LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C – MARCH 1998 – REVISED MARCH 2013 LM118-N/lm218-N/LM318-N Operational Amplifiers Check for Samples: LM118-N, LM218-N, LM318-N FEATURES DESCRIPTION • • • • • • • The LM118 series are precision high speed operational amplifiers designed for applications requiring wide bandwidth and high slew rate. They feature a factor of ten increase in speed over general purpose devices without sacrificing DC performance. 1 2 15 MHz Small Signal Bandwidth Ensured 50V/μs Slew Rate Maximum Bias Current of 250 nA Operates from Supplies of ±5V to ±20V Internal Frequency Compensation Input and Output Overload Protected Pin Compatible with General Purpose Op Amps The LM118 series has internal unity gain frequency compensation. This considerably simplifies its application since no external components are necessary for operation. However, unlike most internally compensated amplifiers, external frequency compensation may be added for optimum performance. For inverting applications, feedforward compensation will boost the slew rate to over 150V/μs and almost double the bandwidth. Overcompensation can be used with the amplifier for greater stability when maximum bandwidth is not needed. Further, a single capacitor can be added to reduce the 0.1% settling time to under 1 μs. The high speed and fast settling time of these op amps make them useful in A/D converters, oscillators, active filters, sample and hold circuits, or general purpose amplifiers. These devices are easy to apply and offer an order of magnitude better AC performance than industry standards such as the LM709. The LM218-N is identical to the LM118 except that the LM218-N has its performance specified over a −25°C to +85°C temperature range. The LM318-N is specified from 0°C to +70°C. Fast Voltage Follower Do not hard-wire as voltage follower (R1 ≥ 5 kΩ) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2013, Texas Instruments Incorporated LM118-N, LM218-N, LM318-N SNOSBS8C – MARCH 1998 – REVISED MARCH 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage ±20V Power Dissipation (3) Differential Input Current Input Voltage 500 mW (4) ±10 mA (5) ±15V Output Short-Circuit Duration Continuous Operating Temperature Range lm118-n −55°C to +125°C LM218-N −25°C to +85°C LM318-N 0°C to +70°C −65°C to +150°C Storage Temperature Range Lead Temperature (Soldering, 10 sec.) TO-99 Package 300°C PDIP Package 260°C Soldering Information Dual-In-Line Package Soldering (10 sec.) 260°C SOIC Package Vapor Phase (60 sec.) 215°C Infrared (15 sec.) 220°C ESD Tolerance (1) (2) (3) (4) (5) (6) (6) 2000V Refer to RETS118X for LM118H and LM118J military specifications. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. The maximum junction temperature of the lm118-n is 150°C, the LM218-N is 110°C, and the LM318-N is 110°C. For operating at elevated temperatures, devices in the LMC package must be derated based on a thermal resistance of 160°C/W, junction to ambient, or 20°C/W, junction to case. The thermal resistance of the dual-in-line package is 100°C/W, junction to ambient. The inputs are shunted with back-to-back diodes for overvoltage protection. Therefore, excessive current will flow if a differential input voltage in excess of 1V is applied between the inputs unless some limiting resistance is used. For supply voltages less than ±15V, the absolute maximum input voltage is equal to the supply voltage. Human body model, 1.5 kΩ in series with 100 pF. Electrical Characteristics (1) Parameter Conditions LM118-N/LM218-N Min Typ Max 2 4 LM318-N Min Units Typ Max 4 10 mV nA Input Offset Voltage TA = 25°C Input Offset Current TA = 25°C 6 50 30 200 Input Bias Current TA = 25°C 120 250 150 500 Input Resistance TA = 25°C Supply Current TA = 25°C Large Signal Voltage Gain TA = 25°C, VS = ±15V 1 3 50 50 nA 0.5 3 200 25 200 V/mV 70 50 70 V/μs 5 8 5 MΩ 10 mA VOUT = ±10V, RL ≥ 2 kΩ Slew Rate TA = 25°C, VS = ±15V, AV = 1 Small Signal Bandwidth TA = 25°C, VS = ±15V (2) 15 15 MHz Input Offset Voltage 6 15 mV Input Offset Current 100 300 nA (1) (2) 2 These specifications apply for ±5V ≤ VS ≤ ±20V and −55°C ≤ TA ≤ +125°C (lm118-n), −25°C ≤ TA ≤ +85°C (LM218-N), and 0°C ≤ TA ≤ +70°C (LM318-N). Also, power supplies must be bypassed with 0.1 μF disc capacitors. Slew rate is tested with VS = ±15V. The lm118-n is in a unity-gain non-inverting configuration. VIN is stepped from −7.5V to +7.5V and vice versa. The slew rates between −5.0V and +5.0V and vice versa are tested and specified to exceed 50V/μs. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C – MARCH 1998 – REVISED MARCH 2013 Electrical Characteristics (1) (continued) Parameter Conditions LM118-N/LM218-N Min Typ Input Bias Current Max LM318-N Min Typ 500 Supply Current TA = 125°C Large Signal Voltage Gain VS = ±15V, VOUT = ±10V 4.5 25 Units Max 750 7 nA mA 20 V/mV RL ≥ 2 kΩ Output Voltage Swing VS = ±15V, RL = 2 kΩ Input Voltage Range VS = ±15V ±12 ±13 ±11.5 ±12 ±13 ±11. 5 V V Common-Mode Rejection Ratio 80 100 70 100 dB Supply Voltage Rejection Ratio 70 80 65 80 dB Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N Submit Documentation Feedback 3 LM118-N, LM218-N, LM318-N SNOSBS8C – MARCH 1998 – REVISED MARCH 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS LM118-N, LM218-N 4 Input Current Voltage Gain Figure 1. Figure 2. Power Supply Rejection Input Noise Voltage Figure 3. Figure 4. Common Mode Rejection Supply Current Figure 5. Figure 6. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C – MARCH 1998 – REVISED MARCH 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) LM118-N, LM218-N Closed Loop Output Impedance Current Limiting Figure 7. Figure 8. Input Current Unity Gain Bandwidth Figure 9. Figure 10. Voltage Follower Slew Rate Inverter Settling Time Figure 11. Figure 12. Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N Submit Documentation Feedback 5 LM118-N, LM218-N, LM318-N SNOSBS8C – MARCH 1998 – REVISED MARCH 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) LM118-N, LM218-N 6 Large Signal Frequency Response Open Loop Frequency Response Figure 13. Figure 14. Voltage Follower Pulse Response Large Signal Frequency Response Figure 15. Figure 16. Open Loop Frequency Response Inverter Pulse Response Figure 17. Figure 18. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C – MARCH 1998 – REVISED MARCH 2013 Typical Performance Characteristics LM318-N Input Current Voltage Gain Figure 19. Figure 20. Power Supply Rejection Input Noise Voltage Figure 21. Figure 22. Common Mode Rejection Supply Current Figure 23. Figure 24. Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N Submit Documentation Feedback 7 LM118-N, LM218-N, LM318-N SNOSBS8C – MARCH 1998 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) LM318-N 8 Closed Loop Output Impedance Current Limiting Figure 25. Figure 26. Input Current Unity Gain Bandwidth Figure 27. Figure 28. Voltage Follower Slew Rate Inverter Settling Time Figure 29. Figure 30. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C – MARCH 1998 – REVISED MARCH 2013 Typical Performance Characteristics (continued) LM318-N Large Signal Frequency Response Open Loop Frequency Response Figure 31. Figure 32. Voltage Follower Pulse Response Large Signal Frequency Response Figure 33. Figure 34. Open Loop Frequency Response Inverter Pulse Response Figure 35. Figure 36. Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N Submit Documentation Feedback 9 LM118-N, LM218-N, LM318-N SNOSBS8C – MARCH 1998 – REVISED MARCH 2013 www.ti.com AUXILIARY CIRCUITS Figure 39. Offset Balancing *Balance circuit necessary for increased slew. Slew rate typically 150V/μs. Figure 37. Feedforward Compensation for Greater Inverting Slew Rate Figure 40. Isolating Large Capacitive Loads Slew and settling time to 0.1% for a 10V step change is 800 ns. Figure 41. Overcompensation Figure 38. Compensation for Minimum Settling Time 10 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C – MARCH 1998 – REVISED MARCH 2013 TYPICAL APPLICATIONS Do not hard-wire as voltage follower (R1 ≥ 5 kΩ) Figure 42. Fast Voltage Follower CF = Large (CF ≥ 50 pF) *Do not hard-wire as integrator or slow inverter; insert a 10k-5 pF network in series with the input, to prevent oscillation. Do not hard-wire as voltage follower (R1 ≥ 5 kΩ) Figure 43. Figure 44. Fast Summing Amplifier Figure 45. Differential Amplifie Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N Submit Documentation Feedback 11 LM118-N, LM218-N, LM318-N SNOSBS8C – MARCH 1998 – REVISED MARCH 2013 www.ti.com Figure 46. Fast Sample and Hold *Optional—Reduces settling time. Figure 47. D/A Converter Using Ladder Network 12 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C – MARCH 1998 – REVISED MARCH 2013 ΔOutput zero. *“Y” zero +“X” zero ‡Full scale adjust. Figure 48. Four Quadrant Multiplier *Optional—Reduces settling time. Figure 49. D/A Converter Using Binary Weighted Network Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N Submit Documentation Feedback 13 LM118-N, LM218-N, LM318-N SNOSBS8C – MARCH 1998 – REVISED MARCH 2013 www.ti.com Figure 50. Fast Summing Amplifier with Low Input Current Figure 51. Wein Bridge Sine Wave Oscillator Figure 52. Instrumentation Amplifier 14 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C – MARCH 1998 – REVISED MARCH 2013 Schematic Diagram Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N Submit Documentation Feedback 15 LM118-N, LM218-N, LM318-N SNOSBS8C – MARCH 1998 – REVISED MARCH 2013 www.ti.com Pin Diagram Available per JM38510/10107. Dual-In-Line Package (Top View) See Package Number J (R-GDIP-T14) Available per JM38510/10107. Dual-In-Line Package (Top View) See Package Number NAB008A, D (R-PDSO-G8), or P (R-PDIP-T8) Pin connections shown on schematic diagram and typical applications are for TO-99 package. TO-99 Package (Top View) See Package Number LMC (O-MBCY-W8) 16 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C – MARCH 1998 – REVISED MARCH 2013 REVISION HISTORY Changes from Revision B (March 2013) to Revision C • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 16 Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N Submit Documentation Feedback 17 PACKAGE OPTION ADDENDUM www.ti.com 19-Mar-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM118H ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI -55 to 125 ( LM118H ~ LM118H) LM118H/NOPB ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI -55 to 125 ( LM118H ~ LM118H) LM318M NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM 318M LM318M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM 318M LM318MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM 318M LM318N/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM 318N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 19-Mar-2015 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device LM318MX/NOPB Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 5.4 2.0 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM318MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated