Fairchild MM74HC244MTC Octal 3-state buffer Datasheet

Revised August 2000
MM74HC244
Octal 3-STATE Buffer
General Description
Features
The MM74HC244 is a non-inverting buffer and has two
active low enables (1G and 2G); each enable independently controls 4 buffers. This device does not have
Schmitt trigger inputs.
■ Typical propagation delay: 14 ns
These 3-STATE buffers utilize advanced silicon-gate
CMOS technology and are general purpose high speed
non-inverting buffers. They possess high drive current outputs which enable high speed operation even when driving
large bus capacitances. These circuits achieve speeds
comparable to low power Schottky devices, while retaining
the advantage of CMOS circuitry, i.e., high noise immunity,
and low power consumption. All three devices have a
fanout of 15 LS-TTL equivalent inputs.
■ 3-STATE outputs for connection to system buses
■ Wide power supply range: 2–6V
■ Low quiescent supply current: 80 µA
■ Output current: 6 mA
All inputs are protected from damage due to static discharge by diodes to VCC and ground.
Ordering Code:
Order Number
Package Number
MM74HC244WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC244SJ
MM74HC244MTC
MM74HC244N
MTC20
N20A
Package Description
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagram
Truth Table
1G
1A
1Y
2G
2A
2Y
L
L
L
L
L
L
L
H
H
L
H
H
H
L
Z
H
L
Z
H
H
Z
H
H
Z
H = HIGH Level
L = LOW Level
Z = High Impedance
Top View
© 2000 Fairchild Semiconductor Corporation
DS005327
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MM74HC244 Octal 3-STATE Buffer
September 1983
MM74HC244
Logic Diagram
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2
Recommended Operating
Conditions
(Note 2)
−0.5 to +7.0V
Supply Voltage (VCC)
DC Input Voltage (VIN)
−1.5 to VCC +1.5V
DC Output Voltage (VOUT)
−0.5 to VCC +0.5V
Clamp Diode Current (IIK, IOK)
± 20 mA
DC Output Current, per pin (IOUT)
± 35 mA
Units
6
V
0
VCC
V
−40
+85
°C
(tr, tf) VCC = 2.0V
1000
ns
VCC = 4.5V
500
ns
VCC = 6.0V
400
ns
(VIN, VOUT)
Operating Temperature Range (TA)
Input Rise or Fall Times
−65°C to +150°C
Storage Temperature Range (TSTG)
Max
2
DC Input or Output Voltage
± 70 mA
DC VCC or GND Current, per pin (ICC)
Min
Supply Voltage (VCC)
Power Dissipation (PD)
(Note 3)
600 mW
S.O. Package only
500 mW
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Lead Temperature (TL)
DC Electrical Characteristics
Symbol
VIH
VIL
Parameter
Note 3: Power Dissipation temperature derating — plastic “N” package: −
12 mW/°C from 65°C to 85°C.
(Note 4)
Conditions
VCC
TA = 25°C
Typ
TA = −40 to 85°C TA = −55 to 125°C
Guaranteed Limits
2.0V
1.5
1.5
1.5
V
Input Voltage
4.5V
3.15
3.15
3.15
V
6.0V
4.2
4.2
4.2
V
Maximum LOW Level
2.0V
0.5
0.5
0.5
V
4.5V
1.35
1.35
1.35
V
6.0V
1.8
1.8
1.8
V
Minimum HIGH Level
VIN = VIH or VIL
Output Voltage
|IOUT | ≤ 20 µA
2.0V
2.0
1.9
1.9
1.9
V
4.5V
4.5
4.4
4.4
4.4
V
6.0V
6.0
5.9
5.9
5.9
VIN = VIH or VIL
VOL
Units
Minimum HIGH Level
Input Voltage
VOH
Note 2: Unless otherwise specified all voltages are referenced to ground.
260°C
(Soldering 10 seconds)
V
V
|IOUT | ≤ 6.0 mA
4.5V
4.2
3.98
3.84
3.7
V
|IOUT | ≤ 7.8 mA
6.0V
5.7
5.4
5.34
5.2
V
Maximum LOW Level
VIN = VIH or VIL
Output Voltage
|IOUT | ≤ 20 µA
2.0V
0
0.1
0.1
0.1
V
4.5V
0
0.1
0.1
0.1
V
6.0V
0
0.1
0.1
0.1
V
V
VIN = VIH or VIL
IIN
|IOUT | ≤ 6.0 mA
4.5V
0.2
0.26
0.33
0.4
|IOUT | ≤ 7.8 mA
6.0V
0.2
0.26
0.33
0.4
V
VIN = VCC or GND
6.0V
± 0.1
± 1.0
±1.0
µA
Maximum 3-STATE
VIN = VIH, or VIL
6.0V
± 0.5
±5
±10
µA
Output Leakage
VOUT = VCC or GND
6.0V
8.0
80
160
µA
Maximum Input
Current
IOZ
ICC
Current
G = VIH
Maximum Quiescent
VIN = VCC or GND
Supply Current
IOUT = 0 µA
Note 4: For a power supply of 5V ± 10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when
designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used.
3
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MM74HC244
Absolute Maximum Ratings(Note 1)
MM74HC244
AC Electrical Characteristics
VCC = 5V, TA = 25°C, tr = tf = 6 ns
Symbol
tPHL, tPLH
Parameter
Conditions
Typ
Guaranteed
Limit
Units
CL = 45 pF
14
20
ns
Maximum Enable Delay
RL = 1 kΩ
17
28
ns
to Active Output
CL = 45 pF
Maximum Disable Delay
RL = 1 kΩ
15
25
ns
from Active Output
CL = 5 pF
Maximum Propagation
Delay
tPZH, tPZL
tPHZ, tPLZ
AC Electrical Characteristics
VCC = 2.0V-6.0V, CL = 50 pF, tr = tf = 6 ns (unless otherwise specified)
Symbol
Parameter
tPHL, tPLH Maximum Propagation
Delay
tPZH, tPZL Maximum Output Enable
Time
tPHZ, tPLZ Maximum Output Disable
Time
Conditions
VCC
TA = 25°C
Typ
2.0V
58
115
145
171
2.0V
83
165
208
246
ns
CL = 50 pF
4.5V
14
23
29
34
ns
CL = 150 pF
4.5V
17
33
42
49
ns
CL = 50 pF
6.0V
10
20
25
29
ns
CL = 150 pF
6.0V
14
28
35
42
ns
ns
CIN
ns
RL = 1 kΩ
CL = 50 pF
2.0V
75
150
189
224
CL = 150 pF
2.0V
100
200
252
298
ns
CL = 50 pF
4.5V
15
30
38
45
ns
CL = 150 pF
4.5V
30
40
50
60
ns
CL = 50 pF
6.0V
13
26
32
38
ns
CL = 150 pF
6.0V
17
34
43
51
ns
RL = 1 kΩ
2.0V
75
150
189
224
ns
CL = 50 pF
4.5V
15
30
38
45
ns
6.0V
13
2.0V
4.5V
6.0V
Capacitance (Note 5)
Units
CL = 50 pF
Rise and Fall Time
Power Dissipation
Guaranteed Limits
CL = 150 pF
tTLH, tTHL Maximum Output
CPD
TA = −40 to 85°C TA = −55 to 125°C
26
32
38
ns
60
75
90
ns
12
15
18
ns
10
13
15
ns
(per buffer)
G = VIH
12
G = VIL
50
Maximum Input
pF
pF
5
10
10
10
pF
10
20
20
20
pF
Capacitance
COUT
Maximum Output
Capacitance
Note 5: CPD determines the no load dynamic power consumption, PD = CPD VCC2f + ICC VCC, and the no load dynamic current consumption,
IS = CPD VCC f + ICC.
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MM74HC244
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
Package Number M20B
5
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MM74HC244
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
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6
MM74HC244
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
7
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MM74HC244 Octal 3-STATE Buffer
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Package Number N20A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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