MADP-017015-1314 MADP-030015-1314 SURMOUNT™ 15μM PIN Diodes RoHS Compliant Rev. V6 Case Style ODS 1314 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ 0603 Outline Surface Mount 15µm I-Region Length Devices No Wirebonds Required Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Average and Peak Power Handling Description This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM Technology Solutions patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical topology provides for exceptional heat transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. Applications These packageless devices are suitable for usage in moderate incident power, ≤ 50dBm/C.W. or where the peak power is ≤ 75dBm, pulse width is ≤ 1μS, and duty cycle is ≤ 0.01%. Their low parasitic inductance, 0.4 nH, and excellent RC constant, make these devices a superior choice for higher frequency switch elements when compared to their plastic package counterparts. Chip Dimensions DIM INCHES MM Min Max Min Max A 0.060 0.062 1.525 1.575 B 0.031 0.032 0.775 0.825 Absolute Maximum Ratings @TAMB = +25°C C 0.004 0.008 0.102 0.203 (unless otherwise specified) D 0.019 0.021 0.475 0.525 E 0.019 0.021 0.475 0.525 F 0.019 0.021 0.475 0.525 G 0.029 0.031 0.725 0.775 1 Parameter Absolute Maximum Forward Current 500 mA Reverse Voltage - 115 V Operating Temperature -55°C to +125°C Storage Temperature -55 °C to +150°C Junction Temperature +175°C C.W. Incident Power 50dBm Mounting Temperature +280°C for 30 seconds Notes: 1) Backside metal: 0.1microns thick. 2) Yellow area with hatch lines indicate backside ohmic gold contacts. 3) Both devices have same outline dimensions ( A to G). 1) Exceeding these limits may cause in permanent damage ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MADP-017015-1314 MADP-030015-1314 SURMOUNT™ 15μM PIN Diodes RoHS Compliant Rev. V6 Electrical Specifications @ TA = 25°C (unless otherwise noted) Parameter Symbol Conditions Units Min Typ Ma x MADP-017015 0.3 8 Min Typ MADP-030015 Capacitance CT -40 V, 1 MHz 1,3 pF 0.32 Capacitance CT -40V, 1 GHz 1,3 pF 0.31 0.78 Capacitance, 85°C CT -40 V, 1 GHz 1,3 pF 0.29 0.76 Resistance RS +10 mA, 1 GHz 2,3 Ω 0.72 0.49 RS +70 mA, 1 GHz 2,3 Ω 0.51 0.38 +10 mA, 1 GHz 2,3 Ω 1.08 0.82 +70 mA, 1 GHz 2,3 Ω 0.84 Resistance Resistance, 85°C Resistance, 85°C RS RS 0.79 Forward Voltage VF +10 mA V 0.74 Reverse Leakage Current IR -115 V uA - 10 F1= 1800 MHz F2 = 1810 MHz Input Power = 0 dBm I bias = +70 mA dBc -36.8 37. 0 °C/W 30 13 uS 1.3 1.6 IP Thermal Resistance θ Lifetime TL 3 +10 mA / -6 mA ( 50% - 90% V ) 0.85 0.69 0.9 0 Third Order Intercept Point Max 0.72 0.90 - 10 Notes: 1) Total capacitance, CT, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar. 2) Series resistance RS is equivalent to the total diode resistance : Rs = Rj ( Junction Resistance) + Rc ( Ohmic Resistance) 3) Rs and CT are measured on an HP4291A Impedance Analyzer with the die mounted in an ODS-186 package . 4) Theta (θ) is measured with the die mounted in an ODS-186 package . Typical Spice Parameters @ TAMB = +25°C Spice Parameter Units MADP-017015-1314 MADP-030015-1314 N 1.1 1.1 RS Ω 1.2 1.1 IS IK BV IBV Ct CJO VJ M FC Cpar_Cj A (mA) (Volts) (μA) (pF) (pF) (Volts) (F) 9.8E-15 14.7 145 10 0.46 0.10 0.29 0.50 0.34 3.5E-13 8.5E-15 13.9 145 10 1.12 0.29 0.18 0.50 0.19 8.2E-13 ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MADP-017015-1314 MADP-030015-1314 SURMOUNT™ 15μM PIN Diodes RoHS Compliant Rev. V6 Typical Performance @ TAMB = +25°C Rs vs. I 10.00 1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 MADP-030015 Rs @ 1GHz (ohm) Ct @ 1GHz (pF) Ct vs. V MADP-017015 0 10 20 30 MADP-017015 1.00 MADP-030015 0.10 0.001 40 0.01 Current (A) Voltage (V) Ct vs. Freq. Ls vs. Freq. 1.2 Ls @ 5, 10, 20mA (nH) 1 10V 40V 0.8 Ct (pF) MADP-30015 0V 0.6 0V 10V 40V 0.4 0.2 MADP-17015 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0.2 0.18 0.16 0.14 0.12 0.1 0.08 0.06 0.04 0.02 0 1.8 MADP-17015 MADP-30015 0 0.2 0.4 Frequency (GHz) MADP-017015 1.0 Ls @ 1GHz (nH) Rs (ohm) 5mA 0.6 5m A 10mA 20mA 0.4 MADP-030015 0.2 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.8 1 1.2 1.4 1.6 1.8 Ls vs. I 1.2 10mA 20mA 0.6 Frequency (GHz) Rs vs. Freq. 0.8 0.1 1.4 1.6 1.8 Frequency (GHz) ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 MADP-017015 MADP-030015 0 0.02 0.04 0.06 0.08 0.1 Current (A) • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MADP-017015-1314 MADP-030015-1314 SURMOUNT™ 15μM PIN Diodes RoHS Compliant Rev. V6 Handling Procedures All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Bonding Techniques Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is recommended. For applications where the average power is ~1W, conductive silver epoxy may also be used. Cure per manufacturers recommended time and temperature. Typically 1 hour at 150°C. When soldering these devices to a hard substrate, hot gas die bonding is preferred. A vacuum tip pick-up tool and a force of 60 to100 grams applied to the top surface of the device is recommended. When soldering to soft substrates, such as Duroid, it is recommended to use a soft solder at the circuit board to mounting pad interface. Position the die so that its mounting pads are aligned with the circuit board mounting pads. While applying a downward force perpendicular to the top surface of the die, apply heat near the circuit trace and diode mounting pad. The solder connection to the two pads should not be made one at a time as this will create unequal heat flow and thermal stress to the part. Solder reflow should not be performed by causing heat to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after attachment is completed. Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in Application Note M538 , “Surface Mounting Instructions“ and can viewed on the MA-COM website @ www.macomtech.com Ordering Information Gel Pack MADP-017015-13140G MADP-030015-13140G ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.