NRVTS560EMFS Exceptionally Low Leakage Trench-based Schottky Rectifier Features • Fine Lithography Trench−based Schottky Technology for Very Low • • • • • • • Leakage Fast Switching with Exceptional Temperature Stability Low Power Loss and Lower Operating Temperature Higher Efficiency for Achieving Regulatory Compliance Low Thermal Resistance High Surge Capability NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These are Pb−Free and Halide−Free Devices www.onsemi.com SCHOTTKY BARRIER RECTIFIERS 5 AMPERES 60 VOLTS 5,6 1,2,3 MARKING DIAGRAM Typical Applications • Switching Power Supplies including Wireless, Smartphone and • • • • Notebook Adapters High Frequency and DC−DC Converters Freewheeling and OR−ing diodes Reverse Battery Protection Instrumentation • 1 A SO−8 FLAT LEAD CASE 488AA STYLE 2 TE0560 A Y W ZZ Mechanical Characteristics: • • • • A Case: Epoxy, Molded Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in. Lead Finish: 100% Matte Sn (Tin) Lead and Mounting SurfaceTemperature for Soldering Purposes: 260°C Max. for 10 Seconds Device Meets MSL 1 Requirements A C TE0560 AYWWZZ C Not Used = Specific Device Code = Assembly Location = Year = Work Week = Lot Traceability ORDERING INFORMATION Package Shipping† NRVTS560EMFST1G SO−8 FL (Pb−Free) 1500 / Tape & Reel NRVTS560EMFST3G SO−8 FL (Pb−Free) 5000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2014 November, 2014 − Rev. 0 1 Publication Order Number: NRVTS560EMFS/D NRVTS560EMFS MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 60 Average Rectified Forward Current (Rated VR, TC = 168°C) IF(AV) 5.0 A Peak Repetitive Forward Current, (Rated VR, Square Wave, 20 kHz, TC = 167°C) IFRM 10 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 150 A Storage Temperature Range Tstg −65 to +175 °C Operating Junction Temperature TJ −55 to +175 °C EAS 60 mJ Unclamped Inductive Switching Energy (10 mH Inductor, Non−repetitive) V ESD Rating (Human Body Model) TBD ESD Rating (Machine Model) M4 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Case, Steady State (Assumes 600 mm2 1 oz. copper bond pad, on a FR4 board) Symbol Max Unit RθJC 2.4 °C/W ELECTRICAL CHARACTERISTICS Characteristic Symbol Instantaneous Forward Voltage (Note 1) (iF = 2.5 Amps, TJ = 25°C) (iF = 5.0 Amps, TJ = 25°C) Typ Max 0.50 0.55 − 0.61 0.41 0.50 − 0.59 − 2 30 4 vF (iF = 2.5 Amps, TJ = 125°C) (iF = 5.0 Amps, TJ = 125°C) Instantaneous Reverse Current (Note 1) (Rated dc Voltage, TJ = 25°C) (Rated dc Voltage, TJ = 125°C) Unit V iR mA mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. www.onsemi.com 2 NRVTS560EMFS TYPICAL CHARACTERISTICS 100 iF, INSTANTANEOUS FORWARD CURRENT (A) iF, INSTANTANEOUS FORWARD CURRENT (A) 100 TA = 175°C TA = 150°C 10 TA = 125°C 1 TA = 25°C TA = −55°C 0.1 TA = 150°C TA = 125°C TA = 25°C 1 TA = −55°C 0.1 0.1 0.2 0.3 0.4 0.6 0.5 0.7 0.8 0 0.1 0.2 0.4 0.3 0.5 0.7 0.6 0.8 0.9 1.0 VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V) Figure 1. Typical Instantaneous Forward Characteristics Figure 2. Maximum Instantaneous Forward Characteristics 1.E−01 IR, INSTANTANEOUS REVERSE CURRENT (A) 0 1.E+00 TA = 175°C 1.E−02 1.E−01 TA = 150°C 1.E−03 TA = 125°C 1.E−04 TA = 175°C 1.E−02 TA = 150°C 1.E−03 TA = 125°C 1.E−04 1.E−05 TA = 25°C 1.E−06 TA = 25°C 1.E−05 1.E−06 1.E−07 5 10 15 20 25 30 35 40 45 50 55 60 10 15 20 25 30 35 40 50 45 55 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Figure 3. Typical Reverse Characteristics Figure 4. Maximum Reverse Characteristics C, JUNCTION CAPACITANCE (pF) 1000 TJ = 25°C 100 0.1 5 VR, INSTANTANEOUS REVERSE VOLTAGE (V) IF(AV), AVERAGE FORWARD CURRENT (A) IR, INSTANTANEOUS REVERSE CURRENT (A) TA = 175°C 10 1 10 12 11 10 9 DC 8 7 Square Wave 6 5 4 3 2 RqJC = 2.4°C/W 1 0 0 20 40 60 80 100 120 140 160 175 VR, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE (°C) Figure 5. Typical Junction Capacitance Figure 6. Current Derating per Device www.onsemi.com 3 60 NRVTS560EMFS TYPICAL CHARACTERISTICS PF(AV), AVERAGE FORWARD POWER DISSIPATION (W) 18 IPK/IAV = 20 16 IPK/IAV = 10 14 12 10 Square Wave 8 IPK/IAV = 5 6 4 dc 2 0 0 1 2 3 4 5 6 IF(AV), AVERAGE FORWARD CURRENT (A) Figure 7. Forward Power Dissipation 100 50% (DUTY CYCLE) R(t) (C/W) 10 1 20% 10% 5.0% 2.0% Assumes 25°C ambient and soldered to a 600 mm2 − oz copper pad on PCB 1.0% 0.1 SINGLE PULSE 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000 1.0 10 100 1000 PULSE TIME (s) Figure 8. Typical Thermal Characteristics R(t) (C/W) 10 1 50% (DUTY CYCLE) 20% 0.1 10% 5.0% 2.0% 1.0% 0.01 SINGLE PULSE 0.000001 0.00001 0.0001 0.001 0.01 0.1 PULSE TIME (s) Figure 9. Typical Transient Thermal Response Characteristics, Junction−to−Case www.onsemi.com 4 NRVTS560EMFS PACKAGE DIMENSIONS DFN5 5x6, 1.27P (SO−8FL) CASE 488AA ISSUE L 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION D1 AND E1 DO NOT INCLUDE MOLD FLASH PROTRUSIONS OR GATE BURRS. 0.20 C D A 2 B D1 2X 0.20 C 4X E1 2 q E c 1 2 3 DIM A A1 b c D D1 D2 E E1 E2 e G K L L1 M q A1 4 TOP VIEW 0.10 C C e SEATING PLANE DETAIL A A 0.10 C SIDE VIEW 3X 2X 0.495 8X 4.560 b 0.10 C A B 0.05 c STYLE 2: PIN 1. ANODE 2. ANODE 3. ANODE 4. NO CONNECT 5. CATHODE RECOMMENDED SOLDERING FOOTPRINT* DETAIL A MILLIMETERS MIN NOM MAX 0.90 1.00 1.10 0.00 −−− 0.05 0.33 0.41 0.51 0.23 0.28 0.33 5.00 5.30 5.15 4.70 4.90 5.10 3.80 4.00 4.20 6.15 6.00 6.30 5.70 5.90 6.10 3.45 3.65 3.85 1.27 BSC 0.51 0.61 0.71 1.20 1.35 1.50 0.51 0.61 0.71 0.125 REF 3.00 3.40 3.80 0_ −−− 12 _ 2X 1.530 e/2 L 1 4 3.200 K 4.530 E2 PIN 5 (EXPOSED PAD) L1 M 1.330 2X 0.905 1 G D2 BOTTOM VIEW 0.965 4X 1.000 4X 0.750 1.270 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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