Microchip MCP111T-300LB Micropower voltage detector Datasheet

MCP111/112
Micropower Voltage Detector
Features
Description
• Ultra-low supply current: 1.75 µA (max.)
• Precision monitoring options of:
- 1.90V, 2.32V, 2.63V, 2.90V, 2.93V, 3.08V,
4.38V and 4.63V
• Resets microcontroller in a power-loss event
• Active-low VOUT pin:
- MCP111 active-low, open-drain
- MCP112 active-low, push-pull
• Available in SOT23-3, TO-92 and SC70 packages
• Temperature Range:
- Extended: –40°C to +125°C
(except MCP1XX-195)
- Industrial: –40°C to +85°C (MCP1XX-195 only)
The MCP111/112 are voltage-detecting devices
designed to keep a microcontroller in reset until the
system voltage has reached, and stabilized, at the
appropriate level for reliable system operation. These
devices also operate as protection from brown-out
conditions when the system supply voltage drops
below a safe operating level. The MCP111 and
MCP112 are available in eight different trip voltages.
Applications
•
•
•
•
Critical µC and µP Power-monitoring Applications
Computers
Intelligent Instruments
Portable Battery-Powered Equipment
The MCP111 has an open-drain output with an activelow pin (VOUT). This device will assert VOUT when the
voltage on the VDD pin is below the trip-point voltage.
The MCP112 has a push-pull output and will assert an
active-low signal (VOUT pin) when the voltage on the
VDD pin is below the trip-point voltage.
During operation, the output (VOUT) remains at a logichigh as long as VDD is greater than the specified
threshold voltage. When VDD falls below the voltage
trip point, VOUT is driven low.
Package Types
SOT23-3/SC-70
Block Diagram
VDD
MCP111/112
VOUT 1
Comparator
+
Output
Driver
–
VOUT
VSS 2
3
VDD
TO-92
Band Gap
Reference
VOUT
VDD VSS
VSS
 2004 Microchip Technology Inc.
DS21889B-page 1
MCP111/112
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Absolute Maximum Ratings†
VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0V
Input current (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA
Output current (RST) . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA
Rated Rise Time of VDD . . . . . . . . . . . . . . . . . . . . . . 100V/µs
All inputs and outputs w.r.t. VSS . . . . . –0.6V to (VDD + 1.0V)
Storage temperature . . . . . . . . . . . . . . . . . . –65°C to + 150°C
Ambient temp. with power applied . . . . . . . –40°C to + 125°C
Maximum Junction temp. with power applied . . . . . . . . 150°C
ESD protection on all pins . . . . . . . . . . . . . . . . . . . . . . . . . ≥ 2 kV
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111),
TA = –40°C to +125°C.
Sym
Min
Typ
Max
Units
Operating Voltage Range
Parameters
VDD
1.0
—
5.5
V
Specified VDD Value to VOUT low
VDD
1.0
—
Operating Current
IDD
—
<1
1.75
µA
VTRIP
1.872
1.900
1.929
V
TA = +25°C (Note 1)
1.853
1.900
1.948
V
TA = -40°C to +85°C (Note 2)
2.285
2.320
2.355
V
TA = +25°C (Note 1)
2.262
2.320
2.378
V
Note 2
2.591
2.630
2.670
V
TA = +25°C (Note 1)
2.564
2.630
2.696
V
Note 2
2.857
2.900
2.944
V
TA = +25°C (Note 1)
2.828
2.900
2.973
V
Note 2
2.886
2.930
2.974
V
TA = +25°C (Note 1)
2.857
2.930
3.003
V
Note 2
3.034
3.080
3.126
V
TA = +25°C (Note 1)
3.003
3.080
3.157
V
Note 2
4.314
4.380
4.446
V
TA = +25°C (Note 1)
4.271
4.380
4.490
V
Note 2
4.561
4.630
4.700
V
TA = +25°C (Note 1)
4.514
4.630
4.746
V
Note 2
TTPCO
—
±100
—
ppm/
°C
VHYS
VDD Trip Point
MCP1XX-195
MCP1XX-240
MCP1XX-270
MCP1XX-290
MCP1XX-300
MCP1XX-315
MCP1XX-450
MCP1XX-475
VDD Trip Point Tempco
Threshold Hysteresis
(min. = 1%, max = 6%)
0.019
—
0.114
V
MCP1XX-240
0.023
—
0.139
V
MCP1XX-270
0.026
—
0.158
V
MCP1XX-290
0.029
—
0.174
V
MCP1XX-300
0.029
—
0.176
V
MCP1XX-315
0.031
—
0.185
V
MCP1XX-450
0.044
—
0.263
V
MCP1XX-475
0.046
—
0.278
V
MCP1XX-195
Note 1:
Trip point is ±1.5% from typical value.
2:
Trip point is ±2.5% from typical value.
DS21889B-page 2
V
Conditions
I RST = 10 µA, V RST < 0.2V
TA = +25°C
 2004 Microchip Technology Inc.
MCP111/112
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111),
TA = –40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
VOUT Low-level Output Voltage
VOL
—
—
0.4
V
IOL = 500 µA, VDD = VTRIP(MIN)
VOUT High-level Output Voltage
VOH
VDD – 0.6
—
—
V
IOH = 1 mA, For only MCP112
(push-pull output)
Open-Drain Output Leakage Current
(MCP111 only)
IOD
—
0.1
—
µA
Note 1:
Trip point is ±1.5% from typical value.
2:
Trip point is ±2.5% from typical value.
VTRIP
1V
VDD
tRPU
tRPD
VOH
1V
VOL
VOUT
tRT
FIGURE 1-1:
Timing Diagram.
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP111), TA = –40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
VDD Detect to VOUT Inactive
tRPU
—
90
—
µs
Figure 1-1 and CL = 50 pF
(Note 1)
VDD Detect to VOUT Active
tRPD
—
130
—
µs
VDD ramped from VTRIP(MAX) +
250 mV down to VTRIP(MIN) –
250 mV, per Figure 1-1,
CL = 50 pF (Note 1)
tRT
—
5
—
µs
For VOUT 10% to 90% of final
value per Figure 1-1, CL = 50 pF
(Note 1)
VOUT Rise Time After VOUT Active
Note 1:
Conditions
These parameters are for design guidance only and are not 100% tested.
 2004 Microchip Technology Inc.
DS21889B-page 3
MCP111/112
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP111), TA = –40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Specified Temperature Range
TA
–40
—
+85
°C
MCP1XX-195
Specified Temperature Range
TA
–40
—
+125
°C
Except MCP1XX-195
Maximum Junction Temperature
TJ
—
—
+150
°C
Storage Temperature Range
TA
–65
—
+150
°C
Temperature Ranges
Package Thermal Resistances
Thermal Resistance, 3L-SOT23
θJA
—
336
—
°C/W
Thermal Resistance, 3L-SC-70
θJA
—
340
—
°C/W
Thermal Resistance, 3L-TO92
θJA
—
131.9
—
°C/W
DS21889B-page 4
 2004 Microchip Technology Inc.
MCP111/112
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;
see Figure 4-1), TA = –40°C to +125°C.
1.6
1.6
MCP111-195
5.5V
5.0V
1.4
1.2
1.2
4.0V
1
0.8
IDD (uA)
IDD (uA)
MCP111-195
1.4
2.8V
2.1V
1.7V
0.6
0.4
+85°C
0.8
0.6
-40°C
0.4
1.0V
0.2
+125°C
1
+25°C
0.2
0
140
120
100
80
60
40
20
0
-20
-40
0
1.0
2.0
3.0
FIGURE 2-1:
(MCP111-195).
1.2
4.0
5.0
6.0
VDD (V)
Temperature (°C)
FIGURE 2-4:
IDD vs. Temperature
1.6
5.5V
MCP112-300
1
5.0V
0.8
4.0V
0.6
2.8V
1.7V
IDD vs. VDD (MCP111-195).
MCP112-300
1.4
0.4
IDD (uA)
IDD (uA)
1.2
2.1V
1
+125°C
0.8
+85°C
0.6
-40°C
0.4
0.2
1.0V
0.2
0
+25°C
140
120
100
80
60
40
20
0
-20
-40
0
1.0
2.0
3.0
6.0
1.6
MCP112-475
1.4
5.5V
MCP112-475
2.1V
2.8V
1.7V
IDD (uA)
1.2
4.0V
5.0V
1
0.8
+125°C
0.6
+85°C
0.4
-40°C
0.2
1.0V
+25°C
140
120
100
80
60
40
20
0
-20
0
-40
IDD (uA)
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
5.0
IDD vs. VDD (MCP112-300).
FIGURE 2-5:
IDD vs. Temperature
FIGURE 2-2:
(MCP112-300).
4.0
VDD (V)
Temperature (°C)
1.0
IDD vs. Temperature
 2004 Microchip Technology Inc.
3.0
4.0
5.0
6.0
VDD (V)
Temperature (°C)
FIGURE 2-3:
(MCP112-475).
2.0
FIGURE 2-6:
IDD vs. VDD (MCP112-475).
DS21889B-page 5
MCP111/112
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;
see Figure 4-1), TA = –40°C to +125°C.
0.100
MCP111-195
VDD = 1.7V
0.080
VOL (V)
0.050
VTRIP, V increasing
0.045
0.040
VHYS, Hysteresis
0.035
0.030
MCP111-195
0.025
max temp is
0.020
+85°C
0.015
VTRIP, V decreasing
0.010
0.005
0.000
-60
-10
40
90
140
Hyst (V)
VTRIP (V)
0.120
1.950
1.945
1.940
1.935
1.930
1.925
1.920
1.915
1.910
1.905
1.900
1.895
+125°C
0.060
+85°C
0.040
-40°C
0.020
+25°C
0.000
0.00
0.25
0.50
Temperature (°C)
0.75
1.00
IOL (mA)
FIGURE 2-10:
VOL vs. IOL
(MCP111-195 @ VDD = 1.7V).
FIGURE 2-7:
VTRIP and VHYST vs.
Temperature (MCP111-195).
0.080
3.020
VTRIP (V)
3.000
VHYS, Hysteresis
2.980
MCP112-300
2.960
2.940
2.920
VTRIP, V decreasing
2.900
-60
-10
40
90
0.100
0.098
0.096
0.094
0.092
0.090
0.088
0.086
0.084
0.082
140
0.070
MCP112-300
VDD = 2.7V
0.060
VOL (V)
VTRIP, V increasing
Hyst (V)
3.040
0.050
+125°C
0.040
+85°C
0.030
0.020
-40°C
+25°C
0.010
0.000
0.00
0.25
0.50
0.050
0.180
VTRIP, V increasing
0.170
0.160
0.150
0.140
MCP112-475
0.130
0.120
20
60
100
0.100
140
Temperature (°C)
FIGURE 2-9:
VTRIP and VHYST vs.
Temperature (MCP112-475).
DS21889B-page 6
MCP112-475
VDD = 4.4V
+125°C
0.030
0.020
+85°C
-40°C
0.010
+25°C
0.110
VTRIP, V decreasing
-20
0.040
VOL (V)
VHYS, Hysteresis
-60
1.00
FIGURE 2-11:
VOL vs. IOL
(MCP112-300 @ VDD = 2.7V).
Hyst (V)
VTRIP (V)
FIGURE 2-8:
VTRIP and VHYST vs.
Temperature (MCP112-300).
4.800
4.780
4.760
4.740
4.720
4.700
4.680
4.660
4.640
4.620
4.600
4.580
0.75
IOL (mA)
Temperature (°C)
0.000
0.00
0.25
0.50
0.75
1.00
IOL (mA)
FIGURE 2-12:
VOL vs. IOL
(MCP112-475 @ VDD = 4.4V).
 2004 Microchip Technology Inc.
MCP111/112
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;
see Figure 4-1), TA = –40°C to +125°C.
0.120
MCP111-195
VDD = 1.7 V
0.100
VOH (V)
IOL = 0.50 mA
0.060
0.040
MCP112-300
VDD = 3.1V
3.100
IOL = 0.75 mA
0.080
VOL (V)
3.150
IOL = 1.00 mA
-40 °C
3.050
+25 °C
3.000
IOL = 0.25 mA
+85 °C
2.950
0.020
IOL = 0.00 mA
+125 °C
0.000
-40
0
40
80
2.900
0.00
120
0.25
Temperature (°C)
0.080
4.820
MCP112-300
VDD = 2.7V
4.800
IOL = 0.50 mA
0.030
VOH (V)
VOL (V)
4.780
IOL = 0.75 mA
0.050
0.040
IOL = 0.25 mA
0.020
0.010
80
-40 °C
4.740
+85 °C
4.700
+125 °C
0.000
40
+25 °C
4.760
4.720
IOL = 0.00 mA
0
4.680
0.00
120
0.25
Temperature (°C)
0.030
IOL = 0.50 mA
0.020
IOL = 0.25 mA
0.010
IOL = 0.00 mA
0.000
40
80
120
Transient Duration (µs)
VOL (V)
IOL = 0.75 mA
0
500
400
1
10
MCP111-195
MCP112-300
300
200
MCP112-475
100
0
0.001
Temperature (°C)
FIGURE 2-15:
VOL vs. Temperature
(MCP112-475 @ VDD = 4.4V).
 2004 Microchip Technology Inc.
1.00
600
0.040
-40
0.75
FIGURE 2-17:
VOH vs. IOH
(MCP112-475 @ VDD = 4.8V).
IOL = 1.00 mA
MCP112-475
VDD = 4.4V
0.50
IOL (mA)
FIGURE 2-14:
VOL vs. Temperature
(MCP112-300 @ VDD = 2.7V).
0.050
1.00
MCP112-475
VDD = 4.8V
IOL = 1.00 mA
0.060
-40
0.75
FIGURE 2-16:
VOH vs. IOH
(MCP112-300 @ VDD = 3.1V).
FIGURE 2-13:
VOL vs. Temperature
(MCP111-195 @ VDD = 1.7V).
0.070
0.50
IOL (mA)
0.01
0.1
VTRIP(min) - VDD
FIGURE 2-18:
(25 °C).
Typical Transient Response
DS21889B-page 7
MCP111/112
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;
see Figure 4-1), TA = –40°C to +125°C.
400
350
350
VDD decreasing from:
VTRIP(max) + 0.25V to VTRIP(min) - 0.25V
200
150
tRPU (µs)
300
250
tRPD (µs)
MCP111-195
MCP111-195
VDD decreasing from:
5V - 1.7V
300
100
200
150
VDD increasing from:
0V - 2.8V
100
VDD decreasing from:
5V - 0V
50
VDD increasing from:
0V - 2.1V
250
50
0
VDD increasing
from: 0V - 5.5V
0
-40
-15
10
35
60
85
-40
110
-15
Temperature (°C)
FIGURE 2-19:
(MCP111-195).
tRPD vs. Temperature
FIGURE 2-22:
(MCP111-195).
VDD decreasing from:
VTRIP(max) + 0.25V to VTRIP(min) - 0.25V
140
85
110
tRPU vs. Temperature
MCP112-300
100
100
tRPU (µs)
tRPD (µs)
60
VDD increasing from:
0V - 3.1V
120
120
VDD decreasing from:
5V - 2.7V
80
60
VDD increasing from:
0V - 3.3V
80
60
VDD increasing from:
0V - 4.0V
40
40
VDD decreasing from:
5V - 0V
20
0
VDD increasing from:
0V - 5.5V
0
-40
-15
10
35
60
85
110
-40
-15
Temperature (°C)
FIGURE 2-20:
(MCP112-300).
tRPD vs. Temperature
FIGURE 2-23:
(MCP112-300).
250
10
35
60
Temperature (°C)
85
110
tRPU vs. Temperature
250
MCP112-475
MCP112-475
VDD increasing from:
0V - 4.9V
200
tRPU (µs)
VDD decreasing from:
5V - 4.4V
200
tRPD (µs)
35
140
MCP112-300
150
100
10
Temperature (°C)
160
20
VDD increasing
from: 0V - 4.0V
VDD decreasing from:
VTRIP(max) + 0.25V to VTRIP(min) - 0.25V
150
VDD increasing from:
0V - 5.0V
100
VDD increasing from:
0V - 5.5V
50
50
VDD decreasing from:
5V - 0V
0
0
-40
-15
FIGURE 2-21:
(MCP112-475).
DS21889B-page 8
10
35
60
Temperature (°C)
85
110
tRPD vs. Temperature
-40
-15
10
35
60
85
110
Temperature (°C)
FIGURE 2-24:
(MCP112-475).
tRPU vs. Temperature
 2004 Microchip Technology Inc.
MCP111/112
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;
see Figure 4-1), TA = –40°C to +125°C.
0.1500
60
55
0.1400
VDD increasing from:
0V - 2.1V
45
VDD increasing from:
0V - 5.5V
40
VDD increasing
from: 0V - 4.0V
35
0.1200
VDD increasing from:
0V - 4.9V
0.1100
0.1000
30
VDD increasing from:
0V - 2.8V
25
20
VDD increasing from:
0V - 5.5V
0.0900
VDD increasing from:
0V - 4.8V
0.0800
-40
-15
10
35
60
85
110
-40
Temperature (°C)
FIGURE 2-25:
(MCP111-195).
0.4
0.35
0.3
tRT (µs)
VDD increasing from:
0V - 5.0V
0.1300
tRT (µs)
50
tRT (µs)
MCP112-475
MCP111-195
-15
10
35
60
85
110
Temperature (°C)
FIGURE 2-27:
(MCP112-475).
tRT vs. Temperature
tRT vs. Temperature
VDD increasing from:
0V - 3.1V
VDD increasing from:
0V - 3.3V
0.25
0.2
VDD increasing from:
0V - 5.5V
0.15
VDD increasing from:
0V - 4.0V
0.1
0.05
MCP112-300
0
-40
-15
10
35
60
85
110
Temperature (°C)
FIGURE 2-26:
(MCP112-300).
tRT vs. Temperature
 2004 Microchip Technology Inc.
DS21889B-page 9
MCP111/112
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
Symbol
SOT23-3
SC-70
T0-92
1
1
VOUT
Function
Output State
VDD Falling:
H = VDD > VTRIP
L = VDD < VTRIP
VDD Rising:
H = VDD > VTRIP + VHYS
L = VDD < VTRIP + VHYS
2
3
VSS
Ground reference
3
2
VDD
Positive power supply
DS21889B-page 10
 2004 Microchip Technology Inc.
MCP111/112
4.0
APPLICATION INFORMATION
4.1
For many of today’s microcontroller applications, care
must be taken to prevent low-power conditions that can
cause many different system problems. The most
common causes are brown-out conditions, where the
system supply drops below the operating level momentarily. The second most common cause is when a slowly
decaying power supply causes the microcontroller to
begin executing instructions without sufficient voltage to
sustain SRAM, thus producing indeterminate results.
Figure 4-1 shows a typical application circuit.
VDD
3
0.1
µF
VTRIP Operation
The voltage trip point (VTRIP) is determined on the falling
edge of VDD. The actual voltage trip point (VTRIPAC) will
be between the minimum trip point (VTRIPMIN) and the
maximum trip point (VTRIPMAX). There is a hysteresis on
this trip point to remove any “jitter” that would occur on
the VOUT pin when the device VDD is at the trip point.
Figure 4-2 shows the state of the VOUT pin as determined by the VDD voltage. The VTRIP specification is for
falling VDD voltages. When the VDD voltage is rising, the
VOUT pin will not be driven high until VDD is at VTRIP +
VHYS.
VDD
VDD
RPU
MCP11X
VOUT
1
VSS
PICmicro®
Microcontroller
MCLR
(Reset Input)
GND
2
Note 1: RPU may be required with the MCP111
due to the open-drain output. Resistor
RPU is not required with the MCP112.
FIGURE 4-1:
VDD
Typical Application Circuit.
VTRIPAC + VHYSAC
VTRIPMAX
VTRIPAC
VTRIPMIN
VTRIPAC
1V
VOUT
< 1 V is outside the
device specifications
FIGURE 4-2:
VOUT Operation as Determined by the VTRIP and VHYS.
 2004 Microchip Technology Inc.
DS21889B-page 11
MCP111/112
4.2
Negative Going VDD Transients
The minimum pulse width (time) required to cause a
reset may be an important criteria in the implementation of a POR circuit. This time is referred to as
transient duration and is the amount of time needed for
these supervisory devices to respond to a drop in VDD.
The transient duration time is dependant on the magnitude of VTRIP – VDD. Generally speaking, the transient
duration decreases with increases in VTRIP – VDD.
4.3
Effect of Temperature on Time-out
Period (tRPU)
The time-out period (tRPU) determines how long the
device remains in the reset condition. This is affected
by both VDD and temperature. The graph shown in
Figures 2-22, 2-23 and 2-24 show the typical
response for different VDD values and temperatures.
Figure 4-3 shows a typical transient duration vs. reset
comparator overdrive for which the MCP111/112 will
not generate a reset pulse. It shows that the farther
below the trip point the transient pulse goes, the
duration of the pulse required to cause a reset gets
shorter. Figure 2-18 shows the transient response
characteristics for the MCP111/112.
A 0.1 µF bypass cap mounted as close as possible to
the VDD pin provides additional transient immunity
(refer to Figure 4-1).
Supply Voltage
5V
0V
VTRIP(MAX)
VTRIP(MIN)
VTRIP(MIN) - VDD
tTRANS
Time (µs)
FIGURE 4-3:
Example of Typical
Transient Duration Waveform.
DS21889B-page 12
 2004 Microchip Technology Inc.
MCP111/112
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
Example:
3-Lead TO-92
MCP111
290E
TO0405
256
XXXXXX
XXXXXX
XXXXXX
YWWNNN
3-Pin SC-70
Example:
Part Number
c d e
Top Side
SC-70
EPN
MCP112T-195I/LB
ERN
MCP111T-240E/LB
EQN
MCP112T-240E/LB
ESN
MCP111T-270E/LB
EGN
MCP112T-270E/LB
EAN
MCP111T-290E/LB
EHN
MCP112T-290E/LB
EBN
MCP111T-300E/LB
EJN
MCP112T-300E/LB
ECN
MCP111T-315E/LB
EKN
MCP112T-315E/LB
EDN
MCP111T-450E/LB
ELN
MCP112T-450E/LB
EEN
MCP111T-475E/LB
EMN
MCP112T-475E/LB
EFN
Example:
Part Number
cdef
Note:
Part Number
MCP111T-195I/LB
3-Pin SOT-23B
Legend:
SC-70
1
2
3
4
SOT-23
Part Number
SOT-23
MCP111T-195I/TT
MPNN
MCP112T-195I/TT
MRNN
MCP111T-240ETT
MQNN
MCP112T-240ETT
MSNN
MCP111T-270E/TT
MGNN
MCP112T-270E/TT
MANN
MCP111T-290E/TT
NHNN
MCP112T-290E/TT
MBNN
MCP111T-300E/TT
MJNN
MCP112T-300E/TT
MCNN
MCP111T-315E/TT
MKNN
MCP112T-315E/TT
MDNN
MCP111T-450E/TT
MLNN
MCP112T-450E/TT
MENN
MCP111T-475E/TT
MMNN
MCP112T-475E/TT
MFNN
Part Number + temperature range and voltage (two-digit code)
Part Number + temperature range and voltage (two-digit code)
Lot ID number
Year and work week
In the event the full Microchip part number cannot be marked on one line, it will be
carried over to the next line thus limiting the number of available characters for customer
specific information.
 2004 Microchip Technology Inc.
DS21889B-page 13
MCP111/112
3-Lead Plastic Small Outline Transistor (TT) (SOT-23)
E
E1
2
B
p1
n
D
p
1
α
c
A
φ
β
A1
L
Units
Dimension Limits
n
Number of Pins
p
Pitch
p1
Outside lead pitch (basic)
Overall Height
A
Molded Package Thickness
A2
Standoff §
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Foot Length
L
φ
Foot Angle
c
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A2
B
α
β
MIN
.035
.035
.000
.083
.047
.110
.014
0
.004
.015
0
0
INCHES*
NOM
3
.038
.076
.040
.037
.002
.093
.051
.115
.018
5
.006
.017
5
5
MAX
.044
.040
.004
.104
.055
.120
.022
10
.007
.020
10
10
MILLIMETERS
NOM
3
0.96
1.92
0.89
1.01
0.88
0.95
0.01
0.06
2.10
2.37
1.20
1.30
2.80
2.92
0.35
0.45
0
5
0.09
0.14
0.37
0.44
0
5
0
5
MIN
MAX
1.12
1.02
0.10
2.64
1.40
3.04
0.55
10
0.18
0.51
10
10
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
DS21889B-page 14
 2004 Microchip Technology Inc.
MCP111/112
3-Lead Plastic Small Outline Transistor (LB) (SC-70)
E
E1
2
B
p1
3
D
p
1
a
A2
A
c
b
A1
L
Units
Dimension Limits
Number of Pins
Pitch
Outside lead pitch (basic)
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
p
p1
A
A2
A1
E
E1
D
L
c
B
a
b
INCHES
MIN
3
.026 BSC.
.051 BSC.
.031
.031
.000
.071
.045
.071
.004
.003
.006
8°
8°
MAX
.043
.039
.0004
.094
.053
.089
.016
.010
.016
12°
12°
MILLIMETERS*
MIN
MAX
3
0.65 BSC.
1.30 BSC.
0.80
1.10
0.80
1.00
0.00
.010
1.80
2.40
1.15
1.35
1.80
2.25
0.10
0.41
0.08
0.25
0.15
0.40
8°
12°
8°
12°
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .005" (0.127mm) per side.
JEITA (EIAJ) Equivalent: SC70
Drawing No. C04-104
 2004 Microchip Technology Inc.
DS21889B-page 15
MCP111/112
3-Lead Plastic Transistor Outline (TO) (TO-92)
E1
D
n
1
L
1
2
3
α
B
p
c
A
R
Units
Dimension Limits
n
p
β
MIN
INCHES*
NOM
MAX
MILLIMETERS
NOM
3
1.27
3.30
3.62
4.45
4.71
4.32
4.64
2.16
2.29
12.70
14.10
0.36
0.43
0.41
0.48
4
5
2
3
MIN
Number of Pins
3
Pitch
.050
Bottom to Package Flat
A
.130
.143
.155
Overall Width
E1
.175
.186
.195
Overall Length
D
.170
.183
.195
Molded Package Radius
R
.085
.090
.095
Tip to Seating Plane
L
.500
.555
.610
c
Lead Thickness
.014
.017
.020
Lead Width
B
.016
.019
.022
α
4
5
6
Mold Draft Angle Top
β
Mold Draft Angle Bottom
2
3
4
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-92
Drawing No. C04-101
DS21889B-page 16
MAX
3.94
4.95
4.95
2.41
15.49
0.51
0.56
6
4
 2004 Microchip Technology Inc.
MCP111/112
5.2
Product Tape and Reel Specifications
FIGURE 5-1:
EMBOSSED CARRIER DIMENSIONS (8, 12, 16 AND 24 MM TAPE ONLY)
Top
Cover
Tape
A0
W
B0
K0
P
TABLE 1:
Case
Outline
CARRIER TAPE/CAVITY DIMENSIONS
Carrier
Dimensions
Package
Type
Cavity
Dimensions
W
mm
P
mm
A0
mm
B0
mm
K0
mm
Output
Quantity
Units
Reel
Diameter in
mm
TT
SOT-23B
3L
8
4
3.15
2.77
1.22
3000
180
LB
SC-70
3L
8
4
2.4
2.4
1.19
3000
180
3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS
Device
Marking
FIGURE 5-2:
User Direction of Feed
Device
Marking
Pin 1
W, Width
of Carrier
Tape
Pin 1
P, Pitch
Standard Reel Component Orientation
 2004 Microchip Technology Inc.
Reverse Reel Component Orientation
DS21889B-page 17
MCP111/112
FIGURE 5-3:
TO-92 DEVICES
P, Pitch
Device
Marking
3 LEAD
TO-92
W, Width of
Carrier Tape
Device
Marking
2 LEAD
TO-92
W, Width of
Carrier Tape
Reverse Reel
Component Orientation
Standard Reel
Component Orientation
H1
H
W6
H0
D
F1
F
F2
P1
P2
DS21889B-page 18
 2004 Microchip Technology Inc.
MCP111/112
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
XXX
X
X
XX
Tape/Reel Monitoring Temperature Package
Range
Option
Options
Examples:
a)
b)
Device:
MCP111: MicroPower Voltage Detector, open-drain
MCP111T: MicroPower Voltage Detector, open-drain
(Tape and Reel)
MCP112: MicroPower Voltage Detector, push-pull
MCP112T: MicroPower Voltage Detector, push-pull
(Tape and Reel)
c)
a)
Monitoring Options:
195
240
270
290
300
315
450
475
=
=
=
=
=
=
=
=
1.90V
2.32V
2.63V
2.90V
2.93V
3.08V
4.38V
4.63V
Temperature Range:
I
E
= -40°C to +85°C (MCP11X-195 only)
= -40°C to +125°C (Except MCP11X-195 only)
Package:
TT = SOT-23B, 3-lead
LB = SC-70, 3-lead
TO = TO-92, 3-lead
b)
c)
MCP111T-195I/TT: Tape and Reel,
1.95V option, open-drain,
-40°C to +85°C,
SOT-23B package.
MCP111T-315E/LB: Tape and Reel,
3.15V option, open-drain,
-40°C to +125°C,
SC-70-3 package.
MCP111-300E/TO: 3.00V option, open-drain,
-40°C to +125°C,
TO-92-3 package.
MCP112T-290E/TT: Tape and Reel,
2.90V option, push-pull, 40°C to +125°C,
SOT-23B-3 package.
MCP112T-475E/LB: Tape and Reel,
4.75V option, push-pull,
-40°C to +125°C,
SC-70-3 package.
MCP112-450E/TO: 4.5V option, push-pull,
-40°C to +125°C,
TO-92-3 package.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2004 Microchip Technology Inc.
DS21889B-page 19
MCP111/112
NOTES:
DS21889B-page 20
 2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL,
SmartSensor and The Embedded Control Solutions Company
are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Migratable Memory, MPASM,
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,
SmartTel and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
 2004 Microchip Technology Inc.
DS21889B-page 21
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
480-792-7627
Web Address:
www.microchip.com
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
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Tel: 91-80-2229-0061
Fax: 91-80-2229-0062
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
India - New Delhi
Tel: 91-11-5160-8632
Fax: 91-11-5160-8632
Austria - Weis
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark - Ballerup
Tel: 45-4420-9895
Fax: 45-4420-9910
China - Chengdu
Tel: 86-28-8676-6200
Fax: 86-28-8676-6599
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Tel: 81-45-471- 6166
Fax: 81-45-471-6122
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Tel: 33-1-69-53-63-20
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Tel: 86-591-750-3506
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Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
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Canada
Tel: 905-673-0699
Fax: 905-673-6509
08/24/04
DS21889B-page 22
 2004 Microchip Technology Inc.