LM7301 Low Power, 4 MHz GBW, Rail-to-Rail Input-Output Operational Amplifier The LM7301 operational amplifier provides high performance in a wide range of applications. It features common mode input range beyond the rails, full rail-to-rail output swing, large capacitive load driving capability, and low signal distortion. The LM7301 operates on supplies of 1.8 V to 32 V and is excellent for a wide range of applications in low power systems. With a gain-bandwidth of 4 MHz while consuming only 0.6 mA supply current, it supports portable applications where higher power devices would reduce battery life. The wide input common mode voltage range allows the LM7301 to be driver by signals 100 mV beyond both rails, eliminating concerns associated with exceeding the common−mode voltage range. The capability for rail−to−rail output swing provides the maximum possible dynamic range at the output, which is particularly important when operating on low supply voltages. The LM7301 is available in a space-saving TSOP-5 package. http://onsemi.com 5 1 TSOP−5 (SOT23−5) SN SUFFIX CASE 483 MARKING DIAGRAM 5 JFGAYWG G 1 Features • Wide Supply Range: 1.8 V to 32 V • Input Common Mode Voltage Range Extends Beyond Rails: • • • • • • • • • VEE − 0.1 V to VCC + 0.1 V Rail−to−Rail Output Swing: 0.07 V to 4.93 V at VS = 5 V Wide Gain−Bandwidth: 4 MHz Low Supply Current: 0.60 mA at VS = 5 V High PSRR: 104 dB at VS = 5 V High CMRR: 93 dB at VS = 5 V Excellent Gain: 97 dB at VS = 5 V Capable of Driving a 1 nF Capacitive Load Tiny 5−pin SOT23 Package Saves Space These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant July, 2014 − Rev. 4 (Note: Microdot may be in either location) PIN CONNECTIONS 5 VCC OUT 1 VEE 2 Non−Inverting Input + − 4 Inverting Input 3 (Top View) See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet. Portable Instrumentation Signal Conditioning Amplifiers/ADC Buffers Active Filters Modems PCMCIA Cards © Semiconductor Components Industries, LLC, 2014 = Assembly Location = Year = Work Week = Pb−Free Package ORDERING INFORMATION Typical Applications • • • • • A Y W G 1 Publication Order Number: LM7301/D LM7301 PIN FUNCTION DESCRIPTION Pin No. Pin Name 1 Output Description 2 VEE 3 Non−inverting Input 4 Inverting Input Inverting Amplifier Input 5 VCC Positive Power Supply Amplifier Output Negative Power Supply Non−inverting Amplifier Input ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage Common Mode Range VCM VCC + 0.3 V, VEE − 0.3 V V Differential Input Voltage Range Vdiff 15 V Supply Voltage (VCC − VEE) VS 35 V Current at Input Pin IIN ±10 mA Current at Output Pin (Note 1) IOUT ±20 mA Current at Power Supply Pin ICC 25 mA TJ(max) 150 °C TSTG −65 to 150 °C ESDHBM 2.5 kV Maximum Junction Temperature (Note 2) Storage Temperature Range ESD Capability, Human Body Model (Note 3) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Applies to both single supply and split supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. 2. The maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable dissipation at any ambient temperature is PD = (TJ(max) − TA)/qJA. All numbers apply for packages soldered directly to a printed circuit board. 3. Human Body Model, applicable std. MIL−STD−883, method 3015.7. THERMAL CHARACTERISTICS Rating Thermal Characteristics, SOT−5, 3 x 3.3 mm (Note 4) Symbol Value Unit qJA 333 °C/W 4. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. OPERATING RANGES Rating Symbol Min Max Unit Supply Voltage VS 1.8 32 V Operating Temperature Range TA −40 85 °C http://onsemi.com 2 LM7301 5.0 V DC ELECTRICAL CHARACTERISTICS Unless otherwise specified, all limits guaranteed for TA = 25°C, VCC = 5 V, VEE = 0 V, VCM = mid−supply, and RL > 1 MW to mid−supply. Boldface limits apply at the temperature extremes. Symbol VOS Parameter Conditions Min Input Offset Voltage Typ Max Unit 0.03 6 mV 8 DVOS/DT IIB Input Offset Voltage Average Drift mV/°C 2 Input Bias Current VCM = 0 V 65 200 nA 250 VCM = 5 V −55 −75 −85 IOS Input Offset Current VCM = 0 V 0.7 70 nA 80 VCM = 5 V 0.7 55 65 RIN CMRR Input Resistance, Common Mode 0 V ≤ VCM ≤ 5 V Common Mode Rejection Ratio 0 V ≤ VCM ≤ 5 V 70 39 MW 88 dB 67 0 V ≤ VCM ≤ 3.5 V PSRR 2.2 V ≤ VS ≤ 30 V Power Supply Rejection Ratio 93 87 104 dB 5.1 V 84 VCM CMRR ≥ 65 dB Input Common−Mode Voltage Range −0.1 AV VOH Large Signal Voltage Gain High Output Voltage Swing RL = 10 kW Vo = 4.0 Vpp 82 RL = 10 kW 4.88 97 dB 4.93 V 80 4.85 RL = 2 kW 4.8 4.87 4.78 VOL Low Output Voltage Swing RL = 10 kW 0.07 0.12 0.15 RL = 2 kW 0.14 0.2 0.22 ISC Output Short Circuit Current Sourcing 8 mA 10.5 5.5 Sinking 6 9.8 5 IS Supply Current RL = open 0.6 1.1 1.24 http://onsemi.com 3 mA LM7301 AC ELECTRICAL CHARACTERISTICS TA = 25°C, VCC = 2.2 V to 30 V, VEE = 0 V, VCM = mid−supply, and RL > 1 MW to mid−supply Symbol SR GBW Parameter Conditions Slew Rate Gain−Bandwidth Product Min Typ Max Unit ±4 V Step @ Vs = ±6 V 1.25 V/ms f = 100 kHz, RL = 10k 4 MHz eN Input−Referred Voltage Noise f = 1 kHz 30 nV/√Hz iN Input−Referred Current Noise f = 1 kHz 0.24 pA/√Hz Total Harmonic Distortion f = 10 kHz 0.004 % THD 2.2 V DC ELECTRICAL CHARACTERISTICS Unless otherwise specified, all limits guaranteed for TA = 25°C, VCC = 2.2 V, VEE = 0 V, VCM = mid−supply, and RL > 1 MW to mid−supply. Boldface limits apply at the temperature extremes. Parameter Symbol VOS Conditions Min Input Offset Voltage Typ Max Unit 0.04 6 mV 8 DVOS/DT IIB Input Offset Voltage Average Drift mV/°C 2 Input Bias Current VCM = 0 V 65 200 nA 250 VCM = 2.2 V −55 −75 −85 IOS Input Offset Current VCM = 0 V 0.8 VCM = 2.2 V 0.4 70 nA 80 55 65 RIN CMRR Input Resistance, Common Mode 0 V ≤ VCM ≤ 2.2 V Common Mode Rejection Ratio 0 V ≤ VCM ≤ 2.2 V 60 18 MW 82 dB 104 dB 2.3 V 56 PSRR 2.2 V ≤ VS ≤ 30 V Power Supply Rejection Ratio 87 84 VCM CMRR ≥ 60 dB Input Common−Mode Voltage Range −0.1 AV VOH Large Signal Voltage Gain High Output Voltage Swing RL = 10 kW Vo = 1.6 Vpp 76 RL = 10 kW 2.1 93 dB 2.15 V 74 2 RL = 2 kW 2.07 2.1 2 VOL Low Output Voltage Swing RL = 10 kW 0.05 0.08 0.1 RL = 2 kW 0.09 0.13 0.14 ISC Output Short Circuit Current Sourcing 8 8.7 5.5 Sinking 6 5 http://onsemi.com 4 8.7 mA LM7301 2.2 V DC ELECTRICAL CHARACTERISTICS Unless otherwise specified, all limits guaranteed for TA = 25°C, VCC = 2.2 V, VEE = 0 V, VCM = mid−supply, and RL > 1 MW to mid−supply. Boldface limits apply at the temperature extremes. Symbol IS Parameter Conditions Supply Current Min RL = open Typ Max Unit 0.57 0.97 mA 1.24 30V DC ELECTRICAL CHARACTERISTICS Unless otherwise specified, all limits guaranteed for TA = 25°C, VCC = 30 V, VEE = 0 V, VCM = mid−supply, and RL > 1 MW to mid−supply. Boldface limits apply at the temperature extremes. Parameter Symbol VOS Conditions Min Input Offset Voltage Typ Max Unit 0.04 6 mV 8 DVOS/DT IIB Input Offset Voltage Average Drift mV/°C 2 Input Bias Current VCM = 0 V 70 300 nA 500 VCM = 30 V −60 −100 −200 IOS Input Offset Current VCM = 0 V 1.2 VCM = 30 V 0.5 90 nA 190 65 135 RIN CMRR Input Resistance, Common Mode 0 V ≤ VCM ≤ 30 V Common Mode Rejection Ratio 0 V ≤ VCM ≤ 30 V 80 200 MW 104 dB 78 0 V ≤ VCM ≤ 27 V 90 115 88 PSRR 2.2 V ≤ VS ≤ 30 V Power Supply Rejection Ratio 87 104 dB 30.1 V 84 VCM CMRR ≥ 80 dB Input Common−Mode Voltage Range −0.1 AV Large Signal Voltage Gain RL = 10 kW Vo = 28 Vpp 89 VOH High Output Voltage Swing RL = 10 kW 29.75 100 dB 29.8 V 86 28.65 VOL Low Output Voltage Swing RL = 10 kW 0.16 0.275 0.375 ISC Output Short Circuit Current Sourcing (Note 5) 8.8 mA 17 6.5 Sinking (Note 5) 8.2 14 6 IS Supply Current RL = open 0.7 1.3 mA 1.35 5. The maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable dissipation at any ambient temperature is PD = (TJ(max) − TA)/qJA. All numbers apply for packages soldered directly to a printed circuit board. http://onsemi.com 5 LM7301 TYPICAL CHARACTERISTICS 800 VCM = mid−supply RL = 1 MW 600 500 Vos (mV) SUPPLY CURRENT (mA) 700 400 300 200 +85°C +25°C 100 −40°C 0 0 5 10 15 20 25 0.45 0.4 0.35 0.3 0.25 0.2 0.15 0.1 0.05 0 −0.05 −0.1 −0.15 −0.2 30 −40°C +25°C +85°C 0 5 10 SUPPLY VOLTAGE (V) 0.5 0.4 0.5 0.4 −40°C −40°C 0.3 +25°C +85°C 0 0.2 +25°C 0.1 +85°C 0 −0.1 −0.1 −0.2 −0.2 −0.3 −0.3 −0.4 −1.2 −0.4 −2.5 −0.8 −0.4 0 0.4 0.8 1.2 VS = ±2.5 V −2 −1.5 −1 −0.5 VCM (V) 0.5 60 VS = ±15 V 1 1.5 2 2.5 VS = ±1.1 V 40 0.3 −40°C 0.2 +25°C BIAS CURRENT (nA) Vos (mV) 0.5 Figure 4. Vos vs. VCM 0.4 0.1 0 0 VCM (V) Figure 3. Vos vs. VCM 0.6 30 0.6 VS = ±1.1 V Vos (mV) Vos (mV) 0.1 25 Figure 2. Vos vs. Supply Voltage 0.3 0.2 20 SUPPLY VOLTAGE (V) Figure 1. Supply Current vs. Supply Voltage 0.6 15 +85°C −0.1 20 0 +25°C −20 −40 −0.2 −60 −0.3 −15 −80 −1.2 −40°C +85°C −10 −5 0 5 10 15 −0.8 −0.4 0 0.4 0.8 VCM (V) VCM, COMMON MODE VOLTAGE (V) Figure 5. Vos vs. VCM Figure 6. Inverting Input Bias Current vs. Common Mode http://onsemi.com 6 1.2 LM7301 TYPICAL CHARACTERISTICS 60 60 VS = ±1.1 V VS = ±2.5 V 40 BIAS CURRENT (nA) BIAS CURRENT (nA) 40 20 0 −20 +25°C −40°C −40 −60 20 0 −20 +25°C −40°C −40 −60 +85°C −80 −1.2 −0.8 −0.4 0 +85°C 0.4 0.8 −80 −3 1.2 100 BIAS CURRENT (nA) 0 −20 +25°C −40°C −40 −60 3 VS = ±15 V −80 −3 −2 −1 0 50 25 0 +25°C −25 −40°C −50 +85°C −75 +85°C 1 2 −100 −15 3 −10 VCM, COMMON MODE VOLTAGE (V) −5 0 5 10 15 VCM, COMMON MODE VOLTAGE (V) Figure 9. Non−Inverting Input Bias Current vs. Common Mode Figure 10. Inverting Input Bias Current vs. Common Mode 0.018 VS = ±15 V TA = 25°C 0.016 OUTPUT CURRENT (A) 75 BIAS CURRENT (nA) 2 75 20 50 25 0 +25°C −40°C −50 +85°C −75 −100 −15 1 Figure 8. Inverting Input Bias Current vs. Common Mode 40 −25 0 Figure 7. Non−Inverting Input Bias Current vs. Common Mode VS = ±2.5 V 100 −1 VCM, COMMON MODE VOLTAGE (V) 60 BIAS CURRENT (nA) −2 VCM, COMMON MODE VOLTAGE (V) Sourcing 0.014 0.012 0.01 Sinking 0.008 0.006 0.004 0.002 0 −10 −5 0 5 10 15 0 VCM, COMMON MODE VOLTAGE (V) 2 4 6 8 10 12 14 SUPPLY VOLTAGE (V) Figure 11. Non−Inverting Input Bias Current vs. Common Mode Figure 12. Short−Circuit Current vs. Supply Voltage http://onsemi.com 7 16 LM7301 TYPICAL CHARACTERISTICS 14 VS = ±1.1 V 12 10 8 VOL: −40°C VOL: 25°C VOL: 85°C VOH: −40°C VOH: 25°C VOH: 85°C 6 4 2 10 8 4 2 0 0.2 0.3 0.4 0.5 0.6 0.7 0.8 1.0 0.9 1.0 1.5 2.0 VOLTAGE DROP FROM VS (V) Figure 13. IO vs. VO Figure 14. IO vs. VO 100 VS = ±2.5 V RL = 10 kW TA = 25°C 100.E−9 OPEN LOOP GAIN (dB) 80 80 PM: 2.7 V PM: 5 V PM: 30 V 60 60 40 40 20 20 0 0 Gain: 2.7 V Gain: 5 V Gain: 30 V RL = 10 kW CL = 0 pF TA = 25°C −20 −40 10.E−9 10 100 1k 10 M Figure 15. Voltage Noise vs. Frequency Figure 16. Gain and Phase Margin 80 PM: 0 pF PM: 1000 pF PHASE MARGIN (°) 80 60 40 40 20 Gain: 0 pF Gain: 1000 pF 0 0 VS = 2.7 V RL = 10 kW TA = 25°C 10 k 1M FREQUENCY (Hz) 100 20 100 k FREQUENCY (Hz) 100 60 −40 10 k 50 k 10 k VS = ±2.5 V RL = 1 MW CL = 10 pF TA = 25°C INPUT (500 mV/div) 1 −20 −40 100 k 1M 10 M FREQUENCY (Hz) TIME (5 ms/div) Figure 17. Gain/Phase vs. Capacitive Load Figure 18. Large Signal Step Response http://onsemi.com 8 2.5 100 −20 OPEN LOOP GAIN (dB) 0.5 VOLTAGE DROP FROM VS (V) 1.E−6 VOLTAGE NOISE (V/√Hz) 0 PHASE MARGIN (°) 0.1 OUTPUT (500 mVp/div) 0 −40 VOL: −40°C VOL: 25°C VOL: 85°C VOH: −40°C VOH: 25°C VOH: 85°C 6 0 −20 VS = ±2.5 V 12 OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) 14 LM7301 VS = ±2.5 V RL = 1 MW CL = 10 pF TA = 25°C Figure 19. Large Signal Step Response Figure 20. Small Signal Step Response INPUT (10 mV/div) VS = ±2.5 V RL = 1 MW CL = 10 pF TA = 25°C OUTPUT (10 mV/div) TIME (5 ms/div) OUTPUT (500 mV/div) TIME (5 ms/div) VS = ±2.5 V RL = 1 MW CL = 10 pF TA = 25°C TIME (5 ms/div) TIME (5 ms/div) Figure 21. Inverting Large Signal Step Response Figure 22. Inverting Small Signal Step Response 100 1 kHz THD+n 10 kHz THD+n 1 kHz THD 10 kHz THD VS = ±1.1 V RL = 100 kW ⎢⎥ 100 pF TA = 25°C THD+n (%) 0.1 10 THD (%) 1 1 kHz THD+n 10 kHz THD+n 1 kHz THD 10 kHz THD 0.01 VS = ±15 V RL = 100 kW ⎢⎥ 100 pF TA = 25°C 1 THD (%) 10 THD+n (%) OUTPUT (10 mV/div) VS = ±6 V RL = 1 MW CL = 10 pF TA = 25°C INPUT (500 mV/div) INPUT (10 mV/div) OUTPUT (1 V/div) INPUT (1 V/div) TYPICAL CHARACTERISTICS 0.1 0.01 0.001 0.001 0.01 0.1 1 10 0.01 0.1 1 10 INPUT (VP) INPUT (VP) Figure 23. Harmonic Distortion Figure 24. Harmonic Distortion http://onsemi.com 9 100 LM7301 TYPICAL CHARACTERISTICS 0 PSRR (dB) −20 −30 −40 0 −10 AV = +1 RL = 10 kW Input = 100 mVpp 2.7 V 5V 10 V 20 V 30 V −20 −30 CMRR (dB) 1.35 V− 1.35 V+ 2.5 V− 2.5 V+ 5 V− 5 V+ −10 −50 −60 −40 AV = +1 RL = 10 kW TA = 25°C −50 −60 −70 −80 −90 −70 −100 −110 −120 −80 −90 10 100 1K 10 K 100 K 1M 10 100 1K 10 K 100 K FREQUENCY (Hz) FREQUENCY (Hz) Figure 25. PSRR vs. Frequency Figure 26. CMRR vs. Frequency http://onsemi.com 10 1M LM7301 APPLICATIONS INFORMATION GENERAL INFORMATION application. Furthermore, the low profile can help in height limited designs, such as consumer hand−held remote controls, sub−notebook computers, and PCMCIA cards. An additional advantage of the tiny TSOP-5 package is that it allows better system performance due to ease of package placement. Because the package is so small, it can fit on the board right where the op amp needs to be placed for optimal performance, unconstrained by the usual space limitations. This optimal placement allows for many system enhancements, which cannot be easily achieved with the constraints of a larger package. For example, problems such as system noise due picking up undesired digital signal can be easily reduced or mitigated. This pick−up problem is often caused by long wires in the board layout going to or from an op amp. By placing the tiny package closer to the signal source and allowing the LM7301 output to drive the long wire, the signal becomes less sensitive to such noise. An overall reduction of system noise results. Often, trying to save space by using dual or quad op amps causes complicated board layouts due to the requirement of routing several signals to and from the same place on the board. Using the tiny op amp eliminates this problem. The LM7301 is ideal in a variety of situations due to low supply current, wide bandwidth, wide input common mode range extending 100 mV beyond the rails, full rail-to-rail output, high capacitive load driving ability, wide supply voltage (1.8 V to 32 V), and low distortion. The high common mode rejection ratio and full rail-to-rail input range provides precision performance, particularly in non− inverting applications where the common mode error is added directly to the other system errors. CAPACITIVE LOAD DRIVING The LM7301 is capable of driving large capacitive loads. A 1000 pF load only reduces the phase margin to about 25°. WIDE SUPPLY RANGE High PSRR and CMRR provide precision performance when the LM7301 is operating on a battery or other unregulated supplies. This advantage is further enhanced by the very wide supply range of 1.8 V to 32 V. In situations where highly variable or unregulated supplies are present, the excellent PSRR and wide supply range will maintain this precision performance, even in such adverse supply conditions. LOW DISTORTION, HIGH OUTPUT DRIVE CAPABILITY The LM7301 offers excellent low distortion performance, with a THD+N of 0.02% at f = 10 kHz. Low distortion levels are offered even at in scenarios with high output current and low load resistance. SPECIFIC ADVANTAGES OF 5−Pin TSOP The most apparent advantage of the 5−pin TSOP is that it can save board space, a critical aspect of any portable or miniaturized system design. The need to decrease the overall system size is inherent in any portable or lightweight system TYPICAL APPLICATIONS HANDHELD REMOTE CONTROLS low distortion at relatively high currents. Due to its low distortion at high output drive currents, the LM7301 fulfills this need, in this as well as other telecom applications. The LM7301 offers outstanding specifications for applications requiring balance between speed and power. In applications such as remote control operation, where high bandwidth and low power consumption are needed, the LM7301 performance can easily meet these requirements. REMOTE MICROPHONE IN PERSONAL COMPUTERS Remote microphones in computers often utilize a microphone at the top of the monitor, which requires driving a long cable in a high noise environment. One method often used to reduce the noise is to lower the signal impedance to reduce the noise pickup. In this configuration, the amplifier usually requires 30 db to 40 db of gain, at bandwidths higher than most low−power CMOS parts can achieve. The LM7301 offers the tiny package, higher bandwidth, and large output drive capability necessary for this application. OPTICAL LINE ISOLATION FOR MODEMS The combination of low distortion and high load driving capabilities of the LM7301 make it an excellent choice in modems for driving opto-isolator circuits to achieve line isolation. This technique prevents telephone line noise from coupling onto the modem signal. Superior isolation is achieved by coupling the signal optically from the computer modem to the telephone lines; however, this also requires a ORDERING INFORMATION Device LM7301SN1T1G Marking Package Shipping† JFG SOT23−5 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 11 LM7301 PACKAGE DIMENSIONS TSOP−5 CASE 483−02 ISSUE K NOTE 5 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. D 5X 0.20 C A B 0.10 T M 2X 0.20 T B 5 1 4 2 S 3 K B DETAIL Z G A A TOP VIEW DIM A B C D G H J K M S DETAIL Z J C 0.05 H SIDE VIEW C SEATING PLANE END VIEW MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 0_ 10 _ 2.50 3.00 SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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