Sample & Buy Product Folder Support & Community Tools & Software Technical Documents Reference Design TPS2552, TPS2553, TPS2552-1, TPS2553-1 SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 TPS255xx Precision Adjustable Current-Limited Power-Distribution Switches 1 Features 3 Description • • • • The TPS255x and TPS255x-1 power-distribution switches are intended for applications where precision current limiting is required or heavy capacitive loads and short circuits are encountered and provide up to 1.5 A of continuous load current. These devices offer a programmable current-limit threshold between 75 mA and 1.7 A (typical) through an external resistor. Current-limit accuracy as tight as ±6% can be achieved at the higher current-limit settings. The power-switch rise and fall times are controlled to minimize current surges during turnon and turnoff. 1 • • • • • • • • • • Up to 1.5-A Maximum Load Current ±6% Current-Limit Accuracy at 1.7 A (Typical) Meets USB Current-Limiting Requirements Backwards Compatible With TPS2550 and TPS2551 Adjustable Current Limit: 75 mA to 1700 mA (Typical) Constant-Current (TPS255x) and Latch-Off (TPS255x-1) Versions Fast Overcurrent Response - 2 µs (Typical) 85-mΩ High-Side MOSFET (DBV Package) Reverse Input-Output Voltage Protection Operating Range: 2.5 V to 6.5 V Built-In Soft Start 15-kV ESD Protection per IEC 61000-4-2 (With External Capacitance) UL Listed – File No. E169910 and NEMKO IEC60950-1-am1 ed2.0 See the TI Switch Portfolio TPS255x devices limit the output current to a safe level by using a constant-current mode when the output load exceeds the current-limit threshold. TPS255x-1 devices provide circuit breaker functionality by latching off the power switch during overcurrent or reverse-voltage situations. An internal reverse-voltage comparator disables the powerswitch when the output voltage is driven higher than the input to protect devices on the input side of the switch. The FAULT output asserts low during overcurrent and reverse-voltage conditions. Device Information(1) 2 Applications • • • • PART NUMBER USB Ports and Hubs Digital TVs Set-Top Boxes VOIP Phones TPS2552 TPS2553 PACKAGE BODY SIZE (NOM) SOT-23 (6) 2.90 mm x 1.60 mm WSON (6) 2.00 mm x 2.00 mm SOT-23 (6) 2.90 mm x 1.60 mm WSON (6) 2.00 mm x 2.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application TPS2552/53 5V USB Input USB Data 0.1 mF IN OUT USB Port RFAULT 100 kW 120 mF Fault Signal Control Signal FAULT EN ILIM GND Power Pad RILIM 20 kW USB requirement only* *USB requirement that downstream facing ports are bypassed with at least 120 mF per hub Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS2552, TPS2553, TPS2552-1, TPS2553-1 SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 9 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 4 5 5 7.1 7.2 7.3 7.4 7.5 7.6 5 6 6 6 7 8 Absolute Maximum Ratings ...................................... ESD Ratings ............................................................ Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Parameter Measurement Information ................ 11 Detailed Description ............................................ 13 9.1 9.2 9.3 9.4 9.5 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ Programming........................................................... 13 13 13 15 15 10 Application and Implementation........................ 17 10.1 Application Information.......................................... 17 10.2 Typical Applications .............................................. 17 11 Power Supply Recommendations ..................... 24 11.1 Self-Powered and Bus-Powered Hubs ................. 24 11.2 Low-Power Bus-Powered and High-Power BusPowered Functions .................................................. 24 11.3 Power Dissipation and Junction Temperature ...... 24 12 Layout................................................................... 25 12.1 Layout Guidelines ................................................. 25 12.2 Layout Example .................................................... 25 13 Device and Documentation Support ................. 26 13.1 13.2 13.3 13.4 13.5 13.6 13.7 Device Support...................................................... Related Links ........................................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 26 26 26 26 26 26 26 14 Mechanical, Packaging, and Orderable Information ........................................................... 26 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (February 2012) to Revision F Page • Added ESD Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................. 1 • Changed 1300 mA to 1700 mA in the adjustable current limit bullet under the Features section ......................................... 1 • Changed from 1.2 A to 1.5 A.................................................................................................................................................. 4 Changes from Revision D (June 2011) to Revision E Page • Changed VEN to VEN in Recommended Operating Conditions ............................................................................................... 6 • Changed VEN to VEN in Recommended Operating Conditions ............................................................................................... 6 Changes from Revision C (September 2009) to Revision D Page • Changed From: Fast Overcurrent Response - 2-µS (typ) To: Fast Overcurrent Response - 2-µs (typ) in the Features ...... 1 • Added text To Feature - UL Listed "and NEMKO IEC60950-1-am1 ed2.0"........................................................................... 1 • Added Features Item "See the TI Switch Portfoilo"................................................................................................................ 1 • Changed the DEVICE INFORMATION table, and Deleted Note 3 ........................................................................................ 1 • Added ESD-system level (contact/air) to the ABS MAX table, and Added Note 3 ................................................................ 6 • Added text to the REVERSE-VOLTAGE PROTECTION section: "A reverse.....when this occurs.".................................... 14 2 Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 TPS2552, TPS2553, TPS2552-1, TPS2553-1 www.ti.com SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 Changes from Revision B (February 2009) to Revision C Page • Added Feature - Up to 1.5 A Maximum Load Current............................................................................................................ 1 • Changed 1.3 A (typ) To: 1.7 A (typ) ....................................................................................................................................... 1 • Added Text - and provide up to 1.5 A of continuous load current.......................................................................................... 1 • Changed From: 19.1 kΩ ≤ RILIM ≤ 232 kΩ To: 15 kΩ ≤ RILIM ≤ 232 kΩ. ................................................................................. 5 • Changed IOUT values for 1.2A and 1.5A ................................................................................................................................. 6 • Changed TJ values for 1.2A and 1.5A .................................................................................................................................... 6 • Added RILIM = 15 kΩ option .................................................................................................................................................... 7 • Changed Text From: current-limit threshold between 75 mA and 1.3 A (typ) To: current-limit threshold between 75 mA and 1.7 A (typ)................................................................................................................................................................ 13 • Changed Text From: The recommended 1% resistor range for RILIM is 19.1 kΩ ≤ RILIM ≤ 232 kΩ to ensure stability To: The recommended 1% resistor range for RILIM is 15 kΩ ≤ RILIM ≤ 232 kΩ to ensure stability........................................ 15 • Changed From: where 19.1 kΩ ≤ RILIM ≤ 232 kΩ. To: where 15 kΩ ≤ RILIM ≤ 232 kΩ. ........................................................ 15 • Changed Figure 23 - Current-Limit Threshold vs RILIM ........................................................................................................ 16 • Changed Table 2 - added rows for Current Limit of 1400 to 1700....................................................................................... 19 Changes from Revision A (December 2008) to Revision B Page • Added To Features - UL Listed – File No. E169910 .............................................................................................................. 1 • Changed Figure 17 Ttitle From: Current Limit Threshold Vs RILM ......................................................................................... 9 • Changed Figure 18 Ttitle From: Current Limit Threshold Vs RILM ......................................................................................... 9 Changes from Original (November 2008) to Revision A • Page Changed Title from: Adjustable Current-Limited Power-Distribution Switches to: Precision Adjustable CurrentLimited Power-Distribution Switches ...................................................................................................................................... 1 Copyright © 2008–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 3 TPS2552, TPS2553, TPS2552-1, TPS2553-1 SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 www.ti.com 5 Device Comparison Table 4 Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 TPS2552, TPS2553, TPS2552-1, TPS2553-1 www.ti.com SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 6 Pin Configuration and Functions TPS255x DBV Package 6-Pin SOT-23 Top View 6 5 4 1 2 3 IN GND EN TPS255x DRV Package 6-Pin WSON Top View OUT ILIM FAULT 1 2 3 OUT ILIM FAULT EN = Active Low for the TPS2552 PAD 6 IN 5 GND 4 EN EN = Active Low for the TPS2552 EN = Active High for the TPS2553 EN = Active High for the TPS2553 Add –1 to part number for latch-off version Add –1 to part number for latch-off version Pin Functions PIN NAME TPS2552 SOT-23 TPS2553 I/O WSON SOT-23 WSON DESCRIPTION EN 3 4 — — I Enable input, logic low turns on power switch EN — — 3 4 I Enable input, logic high turns on power switch FAULT 4 3 4 3 O Active-low open-drain output, asserted during overcurrent, overtemperature, or reverse-voltage conditions. GND 2 5 2 5 — Ground connection; connect externally to PowerPAD ILIM 5 2 5 2 O External resistor used to set current-limit threshold; recommended 15 kΩ ≤ RILIM ≤ 232 kΩ. IN 1 6 1 6 I Input voltage; connect a 0.1 µF or greater ceramic capacitor from IN to GND as close to the IC as possible. OUT 6 1 6 1 O Power-switch output PowerPAD™ — PAD — PAD — Internally connected to GND; used to heat-sink the part to the circuit board traces. Connect PowerPAD to GND pin externally. Add –1 for Latch-Off version 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) Voltage range on IN, OUT, EN or EN, ILIM, FAULT Voltage range from IN to OUT IO (2) MAX UNIT –0.3 7 V –7 7 V Internally Limited See the Thermal Information Continuous FAULT sink current 0 25 mA ILIM source current 0 1 mA –40 150 °C –65 150 °C Maximum junction temperature Tstg Storage temperature (1) MIN Continuous output current Continuous total power dissipation TJ (1) (2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Voltages are referenced to GND unless otherwise noted. Copyright © 2008–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 5 TPS2552, TPS2553, TPS2552-1, TPS2553-1 SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 www.ti.com 7.2 ESD Ratings VALUE V(ESD) (1) (2) (3) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged device model (CDM), per JEDEC specification JESD22C101 (2) ±500 IEC 61000-4-2 contact discharge (3) ±8000 IEC 61000-4-2 air-gap discharge (3) ±15000 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Surges per EN61000-4-2. 1999 applied to output terminals of EVM. These are passing test levels, not failure threshold. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage, IN 2.5 6.5 V VEN Enable voltage TPS2552/52-1 0 6.5 V VEN Enable voltage TPS2553/53-1 0 6.5 V VIH High-level input voltage on EN or EN VIL Low-level input voltage on EN or EN IOUT Continuous output current, OUT RILIM Current-limit threshold resistor range (nominal 1%) from ILIM to GND IO Continuous FAULT sink current 1.1 0.66 –40 °C ≤ TJ ≤ 125 °C 0 1.2 –40 °C ≤ TJ ≤ 105 °C 0 1.5 15 232 kΩ 0 10 mA Input de-coupling capacitance, IN to GND Operating virtual junction temperature (1) TJ (1) V 0.1 A µF IOUT ≤ 1.2 A –40 125 IOUT ≤ 1.5 A –40 105 °C See Power Dissipation and Junction Temperature for details on how to calculate maximum junction temperature for specific applications and packages. 7.4 Thermal Information TPS2552 THERMAL METRIC (1) TPS2553 DBV (SOT-23) DRV (WSON) DBV (SOT-23) DRV (WSON) 6 PINS 6 PINS 6 PINS 6 PINS UNIT RθJA Junction-to-ambient thermal resistance 182.6 72 182.6 72 °C/W RθJC(to Junction-to-case (top) thermal resistance 122.2 85.3 122.2 85.3 °C/W RθJB Junction-to-board thermal resistance 29.4 41.3 29.4 41.3 °C/W ψJT Junction-to-top characterization parameter 20.8 1.7 20.8 1.7 °C/W ψJB Junction-to-board characterization parameter 28.9 41.7 28.9 41.7 °C/W RθJC(b Junction-to-case (bottom) thermal resistance — 11.1 — 11.1 °C/W p) ot) (1) 6 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 TPS2552, TPS2553, TPS2552-1, TPS2553-1 www.ti.com SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 7.5 Electrical Characteristics over recommended operating conditions, VEN = 0 V, or VEN = VIN, RFAULT = 10 kΩ (unless otherwise noted) TEST CONDITIONS (1) PARAMETER MIN TYP MAX UNIT POWER SWITCH DBV package, TJ = 25°C 85 DBV package, –40°C ≤TJ ≤125°C rDS(on) Static drain-source on-state resistance DRV package, TJ = 25°C 100 DRV package, –40°C ≤TJ ≤105°C Rise time, output tf Fall time, output 115 mΩ 140 DRV package, –40°C ≤TJ ≤125°C tr 95 135 150 CL = 1 µF, RL = 100 Ω, (see Figure 20) VIN = 6.5 V 1.1 VIN = 2.5 V 0.7 1.5 CL = 1 µF, RL = 100 Ω, (see Figure 20) VIN = 6.5 V 0.2 0.5 VIN = 2.5 V 0.2 0.5 0.66 1.1 V –0.5 0.5 µA 1 ms ENABLE INPUT EN OR EN Enable pin turn on/off threshold IEN Input current VEN = 0 V or 6.5 V, VEN = 0 V or 6.5 V ton Turnon time CL = 1 µF, RL = 100 Ω, (see Figure 20) 3 ms toff Turnoff time CL = 1 µF, RL = 100 Ω, (see Figure 20) 3 ms CURRENT LIMIT RILIM = 15 kΩ, –40°C ≤TJ ≤105°C Current-limit threshold (Maximum DC output current IOUT delivered to load) and Short-circuit current, OUT connected to GND IOS RILIM = 20 kΩ RILIM = 49.9 kΩ 1610 1700 1800 TJ = 25°C 1215 1295 1375 –40°C ≤TJ ≤125°C 1200 1295 1375 TJ = 25°C 490 520 550 –40°C ≤TJ ≤125°C 475 520 565 110 130 150 50 75 100 RILIM = 210 kΩ ILIM shorted to IN tIOS Response time to short circuit VIN = 5 V (see Figure 21) 2 mA µs REVERSE-VOLTAGE PROTECTION Reverse-voltage comparator trip point (VOUT – VIN) Time from reverse-voltage condition to MOSFET turn off VIN = 5 V 95 135 190 mV 3 5 7 ms SUPPLY CURRENT IIN_off Supply current, low-level output VIN = 6.5 V, No load on OUT, VEN = 6.5 V or VEN = 0 V IIN_on Supply current, high-level output VIN = 6.5 V, No load on OUT IREV Reverse leakage current VOUT = 6.5 V, VIN = 0 V 0.1 1 µA RILIM = 20 kΩ 120 140 µA RILIM = 210 kΩ 100 120 µA TJ = 25 °C 0.01 1 µA 2.35 2.45 UNDERVOLTAGE LOCKOUT UVLO Low-level input voltage, IN Hysteresis, IN VIN rising TJ = 25 °C 25 V mV FAULT FLAG VOL Output low voltage, FAULT I/FAULT = 1 mA Off-state leakage V/FAULT = 6.5 V FAULT deglitch 180 mV 1 µA FAULT assertion or de-assertion due to overcurrent condition 5 7.5 10 ms FAULT assertion or de-assertion due to reverse-voltage condition 2 4 6 ms THERMAL SHUTDOWN Thermal shutdown threshold 155 °C Thermal shutdown threshold in current-limit 135 °C Hysteresis (1) 10 °C Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. Copyright © 2008–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 7 TPS2552, TPS2553, TPS2552-1, TPS2553-1 SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 www.ti.com 7.6 Typical Characteristics Figure 1. Turnon Delay and Rise Time Figure 2. Turnoff Delay and Fall Time 8 Figure 3. Device Enabled into Short-Circuit Figure 4. Full-Load to Short-Circuit Transient Response Figure 5. Short-Circuit to Full-Load Recovery Response Figure 6. No-Load to Short-Circuit Transient Response Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 TPS2552, TPS2553, TPS2552-1, TPS2553-1 www.ti.com SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 Typical Characteristics (continued) Figure 7. Short-Circuit to No-Load Recovery Response Figure 8. No Load to 1-Ω Transient Response Figure 10. Reverse-Voltage Protection Response Figure 9. 1-Ω to No Load Transient Response 2.40 RILIM = 20 kW UVLO - Undervoltage Lockout - V 2.39 2.38 2.37 UVLO Rising 2.36 2.35 2.34 UVLO Falling 2.33 2.32 2.31 2.30 -50 Figure 11. Reverse-Voltage Protection Recovery Copyright © 2008–2016, Texas Instruments Incorporated 0 50 TJ - Junction Temperature - °C 100 150 Figure 12. UVLO – Undervoltage Lockout – V Submit Documentation Feedback Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 9 TPS2552, TPS2553, TPS2552-1, TPS2553-1 SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 www.ti.com Typical Characteristics (continued) 150 0.40 RILIM = 20 kW 135 IIN - Supply Current, Output Enabled - mA IIN - Supply Current, Output Disabled - mA 0.36 0.32 0.28 0.24 VIN = 6.5 V 0.20 0.16 0.12 0.08 VIN = 2.5 V 0 50 TJ - Junction Temperature - °C 100 105 90 75 VIN = 3.3 V VIN = 2.5 V 60 45 30 0 -50 150 Figure 13. IIN – Supply Current, Output Disabled – µA 0 50 TJ - Junction Temperature - °C 100 150 Figure 14. IIN – Supply Current, Output Enabled – µA 150 rDS(on) - Static Drain-Source On-State Resistance - mW 20 VIN = 5 V, 18 RILIM = 20 kW, TA = 25°C 16 Current Limit Response - ms VIN = 5 V 15 0 -50 14 12 10 8 6 4 2 125 DRV Package 100 DBV Package 75 50 25 0 -50 0 0 1.5 3 Peak Current - A 4.5 0 6 Figure 15. Current Limit Response – µs 50 TJ - Junction Temperature - °C 100 150 Figure 16. MOSFET rDS(on) Vs. Junction Temperature 1400 150 1300 140 130 IDS - Static Drain-Source Current - mA 1200 IDS - Static Drain-Source Current - mA VIN = 6.5 V 120 0.04 TA = -40°C 1100 1000 TA = 25°C 900 TA = 125°C 800 700 600 500 400 300 200 VIN = 6.5 V, 100 RILIM = 20 kW 0 0 100 200 300 400 500 600 VIN - VOUT - 100 mV/div 700 800 900 1000 Figure 17. Switch Current Vs. Drain-Source Voltage Across Switch 10 RILIM = 20 kW Submit Documentation Feedback 120 TA = 25°C TA = -40°C 110 TA = 125°C 100 90 80 70 60 50 40 30 20 VIN = 6.5 V, 10 RILIM = 200 kW 0 0 100 200 300 400 500 600 VIN - VOUT - 100 mV/div 700 800 900 1000 Figure 18. Switch Current Vs. Drain-Source Voltage Across Switch Copyright © 2008–2016, Texas Instruments Incorporated Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 TPS2552, TPS2553, TPS2552-1, TPS2553-1 www.ti.com SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 8 Parameter Measurement Information TPS2552 10 mF VIN IN VOUT OUT RFAULT 10 kW 150 mF ILIM Fault Signal FAULT Control Signal RILIM GND EN Power Pad Figure 19. Typical Characteristics Reference Schematic OUT tf tr CL RL 90% 90% VOUT 10% 10% TEST CIRCUIT VEN 50% 50% VEN ton VOUT toff toff ton 90% 50% 50% toff 90% VOUT 10% 10% VOLTAGE WAVEFORMS Figure 20. Test Circuit and Voltage Waveforms IOS IOUT tIOS Figure 21. Response Time to Short-Circuit Waveform Copyright © 2008–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 11 TPS2552, TPS2553, TPS2552-1, TPS2553-1 SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 www.ti.com Parameter Measurement Information (continued) Decreasing Load Resistance VOUT Decreasing Load Resistance IOUT IOS Figure 22. Output Voltage vs Current-Limit Threshold 12 Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 TPS2552, TPS2553, TPS2552-1, TPS2553-1 www.ti.com SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 9 Detailed Description 9.1 Overview The TPS255x and TPS255x-1 are current-limited, power-distribution switches using N-channel MOSFETs for applications where short circuits or heavy capacitive loads are encountered and provide up to 1.5 A of continuous load current. These devices allow the user to program the current-limit threshold between 75 mA and 1.7 A (typical) through an external resistor. Additional device shutdown features include overtemperature protection and reverse-voltage protection. The device incorporates an internal charge pump and gate drive circuitry necessary to drive the N-channel MOSFET. The charge pump supplies power to the driver circuit and provides the necessary voltage to pull the gate of the MOSFET above the source. The charge pump operates from input voltages as low as 2.5 V and requires little supply current. The driver controls the gate voltage of the power switch. The driver incorporates circuitry that controls the rise and fall times of the output voltage to limit large current and voltage surges and provides built-in soft-start functionality. There are two device families that handle overcurrent situations differently. The TPS255x family enters constant-current mode while the TPS255x-1 family latches off when the load exceeds the current-limit threshold. 9.2 Functional Block Diagram - Reverse Voltage Comparator + IN OUT 4-ms Deglitch CS Current Sense Charge Pump Driver EN Current Limit FAULT (Note A) UVLO GND Thermal Sense 8-ms Deglitch ILIM Copyright © 2016, Texas Instruments Incorporated A. TPS255x parts enter constant current mode during current limit condition; TPS255x-1 parts latch off 9.3 Feature Description 9.3.1 Overcurrent Conditions The TPS255x and TPS255x-1 respond to overcurrent conditions by limiting their output current to the IOS levels shown in Figure 23. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Two possible overload conditions can occur. The first condition is when a short circuit or partial short circuit is present when the device is powered-up or enabled. The output voltage is held near zero potential with respect to ground and the TPS255x ramps the output current to IOS. The TPS255x devices limits the current to IOS until the overload condition is removed or the device begins to thermal cycle. The TPS255x-1 devices will limit the current to IOS until the overload condition is removed or the internal deglitch time (7.5-ms typical) is reached and the device is turned off. The device remains off until power is cycled or the device enable is toggled. Copyright © 2008–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 13 TPS2552, TPS2553, TPS2552-1, TPS2553-1 SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 www.ti.com Feature Description (continued) The second condition is when a short circuit, partial short circuit, or transient overload occurs while the device is enabled and powered on. The device responds to the overcurrent condition within time tIOS (see Figure 21). The current-sense amplifier is overdriven during this time and momentarily disables the internal current-limit MOSFET. The current-sense amplifier recovers and limits the output current to IOS. Similar to the previous case, the TPS255x limits the current to IOS until the overload condition is removed or the device begins to thermal cycle; the TPS255x-1 limits the current to IOS until the overload condition is removed or the internal deglitch time is reached and the device is latched off. The TPS255x thermal cycles if an overload condition is present long enough to activate thermal limiting in any of the above cases. The device turns off when the junction temperature exceeds 135°C (typical) while in current limit. The device remains off until the junction temperature cools 10°C (typical) and then restarts. The TPS255x cycles on and off until the overload is removed (see Figure 5 and Figure 7) . 9.3.2 Reverse-Voltage Protection The reverse-voltage protection feature turns off the N-channel MOSFET whenever the output voltage exceeds the input voltage by 135 mV (typical) for 4-ms (typical). A reverse current of (VOUT – VIN)/rDS(on)) are present when this occurs. This prevents damage to devices on the input side of the TPS255x and TPS2552-1/TPS2253-1 by preventing significant current from sinking into the input capacitance. The TPS255x devices allow the N-channel MOSFET to turn on once the output voltage goes below the input voltage for the same 4-ms deglitch time. The TPS255x-1 devices keep the device turned off even if the reverse-voltage condition is removed and do not allow the N-channel MOSFET to turn on until power is cycled or the device enable is toggled. The reverse-voltage comparator also asserts the FAULT output (active-low) after 4-ms. 9.3.3 FAULT Response The FAULT open-drain output is asserted (active low) during an overcurrent, overtemperature, or reverse-voltage condition. The TPS255x asserts the FAULT signal until the fault condition is removed and the device resumes normal operation. The TPS255x-1 asserts the FAULT signal during a fault condition and remains asserted while the part is latched-off. The FAULT signal is de-asserted once device power is cycled or the enable is toggled and the device resumes normal operation. The TPS255x and TPS255x-1 are designed to eliminate false FAULT reporting by using an internal delay de-glitch circuit for overcurrent (7.5-ms typical) and reverse-voltage (4-ms typical) conditions without the need for external circuitry. This ensures that FAULT is not accidentally asserted due to normal operation such as starting into a heavy capacitive load. The deglitch circuitry delays entering and leaving fault conditions. Overtemperature conditions are not deglitched and assert the FAULT signal immediately. 9.3.4 Undervoltage Lockout (UVLO) The undervoltage lockout (UVLO) circuit disables the power switch until the input voltage reaches the UVLO turnon threshold. Built-in hysteresis prevents unwanted on and off cycling due to input voltage drop from large current surges. 9.3.5 ENABLE (EN or EN) The logic enable controls the power switch, bias for the charge pump, driver, and other circuits to reduce the supply current. The supply current is reduced to less than 1-µA when a logic low is present on EN. A logic low input on EN or a logic high input on EN enables the driver, control circuits, and power switch. The enable input is compatible with both TTL and CMOS logic levels. 9.3.6 Thermal Sense The TPS255x and TPS255x-1 have self-protection features using two independent thermal-sensing circuits that monitor the operating temperature of the power switch and disable operation if the temperature exceeds recommended operating conditions. The TPS255x device operates in constant-current mode during an overcurrent conditions, which increases the voltage drop across power-switch. The power dissipation in the package is proportional to the voltage drop across the power switch, which increases the junction temperature during an overcurrent condition. The first thermal sensor turns off the power switch when the die temperature exceeds 135°C (minimum) and the part is in current limit. Hysteresis is built into the thermal sensor, and the switch turns on after the device has cooled approximately 10°C. 14 Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 TPS2552, TPS2553, TPS2552-1, TPS2553-1 www.ti.com SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 Feature Description (continued) The TPS255x and TPS255x-1 also have a second ambient thermal sensor. The ambient thermal sensor turns off the power-switch when the die temperature exceeds 155°C (minimum) regardless of whether the power switch is in current limit and turns on the power switch after the device has cooled approximately 10°C. The TPS255x and TPS255x-1 families continue to cycle off and on until the fault is removed. The open-drain fault reporting output FAULT is asserted (active low) immediately during an overtemperature shutdown condition. 9.4 Device Functional Modes There are no other functional modes. 9.5 Programming 9.5.1 Programming the Current-Limit Threshold The overcurrent threshold is user programmable through an external resistor. The TPS255x and TPS255x-1 use an internal regulation loop to provide a regulated voltage on the ILIM pin. The current-limit threshold is proportional to the current sourced out of ILIM. The recommended 1% resistor range for RILIM is 15 kΩ ≤ RILIM ≤ 232 kΩ to ensure stability of the internal regulation loop. Many applications require that the minimum current limit is above a certain current level or that the maximum current limit is below a certain current level, so it is important to consider the tolerance of the overcurrent threshold when selecting a value for RILIM. The following equations and Figure 23 can be used to calculate the resulting overcurrent threshold for a given external resistor value (RILIM). Figure 23 includes current-limit tolerance due to variations caused by temperature and process. However, the equations do not account for tolerance due to external resistor variation, so it is important to account for this tolerance when selecting RILIM. The traces routing the RILIM resistor to the TPS255x and TPS255x-1 must be as short as possible to reduce parasitic effects on the current-limit accuracy. RILIM can be selected to provide a current-limit threshold that occurs 1) above a minimum load current or 2) below a maximum load current. To design above a minimum current-limit threshold, find the intersection of RILIM and the maximum desired load current on the IOS(min) curve and choose a value of RILIM below this value. Programming the current limit above a minimum threshold is important to ensure start-up into full load or heavy capacitive loads. The resulting maximum current-limit threshold is the intersection of the selected value of RILIM and the IOS(max) curve. To design below a maximum current-limit threshold, find the intersection of RILIM and the maximum desired load current on the IOS(max) curve and choose a value of RILIM above this value. Programming the current limit below a maximum threshold is important to avoid current limiting upstream power supplies, causing the input voltage bus to droop. The resulting minimum current-limit threshold is the intersection of the selected value of RILIM and the IOS(min) curve. Current-Limit Threshold Equations (IOS): IOSmax (mA) = 22980V RILIM0.94kW IOSnom (mA) = 23950V RILIM0.977kW IOSmin (mA) = 25230V RILIM1.016kW where 15 kΩ ≤ RILIM ≤ 232 kΩ. (1) While the maximum recommended value of RILIM is 232 kΩ, there is one additional configuration that allows for a lower current-limit threshold. The ILIM pin may be connected directly to IN to provide a 75 mA (typical) currentlimit threshold. Additional low-ESR ceramic capacitance may be necessary from IN to GND in this configuration to prevent unwanted noise from coupling into the sensitive ILIM circuitry. Copyright © 2008–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 15 TPS2552, TPS2553, TPS2552-1, TPS2553-1 SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 www.ti.com Programming (continued) 1800 1700 1600 Current Limit Threshold - mA 1500 1400 1300 1200 1100 1000 900 IOS(max) 800 700 600 IOS(nom) 500 400 300 IOS(min) 200 100 0 15 25 35 45 55 65 75 85 95 105 115 125 135 145 155 165 175 185 195 205 215 225 235 RILIM - Current Limit Resistor - kW Figure 23. Current-Limit Threshold vs RILIM 16 Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 TPS2552, TPS2553, TPS2552-1, TPS2553-1 www.ti.com SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 10 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 10.1 Application Information 10.1.1 Constant-Current vs Latch-Off Operation and Impact on Output Voltage Both the constant-current devices (TPS255x) and latch-off devices (TPS255x-1) operate identically during normal operation, that is, the load current is less than the current-limit threshold and the devices are not limiting current. During normal operation the N-channel MOSFET is fully enhanced, and VOUT = VIN - (IOUT x rDS(on)). The voltage drop across the MOSFET is relatively small compared to VIN, and VOUT ≉ VIN. Both the constant-current devices (TPS255x ) and latch-off devices (TPS255x-1) operate identically during the initial onset of an overcurrent event. Both devices limit current to the programmed current-limit threshold set to RILIM by operating the N-channel MOSFET in the linear mode. During current-limit operation, the N-channel MOSFET is no longer fully-enhanced and the resistance of the device increases. This allows the device to effectively regulate the current to the current-limit threshold. The effect of increasing the resistance of the MOSFET is that the voltage drop across the device is no longer negligible (VIN ≠ VOUT), and VOUT decreases. The amount that VOUT decreases is proportional to the magnitude of the overload condition. The expected VOUT can be calculated by, IOS × RLOAD where IOS is the current-limit threshold and RLOAD is the magnitude of the overload condition. (2) For example, if IOS is programmed to 1 A and a 1 Ω overload condition is applied, the resulting VOUT is 1 V. While both the constant-current devices (TPS255x ) and latch-off devices (TPS255x-1) operate identically during the initial onset of an overcurrent event, they behave differently if the overcurrent event lasts longer than the internal delay de-glitch circuit (7.5-ms typical). The constant-current devices (TPS255x ) assert the FAULT flag after the deglitch period and continue to regulate the current to the current-limit threshold indefinitely. In practical circuits, the power dissipation in the package increases the die temperature above the overtemperature shutdown threshold (135°C minimum), and the device turns off until the die temperature decreases by the hysteresis of the thermal shutdown circuit (10°C typical). The device turns on and continues to thermal cycle until the overload condition is removed. The constant-current devices resume normal operation once the overload condition is removed. The latch-off devices (TPS255x-1) assert the FAULT flag after the deglitch period and immediately turn off the device. The device remains off regardless of whether the overload condition is removed from the output. The latch-off devices remain off and do not resume normal operation until the surrounding system either toggles the enable or cycles power to the device. 10.2 Typical Applications 10.2.1 Two-Level Current-Limit Circuit Some applications require different current-limit thresholds depending on external system conditions. Figure 24 shows an implementation for an externally controlled, two-level current-limit circuit. The current-limit threshold is set by the total resistance from ILIM to GND (see the Programming the Current-Limit Threshold section). A logiclevel input enables or disables MOSFET Q1 and changes the current-limit threshold by modifying the total resistance from ILIM to GND. Additional MOSFET and resistor combinations can be used in parallel to Q1/R2 to increase the number of additional current-limit levels. NOTE ILIM must never be driven directly with an external signal. Copyright © 2008–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 17 TPS2552, TPS2553, TPS2552-1, TPS2553-1 SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 www.ti.com Typical Applications (continued) Input 0.1 mF Output IN OUT RFAULT 100 kW CLOAD R1 210 kW ILIM Fault Signal FAULT Control Signal RLOAD R2 22.1 kW GND EN Power Pad Q1 2N7002 Current Limit Control Signal Copyright © 2016, Texas Instruments Incorporated Figure 24. Two-Level Current-Limit Circuit 10.2.1.1 Design Requirements For this example, use the parameters shown in Table 1. Table 1. Design Requirements PARAMETER VALUE Input voltage 5V Output voltage 5V Above a minimum current limit 1000 mA Below a maximum current limit 500 mA 10.2.1.2 Detailed Design Procedures 10.2.1.2.1 Designing Above a Minimum Current Limit Some applications require that current limiting cannot occur below a certain threshold. For this example, assume that 1 A must be delivered to the load so that the minimum desired current-limit threshold is 1000 mA. Use the IOS equations and Figure 23 to select RILIM. IOSmin (mA) = 1000mA IOSmin (mA) = 25230V RILIM1.016 k W 1 æ 25230V ÷ö1.016 ÷ RILIM (k W ) = ççç çè IOSmin mA ÷÷ø RILIM (k W ) = 24k W (3) Select the closest 1% resistor less than the calculated value: RILIM = 23.7 kΩ. This sets the minimum current-limit threshold at 1 A . Use the IOS equations, Figure 23, and the previously calculated value for RILIM to calculate the maximum resulting current-limit threshold. RILIM (kW) = 23.7kW IOSmax (mA) = IOSmax (mA) = 22980V RILIM0.94kW 22980V 23.70.94kW IOSmax (mA) = 1172.4mA (4) The resulting maximum current-limit threshold is 1172.4 mA with a 23.7-kΩ resistor. 18 Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 TPS2552, TPS2553, TPS2552-1, TPS2553-1 www.ti.com SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 10.2.1.2.2 Designing Below a Maximum Current Limit Some applications require that current limiting must occur below a certain threshold. For this example, assume that the desired upper current-limit threshold must be below 500 mA to protect an up-stream power supply. Use the IOS equations and Figure 23 to select RILIM. IOSmax (mA) = 500mA IOSmax (mA) = 22980V RILIM0.94kW 1 æ 22980V ÷ö0.94 ÷ RILIM (kW) = ççç çèIOSmax mA ÷÷ø RILIM (kW) = 58.7kW (5) Select the closest 1% resistor greater than the calculated value: RILIM = 59-kΩ. This sets the maximum currentlimit threshold at 500 mA . Use the IOS equations, Figure 23, and the previously calculated value for RILIM to calculate the minimum resulting current-limit threshold. RILIM (kW) = 59kW IOSmin (mA) = IOSmin (mA) = 25230V RILIM1.016kW 25230V 591.016kW IOSmin (mA) = 400.6mA (6) The resulting minimum current-limit threshold is 400.6 mA with a 59-kΩ resistor. 10.2.1.2.3 Accounting for Resistor Tolerance The previous sections described the selection of RILIM given certain application requirements and the importance of understanding the current-limit threshold tolerance. The analysis focused only on the TPS255x and TPS255x1 performance and assumed an exact resistor value. However, resistors sold in quantity are not exact and are bounded by an upper and lower tolerance centered around a nominal resistance. The additional RILIM resistance tolerance directly affects the current-limit threshold accuracy at a system level. The following table shows a process that accounts for worst-case resistor tolerance assuming 1% resistor values. Step one follows the selection process outlined in the application examples above. Step two determines the upper and lower resistance bounds of the selected resistor. Step three uses the upper and lower resistor bounds in the IOS equations to calculate the threshold limits. It is important to use tighter tolerance resistors, for example, 0.5% or 0.1%, when precision current limiting is desired. Copyright © 2008–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 19 TPS2552, TPS2553, TPS2552-1, TPS2553-1 SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 www.ti.com Table 2. Common RILIM Resistor Selections DESIRED NOMINAL CURRENT LIMIT (mA) RESISTOR TOLERANCE IDEAL RESISTOR (kΩ) CLOSEST 1% RESISTOR (kΩ) 75 1% LOW (kΩ) 1% HIGHT (kΩ) SHORT ILIM to IN ACTUAL LIMITS IOS MIN (mA) IOS NOM (mA) IOS MAX (mA) 50.0 75.0 100.0 120 226.1 226 223.7 228.3 101.3 120.0 142.1 200 134.0 133 131.7 134.3 173.7 201.5 233.9 300 88.5 88.7 87.8 89.6 262.1 299.4 342.3 400 65.9 66.5 65.8 67.2 351.2 396.7 448.7 500 52.5 52.3 51.8 52.8 448.3 501.6 562.4 600 43.5 43.2 42.8 43.6 544.3 604.6 673.1 700 37.2 37.4 37.0 37.8 630.2 696.0 770.8 800 32.4 32.4 32.1 32.7 729.1 800.8 882.1 900 28.7 28.7 28.4 29.0 824.7 901.5 988.7 1000 25.8 26.1 25.8 26.4 908.3 989.1 1081.0 1100 23.4 23.2 23.0 23.4 1023.7 1109.7 1207.5 1200 21.4 21.5 21.3 21.7 1106.0 1195.4 1297.1 1300 19.7 19.6 19.4 19.8 1215.1 1308.5 1414.9 1400 18.3 18.2 18.0 18.4 1310.1 1406.7 1517.0 1500 17.0 16.9 16.7 17.1 1412.5 1512.4 1626.4 1600 16.0 15.8 15.6 16.0 1512.5 1615.2 1732.7 1700 15.0 15.0 14.9 15.2 1594.5 1699.3 1819.4 10.2.1.2.4 Input and Output Capacitance Input and output capacitance improves the performance of the device; the actual capacitance must be optimized for the particular application. For all applications, TI recommends placing a 0.1-µF or greater ceramic bypass capacitor between IN and GND as close to the device as possible for local noise de-coupling. This precaution reduces ringing on the input due to power-supply transients. Additional input capacitance may be needed on the input to reduce voltage overshoot from exceeding the absolute maximum voltage of the device during heavy transient conditions. This is especially important during bench testing when long, inductive cables are used to connect the evaluation board to the bench power-supply. TI recommends placing a high-value electrolytic capacitor on the output pin when large transient currents are expected on the output. 10.2.1.3 Application Curves Figure 25. Turnon Delay and Rise Time Figure 26. Reverse-Voltage Protection Recovery 20 Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 TPS2552, TPS2553, TPS2552-1, TPS2553-1 www.ti.com SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 10.2.2 Auto-Retry Functionality Some applications require that an overcurrent condition disables the part momentarily during a fault condition and re-enables after a pre-set time. This auto-retry functionality can be implemented with an external resistor and capacitor. During a fault condition, FAULT pulls low disabling the part. The part is disabled when EN is pulled low, and FAULT goes high impedance allowing CRETRY to begin charging. The part re-enables when the voltage on EN reaches the turnon threshold, and the auto-retry time is determined by the resistor-capacitor time constant. The device continues to cycle in this manner until the fault condition is removed. TPS2553 0.1 mF Input Output IN OUT RLOAD RFAULT CLOAD 100 kW ILIM FAULT GND EN RILIM 20 kW CRETRY Power Pad 0.1 mF Copyright © 2016, Texas Instruments Incorporated Figure 27. Auto-Retry Functionality Some applications require auto-retry functionality and the ability to enable or disable with an external logic signal. Figure 28 shows how an external logic signal can drive EN through RFAULT and maintain auto-retry functionality. The resistor-capacitor time constant determines the auto-retry time-out period. TPS2553 0.1 mF Input Output IN OUT RLOAD CLOAD External Logic Signal & Driver ILIM RFAULT RILIM FAULT 100 kW 20 kW GND EN CRETRY Power Pad 0.1 mF Copyright © 2016, Texas Instruments Incorporated Figure 28. Auto-Retry Functionality With External EN Signal 10.2.2.1 Design Requirements For this example, use the parameters shown in Table 3. Table 3. Design Requirements PARAMETER VALUE Input voltage 5V Output voltage 5V Current 1200 mA Copyright © 2008–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 21 TPS2552, TPS2553, TPS2552-1, TPS2553-1 SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 www.ti.com 10.2.2.2 Detailed Design Procedure Refer to Programming the Current-Limit Threshold section for the current limit setting. For auto-retry functionality, once FAULT asserted, EN pull low, TPS2553 is disabled, FAULT des-asserted, CRETRY is slowly charged to EN logic high through RFAULT, then enable, after deglitch time, FAULT asserted again. In the event of an overload, TPS2553 cycles and has output average current. ON-time with output current is decided by FAULT deglitch time. OFF-time without output current is decided by RFAULT x CRETRY constant time to EN logic high and ton time. Therefore, set the RFAULT × CRETRY to get the desired output average current during overload. 10.2.3 Typical Application as USB Power Switch TPS2552/53 USB Data 0.1 mF 5V USB Input IN OUT USB Port RFAULT 100 kW 120 mF Fault Signal FAULT Control Signal ILIM GND EN Power Pad RILIM 20 kW USB requirement only* *USB requirement that downstream facing ports are bypassed with at least 120 mF per hub Copyright © 2016, Texas Instruments Incorporated Figure 29. Typical Application as USB Power Switch 10.2.3.1 Design Requirements For this example, use the parameters shown in Table 4. Table 4. Design Requirements PARAMETER VALUE Input voltage 5V Output voltage 5V Current 1200 mA 10.2.3.1.1 USB Power-Distribution Requirements USB can be implemented in several ways regardless of the type of USB device being developed. Several powerdistribution features must be implemented. • SPHs must: – Current limit downstream ports – Report overcurrent conditions • BPHs must: – Enable or disable power to downstream ports – Power up at <100 mA – Limit inrush current (<44 Ω and 10 µF) • Functions must: – Limit inrush currents – Power up at <100 mA The feature set of the TPS255x and TPS255x-1 meets each of these requirements. The integrated current limiting and overcurrent reporting is required by self-powered hubs. The logic-level enable and controlled rise times meet the need of both input and output ports on bus-powered hubs and the input ports for bus-powered functions. 22 Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 TPS2552, TPS2553, TPS2552-1, TPS2553-1 www.ti.com SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 10.2.3.2 Detailed Design Procedure 10.2.3.2.1 Universal Serial Bus (USB) Power-Distribution Requirements One application for this device is for current limiting in universal serial bus (USB) applications. The original USB interface was a 12-Mbps or 1.5-Mbps, multiplexed serial bus designed for low-to-medium bandwidth PC peripherals (for example, keyboards, printers, scanners, and mice). As the demand for more bandwidth increased, the USB 2.0 standard was introduced increasing the maximum data rate to 480-Mbps. The four-wire USB interface is conceived for dynamic attach-detach (hot plug-unplug) of peripherals. Two lines are provided for differential data, and two lines are provided for 5-V power distribution. USB data is a 3.3-V level signal, but power is distributed at 5 V to allow for voltage drops in cases where power is distributed through more than one hub across long cables. Each function must provide its own regulated 3.3 V from the 5-V input or its own internal power supply. The USB specification classifies two different classes of devices depending on its maximum current draw. A device classified as low-power can draw up to 100 mA as defined by the standard. A device classified as high-power can draw up to 500 mA. It is important that the minimum current-limit threshold of the current-limiting power-switch exceed the maximum current-limit draw of the intended application. The latest USB standard must always be referenced when considering the current-limit threshold The USB specification defines two types of devices as hubs and functions. A USB hub is a device that contains multiple ports for different USB devices to connect and can be self-powered (SPH) or bus-powered (BPH). A function is a USB device that is able to transmit or receive data or control information over the bus. A USB function can be embedded in a USB hub. A USB function can be one of three types included in the list below. • Low-power, bus-powered function • High-power, bus-powered function • Self-powered function SPHs and BPHs distribute data and power to downstream functions. The TPS255x has higher current capability than required for a single USB port allowing it to power multiple downstream ports. Copyright © 2008–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 23 TPS2552, TPS2553, TPS2552-1, TPS2553-1 SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 www.ti.com 11 Power Supply Recommendations 11.1 Self-Powered and Bus-Powered Hubs A SPH has a local power supply that powers embedded functions and downstream ports. This power supply must provide between 4.75 V to 5.25 V to downstream facing devices under full-load and no-load conditions. SPHs are required to have current-limit protection and must report overcurrent conditions to the USB controller. Typical SPHs are desktop PCs, monitors, printers, and stand-alone hubs. A BPH obtains all power from an upstream port and often contains an embedded function. It must power up with less than 100 mA. The BPH usually has one embedded function, and power is always available to the controller of the hub. If the embedded function and hub require more than 100 mA on power up, keep the power to the embedded function off until enumeration is completed. This can be accomplished by removing power or by shutting off the clock to the embedded function. Power-switching the embedded function is not necessary if the aggregate power draw for the function and controller is less than 100 mA. The total current drawn by the buspowered device is the sum of the current to the controller, the embedded function, and the downstream ports, and it is limited to 500 mA from an upstream port. 11.2 Low-Power Bus-Powered and High-Power Bus-Powered Functions Both low-power and high-power bus-powered functions obtain all power from upstream ports. Low-power functions always draw less than 100 mA; high-power functions must draw less than 100 mA at power up and can draw up to 500 mA after enumeration. If the load of the function is more than the parallel combination of 44 Ω and 10 µF at power up, the device must implement inrush current limiting. 11.3 Power Dissipation and Junction Temperature The low ON-resistance of the N-channel MOSFET allows small surface-mount packages to pass large currents. It is good design practice to estimate power dissipation and junction temperature. The below analysis gives an approximation for calculating junction temperature based on the power dissipation in the package. However, it is important to note that thermal analysis is strongly dependent on additional system level factors. Such factors include air flow, board layout, copper thickness and surface area, and proximity to other devices dissipating power. Good thermal design practice must include all system level factors in addition to individual component analysis. Begin by determining the rDS(on) of the N-channel MOSFET relative to the input voltage and operating temperature. As an initial estimate, use the highest operating ambient temperature of interest and read rDS(on) from the typical characteristics graph. Using this value, the power dissipation can be calculated using Equation 7. PD = rDS(on) × IOUT 2 where • • • • PD = Total power dissipation (W) rDS(on) = Power switch on-resistance (Ω) IOUT = Maximum current-limit threshold (A) This step calculates the total power dissipation of the N-channel MOSFET. (7) Finally, calculate the junction temperature: TJ = PD × θJA + TA where • • • TA = Ambient temperature (°C) θJA = Thermal resistance (°C/W) PD = Total power dissipation (W) (8) Compare the calculated junction temperature with the initial estimate. If they are not within a few degrees, repeat the calculation using the refined rDS(on) from the previous calculation as the new estimate. Two or three iterations are generally sufficient to achieve the desired result. The final junction temperature is highly dependent on thermal resistance θJA, and thermal resistance is highly dependent on the individual package and board layout. The Thermal Information table provides example thermal resistances for specific packages and board layouts. 24 Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 TPS2552, TPS2553, TPS2552-1, TPS2553-1 www.ti.com SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 12 Layout 12.1 Layout Guidelines • • • • TI recommends placing the 100-nF bypass capacitor near the IN and GND pins, and make the connections using a low-inductance trace. TI recommends placing a high-value electrolytic capacitor and a 100-nF bypass capacitor on the output pin when large transient currents are expected on the output. The traces routing the RILIM resistor to the device must be as short as possible to reduce parasitic effects on the current limit accuracy. The PowerPAD must be directly connected to PCB ground plane using wide and short copper trace. 12.2 Layout Example /FAULT IN EN 1 6 OUT 2 5 ILIM 3 4 Figure 30. Layout Recommendation Copyright © 2008–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 25 TPS2552, TPS2553, TPS2552-1, TPS2553-1 SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016 www.ti.com 13 Device and Documentation Support 13.1 Device Support For the TI Switch Portfolio, go here. 13.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 5. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY TPS32552 Click here Click here Click here Click here Click here TPS2553 Click here Click here Click here Click here Click here TPS2552-1 Click here Click here Click here Click here Click here TPS2553-1 Click here Click here Click here Click here Click here 13.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 13.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 13.5 Trademarks PowerPAD, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 13.6 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 13.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 26 Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1 PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) HPA00615DRVR ACTIVE WSON DRV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CHT HPA00714DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 2552 HPA02257DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CHZ TPS2552DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 2552 TPS2552DBVR-1 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CHX TPS2552DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 2552 TPS2552DBVT-1 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CHX TPS2552DRVR ACTIVE WSON DRV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CHR TPS2552DRVR-1 ACTIVE WSON DRV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CHY TPS2552DRVT ACTIVE WSON DRV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CHR TPS2552DRVT-1 ACTIVE WSON DRV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CHY TPS2553DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 2553 TPS2553DBVR-1 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CHZ TPS2553DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 2553 TPS2553DBVT-1 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CHZ TPS2553DRVR ACTIVE WSON DRV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CHT TPS2553DRVR-1 ACTIVE WSON DRV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CJZ Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 15-Apr-2017 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TPS2553DRVT ACTIVE WSON DRV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CHT TPS2553DRVT-1 ACTIVE WSON DRV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CJZ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 OTHER QUALIFIED VERSIONS OF TPS2553, TPS2553-1 : • Automotive: TPS2553-Q1, TPS2553-Q1 NOTE: Qualified Version Definitions: • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 27-Jan-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TPS2552DBVR SOT-23 DBV 6 3000 180.0 8.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.2 3.2 1.4 4.0 8.0 Q3 TPS2552DBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS2552DBVR-1 SOT-23 DBV 6 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS2552DBVR-1 SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS2552DBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS2552DBVT SOT-23 DBV 6 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS2552DBVT SOT-23 DBV 6 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS2552DBVT-1 SOT-23 DBV 6 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS2552DBVT-1 SOT-23 DBV 6 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS2552DRVR WSON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS2552DRVR WSON DRV 6 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 TPS2552DRVR-1 WSON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS2552DRVT WSON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS2552DRVT WSON DRV 6 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 TPS2552DRVT-1 WSON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS2553DBVR SOT-23 DBV 6 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS2553DBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS2553DBVR-1 SOT-23 DBV 6 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 27-Jan-2017 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TPS2553DBVR-1 SOT-23 DBV 6 3000 178.0 9.0 TPS2553DBVT SOT-23 DBV 6 250 179.0 8.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 3.2 3.2 1.4 4.0 8.0 Q3 TPS2553DBVT SOT-23 DBV 6 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS2553DBVT-1 SOT-23 DBV 6 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS2553DBVT-1 SOT-23 DBV 6 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS2553DRVR WSON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS2553DRVR WSON DRV 6 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 TPS2553DRVR-1 WSON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS2553DRVR-1 WSON DRV 6 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 TPS2553DRVT WSON DRV 6 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 TPS2553DRVT WSON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS2553DRVT-1 WSON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS2553DRVT-1 WSON DRV 6 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS2552DBVR SOT-23 DBV 6 3000 210.0 185.0 35.0 TPS2552DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 TPS2552DBVR-1 SOT-23 DBV 6 3000 203.0 203.0 35.0 TPS2552DBVR-1 SOT-23 DBV 6 3000 180.0 180.0 18.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 27-Jan-2017 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS2552DBVT SOT-23 DBV 6 250 210.0 185.0 35.0 TPS2552DBVT SOT-23 DBV 6 250 180.0 180.0 18.0 TPS2552DBVT SOT-23 DBV 6 250 203.0 203.0 35.0 TPS2552DBVT-1 SOT-23 DBV 6 250 180.0 180.0 18.0 TPS2552DBVT-1 SOT-23 DBV 6 250 203.0 203.0 35.0 TPS2552DRVR WSON DRV 6 3000 203.0 203.0 35.0 TPS2552DRVR WSON DRV 6 3000 210.0 185.0 35.0 TPS2552DRVR-1 WSON DRV 6 3000 203.0 203.0 35.0 TPS2552DRVT WSON DRV 6 250 203.0 203.0 35.0 TPS2552DRVT WSON DRV 6 250 210.0 185.0 35.0 TPS2552DRVT-1 WSON DRV 6 250 203.0 203.0 35.0 TPS2553DBVR SOT-23 DBV 6 3000 203.0 203.0 35.0 TPS2553DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 TPS2553DBVR-1 SOT-23 DBV 6 3000 203.0 203.0 35.0 TPS2553DBVR-1 SOT-23 DBV 6 3000 180.0 180.0 18.0 TPS2553DBVT SOT-23 DBV 6 250 203.0 203.0 35.0 TPS2553DBVT SOT-23 DBV 6 250 180.0 180.0 18.0 TPS2553DBVT-1 SOT-23 DBV 6 250 180.0 180.0 18.0 TPS2553DBVT-1 SOT-23 DBV 6 250 203.0 203.0 35.0 TPS2553DRVR WSON DRV 6 3000 203.0 203.0 35.0 TPS2553DRVR WSON DRV 6 3000 210.0 185.0 35.0 TPS2553DRVR-1 WSON DRV 6 3000 203.0 203.0 35.0 TPS2553DRVR-1 WSON DRV 6 3000 210.0 185.0 35.0 TPS2553DRVT WSON DRV 6 250 210.0 185.0 35.0 TPS2553DRVT WSON DRV 6 250 203.0 203.0 35.0 TPS2553DRVT-1 WSON DRV 6 250 203.0 203.0 35.0 TPS2553DRVT-1 WSON DRV 6 250 210.0 185.0 35.0 Pack Materials-Page 3 IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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