or LOCK BIT configurations and in
addition can be hard-wired to VCC all dependent on the end
application(s). VPEN is treated as an input pin to enable
ERASING, PROGRAMMING, and BLOCK LOCKING. When
VPEN is lower than the VCC lockout voltage (VLKO), all
program functions are disabled. BLOCK ERASE SUSPEND
mode enables the user to stop BLOCK ERASE to READ data
from or PROGRAM data to any other blocks. Similarly,
PROGRAM SUSPEND mode enables the user to SUSPEND
PROGRAMMING to READ data or execute code from any unsuspended block(s).
AS28F128J3MRG
Revision 5.0 11/23/04
This device is an even-sectored device architecture offering
individual BLOCK LOCKING that can LOCK and UN-LOCK a
block using the SECTOR LOCK BITS command sequence.
Status [STS] is a logic signal output that gives an additional
indicator of the internal state machine [ISM] activity by providing
a hardware signal of both the status and status masking. This
status indicator minimizes central processing unit overhead and
system power consumption. In the default mode, STS acts as an
RY/BY\ pin. When LOW, STS indicates that the ISM is
performing a BLOCK ERASE, PROGRAM, or LOCK BIT
configuration. When HIGH, STS indicates that the ISM is ready
for a new command.
Austin Semiconductor, Inc. reserves the right to change products or modify product specifications with appropriate notification
For Additional Products and Information visit out Web site at www.austinsemiconductor.com
2
PEM
AS28F128J3M
Q-Flash
Austin Semiconductor, Inc.
Three Chip Enable (CEx) pins are used for enabling and disabling
the device by activating the device’s control logic, input buffer,
decoders, and sense amplifiers.
Chip Enable Truth Table
CE2
VIL
VIL
VIL
VIL
VIH
VIH
VIH
VIH
BYTE\ enables the device to be used in x8 or x16 configuration.
Byte=Low (logic 0) selects and 8-bit mode with address zero (A0)
selecting the High or Low Byte and Byte=High (logic 1) selects
the 16-bit or Word mode. When the device is in Word mode,
address one (A1) becomes the low order address bit and address
zero (A0) becomes a no-connect (NC).
RP\ is used to reset the device. When the device is disabled and
RP\ is at VCC, the STANDBY mode is enabled. A reset time
(tRWH) is required after RP\ switches to a High (logic 1) and the
outputs become valid. Likewise, the device has a wake time (tRS)
from RP\ High until WRITES to the Command User Interface
[CUI] are recognized, RESETS the ISM and clears the status
register.
Symbol
Cin
Cbyte
Cout
Typ
5
14
5
Max
8
16
12
Units
pF
pF
pF
Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions greater than those
indicated in the operational sections of this specification is not implied. Exposure
to absolute maximum conditions for any duration or segment of time may affect
device reliability.
Chip Enables
Write Enable
Reset/Power-Down
Output Enable
Symbol
Type
A0, A1, A2. A3,
Input
A4, A5, A6, A7
A8, A9, A10, A11
A12,A13,A14,A15
A16,A17,A18,A19
A20,A21,A22,A23
CE0, CE1, CE2
Input
Input
WE\
Input
RP\
Pin
32,28,27,26,
25,24,23,22,
20,19,18,17,
13,12,11,10,
8,7,6,5,
4,3,1,30
14,2,29
55
16
OE\
Input
54
Byte Mode Control
BYTE\
Input
31
Programming Voltage
VPEN
Input
15
STS
Output
53
VCCQ
Supply
43
VCC
GND
NC
Supply
Supply
-
9, 37
21, 42, 48
1, 30, 56
Status Pin/Flag
Input/Output Voltage
Supply Voltage
Digital Ground
No Connect(s)
AS28F128J3MRG
Revision 5.0 11/23/04
Device
Enabled
Disabled
Disabled
Disabled
Enabled
Enabled
Enabled
Disabled
Min
-55
Max
125
-65
-2
125
5
100
Units
0
Notes
C
0
C
V
mA
1
Notes
1: All specified voltages are with respect to GND. Minimum DC
voltage is -0.5v on input/output pins and -0.2v on Vcc and VPEN
pins. During transitions, this level may undershoot to -2.0v for
periods </= 20ns. Maximum DC voltage on input/output pins,
Vcc and VPEN is VCC+0.5V which, during transitions, may
overshoot to Vcc + 2.0v for periods <20ns.
Pin Description Table:
Signal Name
Address
CE0
VIL
VIH
VIL
VIH
VIL
VIH
VIL
VIH
Absolute Maximum Ratings
Voltage
Temperature under
Bias
Storage Temperature
For VCCQ=2.7v to 3.6v
Voltage on any pin
Short Circuit Current
Capacitance
Parameter/Condition
Input Capacitance
Output Capacitance
CE1
VIL
VIL
VIH
VIH
VIL
VIL
VIH
VIH
Description
Address Inputs during READ and WRITE Operations. A0 is only
used in x8 mode and will be a NC in x16 mode.
Three Chip Enable pins for Multiple devices. See chart for function
Write Control
Reset/Power-Down, When Low the control pin resets the status Reg.
and ISM to array READ mode.
Ouput Enable control enable data output buffers when Low, and when
High the output buffers are disabled
Configuration Control pin. When High the device is in x16 mode, when
Low the device is in Byte mode (x8)
Necessary Voltage pin for Programming, Erasing or configuring lock
bits. Typically connected to VCC. When VPEN</=VPENLK, this
enables Hardware Write Protect.
Indicates the status of the ISM. When configured in level mode, STS
acts as a RY/BY\ pin. When configured in its pulse mode, it can
pulse to indicate PROGRAM and or ERASE completion.
Separate/Isolated Voltage supply for Input/Output bus. Allows
voltage matching to different interface standards.
Power Supply: 2.7V - 3.6V
Ground
No electrical connection or function
Austin Semiconductor, Inc. reserves the right to change products or modify product specifications with appropriate notification
For Additional Products and Information visit out Web site at www.austinsemiconductor.com
3
PEM
AS28F128J3M
Q-Flash
Austin Semiconductor, Inc.
Bus Operations:
MODE
Read Array
Output Disable
Standby
Reset/Power-Down
Read Identifier Codes
Read Query
Read Status (ISM off)
Read Status (ISN on)
Write
RP\
VIH
VIH
VIH
VIL
VIH
VIH
VIH
VIH
VIH
CE0
Enabled
Enabled
Disabled
X
Enabled
Enabled
Enabled
Enabled
Enabled
CE1
Enabled
Enabled
Disabled
X
Enabled
Enabled
Enabled
Enabled
Enabled
CE2
Enabled
Enabled
Disabled
X
Enabled
Enabled
Enabled
Enabled
Enabled
OE\
VIL
VIH
X
X
VIL
VIL
VIL
VIL
VIH
WE\
VIH
VIH
X
X
VIH
VIH
VIH
VIH
VIL
VPEN
X
X
X
X
X
X
X .
X
VPENH
DQ
Dout
High-Z
High-Z
High-Z
NOTES ADDRESS
1,2,3
4
5
Dout
Din
3,6,7
X
X
X
X
See Figure 7 of Micron DS
See Figure 7 of Micron DS
X
X
X
STS Default Mode
High-Z (VOH with External PU)
X
X
High-Z (VOH with External PU)
High-Z (VOH with External PU)
High-Z (VOH with External PU)
X
X
X
Notes
1
2
3
4
5
6
7
Refer to DC Characteristics. When VPEN</= VPENLK, memory contents can be read but not altered
X can be VIL or VIH for control and address pins, and VPENLK or VPENH for VPEN. See DC Characteristics for VPENLK and VPENH voltages
In default mode, STA is VOL when the ISM is executing internal Block Erase, Program, or lock bit configuration algorithms. It is VOH when the ISM
is not busy, in block erase suspend mode, program suspend mode, or reset/power-down mode.
See Read Identifier codes of the Micron Datasheet (DS)
See Read Query Mode Command section of the Micron Datasheet (DS)
Command Writes involving block erase, program, or lock bit configuration are reliably executed when VPEN=VPENH and VCC is within Specification
Refer to Table 4 on page 15 of the Micron Datasheet (DS)
DC Electrical Characteristics:
(VDD=3.0v-5%/+10%,TA=Min/Max temperatures of Operational
Range chosen)
Symbol
Vcc
VccQ
ILI
ILO
VIL
VIH
Parameter
Supply Voltage
Isolated Input/Output Supply
Input Load Current
Output Leakage Current
Input Low Voltage
Input High Voltage
VOL
Output Low Voltage
VOH
Output High Voltage
VPENLK
VPENH
VLKO
ICC1
Program Voltage Lockout
Program Voltage
Vcc Lockout Voltage
Standby Current
Test Conditions
Power-Down Current
Page Mode READ Current
ICC4
ICC5
ICC6
ICC7
3
10
mA
8
15
mA
9
50
mA
17
17
17
17
60
70
70
80
-0.5
2
VccQ=VccQ (MIN), IOL = 2mA
VccQ=VccQ (MIN), IOL = 100uA
Max
3.6
3.6
+/- 1.0
+/-10.0
0.8
VCCQ+0.5
0.4
0.2
0.85xVCCQ
VCCQ-0.2
VccQ=VccQ (MIN), IOH = 2.5mA
VccQ=VccQ (MIN), IOH = 100uA
0.8
3.6
CMOS Inputs; VCC= VCC (MAX), Device Enabled, RP\=VCCQ+/-0.2v
RP\=GND,+/-0.2V; IOUT (STS)=0mA
page mode READS; Device is enabled; f=5MHz; IOUT=0mA
CMOS Inputs; Vcc=Vcc(MAX); VCCQ=VCCQ(MAX) using standard 4-word
page mode READS; Device is enabled; Ff=33MHz; IOUT=0mA
Asynchronous READ Mode
Current
PROGRAM or set LOCK BITS
Current
BLOCL ERASE or CLEAR
BLOCK LOCK bits Current
PROGRAM SUSPEND or
BLOCK ERASE SUSPEND
Current
220
2000
120
Vin=VccQ or GND, VCC=VCC Max., VCCQ = VCCQ Max
CMOS Inputs; VCC=VCC(MAX); VCCQ=VCCQ(MAX) using standard 4-word
ICC3
2.2
50
90
50
Units
V
V
uA
uA
V
V
V
V
V
V
V
V
V
uA
uA
uA
Vin=VccQ or GND, VCC=VCC Max., VCCQ = VCCQ Max
TTL Inputs; VCC=VCC (MAX): Device Enabled, RP\=VIH
ICC2
Min
2.7
2.7
CMOS Inputs; VCC=VCC(MAX); VCCQ=VCCQ(MAX) using standard work/byte
single READS; Device Enabled; f=5MHz; IOUT=0mA
CMOS Inputs, VPEN=VCC
TTL Inputs, VPEN=VCC
CMOS Inputs, VPEN=VCC
TTL Inputs, VPEN=VCC
10
Device is Disabled
Notes
1
1
1,2
1
3,4,5
4,5,6
1
mA
mA
mA
Notes
[1]
[2]
[3]
[4]
[5]
[6]
AS28F128J3MRG
Revision 5.0 11/23/04
Sampled, not 100% tested
Includes STS
ICCWS and ICCES are specified with the device deselected. If the device is read or written while in ERASE SUSPEND mode,
the device's curent draw is ICCR or ICCW
BLOCK ERASE, PROGRAMMING, and LOCK BIT configurations are inhibited when VPEN</= VPENLK, and they are not
guaranteed in the range betwwn VPENLK (MAX) and VPENH (MIN), or above VPENH (Max)
Typically, VPEN is connected to VCC
VPENH (MIN) = 2.7v
Austin Semiconductor, Inc. reserves the right to change products or modify product specifications with appropriate notification
For Additional Products and Information visit out Web site at www.austinsemiconductor.com
4
PEM
AS28F128J3M
Q-Flash
Austin Semiconductor, Inc.
Memory Command Set Operations:
Command
READ ARRAY
READ IDENTIFIER CODES
READ QUERY
READ STATUS REGISTER
CLEAR STATUS REGISTER
WRITE TO BUFFER
WORD/BYTE PROGRAM
BLOCK ERASE
BLOCK ERASE/PROGRAM
SUSPEND
BLOCK ERASE/PROGRAM
RESUME
CONFIGURATION
SET BLOCK LOCK BITS
CLEAR BLOCK LOCK BITS
PROTECTION PROGRAM
Key:
[IA]
[ID]
[BA]
[QA]
[PA]
[QD]
[SRD]
Notes
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
AS28F128J3MRG
Revision 5.0 11/23/04
Scalable or Basic Command
Set [SCS or BCS]
SCS / BCS
SCS / BCS
SCS
SCS / BCS
First Bus Cycle
Bus Cycles Operation
Address
1
WRITE
X
>/= 2
WRITE
X
Data
FFh
90h
Second Bus Cycle
Operation
Address
Data
Notes
READ
IA
ID
1
X
X
98h
70h
READ
READ
QA
X
QD
SRD
2
X
BA
X
BA
X
50h
E8h
40h or 10h
20h
B0h
WRITE
WRITE
WRITE
BA
PA
BA
N
PD
D0h
SCS / BCS
SCS / BCS
SCS / BCS
SCS / BCS
SCS / BCS
2
1
>2
2
2
1
WRITE
WRITE
WRITE
WRITE
WRITE
WRITE
WRITE
SCS / BCS
1
WRITE
X
D0h
SCS
SCS
SCS
2
2
2
2
WRITE
WRITE
WRITE
WRITE
X
X
X
X
B8h
60h
60h
C0h
3, 4, 5
6, 7
5, 6
7, 8
7
WRITE
WRITE
WRITE
WRITE
X
BA
X
PA
CC
01h
D0h
PD
Identifier Code address
Data read from identifier Code
Address within a Block
Query data base Address
Address of Memory location to be programmed
Data read from Query data base
Data read from Status Register
Following the READ IDENTIFIER CODES command, READ operations access manufacturer, device, and block lock codes.
If the ISM is running, only DQ7 is valid; DQ15-DQ8 and DQ6-DQ0 are placed in High-Z
After the WRITE-to-BUFFER command is issued, check the XSR to make sure a buffer is available for WRITING
The number of Bytes/words to be written to the write buffer = n+1, where n=byte/word count argument. Count ranges on this device
for byte mode are n=00H to n=1Fh and for word mode, n=0000h to 000Fh. The third and consecutive bus cycles, as determined by n,
are for writing data into the write buffer. The CONFIRM command (D0h) is expected after exactly n+1 WRITE cycles; any other
command at that point in the sequence aborts the WRITE-to-BUFFER operation.
The WRITE-to-BUFFER or ERASE operation does not begin until a CONFIRM command (D0h) is issued
Attempts to issue a BLOCK ERASE or PROGRAM to a locked block will fail
Etiher 40h or 10h is recognized by the ISM as the byte/word program setup
PROGRAM SUSPEND can be issued after either the WRITE-to-BUFFER or WORD/BYTE PROGRAM operation is inititated.
The CLEAR BLOCK LOCK BITS operation simultaneously clears all block lock bits.
Austin Semiconductor, Inc. reserves the right to change products or modify product specifications with appropriate notification
For Additional Products and Information visit out Web site at www.austinsemiconductor.com
5
PEM
AS28F128J3M
Q-Flash
Austin Semiconductor, Inc.
AC Switching Characteristics:
(VDD=3.0V –5%/+10%, TA= Min. / Max. temperatures of
Operational Range chosen)
Symbol
128Mb
Parameter
Write Operations
RP\ High Recovery to WE\ (CEx) going Low
CEx (WE\) Low to WE\ (CEx) going High
Write Pulse Width
Data Setup to WE\ going High
Address Setup to WE\ going High
CEx Hold from WE\ High
Data Hold from WE\ High
Address Hold from WE\ High
Write Pulse Width High
VPEN Setup to WE\ going High
Write Recovery before READ
WE\ High to STA going Low
VPEN Hold from valid SRD, STS going High
WE\ High to Status Registry Busy
tRS
tCS
tWP
tDS
tAS
tCH
tDH
tAH
tWPH
tVPS
tWR
tSTS
tVPH
tWB
Block Erase, Program and Lock Bit Performance
Write Buffer Byte Program time (Program time 32 Bytes/ 16 Words)
Byte/Word Program time
Block Program time
Block Erase time
Set Lock Bits time
Clear Block Lock Bits time
Program Suspend Latency time to Read
Erase Suspend Latency time to Read
tWED1
tWED2
tWED3
tWED4
tWED5
tWED6
tLPS
tLES
Read Only Operations
Read Cycle time
Address to Output Delay
CEx to Output Delay
OE\ to Non-Array Output Delay
OE\ to Array Output Delay
RP\ High to Output Delay
CEx to Output in Low-Z
OE\ to Output in Low-Z
Cex High to Output in High-Z
OE\ High to Output in High-Z
Output Hold from Address, Cex, or OE\ change,
whichever occurs first
CEx Low to BYTE\ High or Low
BYTE\ to Output Delay
BYTE\ to Output in High-Z
CEx High to CEx Low
Page Address Access
tRC
tAA
tACE
tAOE
tAOA
tRWH
tOEC
tOEO
tODC
tODO
tOH
tCB
tABY
tODB
tCWH
tAPA
Reset Specifications
RP\ Pulse Low time
RP\ High to RESET during BLOCK ERASE, PROGRAM, or
Lock Bit configuration
tPLPH
tPHRH
Min
1.0
0
70.0
50.0
55.0
0
0
0
30
0
35
200
0
200
Typ
180
11.20
0.70
0.75
10.00
0.50
25
25
Max
654
630
1.70
5
75
0.70
30
35
Min
115
Max
115
115
50
25
210
0
0
35
15
0
10
1,000
1,000
0.0
25
Min
35
Units
Notes
us
ns
ns
ns
us
ns
1
Max
ns
ns
ns
ns
ns
ns
ns
1
1
1
us
us
sec
sec
us
sec
us
us
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
1
1
1
1
1
1
1
1
1
Max
100
us
ns
Notes to Switching Specifications:
1.
AS28F128J3MRG
Revision 5.0 11/23/04
Sampled, not 100% tested
Austin Semiconductor, Inc. reserves the right to change products or modify product specifications with appropriate notification
For Additional Products and Information visit out Web site at www.austinsemiconductor.com
6
PEM
AS28F128J3M
Q-Flash
Austin Semiconductor, Inc.
Mechanical Diagram
TSOP, Type I, 56 Pin
(Dimensions in mm)
20.00 +/- 0.25
18.40 +/- 0.08
14.00 +/- 0.08
0.50 TYP.
0.20 +/- 0.05
0.25
0.15 +0.03, -0.02
0.10
1.20 MAX.
SEE DETAIL A
0.25 Gage Plane
0.10 + 0.10, -0.05
DETAIL A
0.50 +/- 0.10
0.80 TYP.
AS28F128J3MRG
Revision 5.0 11/23/04
Austin Semiconductor, Inc. reserves the right to change products or modify product specifications with appropriate notification
For Additional Products and Information visit out Web site at www.austinsemiconductor.com
7
PEM
AS28F128J3M
Q-Flash
Austin Semiconductor, Inc.
Mechanical Diagram
PBGA, 10mm x 13mm, 64 Ball w/1.00mm Pitch
(Dimensions in mm)
0.85 +/-0.075
C
0.10 C
Ball A1
Ball A1 ID
7.00
Seating Plane
Alt. Ball A1 ID
Ball A1 Corner ID
(Bottom View)
1.00 Typ.
3.50 +/-0.05
XT
6.50 +/-0.05
OEU86
13.00 +/-0.10
AS28F128J3MPBG-15
LOT CODE
DATE CODE
7.00
1.20 Max.
10.00 +/-0.10
Solder Ball Material: 62% Sn., 36% Pb., 2% Ag.
x64 @ 0.45 diameter, post reflow
ASI Ordering Information
ASI Part Number
Configuration
0
Speed
(ns)
Pkg.
Comments
0
Enhanced Operating Range (-40 C to +105 C)
AS28F128J3MRG-15/ET
128Mb, x8/x16 Q-Flash
115
TSOP1-56
AS28F128J3MPBG-15/ET
128Mb, x8/x16 Q-Flash
115
FBGA-64
Consult Factory, MOQ's
Apply
Extended Operating Range (-550C to +1250C)
AS28F128J3MRG-15/XT
128Mb, x8/x16 Q-Flash
115
TSOP1-56
AS28F128J3MPBG-15/XT
128Mb, x8/x16 Q-Flash
115
FBGA-64
AS28F128J3MRG
Revision 5.0 11/23/04
Consult Factory, MOQ's
Apply
Austin Semiconductor, Inc. reserves the right to change products or modify product specifications with appropriate notification
For Additional Products and Information visit out Web site at www.austinsemiconductor.com
8
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