Common mode filter (RoHS Compliant) CMT03 SERIES 1. PART NO. EXPRESSION : C M T 0 3 - 9 0 0 - R A - 〖〖 (b) (a) (c) (d) (e) (f) (a) Series code (d) R : Reel (b) Dimension code (e) Current code (c) Impedance code : 900 = 90Ω (f) 10 : RoHS Compliant 11~99 : Internal controlled number 2. CONFIGURATION & DIMENSIONS : G C 4 2 3 F B D2 1 E A P H D1 A B Unit:m/m C 0.85±0.05 0.65±0.05 0.4±0.05 P D1 0.50±0.1 0.27±0.1 D2 +0.05 0.2 -0.1 E F G 0.25~0.35 0.25~0.35 0.25~0.35 H 0.5 3. SCHEMATIC : 1 2 4 3 4. GENERAL SPECIFICATION : a) Storage Temp. : -40°C to +85°C b) Operating Temp. : -40°C to +85°C (Including self-generated heat) NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.03.2014 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 Common mode filter (RoHS Compliant) CMT03 SERIES 5. ELECTRICAL CHARACTERISTICS : Impedance (Ω) Test Frequency ( MHz ) Rated Voltage (Vdc) Max. Insulation Resistance ( MΩ ) Min. DC Resistance (Ω) Max. Rated Current (mA) Max. CMT03-120-RA-□ □ 12±5Ω 100 5 100 2.5 130 CMT03-330-RA-□ □ 33±20% 100 5 100 2.5 100 CMT03-470-RA-□ □ 47±20% 100 5 100 5.0 100 CMT03-900-RA-□ □ 90±20% Part Number 100 5 100 6.5 100 NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.03.2014 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 Common mode filter (RoHS Compliant) CMT03 SERIES 6. CHARACTERISTICS CURVES : CMT03-120-RA MCF0806NF2-120T01 1000 100 Common Mode Differential Mode 10 1 1 10 100 1000 1000 1 10 IMPEDANCE(Ohm) 1000 Common Mode Dif ferential Mode 10 1 10 100 1000 10000 CMT03-900-RA MCF0806NF2-900T01 10000 100 100 FREQUENCY(MHz) CMT03-470-RA MCF0806NF2-470T01 10000 IMPEDANCE(Ohm) Differential Mode 10 1 10000 Common Mode 100 FREQUENCY(MHz) 1 CMT03-330-RA MCF0806NF2-330T01 10000 IMPEDANCE(Ohm) IMPEDANCE(Ohm) 10000 1000 10000 1000 Common Mode 100 Differential Mode 10 1 1 FREQUENCY(MHz) 10 100 1000 10000 FREQUENCY(MHz) NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.03.2014 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 Common mode filter (RoHS Compliant) CMT03 SERIES 7. RELIABILITY AND TEST CONDITION ITEM PERFORMANCE TEST CONDITION Electrical Characteristics Test Impedance (Z) Within the specified tolerance Measuring equipment:4291A or its equivalent Measuring jig: 16192A（or its equivalent） Insulation Resistance Measuring points: (1) to (3) or (2) to (4) Measuring voltage: Rated voltage DC Resistance Measuring points: (1) to (2) or (3) to (4) Rated Current Measuring Current: DC Current Rated Current < 1A ΔT 20℃Max Reliability Test Vibration Per table 1. Table 1 Appearance No remarkable Defect Commom Impedance change rate Within±15% Insulation resistance 100MΩ min Test sample shall be soldered to test board and the test shall be conducted under the conditions shown in Table 2. Table 2 Vibraiton frequency range 10Hz to 55Hz Overall amplitude 1 cycle 1.52mm 15min.(10→55→10Hz) X 3 hours each Y Z Time Test Cycles：12 Solderability More than 95% of terminal electrode shall be covered with fresh solder. Test sample shall be immersed into molten solder under the conditions shown in Table 3 after immersed into flux. After this, test samples shall be taken out and visually checked. The speed for immersion and taking out shall be 25 mm/s. Table 3 Resistance to Soldering Heat Per table 1. Solder temperature 245°C±3°C Immersion time 4s±1s Test sample shall be immersed into molten solder after immersed into flux and preheated under the conditions shown in Table 4. After this, test samples shall be taken out and measured after kept at room temperature for 2 to 3 hours.(Note 1) The speed for immersion and taking out shall be 25mm/s. Table 4 Preheating Resistance to Soldering Heat Immersion time 150°C, 3min. 260°C±5°C 10s±0.5s NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.03.2014 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 Common mode filter (RoHS Compliant) CMT03 SERIES 7. RELIABILITY AND TEST CONDITION ITEM PERFORMANCE TEST CONDITION Reliability Test Thermal Shock Per table 1. Steps 1 to 4 shown in Table 5 as one cycle shall be repeated 5 times. After the test, keep the test sample at a normal temperature with a normal humidity for 2 to 2 hours them measurement shall be conducted.(Note 1) Table 5 Step Temperature (°C) Times (min.) 1 -40±2 30±3 2 Normal temp 4~5 3 +85±2 30±3 4 Normal temp 4~5 Resistance to Humidity Per table 1. Test board shall be kept in a thermo hygrostat at temperature of 40°C±2°C and relative humidity of 90% to 95% for 500+24/-0 hours. After the test, keep the test sample at a normal temperature with a normal humidity for 2 to 3 hours then measurement shall be conducted.(Note 1) High Temperature Load Life Test Per table 1. Test board shall be kept in a thermostatic oven with temperature of 85°C±2°C for 500+24/-0 hours while supplying (1) to (2) and (3) - (4) with rated current. supplying (1) to (3) and (2) - (4) with rated Voltage After the test, keep the test sample at a normal temperature with a normal humidity for 2 to 3 hours, them measurement shall be conducted.(Note 1) High Temperature Life Test Per table 1. Test board shall be kept in an atmosphere with temperature of 85°C±2°C for 500+24/-0 hours. After the test, keep the test sample at a normal temperature with a normal humidity for 2 to 3 hours, then measurement shall be conducted.(Note 1) Bending Strength Appearance: No mechanical damage. Warp : 1mm(03) Testing board : Glass epoxy-resin substrate Thickness : 1.6mm NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.03.2014 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 Common mode filter (RoHS Compliant) CMT03 SERIES 8. SOLDERIND AND MOUNTING : 8-1. Recommended PC Board Pattern PC board should be designed so that products can prevent damage from mechanical stress when warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 0.25~0.35 0.25~0.35 0.25~0.35 0.5 8-2. Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If Use Wave soldering is there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be unwitting risk 8-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 8-2.2 Soldering Iron : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. Note : a) Preheat circuit and products to 150°C. d) 1.0mm tip diameter (max) b) 350°C tip temperature (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm c) Never contact the ceramic with the iron tip f) Limit soldering time to 4-5 secs. Soldering 20~40s Natural cooling TP(26 0°C/40 s max.) 217 200 150 60~150s 60~180s 25 4 80s max. Preheating TEMPERATURE °C TEMPERATURE °C Preheating Soldering Natural cooling 350 150 Time(sec.) Reflow times: 3 times max Fig.1 G rad ual Cooling O ve r 60s. Within4 ~5s Iron Soldering times：1 times max Fig.2 NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.03.2014 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 Common mode filter (RoHS Compliant) CMT03 SERIES 8-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4. Minimum fillet height = soldering thickness + 25% product height Upper limit t Recommendable Figure 4 NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.03.2014 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 Common mode filter (RoHS Compliant) CMT03 SERIES 9. PACKAGING INFORMATION : 9-1. Reel Dimension ØA(mm) ØB(mm) ØC(mm) ØD(mm) E(mm) W(mm) t(mm) R(mm) 178±2.0 50 Min. 13±0.2 21±0.8 2.0±0.5 10±1.5 2.5 Max. 1.0 9-2. Tape Dimension / 8mm(black anti-static electricity carrier tape) Po:4±0.1 D:1.5+0.1 t P A D1:1±0.1 Ao Bo W:8.0±0.1 A F:3.5±0.05 E:1.75±0.1 P2:2±0.05 Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) CMT 03 0.95±0.05 0.75±0.05 0.55±0.05 4.0±0.1 0.3 Max. Ko Section A-A 9-3. Packaging Quantity Chip Size 03 Chip / Reel 10000 Inner Box 50000 Middle Box 250000 Carton 500000 NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.03.2014 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 Common mode filter (RoHS Compliant) CMT03 SERIES 9-4. Tearing Off Force The force for tearing off cover tape is 15 to 85 grams in the arrow direction under the following conditions. F 165° to 180° Top cover tape Room Temp. (°C) Room Humidity (%) Room atm (hPa) Tearing Speed (mm/min) 5~35 45~85 860~1060 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions: Less than 40°C and 60% RH. b) Recommended products should be used within 12 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.03.2014 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9