MAS MAS1634AA1WA611 Quad led driver ic Datasheet

DA1634.001
28 November, 2008
MAS1634
Quad LED Driver IC
•
•
•
•
Quad Current Sink Output
Wide Supply Voltage Range
Low Power Consumption
Power Down Control
DESCRIPTION
MAS1634 is a quad LED driver IC. It has four
constant current sink type outputs for driving up to
four LEDs. It has wide supply voltage range and low
power consumption ideally suitable for low power
applications. MAS1634 can be set into power down
mode by a power down control pin. The LED driver
control inputs have pull down resistors and which are
disabled in the power down mode.
FEATURES
APPLICATIONS
•
•
•
•
Quad Current Sink Output, 2.1 mA typ
Wide Supply Voltage Range from 1.0 V to 3.1 V
Low Power Consumption
Power Down Control
•
•
LED Driver for Portable Low Power Application
IR LED Driver for Optical Hand Position Detection
of Radio Controlled Watch
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28 November, 2008
BLOCK DIAGRAM
VDD1
VDD2
XPD
DUMMY
&
IN1
OUT1
IN2
OUT2
IN3
OUT3
IN4
OUT4
MAS1634
4 x LED Driver
GND1
GND2
Figure 1. MAS1634 Block Diagram
Figure 1 presents MAS1634 block diagram.
MAS1634 consists of four fixed current sink outputs
for driving VDD connected LEDs. Each LED driver
can be turned on or off independently. There is also
common power-down control pin XPD which is
active when low.
The dummy pad is electrically unconnected and its
only purpose is to make the pad layout symmetrical
which helps in making the flip-chip connection even
more reliable.
VDD1 and VDD2 power supply pins are internally
connected making only one supply voltage
connection necessary. Also GND1 and GND2 pins
are internally connected so that it is necessary to
connect only one of the two ground pins to supply
ground.
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ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Supply Voltage
Storage Temperature
Input Voltage
Latch-up Current Limit
VDD
TST
VIN
ILUT
Conditions
Min
Max
Unit
For all pins (see note 1)
-0.3
-55
-0.3
-100
6.0
+125
VDD+0.3
100
V
C
V
mA
o
Stresses beyond those listed may cause permanent damage to the device. The device may not operate under these conditions, but it will
not be destroyed.
This is a CMOS device and therefore it should be handled carefully to avoid any damage by static voltages (ESD).
Note 1. In latch-up testing the supply voltages are connected normally to the tested device. Then pulsed test current is fed to each input
separately and device current consumption is observed. If the device current consumption increases suddenly due to test current pulses
and the abnormally high current consumption continues after test current pulses are cut off then the device has gone to latch up. Current
pulse is turned on for 10 ms and off for 20 ms. Testing is done up to ± 300 mA.
ELECTRICAL CHARACTERISTICS
(Operating Conditions: VDD = 2.0V, Temperature = 25°C unless otherwise mentioned)
Parameter
Supply Voltage
Operating
Temperature
Standby Current
Quiescent Current
Current driver
Leakage current of
an output
Input high voltage
Input low voltage
Start up time
Symbol
VDD
TA
Conditions
ISS
ISC
XPD = “0”
XPD = “1”, OUTPUTS OFF (INx=”0”)
XPD = “1”, 1 OUTPUT ON
XPD = “1”, 2 OUTPUTS ON
XPD = “1”, 3 OUTPUTS ON
XPD = “1”, 4 OUTPUTS ON
XPD = “1”
VDD = 0.95V, OUT1-4 = 0.075V
VDD = 1.15V, OUT1-4 = 0.025V
VDD = 1.15V, OUT1-4 = 0.075V
VDD = 1.25V, OUT1-4 = 0.175V
VDD = 1.70V, OUT1-4 = 0.625V
VDD = 1.70 V, VOUT1-4 = VDD
VIN1-4 = GND
ICD
Ileak
VIH
VIL
tst
Min
1.0
-20
1.4
1
1.4
1.4
1.4
Typ
2.0
+25
Max
3.1
+60
Unit
V
ºC
µA
µA
140
270
390
500
0.5
0.5
300
500
700
900
4.5
4.0
3.45
3
3
100
mA
VDD
0.2*VDD
50
V
V
µs
2.1
1.8
2.1
2.1
2.1
0.8*VDD
GND
VDD = 1.15 V
15
nA
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FUNCTIONAL DESCRIPTION
◆ Main Functions
◆ Inverting input buffer
MAS1634 has two functional blocks. First is the LED
driver to drive LEDs in a wrist watch applications.
Second is Bias voltage generator for generating bias
current for the drivers
The inverting buffers buffer the input signals. These
blocks also contain pull-down resistors and they are
switched in an inactive high impedance state if the
XPD input is low.
◆ Operating Modes
If the XPD pin is high then the INx inputs have pull
down by the pull down resistors. Nominally the
values of the pull down resistors are 1.7 MΩ but
they can vary ±15%.
MAS1634 has two operating modes. These modes
are simply ON and OFF modes.
ON mode is selected when XPD is high. In ON
mode each of the four output drivers can be
switched on separately by setting each of the INx
control inputs high. If control input is low the
corresponding current output driver is off. If all
control inputs are low the bias generator is turned
off.
OFF mode is selected when XPD is low. In OFF
mode the bias generator and the current drivers are
in power down.
The device has two supply voltage pins VDD1 and
VDD2 and which are internally connected. It is
sufficient to connect only one of the two supply pins
but if both supplies are connected then they should
be connected to same voltage potential.
The XPD input doesn’t have pull down resistor so
this input must be driven by the controller or be
connected to VDD (always ON mode) in order to
achieve properly controlled operation.
◆ Output Driver
Four switchable low-voltage 2.1 mA constant current
sinks with very low drop-out voltage are
implemented to drive external VDD connected
LEDs.
◆ Bias Generator
Bias voltage generator supplies bias current for the
output drivers. It is turned on if XPD is high and if
any of the four control inputs is high.
The device has also two supply ground pins GND1
and GND2 and which are internally connected. It is
sufficient to connect only one of the two ground pins
but if both grounds are connected then they should
be connected to same ground potential.
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MAS1634 PAD LAYOUT
VDD1
GND1
XPD
DUMMY
IN1
OUT1
IN2
OUT2
IN3
OUT3
MAS1634
IN4
VDD2
OUT4
GND2
1660 µm (Y-scribe line width 210 µm)
1580 µm (X-scribe line width 100 µm)
DIE size = 1.58 mm x 1.66 mm; PAD size = 90 µm x 90 µm
Note: Because the substrate of the die is internally connected to VSS, the die has to be connected to VSS or left
floating. Please make sure that GND1 and GND2 are the first pads to be bonded. Pick-and-place and all
component assembly are recommended to be performed in ESD protected area.
MAS1634 PAD COORDINATES
Note: Coordinates are pad center points where origin has been located in bottom-left corner of the silicon die.
Pad Identification
Positive Power Supply
Power Down Input
LED Current Driver Input 1
LED Current Driver Input 2
LED Current Driver Input 3
LED Current Driver Input 4
Positive Power Supply
Power Supply Ground
Unused Dummy Pad
LED Current Driver Output 1
LED Current Driver Output 2
LED Current Driver Output 3
LED Current Driver Output 4
Power Supply Ground
Name
X-coordinate
Y-coordinate
Note
VDD1
XPD
IN1
IN2
IN3
IN4
VDD2
GND1
DUMMY
OUT1
OUT2
OUT3
OUT4
GND2
158 µm
158 µm
158 µm
158 µm
158 µm
158 µm
158 µm
1422 µm
1422 µm
1422 µm
1422 µm
1422 µm
1422 µm
1422 µm
1435 µm
1225 µm
1014 µm
814 µm
603 µm
392 µm
182 µm
1435 µm
1225 µm
1014 µm
814 µm
603 µm
392 µm
182 µm
1
3
4
4
4
4
1
2
5
2
Notes:
1) Keep VDD1 and VDD2 in same potential since both are internally connected together. Due to internal
connection it is only necessary to connect at least one of the two VDD pins to supply voltage.
2) Keep GND1 and GND2 in same potential since both are internally connected together. Due to internal
connection it is only necessary to connect at least one of the two GND pins to supply ground.
3) Power down mode when XPD is low and operating mode when XPD is high.
4) Each led driver input has 1.7MΩ ± 15% pull-down resistor but which are in an inactive high impedance state
if the XPD input is low (i.e. power down mode). This is the reason why XPD pin requires external control to
achieve properly controlled operation.
5) Dummy pad is electrically unconnected and its only purpose is to make pad layout symmetrical.
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TYPICAL APPLICATION
VDD
VDD
VDD1
VDD2
XPD
DUMMY
&
VDD
OUT1
IN1
VDD
OUT2
IN2
MCU
VDD
OUT3
IN3
VDD
OUT4
IN4
MAS1634
GND1
4 x LED Driver
GND
GND2
GND
Figure 2. Application circuit of MAS1634 quad LED driver
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MAS1634 SAMPLES IN DIL-20 PACKAGE
1
20
19 GND1
18
2
VDD1 3
IN2 6
IN3 7
IN4 8
MAS1634xx
YYWW
XXXXX.X
XPD 4
IN1 5
VDD2 9
17 OUT1
16 OUT2
15 OUT3
14 OUT4
13 GND2
12
11
10
Top Marking Definitions:
YYWW = Year Week
XXXXX.X = Lot Number
xx = Sample Version
PIN DESCRIPTION
Pin Name
VDD1
XPD
IN1
IN2
IN3
IN4
VDD2
GND2
OUT4
OUT3
OUT2
OUT1
GND1
Pin
Type
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
NC
NC
P
DI
DI
DI
DI
DI
P
NC
NC
NC
G
AO
AO
AO
AO
NC
G
NC
Function
Note
Positive Power Supply
Power Down Input
LED Current Driver Input 1
LED Current Driver Input 2
LED Current Driver Input 3
LED Current Driver Input 4
Positive Power Supply
1
3
4
4
4
4
1
Power Supply Ground
LED Current Driver Output 4
LED Current Driver Output 3
LED Current Driver Output 2
LED Current Driver Output 1
2
Power Supply Ground
2
A = Analog, D = Digital, P = Power, G = Ground, I = Input, O = Output, NC = Not Connected
Notes:
1) Keep VDD1 and VDD2 in same potential since both are internally connected together. Due to internal
connection it is only necessary to connect at least one of the two VDD pins to supply voltage.
2) Keep GND1 and GND2 in same potential since both are internally connected together. Due to internal
connection it is only necessary to connect at least one of the two GND pins to supply ground.
3) Power down mode when XPD is low and operating mode when XPD is high.
4) Each led driver input has 1.7MΩ ± 15% pull-down resistor but which are in an inactive high impedance
state if the XPD input is low (i.e. power down mode). This is the reason why XPD pin requires external
control to achieve properly controlled operation.
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28 November, 2008
ORDERING INFORMATION
Product Code
Product
Description
MAS1634AA1WA611
Quad LED Driver IC
EWS-tested 300 µm thick MAS1634 wafer
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy
Kamreerintie 2, P.O. Box 51
FIN-02771 Espoo, FINLAND
Tel. +358 9 80 521
Fax +358 9 805 3213
http://www.mas-oy.com
NOTICE
Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or
performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits
shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no
claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and
Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or
modification.
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