Material Content Data Sheet Sales Product Name TLE42764DV Issued MA# MA001375570 Package PG-TO252-5-11 15. June 2015 Weight* 366.01 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 3.179 0.87 0.205 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.87 8685 8685 559 0.061 0.02 204.243 55.81 55.89 558032 168 558760 0.182 0.05 0.05 499 499 0.296 0.08 810 13.630 3.72 134.230 36.67 40.47 366742 404793 5.136 1.40 1.40 14032 14032 0.076 0.02 0.000 0.00 0.119 0.03 0.095 0.03 4.552 1.24 37241 208 0.02 1 260 1.30 12437 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 208 326 13023 1000000