STMicroelectronics EMIF02-MIC02F2 2-line ipadâ ¢, emi filter and esd protection Datasheet

EMIF02-MIC02F2
2-line IPAD™, EMI filter and ESD protection
Features
■
EMI symmetrical (I/O) low-pass filter
■
High efficiency in EMI filtering
■
Lead-free package
■
Very low PCB space occupation:
1.42 mm x 0.92 mm
■
Very thin package: 0.65 mm
■
High efficiency in ESD suppression
■
High reliability offered by monolithic integration
■
High reducing of parasitic elements through
integration and wafer level packaging
Flip Chip
(6 bumps)
Figure 1.
Complies with the following standards
■
■
IEC 61000-4-2 level 4 on input pins
– 15 kV (air discharge)
– 8 kV (contact discharge)
IEC 61000-4-2 level 1 on input pins
– 2 kV (air discharge)
– 2 kV (contact discharge)
Figure 2.
Applications
Pin configuration (bump side)
3
2
1
I2
GND
I1
A
O2
GND
O1
B
Basic cell configuration
Low-pass Filter
Where EMI filtering in ESD sensitive equipment is
required:
■
Mobile phones and communication systems
■
Computers, printers and MCU Boards
Input
Output
Ri/o = 470 W
Cline = 16 pF
GND
GND
GND
Description
The EMIF02-MIC02 is a highly integrated device
designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interference. The EMIF02 Flip-Chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents damage to the application when
subjected to ESD surges up 15 kV.
May 2011
TM: IPAD is a trademark of STMicroelectronics.
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Electrical characteristics
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EMIF02-MIC02F2
Electrical characteristics
Table 1.
Absolute ratings (Tamb = 25 °C)
Symbol
Tj
Parameter
Unit
125
°C
junction temperature
Top
Operating temperature range
-40 to +85
°C
Tstg
Storage temperature range
-55 to 150
°C
Table 2.
Electrical characteristics (Tamb = 25 °C)
Symbol
Parameters
VBR
Breakdown voltage
IRM
Leakage current @ VRM
VRM
Stand-off voltage
VCL
Clamping voltage
Rd
Dynamic impedance
IPP
Peak pulse current
RI/O
Series resistance between input and
output
Cline
Input capacitance per line
Symbol
Test conditions
VBR
IR = 1 mA
IRM
VRM = 12 V per line
Cline
I
IPP
VCL VBR VRM
@0V
Doc ID 10913 Rev 4
IR
IRM
IRM
IR
V
VRM VBR VCL
IPP
Min.
Typ.
14
16
423
RI/O
2/8
Value
Max.
Unit
V
500
nA
470
517
Ω
16
20
pF
EMIF02-MIC02F2
Figure 3.
Electrical characteristics
Attenuation measurement and
Aplac simulation
Figure 4.
S21 (dB)
Analog crosstalk measurements
dB
- 10.00
-20.00
- 15.00
--30.00
- 20.00
Measurement
I2/O1
--40.00
- 25.00
- 30.00
--50.00
- 35.00
--60.00
- 40.00
--70.00
- 45.00
F (Hz)
- 50.00
1.0M
3.0M
10.0M
30.0M
100.0M 300.0M
Simulation
1.0G
F (Hz)
--80.00
1.0M
3.0G
3.0M
10.0M
30.0M
100.0M
300.0M
1.0G
3.0G
Figure 5.
Digital crosstalk measurement
Figure 6.
ESD response to IEC61000-4-2
(-15 kV air discharge) on one input
V(in) and on one output V(out)
Figure 7.
ESD response to IEC61000-4-2
(+15 kV air discharge) on one input
V(in) and on one output V(out)
Figure 8.
Line capacitance versus applied
voltage
C(pF)
20
F=1MHz
Vosc=30mVRMS
Tj=25°C
18
16
14
12
10
8
6
4
2
VR(V)
0
0
1
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Application information
2
EMIF02-MIC02F2
Application information
Figure 9.
I1
Cox
Aplac model
gnd
O1
R_470R
MODEL = D01-int
Cox
50pH
MODEL = D01-ext
Rsubump
Rsubump
50pH
50m
50m
MODEL = D01-gnd
gnd
Rsubump
Rsubump
Lgnd
Cgnd
MODEL = D01-ext
Cox
Cox
MODEL = D01-int
I2
Lgnd
Cgnd
Rgnd
Rgnd
O2
R_470R
Figure 10. Aplac parameters
Model D01-ext
BV = 7
CJO = Cz_ext
IBV = 1u
IKF = 1000
IS = 10f
ISR = 100p
N=1
M = 0.3333
RS = Rs_ext
VJ = 0.6
TT = 50n
Model D01-int
BV = 7
CJO = Cz_int
IBV = 1u
IKF = 1000
IS = 10f
ISR = 100p
N=1
M = 0.3333
RS = Rs_int
VJ = 0.6
TT = 50n
Model D01-gnd
BV = 7
CJO = Cz_gnd
IBV = 1u
IKF = 1000
IS = 10f
ISR = 100p
N=1
M = 0.3333
RS = Rs_gnd
VJ = 0.6
TT = 50n
Ls 400pH
Rs 100m
R_470R 482.6
Cz_ext 8.73pF
Rs_ext 850m
Cz_int 2.9pF
Rs_int 850m
Cz_gnd 215.61pF
Rs_gnd 470m
Rgnd 10m
Lgnd 48pH
Cgnd 0.15pF
Cox 3.05pF
Rsubump 200m
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EMIF02-MIC02F2
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Ordering information scheme
Ordering information scheme
Figure 11. Ordering information scheme
EMIF
yy
-
xxx zz
Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10 pF
or
3 letters = application
2 digits = version
Package
F = Flip Chip
x = 2: Lead-free, pitch = 500 µm, bump = 315 µm
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 12. Package dimensions
500 µm ± 50
315 µm ± 50
650µm ± 65
1.42 mm ± 50 µm
500 µm ± 50
210 µm
0.92 mm ± 50µm
210 µm
4
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Ordering information
EMIF02-MIC02F2
Figure 13. Footprint
Figure 14. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Copper pad Diameter:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
E
x x z
y ww
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
Dot identifying Pin A1 location
Ø 1.55 ± 0.05
4.0 ± 0.1
2.0 ± 0.05
3.5 ±- 0.05
1.47 ± 0.05
1.02 ± 0.05
xxz
yww
STE
xxz
yww
STE
xxz
yww
STE
8.0 ± 0.3
0.20 ± 0.02
1.75 ± 0.1
Figure 15. Flip Chip tape and reel specification
4.0 ± 0.1
0.73 ± 0.05
User direction of unreeling
All dimensions in mm
5
Ordering information
Table 3.
Note:
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Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
EMIF02-MIC02F2
FJ
Flip Chip
2.3 mg
5000
Tape and reel 7”
More information is available in the application notes:
AN1235:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
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EMIF02-MIC02F2
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Revision history
Revision history
Table 4.
Document revision history
Date
Revision
Changes
12-Oct-2004
1
Initial release.
11-Jan-2006
2
ECOPACK statement added. Die dimensions modified in Figure 12.
and first page. Typographical errors corrected.
17-Apr-2008
3
Updated ECOPACK statement. Updated Figure 11, Figure 12 and
Figure 15. Reformatted to current standards.
26-May-2011
4
Updated Cline values in Table 2.
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EMIF02-MIC02F2
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