IXYS IXTY2N65X2 Preliminary technical information Datasheet

Preliminary Technical Information
IXTY2N65X2
IXTP2N65X2
X2-Class
Power MOSFET
VDSS
ID25
RDS(on)
= 650V
= 2A
 2.3

N-Channel Enhancement Mode
TO-252 (IXTY)
G
S
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25C to 150C
650
V
VDGR
TJ = 25C to 150C, RGS = 1M
650
V
VGSS
Continuous
30
V
VGSM
Transient
40
V
ID25
TC = 25C
2
A
IDM
TC = 25C, Pulse Width Limited by TJM
4
A
IA
TC = 25C
1
A
EAS
TC = 25C
100
mJ
dv/dt
IS  IDM, VDD  VDSS, TJ  150°C
50
V/ns
PD
TC = 25C
55
W
-55 ... +150
C
TJ
TJM
150
C
Tstg
-55 ... +150
C
300
260
°C
°C
1.13 / 10
Nm/lb.in
0.35
3.00
g
g
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
Md
Mounting Torque (TO-220)
Weight
TO-252
TO-220
D (Tab)
TO-220 (IXTP)
GD
S
G = Gate
S = Source
D (Tab)
D
= Drain
Tab = Drain
Features




International Standard Packages
Low QG
Avalanche Rated
Low Package Inductance
Advantages


Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVDSS
VGS = 0V, ID = 250μA
650
VGS(th)
VDS = VGS, ID = 250μA
3.0
IGSS
VGS = 30V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
RDS(on)
TJ = 125C
VGS = 10V, ID = 0.5 • ID25, Note 1
© 2015 IXYS CORPORATION, All Rights Reserved

High Power Density
Easy to Mount
Space Savings
V
Applications
V

100 nA

5.0
5 A
100 A
2.3



Switch-Mode and Resonant-Mode
Power Supplies
DC-DC Converters
PFC Circuits
AC and DC Motor Drives
Robotics and Servo Controls

DS100654A(6/15)
IXTY2N65X2
IXTP2N65X2
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max
gfs
VDS = 10V, ID = 0.5 • ID25, Note 1
1.1
RGi
Gate Input Resistance
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
Crss
TO-252 AA Outline
1.8
S
14

180
pF
129
pF
0.7
pF
22
45
pF
pF
15
ns
19
ns
20
ns
14
ns
4.3
nC
0.8
nC
2.1
nC
Effective Output Capacitance
Co(er)
Co(tr)
Energy related
td(on)
Resistive Switching Times
tr
td(off)
tf
Time related
VGS = 0V
VDS = 0.8 • VDSS
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 50 (External)
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
2.27 C/W
RthJC
RthCS
1 - Gate
2,4 - Drain
3 - Source
TO-220
C/W
0.50
TO-220 Outline
Source-Drain Diode
E
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max
A
oP
A1
H1
Q
D2
D
IS
VGS = 0V
2
A
ISM
Repetitive, pulse Width Limited by TJM
8
A
VSD
IF = IS, VGS = 0V, Note 1
trr
QRM
IRM
IF = 1A, -di/dt = 100A/μs
D1
E1
A2
EJECTOR
PIN
1.4
137
508
7.4
VR = 100V
L1
L
V
ns
nC
A
e
3X b
c
e1
3X b2
1 - Gate
2,4 - Drain
3 - Source
Note 1. Pulse test, t  300s, duty cycle, d 2%.
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are
derived from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute a "considered reflection" of the anticipated result. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123B1
6,306,728B1
6,404,065B1
6,534,343
6,583,505
6,683,344
6,710,405B2
6,710,463
6,727,585
7,005,734B2
6,759,692
7,063,975B2
6,771,478B2 7,071,537
7,157,338B2
IXTY2N65X2
IXTP2N65X2
Fig. 1. Output Characteristics @ TJ = 25ºC
Fig. 2. Extended Output Characteristics @ TJ = 25ºC
2.0
4.0
VGS = 10V
8V
7V
VGS = 10V
8V
3.5
1.5
3.0
7V
I D - Amperes
I D - Amperes
6V
1.0
5.5V
0.5
2.5
6V
2.0
1.5
1.0
5.5V
0.5
5V
5V
0.0
0.0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
4
8
12
VDS - Volts
20
24
28
32
Fig. 4. RDS(on) Normalized to ID = 1A Value vs.
Junction Temperature
Fig. 3. Output Characteristics @ TJ = 125ºC
4.5
2.0
VGS = 10V
7V
VGS = 10V
4.0
3.5
1.5
RDS(on) - Normalized
6V
I D - Amperes
16
VDS - Volts
1.0
5V
0.5
3.0
I D = 2A
2.5
2.0
I D = 1A
1.5
1.0
0.5
4V
0.0
0.0
0
1
2
3
4
5
6
7
8
9
10
11
12
-50
13
25
50
75
100
Fig. 5. RDS(on) Normalized to ID = 1A Value vs.
Drain Current
Fig. 6. Maximum Drain Current vs.
Case Temperature
125
150
2.2
2.0
VGS = 10V
1.8
TJ = 125ºC
3.5
1.6
3.0
1.4
I D - Amperes
R DS(on) - Normalized
0
TJ - Degrees Centigrade
4.5
4.0
-25
VDS - Volts
2.5
TJ = 25ºC
2.0
1.2
1.0
0.8
0.6
1.5
0.4
1.0
0.2
0.0
0.5
0.0
0.5
1.0
1.5
2.0
I D - Amperes
© 2015 IXYS CORPORATION, All Rights Reserved
2.5
3.0
3.5
-50
-25
0
25
50
75
TC - Degrees Centigrade
100
125
150
IXTY2N65X2
IXTP2N65X2
Fig. 7. Input Admittance
Fig. 8. Transconductance
2.8
3.0
TJ = - 40ºC
2.4
2.5
g f s - Siemens
I D - Amperes
2.0
1.6
TJ = 125ºC
25ºC
- 40ºC
1.2
25ºC
2.0
1.5
125ºC
1.0
0.8
0.5
0.4
0.0
0.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
0.0
6.5
0.4
0.8
1.2
VGS - Volts
1.6
2.0
2.4
2.8
I D - Amperes
Fig. 9. Forward Voltage Drop of Intrinsic Diode
Fig. 10. Gate Charge
10
6
VDS = 325V
5
I D = 1A
8
I G = 1mA
VGS - Volts
I S - Amperes
4
3
TJ = 125ºC
6
4
2
TJ = 25ºC
2
1
0
0
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
0
0.5
1
1.5
Fig. 11. Capacitance
2.5
3
3.5
4
4.5
Fig. 12. Output Capacitance Stored Energy
1,000
5.0
4.5
Ciss
4.0
100
E OSS - MicroJoules
Capacitance - PicoFarads
2
QG - NanoCoulombs
VSD - Volts
Coss
10
Crss
1
3.5
3.0
2.5
2.0
1.5
1.0
f = 1 MHz
0.5
0
0.0
1
10
100
1000
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
0
100
200
300
VDS - Volts
400
500
600
IXTY2N65X2
IXTP2N65X2
Fig. 13. Forward-Bias Safe Operating Area
Fig. 14. Maximum Transient Thermal Impedance
10
10
RDS(on) Limit
I D - Amperes
1
100µs
0.1
Z (th)JC - ºC / W
25µs
1
0.1
TJ = 150ºC
TC = 25ºC
Single Pulse
DC
1ms
10ms
0.01
10
100
VDS - Volts
© 2015 IXYS CORPORATION, All Rights Reserved
1,000
0.01
0.00001
0.0001
0.001
0.01
0.1
1
Pulse Width - Second
IXYS REF: T_2N65X2(Z1-R25T50) 6-05-15-A
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