TI BQ27510DRZT-G3 System-side impedance track fuel gauge with direct battery connection Datasheet

bq27510-G3
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SLUSAT1 – MARCH 2013
System-Side Impedance Track™ Fuel Gauge With Direct Battery Connection
FEATURES
APPLICATIONS
•
•
•
•
•
1
23
•
•
•
Single series cell Li-Ion battery fuel gauge
resides on system board
– Integrated 2.5 VDC LDO
– External low-value 10 mΩ sense resistor
Patented Impedance Track™ technology
– Adjusts for battery aging, self-discharge,
temperature, and rate changes
– Reports Remaining Capacity, State of
Charge (SOC), and Time-to-Empty
– Optional Smoothing Filter
– Battery State of Health (aging) estimation
– Supports embedded or removable packs
with up to 32Ahr capacity
– Accommodates pack swapping with 2
separate battery profiles
Microcontroller peripheral supports:
– 400-kHz I2C™ serial interface
– 32 Bytes of Scratch-Pad FLASH NVM
– Battery Low digital output warning
– Configurable SOC Interrupts
– External thermistor, internal sensor, or host
reported temperature options
Small 12-pin 2,5 mm × 4 mm SON Package
Smartphones, Feature phones and Tablets
Digital Still and Video Cameras
Handheld Terminals
MP3 or Multimedia Players
DESCRIPTION
The Texas Instruments bq27510-G3 system-side LiIon battery fuel gauge is a microcontroller peripheral
that provides fuel gauging for single-cell Li-Ion battery
packs.
The
device
requires
little
system
microcontroller firmware development. The bq27510G3 resides on the system’s main board and manages
an embedded battery (non-removable) or a
removable battery pack.
The bq27510-G3 uses the patented Impedance
Track™ algorithm for fuel gauging, and provides
information such as remaining battery capacity
(mAh), state-of-charge (%), run-time to empty (min.),
battery voltage (mV), temperature (°C) and state of
health (%).
Battery fuel gauging with the bq27510-G3 requires
only PACK+ (P+), PACK– (P–), and optional
Thermistor (T) connections to a removable battery
pack or embedded battery circuit.
TYPICAL APPLICATION
Host System
Single-Cell Li-ion
Battery Pack
VCC
REG25
Power
Management
Controller
2
IC
LDO
REGIN
PACK+
GPOUT
Voltage
Sense
DATA
Temp
Sense
PROTECTION
IC
T
bq27510-G3
PACK-
FETs
CHG
DSG
Current
Sense
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Impedance Track is a trademark of Texas Instruments.
I2C is a trademark of Phillips Corporation.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
bq27510-G3
SLUSAT1 – MARCH 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DEVICE INFORMATION
AVAILABLE OPTIONS
PART NUMBER
FIRMWARE VERSION
PACKAGE (1)
TA
COMMUNICATION
FORMAT
4.00 (0X0400)
12-pin, 2,5-mm × 4mm SON
–40°C to 85°C
I2C
bq27510DRZR-G3
bq27510DRZT-G3
(1)
TAPE and REEL
QUANTITY
3000
250
For the most current package and ordering information see the Package Option Addendum at the end of this document; or, see the TI
website at www.ti.com.
PIN DIAGRAM
DRZ PACKAGE
(TOP VIEW)
BI/TOUT
1
12
GPOUT
REG25
2
11
SCL
REGIN
3
10
SDA
BAT
4
9
TS
Vcc
5
8
SRN
Vss
6
7
SRP
PIN FUNCTIONS
PIN
NAME
TYPE (1)
DESCRIPTION
Battery-insertion detection input. Power pin for pack thermistor network. Thermistor-multiplexer control
pin. Open-drain I/O. Use with pull-up resistor >1MΩ (1.8 MΩ typical).
NO.
BI/TOUT
1
I/O
REG25
2
P
2.5 V output voltage of the internal integrated LDO.
REGIN
3
P
Regulator input. Decouple with 0.1μF ceramic capacitor to Vss.
BAT
4
I
Cell voltage measurement input. ADC input.
Vcc
5
P
Processor power input. Decouple with 0.1μF ceramic capacitor minimum.
Vss
6
P
Device ground
SRP
7
IA
Analog input pin connected to the internal coulomb counter with a Kelvin connection where SRP is
nearest the PACK– connection. Connect to 5-mΩ to 20-mΩ sense resistor.
SRN
8
IA
Analog input pin connected to the internal coulomb counter with a Kelvin connection where SRN is
nearest the Vss connection. Connect to 5-mΩ to 20-mΩ sense resistor.
TS
9
IA
Pack thermistor voltage sense (use 103AT-type thermistor). ADC input
SDA
10
I/O
Slave I2C serial communications data line for communication with system (Master). Open-drain I/O.
Use with 10-kΩ pull-up resistor (typical).
SCL
11
I
Slave I2C serial communications clock input line for communication with system (Master). Open-drain
I/O. Use with 10-kΩ pull-up resistor (typical).
GPOUT
12
O
General Purpose open-drain output. May be configured as Battery Low, Battery Good, or to perform
interrupt functionality.
(1)
2
I/O = Digital input/output; IA = Analog input; P = Power connection.
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ELECTRICAL SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
VALUE
MIN
UNIT
MAX
VREGIN
Regulator input voltage
–0.3
24
V
VCC
Supply voltage range
–0.3
2.75
V
VIOD
Open-drain I/O pins (SDA, SCL, GPOUT)
–0.3
6
V
VBAT
BAT input pin
–0.3
6
V
VI
Input voltage range to all other pins (TS, SRP, SRN, BI/TOUT)
–0.3
VCC + 0.3
V
TF
Functional temperature range
–40
100
°C
TSTG
Storage temperature range
–65
150
°C
ESD
(1)
Human Body Model (HBM), BAT pin
1.5
Human Body Model (HBM), all other pins
KV
2
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
THERMAL METRIC (1)
DRZ (12-PINS)
θJA
Junction-to-ambient thermal resistance
64.1
θJCtop
Junction-to-case (top) thermal resistance
59.8
θJB
Junction-to-board thermal resistance
52.7
ψJT
Junction-to-top characterization parameter
0.3
ψJB
Junction-to-board characterization parameter
28.3
θJCbot
Junction-to-case (bottom) thermal resistance
2.4
(1)
UNITS
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
TA = 25°C, VCC = 2.5 V (unless otherwise noted)
PARAMETER
VREGIN
Supply voltage
TEST CONDITION
No operating restrictions
MIN
TYP
MAX
2.7
5.5
No FLASH writes
2.45
2.7
CREG25
0.47
CREG25
External REG25 capacitor
tPUCD
Power Up Communication Delay
ICC
Normal operating mode current
Fuel gauge in NORMAL mode,
ILOAD > Sleep Current
ISLP
Low-power operating mode current
ISLP+
UNIT
V
µF
250
ms
103
μA
Fuel gauge in SLEEP mode.
ILOAD < Sleep Current
18
μA
Low-power operating mode current
Fuel gauge in SLEEP+ mode.
ILOAD < Sleep Current
60
μA
IHIB
Hibernate operating mode current
Fuel gauge in HIBERNATE mode.
ILOAD < Hibernate Current
4
μA
VOL
Output voltage low (SDA, GPOUT, BI/TOUT)
IOL = 0.5 mA
VOH(PP)
Output high voltage (GPOUT)
IOH = –1 mA
VCC–0.5
VOH(OD)
Output high voltage (SDA, SCL, BI/TOUT)
External pull-up resistor connected to Vcc
VCC–0.5
VIL
VIH(OD)
Input voltage low (SDA, SCL)
Input voltage low (BI/TOUT)
BAT INSERT CHECK MODE active
Input voltage high (SDA, SCL)
Input voltage high (BI/TOUT)
BAT INSERT CHECK MODE active
0.4
V
V
V
–0.3
0.6
–0.3
0.6
1.2
6
1.2
6
V
V
VA1
Input voltage range (TS)
VSS–0.125
2
V
VA2
Input voltage range (BAT)
VSS–0.125
5
V
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RECOMMENDED OPERATING CONDITIONS (continued)
TA = 25°C, VCC = 2.5 V (unless otherwise noted)
PARAMETER
VA3
Input voltage range (SRP, SRN)
tPUCD
Power-up communication delay
TA
Operating free-air temperature range
2.5 V LDO
TEST CONDITION
MIN
TYP
MAX
VSS–0.125
0.125
250
UNIT
V
ms
–40
85
°C
(1)
TA = 25°C, CREG = 0.47 μF, VREGIN = 3.6 V (unless otherwise noted)
PARAMETER
MIN
NOM
MAX
2.7 V ≤ VREGIN ≤ 5.5 V,
IOUT ≤ 16mA
TEST CONDITION
TA = –40°C to 85°C
2.4
2.5
2.6
2.45 V ≤ VREGIN < 2.7 V (low
battery), IOUT ≤ 3mA
TA = –40°C to 85°C
2.40
2.7 V, IOUT ≤ 16 mA
TA = –40°C to 85°C
UNIT
V
VREG25
Regulator output voltage
VDO
Regulator dropout voltage
ΔVREGTEMP
Regulator output change
with temperature
VREGIN = 3.6 V, IOUT = 16 mA
ΔVREGLINE
Line regulation
2.7 V ≤ VREGIN ≤ 5.5 V, IOUT = 16 mA
11
25
mV
ΔVREGLOAD
Load regulation
0.2 mA ≤ IO UT ≤ 3 mA, VREGIN = 2.45 V
34
40
mV
3 mA ≤ IOUT ≤ 16 mA, VREGIN = 2.7 V
31
250
mA
UNIT
ISHORT
(1)
(2)
(2)
Short circuit current limit
V
280
2.45 V, IOUT ≤ 3 mA
mV
50
VREG25 = 0 V
TA = –40°C to 85°C
0.3%
TA = –40°C to 85°C
LDO output current, IOUT, is the sum of internal and external load currents.
Assured by design. Not production tested.
POWER-ON RESET
TA = –40°C to 85°C, typical values at TA = 25°C and VBAT = 3.6 V (unless otherwise noted)
PARAMETER
VIT+
Positive-going battery voltage input at VCC
VHYS
Power-on reset hysteresis
TEST CONDITIONS
MIN
TYP
MAX
2.05
2.20
2.31
V
45
115
185
mV
INTERNAL TEMPERATURE SENSOR CHARACTERISTICS
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER
GTEMP
TEST CONDITIONS
MIN
Temperature sensor voltage gain
TYP
MAX
–2
UNIT
mV/°C
INTERNAL CLOCK OSCILLATORS
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
fOSC
High Frequency Oscillator
8.389
MHz
fLOSC
Low Frequency Oscillator
32.768
kHz
INTEGRATING ADC (COULOMB COUNTER) CHARACTERISTICS
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VSR_IN
Input voltage range, V(SRN) and V(SRP)
VSR = V(SRN) – V(SRP)
tSR_CONV
Conversion time
Single conversion
Resolution
VSR_OS
Input offset
INL
Integral nonlinearity error
4
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MIN
TYP
–0.125
MAX
UNIT
0.125
V
1
14
s
15
±0.007
bits
μV
10
±0.034
%FSR
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INTEGRATING ADC (COULOMB COUNTER) CHARACTERISTICS (continued)
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER
ZSR_IN
Effective input resistance
ISR_LKG
Input leakage current (1)
(1)
TEST CONDITIONS
(1)
MIN
TYP
MAX
UNIT
2.5
MΩ
μA
0.3
Assured by design. Not production tested.
ADC (TEMPERATURE AND CELL MEASUREMENT) CHARACTERISTICS
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER
VADC_IN
Input voltage range
tADC_CONV
Conversion time
TEST CONDITIONS
Resolution
TYP
Input offset
ZADC1
Effective input resistance (TS)
ZADC2
Effective input resistance (BAT) (1)
IADC_LKG
Input leakage current (1)
MAX
UNIT
1
14
VADC_OS
(1)
MIN
–0.2
V
125
ms
15
bits
1
(1)
bq27510-G3 not measuring cell voltage
mV
8
MΩ
8
MΩ
bq27510-G3 measuring cell voltage
100
kΩ
μA
0.3
Assured by design. Not production tested.
DATA FLASH MEMORY CHARACTERISTICS
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Data retention (1)
tDR
TYP
MAX
10
Flash programming write-cycles
(1)
Word programming time
ICCPROG)
Flash-write supply current (1)
UNIT
Years
20,000
Cycles
(1)
tWORDPROG)
(1)
MIN
5
2
ms
10
mA
Assured by design. Not production tested.
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400 kHz I2C-COMPATIBLE INTERFACE COMMUNICATION TIMING CHARACTERISTICS
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tr
SCL/SDA rise time
300
ns
tf
SCL/SDA fall time
300
ns
tw(H)
SCL pulse width (high)
600
ns
tw(L)
SCL pulse width (low)
1.3
μs
tsu(STA)
Setup for repeated start
600
ns
td(STA)
Start to first falling edge of SCL
600
ns
tsu(DAT)
Data setup time
100
ns
th(DAT)
Data hold time
0
ns
tsu(STOP)
Setup time for stop
tBUF
Bus free time between stop and start
fSCL
Clock frequency
600
ns
66
μs
400
kHz
100 kHz I2C-COMPATIBLE INTERFACE COMMUNICATION TIMING CHARACTERISTICS
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER
tr
SCL/SDA rise time
tf
SCL/SDA fall time
tw(H)
SCL pulse width (high)
tw(L)
TEST CONDITIONS
MIN
TYP
MAX
1
300
UNIT
µs
ns
4
µs
SCL pulse width (low)
4.7
μs
tsu(STA)
Setup for repeated start
4.7
µs
td(STA)
Start to first falling edge of SCL
4
µs
tsu(DAT)
Data setup time
250
ns
th(DAT)
Data hold time
tsu(STOP)
Setup time for stop
tBUF
Bus free time between stop and start
fSCL
Clock frequency
tBUSERR
Bus error timeout
tSU(STA)
tw(H)
Receive mode
0
Transmit mode
300
tf
tw(L)
ns
4
µs
4.7
μs
10
100
kHz
17.3
21.2
s
tr
t(BUF)
SCL
SDA
td(STA)
tsu(STOP)
tf
tr
REPEATED
START
th(DAT)
tsu(DAT)
STOP
START
Figure 1. I2C-Compatible Interface Timing Diagrams
6
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GENERAL DESCRIPTION
The bq27510-G3 fuel gauge accurately predicts the battery capacity and other operational characteristics of a
single Li-based rechargeable cell. It can be interrogated by a system processor to provide cell information, such
as time-to-empty (TTE) and state-of-charge (SOC) as well as SOC interrupt signal to the host.
Information is accessed through a series of commands, called Standard Commands. Further capabilities are
provided by the additional Extended Commands set. Both sets of commands, indicated by the general format
Command( ), read and write information contained within the device control and status registers, as well as its
data flash locations. Commands are sent from system to gauge using the I2C serial communications engine, and
can be executed during application development, system manufacture, or end-equipment operation.
Cell information is stored in the device in non-volatile flash memory. Many of these data flash locations are
accessible during application development. They cannot, generally, be accessed directly during end-equipment
operation. Access to these locations is achieved by either use of the fuel gauge companion evaluation software,
through individual commands, or through a sequence of data-flash-access commands. To access a desired data
flash location, the correct data flash subclass and offset must be known.
The key to the fuel gauge high-accuracy gas gauging prediction is Texas Instruments proprietary Impedance
Track™ algorithm. This algorithm uses cell measurements, characteristics, and properties to create state-ofcharge predictions that can achieve less than 1% error across a wide variety of operating conditions and over the
lifetime of the battery.
The fuel gauge measures charge and discharge activity by monitoring the voltage across a small-value series
sense resistor (5 mΩ to 20 mΩ, typical) located between the system VSS and the battery PACK– terminal. When
a cell is attached to the device, cell impedance is learned, based on cell current, cell open-circuit voltage (OCV),
and cell voltage under loading conditions.
The external temperature sensing is optimized with the use of a high-accuracy negative temperature coefficient
(NTC) thermistor with R25 = 10.0 kΩ ±1%. B25/85 = 3435 kΩ ± 1% (such as Semitec NTC 103AT). Alternatively,
the fuel gauge can also be configured to use its internal temperature sensor or receive temperature data from the
host processor. When an external thermistor is used, a 18.2-kΩ pull-up resistor between BI/TOUT and TS pins is
also required. The fuel gauge uses temperature to monitor the battery-pack environment, which is used for fuel
gauging and cell protection functionality.
To minimize power consumption, the fuel gauge has several power modes: NORMAL, SLEEP, HIBERNATE, and
BAT INSERT CHECK. The fuel gauge passes automatically between these modes, depending upon the
occurrence of specific events, though a system processor can initiate some of these modes directly.
For complete operational details, refer to bq27510-G3 Technical Reference Manual.
Formatting conventions used in this document:
Information Type
Formatting Convention
Example
Commands
Italics with parentheses and no breaking spaces
RemainingCapacity( ) command
NVM Data
Italics, bold, and breaking spaces
Design Capacity data
Register bits and flags
Brackets and italics
[TDA] bit
NVM Data bits
Brackets, italics, and bold
[LED1] bit
Modes and states
ALL CAPITALS
UNSEALED mode
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DATA COMMANDS
STANDARD DATA COMMANDS
The bq27510-G3 fuel gauge uses a series of 2-byte standard commands to enable system reading and writing of
battery information. Each standard command has an associated command-code pair, as indicated in Table 1.
Because each command consists of two bytes of data, two consecutive I2C transmissions must be executed both
to initiate the command function, and to read or write the corresponding two bytes of data. Additional options for
transferring data are described in Section of COMMUNICATIONS. Standard commands are accessible in
NORMAL operation. Read and write permissions depend on the active access mode, SEALED or UNSEALED.
Additional details are found in the bq27510-G3 Technical Reference Manual.
Table 1. Standard Commands
COMMAND CODE
UNITS
SEALED
ACCESS
Control( )
0x00 / 0x01
N/A
R/W
AtRate( )
0x02 / 0x03
mA
R/W
AtRateTimeToEmpty( )
0x04 / 0x05
Minutes
R
Temperature( )
0x06 / 0x07
0.1 K
R/W
Voltage( )
0x08 / 0x09
mV
R
Flags( )
0x0a / 0x0b
N/A
R
NominalAvailableCapacity( )
0x0c / 0x0d
mAh
R
FullAvailableCapacity( )
0x0e / 0x0f
mAh
R
RemainingCapacity( )
0x10 / 0x11
mAh
R
FullChargeCapacity( )
0x12 / 0x13
mAh
R
AverageCurrent( )
0x14 / 0x15
mA
R
TimeToEmpty( )
0x16 / 0x17
Minutes
R
StandbyCurrent( )
0x18 / 0x19
mA
R
StandbyTimeToEmpty( )
0x1a/ 0x1b
Minutes
R
StateOfHealth( )
0x1c / 0x1d
% / num
R
CycleCount( )
0x1e/ 0x1f
num
R
StateOfCharge( )
0x20/ 0x21
%
R
InstantaneousCurrent( )
0x22 / 0x23
mA
R
InternalTemperature( )
0x28 / 0x29
0.1 K
R
ResistanceScale( )
0x2a / 0x2b
OperationConfiguration( )
0x2c/ 0x2d
N/A
R
DesignCapacity( )
0x2e / 0x2f
mAh
R
NAME
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Control( ): 0x00/0x01
Issuing a Control( ) command requires a subsequent 2-byte subcommand. These additional bytes specify the
particular control function desired. The Control( ) command allows the system to control specific features of the
fuel gauge during normal operation and additional features when the device is in different access modes, as
described in Table 2. Additional details are found in the bq27510-G3 Technical Reference Manual.
Table 2. Control( ) Subcommands
CNTL
DATA
SEALED
ACCESS
CONTROL_STATUS
0x0000
Yes
Reports the status of DF checksum, hibernate, IT, etc.
DEVICE_TYPE
0x0001
Yes
Reports the device type (for example: 0x0520)
FW_VERSION
0x0002
Yes
Reports the firmware version on the device type
PREV_MACWRITE
0x0007
Yes
Returns previous Control( ) subcommand code
CHEM_ID
0x0008
Yes
Reports the chemical identifier of the Impedance Track™ configuration
OCV_CMD
0x000C
Yes
Requests the fuel gauge to take an OCV measurement
BAT_INSERT
0x000D
Yes
Forces Flags( ) [BAT_DET] bit set when OpConfig B [BIE] = 0
BAT_REMOVE
0x000E
Yes
Forces Flags( ) [BAT_DET] bit clear when OpConfig B [BIE] = 0
SET_HIBERNATE
0x0011
Yes
Forces CONTROL_STATUS [HIBERNATE] to 1
CLEAR_HIBERNATE
0x0012
Yes
Forces CONTROL_STATUS [HIBERNATE] to 0
SET_SLEEP+
0x0013
Yes
Forces CONTROL_STATUS [SNOOZE] to 1
CLEAR_SLEEP+
0x0014
Yes
Forces CONTROL_STATUS [SNOOZE] to 0
DF_VERSION
0x001F
Yes
Returns the Data Flash Version code
SEALED
0x0020
No
Places the fuel gauge in SEALED access mode
IT_ENABLE
0x0021
No
Enables the Impedance Track™ (IT) algorithm
RESET
0x0041
No
Forces a full reset of the fuel gauge
CNTL FUNCTION
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DESCRIPTION
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FUNCTIONAL DESCRIPTION
FUEL GAUGING
The fuel gauge measures the cell voltage, temperature, and current to determine battery SOC. The fuel gauge
monitors charge and discharge activity by sensing the voltage across a small-value (5 mΩ to 20 mΩ typ.) resistor
between the SRP and SRN pins and in series with the cell. By integrating charge passing through the battery,
the battery’s SOC is adjusted during battery charge or discharge.
The total battery capacity is found by comparing states of charge before and after applying the load with the
amount of charge passed. When an application load is applied, the impedance of the cell is measured by
comparing the OCV obtained from a predefined function for present SOC with the measured voltage under load.
Measurements of OCV and charge integration determine chemical state of charge and chemical capacity
(Qmax). The initial Qmax values are taken from a cell manufacturers' data sheet multiplied by the number of
parallel cells. It is also used for the value in Design Capacity. The fuel gauge acquires and updates the batteryimpedance profile during normal battery usage. It uses this profile, along with SOC and the Qmax value, to
determine FullChargeCapacity() and StateOfCharge(), specifically for the present load and temperature.
FullChargeCapacity() is reported as capacity available from a fully charged battery under the present load and
temperature until Voltage() reaches the Terminate Voltage. NominalAvailableCapacity() and
FullAvailableCapacity() are the uncompensated (no or light load) versions of RemainingCapacity() and
FullChargeCapacity() respectively.
The fuel gauge has two flags accessed by the Flags() function that warns when the battery’s SOC has fallen to
critical levels. When StateOfCharge() falls below the first capacity threshold, specified in SOC1 Set Threshold,
the [SOC1] (State of Charge Initial) flag is set. The flag is cleared once StateOfCharge() rises above SOC1 Clear
Threshold. The fuel gauge’s GPOUT pin puts out 3 pulses 10ms wide and in 10ms intervals whenever the
SOC1 flag is set. This flag is enabled when RMC_IND bit in Operation Configuration B is set. This behavior
also applies to the [SOCF] (State of Charge Final) flag.
When Voltage( ) falls below the system shut down threshold voltage, SysDown Set Volt Threshold, the
[SYSDOWN] flag is set, serving as a final warning to shut down the system. The GPOUT also signals. When
Voltage( ) rises above SysDown Clear Voltage and the [SYSDOWN] flag has already been set, the
[SYSDOWN] flag is cleared. The GPOUT also signals such change. All units are in mV.
Additional details are found in the bq27510-G3 Technical Reference Manual
10
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bq27510-G3
www.ti.com
SLUSAT1 – MARCH 2013
COMMUNICATIONS
I2C Interface
The bq27510-G3 fuel gauge supports the standard I2C read, incremental read, quick read, one byte write, and
incremental write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address
and is fixed as 1010101. The first 8-bits of the I2C protocol is, therefore, 0xAA or 0xAB for write or read,
respectively.
Host generated
S
ADDR[6:0]
0 A
Gauge generated
CMD [7:0]
A
DATA [7:0]
A P
S
ADDR[6:0]
(a) 1-byte write
S
ADDR[6:0]
0 A
1 A
DATA [7:0]
N P
(b) quick read
CMD [7:0]
A Sr
ADDR[6:0]
1 A
DATA [7:0]
N P
(c) 1- byte read
S
ADDR[6:0]
0 A
CMD [7:0]
A Sr
ADDR[6:0]
1 A
DATA [7:0]
A ...
DATA [7:0]
N P
(d) incremental read
S
ADDR[6:0]
0 A
CMD[7:0]
A
DATA [7:0]
A
DATA [7:0]
A
...
A P
(e) incremental write
(S = Start , Sr = Repeated Start , A = Acknowledge , N = No Acknowledge , and P = Stop).
The “quick read” returns data at the address indicated by the address pointer. The address pointer, a register
internal to the I2C communication engine, increments whenever data is acknowledged by the fuel gauge or the
I2C master. “Quick writes” function in the same manner and are a convenient means of sending multiple bytes to
consecutive command locations (such as two-byte commands that require two bytes of data)
The following command sequences are not supported:
Attempt to write a read-only address (NACK after data sent by master):
Attempt to read an address above 0x6B (NACK command):
I2C Time Out
The I2C engine releases both SDA and SCL if the I2C bus is held low for 2 seconds. If the fuel gauge was
holding the lines, releasing them frees them for the master to drive the lines. If an external condition is holding
either of the lines low, the I2C engine enters the low-power sleep mode.
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bq27510-G3
SLUSAT1 – MARCH 2013
www.ti.com
I2C Command Waiting Time
To ensure proper operation at 400 kHz, a t(BUF) ≥ 66 μs bus free waiting time must be inserted between all
packets addressed to the fuel gauge. In addition, if the SCL clock frequency (fSCL) is > 100 kHz, use individual 1byte write commands for proper data flow control. The following diagram shows the standard waiting time
required between issuing the control subcommand the reading the status result. For read-write standard
command, a minimum of 2 seconds is required to get the result updated. For read-only standard commands,
there is no waiting time required, but the host should not issue all standard commands more than two times per
second. Otherwise, the fuel gauge could result in a reset issue due to the expiration of the watchdog timer.
S
ADDR [6:0]
0 A
CMD [7:0]
A
DATA [7:0]
A P
66ms
S
ADDR [6:0]
0 A
CMD [7:0]
A
DATA [7:0]
A P
66ms
S
ADDR [6:0]
0 A
CMD [7:0]
A Sr
ADDR [6:0]
1 A
DATA [7:0]
A
DATA [7:0]
N P
66ms
N P
66ms
Waiting time inserted between two 1-byte write packets for a subcommand and reading results
(required for 100 kHz < fSCL £ 400 kHz)
S
ADDR [6:0]
0 A
CMD [7:0]
A
S
ADDR [6:0]
0 A
CMD [7:0]
A Sr
DATA [7:0]
ADDR [6:0]
A
1 A
DATA [7:0]
A P
DATA [7:0]
A
66ms
DATA [7:0]
Waiting time inserted between incremental 2-byte write packet for a subcommand and reading results
(acceptable for fSCL £ 100 kHz)
S
ADDR [6:0]
DATA [7:0]
0 A
A
CMD [7:0]
DATA [7:0]
A Sr
N P
ADDR [6:0]
1 A
DATA [7:0]
A
DATA [7:0]
A
66ms
Waiting time inserted after incremental read
I2C Clock Stretching
A clock stretch can occur during all modes of fuel gauge operation. In SLEEP and HIBERNATE modes, a short
clock stretch occurs on all I2C traffic as the device must wake-up to process the packet. In the other modes (BAT
INSERT CHECK, NORMAL) clock stretching only occurs for packets addressed for the fuel gauge. The majority
of clock stretch periods are small as the I2C interface performs normal data flow control. However, less frequent
yet more significant clock stretch periods may occur as blocks of Data Flash are updated. The following table
summarizes the approximate clock stretch duration for various fuel gauge operating conditions.
Approximate
Duration
Gauging Mode
Operating Condition or Comment
SLEEP
HIBERNATE
Clock stretch occurs at the beginning of all traffic as the device wakes up.
≤ 4 ms
BAT INSERT
CHECK,
NORMAL
Clock stretch occurs within the packet for flow control (after a start bit, ACK or first data bit).
≤ 4 ms
Normal Ra table Data Flash updates.
24 ms
12
Data Flash block writes.
72 ms
Restored Data Flash block write after loss of power.
116 ms
End of discharge Ra table Data Flash update.
144 ms
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bq27510-G3
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SLUSAT1 – MARCH 2013
REFERENCE SCHEMATICS
SCHEMATIC
bq27510DRZ
GPOUT
GPOUT
Copyright © 2013, Texas Instruments Incorporated
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13
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
BQ27510DRZR-G3
ACTIVE
SON
DRZ
12
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
BQ
7510
BQ27510DRZT-G3
ACTIVE
SON
DRZ
12
250
TBD
Call TI
Call TI
-40 to 85
BQ
7510
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jun-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
BQ27510DRZR-G3
Package Package Pins
Type Drawing
SON
DRZ
12
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
330.0
12.4
Pack Materials-Page 1
2.8
B0
(mm)
K0
(mm)
P1
(mm)
4.3
1.2
4.0
W
Pin1
(mm) Quadrant
12.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jun-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ27510DRZR-G3
SON
DRZ
12
3000
338.1
338.1
20.6
Pack Materials-Page 2
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