TI DS90LV047ATMTC Ds90lv047a 3v lvds quad cmos differential line driver Datasheet

DS90LV047A
www.ti.com
SNLS044C – MAY 2000 – REVISED APRIL 2013
DS90LV047A 3V LVDS Quad CMOS Differential Line Driver
Check for Samples: DS90LV047A
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
•
•
•
The DS90LV047A is a quad CMOS flow-through
differential line driver designed for applications
requiring ultra low power dissipation and high data
rates. The device is designed to support data rates in
excess of 400 Mbps (200 MHz) utilizing Low Voltage
Differential Signaling (LVDS) technology.
1
2
•
•
•
>400 Mbps (200 MHz) Switching Rates
Flow-Through Pinout Simplifies PCB Layout
300 ps Typical Differential Skew
400 ps Maximum Differential Skew
1.7 ns Maximum Propagation Delay
3.3V Power Supply Design
±350 mV Differential Signaling
Low Power Dissipation (13mW at 3.3V Static)
Interoperable with Existing 5V LVDS Receivers
High impedance on LVDS Outputs on Power
Down
Conforms to TIA/EIA-644 LVDS Standard
Industrial Operating Temperature Range
(−40°C to +85°C)
Available in Surface Mount (SOIC) and Low
Profile TSSOP Package
The DS90LV047A accepts low voltage TTL/CMOS
input levels and translates them to low voltage (350
mV) differential output signals. In addition, the driver
supports a TRI-STATE function that may be used to
disable the output stage, disabling the load current,
and thus dropping the device to an ultra low idle
power state of 13 mW typical. The DS90LV047A has
a flow-through pinout for easy PCB layout.
The EN and EN* inputs are ANDed together and
control the TRI-STATE outputs. The enables are
common to all four drivers. The DS90LV047A and
companion line receiver (DS90LV048A) provide a
new alternative to high power psuedo-ECL devices
for high speed point-to-point interface applications.
Connection Diagram
Figure 1. Order Number DS90LV047ATM, DS90LV047ATMTC
D0016A, PW0016A Packages
Truth Table
ENABLES
INPUT
OUTPUTS
EN
EN*
DIN
DOUT+
DOUT−
H
L or Open
L
L
H
H
H
L
X
Z
Z
All other combinations of ENABLE inputs
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
DS90LV047A
SNLS044C – MAY 2000 – REVISED APRIL 2013
www.ti.com
Functional Diagram
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)
−0.3V to +4V
Supply Voltage (VCC)
Input Voltage (DIN)
−0.3V to (VCC + 0.3V)
Enable Input Voltage (EN, EN*)
−0.3V to (VCC + 0.3V)
−0.3V to +3.9V
Output Voltage (DOUT+, DOUT−)
Short Circuit Duration
(DOUT+, DOUT−)
Continuous
D0016A Package
Maximum Package Power Dissipation @ +25°C
1088 mW
PW0016A Package
866 mW
Derate D0016A Package
8.5 mW/°C above +25°C
Derate PW0016A Package
6.9 mW/°C above +25°C
−65°C to +150°C
Storage Temperature Range
Lead Temperature Range
Soldering (4 sec.)
+260°C
(HBM, 1.5 kΩ, 100 pF)
≥ 10 kV
Maximum Junction Temperature
ESD Rating (2)
(1)
(2)
+150°C
(EIAJ, 0 Ω, 200 pF)
≥ 1200 V
“Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply
that the devices should be operated at these limits. Electrical Characteristics specifies conditions of device operation.
ESD Ratings:
HBM (1.5 kΩ, 100 pF) ≥ 10 kV
EIAJ (0 Ω, 200 pF) ≥ 1200 V
Recommended Operating Conditions
Min
Typ
Max
Supply Voltage (VCC)
+3.0
+3.3
+3.6
V
Operating Free Air Temperature (TA)
−40
+25
+85
°C
2
Submit Documentation Feedback
Units
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV047A
DS90LV047A
www.ti.com
SNLS044C – MAY 2000 – REVISED APRIL 2013
Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified (1) (2) (3)
Symbol
Parameter
Conditions
VOD1
Differential Output Voltage
ΔVOD1
Change in Magnitude of VOD1 for
Complementary Output States
VOS
Offset Voltage
ΔVOS
Change in Magnitude of VOS for
Complementary Output States
VOH
Output High Voltage
VOL
Output Low Voltage
VIH
Input High Voltage
VIL
Input Low Voltage
IIH
Input High Current
VIN = VCC or 2.5V
IIL
Input Low Current
VIN = GND or 0.4V
VCL
Input Clamp Voltage
ICL = −18 mA
IOS
Output Short Circuit Current (4)
ENABLED,
DIN = VCC, DOUT+ = 0V or
DIN = GND, DOUT− = 0V
IOSD
Differential Output Short Circuit
Current (4)
ENABLED, VOD = 0V
IOFF
Power-off Leakage
VOUT = 0V or 3.6V, VCC = 0V or
Open
IOZ
Output TRI-STATE Current
EN = 0.8V and EN* = 2.0V
VOUT = 0V or VCC
ICC
No Load Supply current Drivers
Enabled
DIN = VCC or GND
ICCL
Loaded Supply Current Drivers
Enabled
ICCZ
No Load Supply Current Drivers
Disabled
(1)
(2)
(3)
(4)
RL = 100Ω (Figure 2)
Pin
Min
Typ
Max
DOUT−
DOUT+
250
310
450
mV
1
35
|mV|
1.17
1.375
V
1
25
|mV|
1.33
1.6
V
1.125
0.90
DIN,
EN,
EN*
Units
1.02
V
2.0
VCC
GND
0.8
V
2
+10
μA
−10
−2
+10
μA
−1.5
−0.8
−4.2
−9.0
mA
−4.2
−9.0
mA
−20
±1
+20
μA
−10
±1
+10
μA
4.0
8.0
mA
RL = 100Ω All Channels, DIN = VCC
or GND (all inputs)
20
30
mA
DIN = VCC or GND, EN = GND, EN*
= VCC
2.2
6.0
mA
−10
DOUT−
DOUT+
VCC
V
V
Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except: VOD1 and ΔVOD1.
All typicals are given for: VCC = +3.3V, TA = +25°C.
The DS90LV047A is a current mode device and only functions within datasheet specifications when a resistive load is applied to the
driver outputs typical range is (90Ω to 110Ω).
Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV047A
3
DS90LV047A
SNLS044C – MAY 2000 – REVISED APRIL 2013
www.ti.com
Switching Characteristics
VCC = +3.3V ± 10%, TA = −40°C to +85°C (1) (2) (3)
Symbol
Parameter
Conditions
RL = 100Ω, CL = 15 pF
(Figure 3 and Figure 4)
Min
Typ
Max
Units
0.5
0.9
1.7
ns
0.5
1.2
1.7
ns
tPHLD
Differential Propagation Delay High to Low
tPLHD
Differential Propagation Delay Low to High
tSKD1
Differential Pulse Skew |tPHLD − tPLHD| (4)
0
0.3
0.4
ns
tSKD2
Channel-to-Channel Skew (5)
0
0.4
0.5
ns
tSKD3
Differential Part to Part Skew
(6)
0
1.0
ns
tSKD4
Differential Part to Part Skew (7)
0
1.2
ns
tTLH
Rise Time
0.5
1.5
ns
tTHL
Fall Time
0.5
1.5
ns
tPHZ
Disable Time High to Z
2
5
ns
tPLZ
Disable Time Low to Z
2
5
ns
tPZH
Enable Time Z to High
3
7
ns
tPZL
Enable Time Z to Low
3
7
fMAX
Maximum Operating Frequency (8)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
RL = 100Ω, CL = 15 pF
(Figure 5 and Figure 6)
200
250
ns
MHz
All typicals are given for: VCC = +3.3V, TA = +25°C.
Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr ≤ 1 ns, and tf ≤ 1 ns.
CL includes probe and jig capacitance.
tSKD1 |tPHLD − tPLHD| is the magnitude difference in differential propagation delay time between the positive going edge and the negative
going edge of the same channel.
tSKD2 is the Differential Channel-to-Channel Skew of any event on the same device.
tSKD3, Differential Part to Part Skew, is defined as the difference between the minimum and maximum specified differential propagation
delays. This specification applies to devices at the same VCC and within 5°C of each other within the operating temperature range.
tSKD4, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices
over recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min|
differential propagation delay.
fMAX generator input conditions: tr = tf < 1 ns (0% to 100%), 50% duty cycle, 0V to 3V. Output Criteria: duty cycle = 45%/55%, VOD >
250mV, all channels switching.
Parameter Measurement Information
Figure 2. Driver VOD and VOS Test Circuit
Figure 3. Driver Propagation Delay and Transition Time Test Circuit
4
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV047A
DS90LV047A
www.ti.com
SNLS044C – MAY 2000 – REVISED APRIL 2013
Parameter Measurement Information (continued)
Figure 4. Driver Propagation Delay and Transition Time Waveforms
Figure 5. Driver TRI-STATE Delay Test Circuit
Figure 6. Driver TRI-STATE Delay Waveform
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV047A
5
DS90LV047A
SNLS044C – MAY 2000 – REVISED APRIL 2013
www.ti.com
Typical Application
Figure 7. Point-to-Point Application
APPLICATION INFORMATION
General application guidelines and hints for LVDS drivers and receivers may be found in the following application
notes: LVDS Owner's Manual (lit #550062-001), AN808, AN977, AN971, AN916, AN805, AN903.
LVDS drivers and receivers are intended to be primarily used in an uncomplicated point-to-point configuration as
is shown in Figure 7. This configuration provides a clean signaling environment for the fast edge rates of the
drivers. The receiver is connected to the driver through a balanced media which may be a standard twisted pair
cable, a parallel pair cable, or simply PCB traces. Typically, the characteristic differential impedance of the media
is in the range of 100Ω. A termination resistor of 100Ω (selected to match the media), and is located as close to
the receiver input pins as possible. The termination resistor converts the driver output current (current mode) into
a voltage that is detected by the receiver. Other configurations are possible such as a multi-receiver
configuration, but the effects of a mid-stream connector(s), cable stub(s), and other impedance discontinuities as
well as ground shifting, noise margin limits, and total termination loading must be taken into account.
The DS90LV047A differential line driver is a balanced current source design. A current mode driver, generally
speaking has a high output impedance and supplies a constant current for a range of loads (a voltage mode
driver on the other hand supplies a constant voltage for a range of loads). Current is switched through the load in
one direction to produce a logic state and in the other direction to produce the other logic state. The output
current is typically 3.1 mA, a minimum of 2.5 mA, and a maximum of 4.5 mA. The current mode driver requires
(as discussed above) that a resistive termination be employed to terminate the signal and to complete the loop
as shown in Figure 7. AC or unterminated configurations are not allowed. The 3.1 mA loop current will develop a
differential voltage of 310mV across the 100Ω termination resistor which the receiver detects with a 250mV
minimum differential noise margin, (driven signal minus receiver threshold (250mV – 100mV = 150mV)). The
signal is centered around +1.2V (Driver Offset, VOS) with respect to ground as shown in Figure 8. Note that the
steady-state voltage (VSS) peak-to-peak swing is twice the differential voltage (VOD) and is typically 620mV.
The current mode driver provides substantial benefits over voltage mode drivers, such as an RS-422 driver. Its
quiescent current remains relatively flat versus switching frequency. Whereas the RS-422 voltage mode driver
increases exponentially in most case between 20 MHz–50 MHz. This is due to the overlap current that flows
between the rails of the device when the internal gates switch. Whereas the current mode driver switches a fixed
current between its output without any substantial overlap current. This is similar to some ECL and PECL
devices, but without the heavy static ICC requirements of the ECL/PECL designs. LVDS requires > 80% less
current than similar PECL devices. AC specifications for the driver are a tenfold improvement over other existing
RS-422 drivers.
The TRI-STATE function allows the driver outputs to be disabled, thus obtaining an even lower power state when
the transmission of data is not required.
The DS90LV047A has a flow-through pinout that allows for easy PCB layout. The LVDS signals on one side of
the device easily allows for matching electrical lengths of the differential pair trace lines between the driver and
the receiver as well as allowing the trace lines to be close together to couple noise as common-mode. Noise
isolation is achieved with the LVDS signals on one side of the device and the TTL signals on the other side.
6
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV047A
DS90LV047A
www.ti.com
SNLS044C – MAY 2000 – REVISED APRIL 2013
POWER DECOUPLING RECOMMENDATIONS
Bypass capacitors must be used on power pins. Use high frequency ceramic (surface mount is recommended)
0.1μF and 0.001μF capacitors in parallel at the power supply pin with the smallest value capacitor closest to the
device supply pin. Additional scattered capacitors over the printed circuit board will improve decoupling. Multiple
vias should be used to connect the decoupling capacitors to the power planes. A 10μF (35V) or greater solid
tantalum capacitor should be connected at the power entry point on the printed circuit board between the supply
and ground.
PC BOARD CONSIDERATIONS
Use at least 4 PCB layers (top to bottom); LVDS signals, ground, power, TTL signals.
Isolate TTL signals from LVDS signals, otherwise the TTL may couple onto the LVDS lines. It is best to put TTL
and LVDS signals on different layers which are isolated by a power/ground plane(s).
Keep drivers and receivers as close to the (LVDS port side) connectors as possible.
DIFFERENTIAL TRACES
Use controlled impedance traces which match the differential impedance of your transmission medium (ie. cable)
and termination resistor. Run the differential pair trace lines as close together as possible as soon as they leave
the IC (stubs should be < 10mm long). This will help eliminate reflections and ensure noise is coupled as
common-mode. In fact, we have seen that differential signals which are 1mm apart radiate far less noise than
traces 3mm apart since magnetic field cancellation is much better with the closer traces. In addition, noise
induced on the differential lines is much more likely to appear as common-mode which is rejected by the
receiver.
Match electrical lengths between traces to reduce skew. Skew between the signals of a pair means a phase
difference between signals which destroys the magnetic field cancellation benefits of differential signals and EMI
will result. (Note the velocity of propagation, v = c/Er where c (the speed of light) = 0.2997mm/ps or 0.0118
in/ps). Do not rely solely on the autoroute function for differential traces. Carefully review dimensions to match
differential impedance and provide isolation for the differential lines. Minimize the number or vias and other
discontinuities on the line.
Avoid 90° turns (these cause impedance discontinuities). Use arcs or 45° bevels.
Within a pair of traces, the distance between the two traces should be minimized to maintain common-mode
rejection of the receivers. On the printed circuit board, this distance should remain constant to avoid
discontinuities in differential impedance. Minor violations at connection points are allowable.
TERMINATION
Use a termination resistor which best matches the differential impedance or your transmission line. The resistor
should be between 90Ω and 130Ω. Remember that the current mode outputs need the termination resistor to
generate the differential voltage. LVDS will not work without resistor termination. Typically, connecting a single
resistor across the pair at the receiver end will suffice.
Surface mount 1% to 2% resistors are best. PCB stubs, component lead, and the distance from the termination
to the receiver inputs should be minimized. The distance between the termination resistor and the receiver
should be < 10mm (12mm MAX).
PROBING LVDS TRANSMISSION LINES
Always use high impedance (> 100kΩ), low capacitance (< 2 pF) scope probes with a wide bandwidth (1 GHz)
scope. Improper probing will give deceiving results.
CABLES AND CONNECTORS, GENERAL COMMENTS
When choosing cable and connectors for LVDS it is important to remember:
Use controlled impedance media. The cables and connectors you use should have a matched differential
impedance of about 100Ω. They should not introduce major impedance discontinuities.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV047A
7
DS90LV047A
SNLS044C – MAY 2000 – REVISED APRIL 2013
www.ti.com
Balanced cables (e.g. twisted pair) are usually better than unbalanced cables (ribbon cable, simple coax.) for
noise reduction and signal quality. Balanced cables tend to generate less EMI due to field canceling effects and
also tend to pick up electromagnetic radiation a common-mode (not differential mode) noise which is rejected by
the receiver.
For cable distances < 0.5M, most cables can be made to work effectively. For distances 0.5M ≤ d ≤ 10M, CAT 3
(category 3) twisted pair cable works well, is readily available and relatively inexpensive.
LVDS FAIL-SAFE
This section addresses the common concern of fail-safe biasing of LVDS interconnects, specifically looking at the
DS90LV047A driver outputs and the DS90LV048A receiver inputs.
The LVDS receiver is a high gain, high speed device that amplifies a small differential signal (20mV) to CMOS
logic levels. Due to the high gain and tight threshold of the receiver, care should be taken to prevent noise from
appearing as a valid signal.
The receiver's internal fail-safe circuitry is designed to source/sink a small amount of current, providing fail-safe
protection (a stable known state of HIGH output voltage) for floating, terminated or shorted receiver inputs.
1. Open Input Pins. The DS90LV048A is a quad receiver device, and if an application requires only 1, 2 or 3
receivers, the unused channel(s) inputs should be left OPEN. Do not tie unused receiver inputs to ground or
any other voltages. The input is biased by internal high value pull up and pull down resistors to set the output
to a HIGH state. This internal circuitry will ensure a HIGH, stable output state for open inputs.
2. Terminated Input. If the DS90LV047A driver is disconnected (cable unplugged), or if the DS90LV047A
driver is in a TRI-STATE or power-off condition, the receiver output will again be in a HIGH state, even with
the end of cable 100Ω termination resistor across the input pins. The unplugged cable can become a floating
antenna which can pick up noise. If the cable picks up more than 10mV of differential noise, the receiver may
see the noise as a valid signal and switch. To insure that any noise is seen as common-mode and not
differential, a balanced interconnect should be used. Twisted pair cable will offer better balance than flat
ribbon cable.
3. Shorted Inputs. If a fault condition occurs that shorts the receiver inputs together, thus resulting in a 0V
differential input voltage, the receiver output will remain in a HIGH state. Shorted input fail-safe is not
supported across the common-mode range of the device (GND to 2.4V). It is only supported with inputs
shorted and no external common-mode voltage applied.
External lower value pull up and pull down resistors (for a stronger bias) may be used to boost fail-safe in the
presence of higher noise levels. The pull up and pull down resistors should be in the 5kΩ to 15kΩ range to
minimize loading and waveform distortion to the driver. The common-mode bias point should be set to
approximately 1.2V (less than 1.75V) to be compatible with the internal circuitry.
Figure 8. Driver Output Levels
8
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV047A
DS90LV047A
www.ti.com
SNLS044C – MAY 2000 – REVISED APRIL 2013
PIN DESCRIPTIONS
Pin No.
Name
Description
2, 3, 6, 7
DIN
10, 11, 14, 15
DOUT+
Driver input pin, TTL/CMOS compatible
Non-inverting driver output pin, LVDS levels
9, 12, 13, 16
DOUT−
Inverting driver output pin, LVDS levels
1
EN
Driver enable pin: When EN is low, the driver is disabled. When EN is high and EN*
is low or open, the driver is enabled. If both EN and EN* are open circuit, then the
driver is disabled.
8
EN*
Driver enable pin: When EN* is high, the driver is disabled. When EN* is low or
open and EN is high, the driver is enabled. If both EN and EN* are open circuit, then
the driver is disabled.
4
VCC
Power supply pin, +3.3V ± 0.3V
5
GND
Ground pin
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV047A
9
DS90LV047A
SNLS044C – MAY 2000 – REVISED APRIL 2013
www.ti.com
Typical Performance Curves
10
Figure 9. Output High Voltage vs Power Supply Voltage
Figure 10. Output Low Voltage vs Power Supply Voltage
Figure 11. Output Short Circuit Current vs
Power Supply Voltage
Figure 12. Output TRI-STATE Current vs
Power Supply Voltage
Figure 13. Differential Output Voltage vs
Power Supply Voltage
Figure 14. Differential Output Voltage vs Load Resistor
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV047A
DS90LV047A
www.ti.com
SNLS044C – MAY 2000 – REVISED APRIL 2013
Typical Performance Curves (continued)
Figure 15. Offset Voltage vs Power Suppy Voltage
Figure 16. Power Supply Current vs Frequency
Figure 17. Power Supply Current vs Power Supply Voltage
Figure 18. Power Supply Current vs Ambient Temperature
Figure 19. Differential Propagation Delay vs
Power Supply Voltage
Figure 20. Differential Propagation Delay vs
Ambient Temperature
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV047A
11
DS90LV047A
SNLS044C – MAY 2000 – REVISED APRIL 2013
www.ti.com
Typical Performance Curves (continued)
Figure 21. Differential Skew vs Power Supply Voltage
Figure 22. Differential Skew vs Ambient Temperature
Figure 23. Transition Time vs Power Supply Voltage
Figure 24. Transition Time vs Ambient Temperature
Figure 25. Data Rate vs Cable Length
12
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV047A
DS90LV047A
www.ti.com
SNLS044C – MAY 2000 – REVISED APRIL 2013
Data Rate vs Cable Length Graph Test Procedure
A pseudo-random bit sequence (PRBS) of 29−1 bits was programmed into a function generator (Tektronix
HFS9009) and connected to the driver inputs via 50Ω cables and SMB connectors. An oscilloscope (Tektronix
11801B) was used to probe the resulting eye pattern, measured differentially at the input to the receiver. A 100Ω
resistor was used to terminate the pair at the far end of the cable. The measurements were taken at the far end
of the cable, at the receiver"s input, and used for the jitter analysis for this graph (Figure 25). The frequency of
the input signal was increased until the measured jitter (ttcs) equaled 20% with respect to the unit interval (ttui) for
the particular cable length under test. Twenty percent jitter is a reasonable place to start with many system
designs. The data used was NRZ. Jitter was measured at the 0V differential voltage of the differential eye
pattern. The cables used were LG UTP 4 pair 24 gauge CAT 5 cables. The DS90LV047A and DS90LV048A
were tested using the new LVDS Flow-Evaluation Board LVDS47/48PCB which is available in the
LVDS47/48EVK evaluation kit.
The curve shows very good typical performance that can be used as a design guideline for data rate vs cable
length. Increasing the jitter percentage increases the curve respectively, allowing the device to transmit faster
over longer cable lengths. This relaxes the jitter tolerance of the system allowing more jitter into the system,
which could reduce the reliability and efficiency of the system. Alternatively, decreasing the jitter percentage will
have the opposite effect on the system. The area under the curve is considered the safe operating area based
on the above signal quality criteria. For more information on eye pattern testing, please see TI Application Note
AN-808.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV047A
13
DS90LV047A
SNLS044C – MAY 2000 – REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
•
14
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 13
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV047A
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DS90LV047ATM
NRND
SOIC
D
16
48
TBD
Call TI
Call TI
-40 to 85
DS90LV047A
TM
DS90LV047ATM/NOPB
ACTIVE
SOIC
D
16
48
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
DS90LV047A
TM
DS90LV047ATMTC
NRND
TSSOP
PW
16
92
TBD
Call TI
Call TI
-40 to 85
DS90LV
047AT
DS90LV047ATMTC/NOPB
ACTIVE
TSSOP
PW
16
92
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
DS90LV
047AT
DS90LV047ATMTCX
NRND
TSSOP
PW
16
2500
TBD
Call TI
Call TI
-40 to 85
DS90LV
047AT
DS90LV047ATMTCX/NOPB
ACTIVE
TSSOP
PW
16
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
DS90LV
047AT
DS90LV047ATMX/NOPB
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
DS90LV047A
TM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DS90LV047ATMTCX
TSSOP
PW
16
2500
330.0
12.4
6.95
8.3
1.6
8.0
12.0
Q1
DS90LV047ATMX/NOPB
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.3
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS90LV047ATMTCX
TSSOP
PW
16
2500
367.0
367.0
35.0
DS90LV047ATMX/NOPB
SOIC
D
16
2500
367.0
367.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated