Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2527DF GENERAL DESCRIPTION New generation, high-voltage, high-speed switching npn transistor with integrated damper diode in a plastic full-pack envelope intended for use in horizontal deflection circuits of high resolution monitors. Features improved RBSOA performance. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS VCESM Collector-emitter voltage peak value VBE = 0 V VCEO IC ICM Ptot VCEsat ICsat ts Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Total power dissipation Collector-emitter saturation voltage Collector saturation current Storage time PINNING - SOT199 PIN Ths ≤ 25 ˚C IC = 8.0 A; IB = 1.6 A f = 64 kHz ICsat = 6.0 A; f = 64 kHz PIN CONFIGURATION TYP. MAX. UNIT - 1500 V 6.0 1.7 800 12 30 45 5.0 2.0 V A A W V A µs SYMBOL DESCRIPTION 1 base 2 collector 3 emitter case isolated c case b Rbe 1 2 e 3 LIMITING VALUES Limiting values in accordance with the Absolute Maximum Rating System (IEC 134) SYMBOL PARAMETER CONDITIONS VCESM VCEO IC ICM IB IBM -IB(AV) -IBM Ptot Tstg Tj Collector-emitter voltage peak value Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Base current (DC) Base current peak value Reverse base current Reverse base current peak value 1 Total power dissipation Storage temperature Junction temperature VBE = 0 V average over any 20 ms period Ths ≤ 25 ˚C MIN. MAX. UNIT -65 - 1500 800 12 30 8 12 200 7 45 150 150 V V A A A A mA A W ˚C ˚C TYP. MAX. UNIT - 3.7 K/W - 2.8 K/W 35 - K/W THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-hs Junction to heatsink without heatsink compound Rth j-hs Junction to heatsink with heatsink compound Rth j-a Junction to ambient in free air 1 Turn-off current. September 1997 1 Rev 1.200 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2527DF ISOLATION LIMITING VALUE & CHARACTERISTIC Ths = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS Visol Repetitive peak voltage from all three terminals to external heatsink R.H. ≤ 65 % ; clean and dustfree Cisol Capacitance from T2 to external f = 1 MHz heatsink MIN. TYP. - MAX. UNIT 2500 V - 22 - pF MIN. TYP. MAX. UNIT - - 1.0 2.0 mA mA 7.5 800 110 55 13.5 - - mA Ω V V 5 - 11 7 1.6 5.0 1.1 10 2.0 V V STATIC CHARACTERISTICS Ths = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS 2 ICES ICES Collector cut-off current IEBO REB BVEBO VCEOsust Emitter cut-off current Base-emitter resistance Emitter-base breakdown voltage Collector-emitter sustaining voltage VCEsat VBEsat hFE hFE VF Collector-emitter saturation voltage Base-emitter saturation voltage DC current gain Diode forward voltage VBE = 0 V; VCE = VCESMmax VBE = 0 V; VCE = VCESMmax; Tj = 125 ˚C VEB = 6.0 V; IC = 0 A VEB = 6.0 V IB = 600 mA IB = 0 A;IC = 100mA; L = 25 mH IC = 8.0 A; IB = 1.6 A IC = 8.0 A; IB = 1.6 A IC = 1 A; VCE = 5 V IC = 8 A; VCE = 5 V IF = 8 A V DYNAMIC CHARACTERISTICS Ths = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT Cc Collector capacitance IE = 0 A; VCB = 10 V; f = 1 MHz 145 - pF Switching times (64 kHz line deflection circuit) ICsat = 6.0 A; LC = 170 µH; Cfb = 5.4 nF; IB(end) = 0.55 A; LB = 0.6 µH; -VBB = 4 V;-IBM = 3.6 A 1.7 0.1 2.0 0.2 µs µs IF = 8 A; dIF/dt = 50 A/µs 16 - V VF = 5 V 410 - ns ts tf Turn-off storage time Turn-off fall time Vfr Anti-parallel diode forward recovery voltage Anti-parallel diode forward recovery time tfr 2 Measured with half sine-wave voltage (curve tracer). September 1997 2 Rev 1.200 Philips Semiconductors Product specification Silicon Diffused Power Transistor ICsat TRANSISTOR IC BU2527DF + 150 v nominal adjust for ICsat DIODE t Lc IB I B end t 5 us D.U.T. 6.5 us LB IBend Cfb 16 us VCE -VBB Rbe t Fig.1. Switching times waveforms. Fig.4. Switching times test circuit. VCC ICsat 90 % IC LC 10 % tf t VCL IBend ts LB IB IBend -VBB Rbe CFB T.U.T. t - IBM Fig.5. Test Circuit RBSOA. VCC = 140 V; -VBB = 4 V; LC = 100 - 200 µH; VCL ≤ 1500 V; LB = 3 µH; CFB = 1 - 2.2 nF; IB(end) = 1 - 2 A Fig.2. Switching times definitions. I I F BU2525DF hFE F 100 Tj = 25 C Tj = 125 C 5V 10% time t fr V 10 F 1V V 5V V fr F 1 0.1 time 10 100 IC / A Fig.3. Definition of anti-parallel diode Vfr and tfr September 1997 1 Fig.6. Typical DC current gain. hFE = f (IC) parameter VCE 3 Rev 1.200 Philips Semiconductors Product specification Silicon Diffused Power Transistor 1.2 VBESAT / V 1.1 BU2527DF BU2525AF VCESAT / V 10 BU2525AF Tj = 25 C Tj = 25 C Tj = 125 C Tj = 125 C 1 0.9 8A 0.8 1 6A IC/IB= 0.7 3 0.6 5A 4 0.5 IC = 4 A 5 0.4 0.1 1 IC / A 0.1 10 0.1 Fig.7. Typical base-emitter saturation voltage. VBEsat = f (IC); parameter IC/IB 1 VCESAT / V 1 IB / A 10 Fig.10. Typical collector-emitter saturation voltage. VCEsat = f (IB); parameter IC BU2525AF BU2527AF Poff / W 100 IC/IB = 0.9 5 0.8 4 0.7 IC = 3 0.6 6A 10 0.5 5A Tj = 25 C 0.4 Tj = 125 C 0.3 0.2 0.1 0 1 0.1 1 100 10 0 0.2 0.4 0.6 0.8 IC / A Fig.8. Typical collector-emitter saturation voltage. VCEsat = f (IC); parameter IC/IB 1.2 VBESAT / V 1 1.2 1.4 1.6 1.8 IB / A 2 Fig.11. Typical turn-off losses. Tj = 85˚C Eoff = f (IB); parameter IC; f = 64 kHz BU2525AF 4 BU2527AF ts, tf / us Tj = 25 C 3.5 Tj = 125 C 1.1 3 1 2.5 0.9 2 IC= 0.8 IC = 1.5 6A 8A 1 6A 5A 4A 0.7 0.6 0 1 2 IB / A 3 0.5 0 4 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 IB / A 2 Fig.12. Typical collector storage and fall time. ts = f (IB); tf = f (IB); parameter IC; Tj = 85˚C; f = 64 kHz Fig.9. Typical base-emitter saturation voltage. VBEsat = f (IB); parameter IC September 1997 5A 4 Rev 1.200 Philips Semiconductors Product specification Silicon Diffused Power Transistor Normalised Power Derating PD% 120 BU2527DF IC / A BU2527AF 30 with heatsink compound 110 100 90 80 70 20 60 50 40 10 30 20 10 0 0 20 40 60 80 Ths / C 100 120 0 140 500 1000 1500 VCE / V Fig.15. Reverse bias safe operating area. Tj ≤ Tjmax Fig.13. Normalised power dissipation. PD% = 100⋅PD/PD 25˚C = f (Ths) 10 0 Zth / (K/W) BU2525AF IC / A BU2525AF 100 tp = 0.5 1 0.1 0.2 0.1 0.05 ICM 0.02 ICDC 40 us PD 0.01 D=0 0.001 1E-06 = 0.01 tp D= 1E-02 t/s 100 us t T 1E-04 10 tp T 1E+00 Ptot Fig.14. Transient thermal impedance. Zth j-hs = f(t); parameter D = tp/T 1 1 ms 0.1 10 ms DC 0.01 1 10 100 1000 VCE / V Fig.16. Forward bias safe operating area. Ths = 25 ˚C ICDC & ICM = f(VCE); ICM single pulse; parameter tp Second-breakdown limits independant of temperature. Mounted with heatsink compound. September 1997 5 Rev 1.200 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2527DF MECHANICAL DATA Dimensions in mm 15.3 max Net Mass: 5.5 g 5.2 max 3.1 3.3 0.7 7.3 3.2 o 45 6.2 5.8 21.5 max seating plane 3.5 max not tinned 3.5 15.7 min 1 2 2.1 max 5.45 3 1.2 1.0 0.7 max 0.4 M 2.0 5.45 Fig.17. SOT199; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". September 1997 6 Rev 1.200 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2527DF DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1997 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1997 7 Rev 1.200