MC34151, MC33151 High Speed Dual MOSFET Drivers The MC34151/MC33151 are dual inverting high speed drivers specifically designed for applications that require low current digital circuitry to drive large capacitive loads with high slew rates. These devices feature low input current making them CMOS and LSTTL logic compatible, input hysteresis for fast output switching that is independent of input transition time, and two high current totem pole outputs ideally suited for driving power MOSFETs. Also included is an undervoltage lockout with hysteresis to prevent erratic system operation at low supply voltages. Typical applications include switching power supplies, dc to dc converters, capacitor charge pump voltage doublers/inverters, and motor controllers. These devices are available in dual−in−line and surface mount packages. Features • • • • • • • • • http://onsemi.com MARKING DIAGRAMS 8 8 1 1 8 8 Two Independent Channels with 1.5 A Totem Pole Output Output Rise and Fall Times of 15 ns with 1000 pF Load CMOS/LSTTL Compatible Inputs with Hysteresis Undervoltage Lockout with Hysteresis Low Standby Current Efficient High Frequency Operation Enhanced System Performance with Common Switching Regulator Control ICs Pin Out Equivalent to DS0026 and MMH0026 These are Pb−Free and Halide−Free Devices MC3x151P AWL YYWWG PDIP−8 P SUFFIX CASE 626 1 SOIC−8 D SUFFIX CASE 751 1 8 3x151 ALYWG G MC3x151 x A WL, L YY, Y WW, W G or G 1 3151V ALYWG G MC33151V = 3 or 4 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) PIN CONNECTIONS VCC 6 N.C. 1 + + + 8 N.C. Logic Input A 2 - 7 Drive Output A GND 3 + 6 VCC Logic Input B 4 5.7V 5 Drive Output B + Drive Output A Logic Input A 100k 2 (Top View) 7 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. + + Drive Output B 100k Logic Input B 4 GND 5 3 Figure 1. Representative Block Diagram © Semiconductor Components Industries, LLC, 2013 August, 2013 − Rev. 9 1 Publication Order Number: MC34151/D MC34151, MC33151 MAXIMUM RATINGS Symbol Value Unit Power Supply Voltage Rating VCC 20 V Logic Inputs (Note 1) Vin −0.3 to VCC V Drive Outputs (Note 2) Totem Pole Sink or Source Current Diode Clamp Current (Drive Output to VCC) IO IO(clamp) 1.5 1.0 PD RqJA 0.56 180 W °C/W PD RqJA 1.0 100 W °C/W Operating Junction Temperature TJ +150 °C Operating Ambient Temperature MC34151 MC33151 MC33151V TA Storage Temperature Range Tstg Electrostatic Discharge Sensitivity (ESD) (Note 3) Human Body Model (HBM) Machine Model (MM) Charged Device Model (CDM) ESD A Power Dissipation and Thermal Characteristics D Suffix SOIC−8 Package Case 751 Maximum Power Dissipation @ TA = 50°C Thermal Resistance, Junction−to−Air P Suffix 8−Pin Package Case 626 Maximum Power Dissipation @ TA = 50°C Thermal Resistance, Junction−to−Air 0 to +70 −40 to +85 −40 to +125 −65 to +150 °C °C V 2000 200 1500 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. For optimum switching speed, the maximum input voltage should be limited to 10 V or VCC, whichever is less. 2. Maximum package power dissipation limits must be observed. 3. ESD protection per JEDEC Standard JESD22−A114−F for HBM per JEDEC Standard JESD22−A115−A for MM per JEDEC Standard JESD22−C101D for CDM. http://onsemi.com 2 MC34151, MC33151 ELECTRICAL CHARACTERISTICS (VCC = 12 V, for typical values TA = 25°C, for min/max values TA is the only operating ambient temperature range that applies [Note 3], unless otherwise noted.) Characteristics Symbol Min Typ Max Unit VIH VIL − 0.8 1.75 1.58 2.6 − V IIH IIL − − 200 20 500 100 mA VOL − − − 10.5 10.4 9.5 0.8 1.1 1.7 11.2 11.1 10.9 1.2 1.5 2.5 − − − V RPD − 100 − kW tPLH(in/out) tPHL(in/out) − − 35 36 100 100 Drive Output Rise Time (10% to 90%) CL = 1.0 nF Drive Output Rise Time (10% to 90%) CL = 2.5 nF tr − − 14 31 30 − ns Drive Output Fall Time (90% to 10%) CL = 1.0 nF Drive Output Fall Time (90% to 10%) CL = 2.5 nF tf − − 16 32 30 − ns − − 6.0 10.5 10 15 6.5 − 18 LOGIC INPUTS Input Threshold Voltage − Output Transition High to Low State Output Transition Low to High State Input Current − High State (VIH = 2.6 V) Input Current − Low State (VIL = 0.8 V) DRIVE OUTPUT Output Voltage − Low State (ISink = 10 mA) Output Voltage − Low State (ISink = 50 mA) Output Voltage − Low State (ISink = 400 mA) Output Voltage − High State (ISource = 10 mA) Output Voltage − High State (ISource = 50 mA) Output Voltage − High State (ISource = 400 mA) VOH Output Pulldown Resistor SWITCHING CHARACTERISTICS (TA = 25°C) Propagation Delay (10% Input to 10% Output, CL = 1.0 nF) Logic Input to Drive Output Rise Logic Input to Drive Output Fall ns TOTAL DEVICE Power Supply Current Standby (Logic Inputs Grounded) Operating (CL = 1.0 nF Drive Outputs 1 and 2, f = 100 kHz) ICC Operating Voltage VCC mA 1. For optimum switching speed, the maximum input voltage should be limited to 10 V or VCC, whichever is less. 2. Maximum package power dissipation limits must be observed. Thigh = +70°C for MC34151 3. Tlow = 0°C for MC34151 −40°C for MC33151 +85°C for MC33151 http://onsemi.com 3 V MC34151, MC33151 12 4.7 V 0.1 + 6 + + + + - + 5.7V Drive Output 7 100k 2 Logic Input 50 CL 5.0 V Logic Input tr, tf ≤ 10 ns 0V + + 90% 10% tPLH 5 4 100k tPHL 90% 10% Drive Output 3 Figure 2. Switching Characteristics Test Circuit Figure 3. Switching Waveform Definitions 2.2 V th , INPUT THRESHOLD VOLTAGE (V) I in , INPUT CURRENT (mA) 2.4 VCC = 12 V TA = 25°C 2.0 1.6 1.2 0.8 0.4 0 0 2.0 4.0 6.0 8.0 Vin, INPUT VOLTAGE (V) 10 VCC = 12 V 2.0 1.8 Upper Threshold Low State Output 1.6 1.4 Lower Threshold High State Output 1.2 1.0 -55 12 200 VCC = 12 V CL = 1.0 nF TA = 25°C -25 0 25 50 75 TA, AMBIENT TEMPERATURE (°C) 100 125 Figure 5. Logic Input Threshold Voltage versus Temperature t PHL(IN/OUT) , DRIVE OUTPUT PROPAGATION DELAY (ns) t PLH(IN/OUT) , DRIVE OUTPUT PROPAGATION DELAY (ns) Figure 4. Logic Input Current versus Input Voltage 160 tr tf Overdrive Voltage is with Respect to the Logic Input Lower Threshold 120 80 40 Vth(lower) 0 -1.6 -1.2 -0.8 -0.4 0 Vin, INPUT OVERDRIVE VOLTAGE BELOW LOWER THRESHOLD (V) Figure 6. Drive Output Low−to−High Propagation Delay versus Logic Overdrive Voltage 200 Overdrive Voltage is with Respect to the Logic Input Lower Threshold 160 VCC = 12 V CL = 1.0 nF TA = 25°C 120 80 40 Vth(upper) 0 0 1.0 2.0 3.0 4.0 Vin, INPUT OVERDRIVE VOLTAGE ABOVE UPPER THRESHOLD (V) Figure 7. Drive Output High−to−Low Propagation Delay versus Logic Input Overdrive Voltage http://onsemi.com 4 90% Logic Input V clamp , OUTPUT CLAMP VOLTAGE (V) MC34151, MC33151 VCC = 12 V Vin = 5 V to 0 V CL = 1.0 nF TA = 25°C Drive Output 10% 3.0 High State Clamp (Drive Output Driven Above VCC) 1.0 VCC 0 0 GND -1.0 0 50 ns/DIV VCC -1.0 -2.0 Source Saturation VCC = 12 V (Load to Ground) 80 ms Pulsed Load 120 Hz Rate TA = 25°C -3.0 3.0 2.0 1.0 0 Sink Saturation (Load to VCC) 0 0.2 GND 0.4 0.6 0.8 1.0 IO, OUTPUT LOAD CURRENT (A) 0.2 Low State Clamp (Drive Output Driven Below Ground) 0.4 0.6 0.8 1.0 IO, OUTPUT LOAD CURRENT (A) 1.2 1.4 0 -0.5 -0.7 -0.9 -1.1 1.9 1.7 Source Saturation (Load to Ground) VCC Isource = 10 mA 1.4 VCC = 12 V Isource = 400 mA Isink = 400 mA 1.5 1.0 Isink = 10 mA 0.8 GND Sink Saturation 0.6 (Load to VCC) 0 -55 -25 0 25 50 75 TA, AMBIENT TEMPERATURE (°C) Figure 10. Drive Output Saturation Voltage versus Load Current 100 Figure 11. Drive Output Saturation Voltage versus Temperature 90% VCC = 12 V Vin = 5 V to 0 V CL = 1.0 nF TA = 25°C 90% VCC = 12 V Vin = 5 V to 0 V CL = 1.0 nF TA = 25°C 10% 1.2 Figure 9. Drive Output Clamp Voltage versus Clamp Current V sat , OUTPUT SATURATION VOLTAGE(V) V sat , OUTPUT SATURATION VOLTAGE(V) Figure 8. Propagation Delay 0 VCC = 12 V 80 ms Pulsed Load 120 Hz Rate TA = 25°C 2.0 10% 10 ns/DIV 10 ns/DIV Figure 12. Drive Output Rise Time Figure 13. Drive Output Fall Time http://onsemi.com 5 125 MC34151, MC33151 80 VCC = 12 V VIN = 0 V to 5.0 V TA = 25°C 60 ICC, SUPPLY CURRENT (mA) t r -t f , OUTPUT RISE‐FALL TIME(ns) 80 40 tf 20 tr 0 0.1 1.0 CL, OUTPUT LOAD CAPACITANCE (nF) f = 500 kHz 20 f = 50 kHz 1.0 CL, OUTPUT LOAD CAPACITANCE (nF) 10 TA = 25°C ICC , SUPPLY CURRENT (mA) ICC , SUPPLY CURRENT (mA) 40 8.0 Both Logic Inputs Driven 0 V to 5.0 V, 50% Duty Cycle Both Drive Outputs Loaded TA = 25°C 1 - VCC = 18 V, CL = 2.5 nF 2 - VCC = 12 V, CL = 2.5 nF 3 - VCC = 18 V, CL = 1.0 nF 4 - VCC = 12 V, CL = 1.0 nF 1 2 3 4 20 0 f = 200 kHz Figure 15. Supply Current versus Drive Output Load Capacitance 80 40 60 0 0.1 10 Figure 14. Drive Output Rise and Fall Time versus Load Capacitance 60 VCC = 12 V Both Logic Inputs Driven 0 V to 5.0 V 50% Duty Cycle Both Drive Outputs Loaded TA = 25°C 10 k 100 4.0 Logic Inputs Grounded High State Drive Outputs 2.0 0 1.0 M Logic Inputs at VCC Low State Drive Outputs 6.0 0 f, INPUT FREQUENCY (Hz) 4.0 8.0 12 16 VCC, SUPPLY VOLTAGE (V) Figure 16. Supply Current versus Input Frequency Figure 17. Supply Current versus Supply Voltage APPLICATIONS INFORMATION Description Output Stage The MC34151 is a dual inverting high speed driver specifically designed to interface low current digital circuitry with power MOSFETs. This device is constructed with Schottky clamped Bipolar Analog technology which offers a high degree of performance and ruggedness in hostile industrial environments. Each totem pole Drive Output is capable of sourcing and sinking up to 1.5 A with a typical ‘on’ resistance of 2.4 W at 1.0 A. The low ‘on’ resistance allows high output currents to be attained at a lower VCC than with comparative CMOS drivers. Each output has a 100 kW pulldown resistor to keep the MOSFET gate low when VCC is less than 1.4 V. No over current or thermal protection has been designed into the device, so output shorting to VCC or ground must be avoided. Parasitic inductance in series with the load will cause the driver outputs to ring above VCC during the turn−on transition, and below ground during the turn−off transition. With CMOS drivers, this mode of operation can cause a destructive output latchup condition. The MC34151 is immune to output latchup. The Drive Outputs contain an internal diode to VCC for clamping positive voltage transients. When operating with VCC at 18 V, proper power supply bypassing must be observed to prevent the output ringing from exceeding the maximum 20 V device rating. Negative output transients are clamped by the internal NPN pullup transistor. Since full supply voltage is applied across Input Stage The Logic Inputs have 170 mV of hysteresis with the input threshold centered at 1.67 V. The input thresholds are insensitive to VCC making this device directly compatible with CMOS and LSTTL logic families over its entire operating voltage range. Input hysteresis provides fast output switching that is independent of the input signal transition time, preventing output oscillations as the input thresholds are crossed. The inputs are designed to accept a signal amplitude ranging from ground to VCC. This allows the output of one channel to directly drive the input of a second channel for master−slave operation. Each input has a 30 kW pulldown resistor so that an unconnected open input will cause the associated Drive Output to be in a known high state. http://onsemi.com 6 MC34151, MC33151 the NPN pullup during the negative output transient, power dissipation at high frequencies can become excessive. Figures 20, 21, and 22 show a method of using external Schottky diode clamps to reduce driver power dissipation. gate charge information on their data sheets. Figure 18 shows a curve of gate voltage versus gate charge for the ON Semiconductor MTM15N50. Note that there are three distinct slopes to the curve representing different input capacitance values. To completely switch the MOSFET ‘on’, the gate must be brought to 10 V with respect to the source. The graph shows that a gate charge Qg of 110 nC is required when operating the MOSFET with a drain to source voltage VDS of 400 V. Undervoltage Lockout V GS , GATE-TO-SOURCE VOLTAGE (V) An undervoltage lockout with hysteresis prevents erratic system operation at low supply voltages. The UVLO forces the Drive Outputs into a low state as VCC rises from 1.4 V to the 5.8 V upper threshold. The lower UVLO threshold is 5.3 V, yielding about 500 mV of hysteresis. Power Dissipation Circuit performance and long term reliability are enhanced with reduced die temperature. Die temperature increase is directly related to the power that the integrated circuit must dissipate and the total thermal resistance from the junction to ambient. The formula for calculating the junction temperature with the package in free air is: where: TJ = TJ = TA = PD = RqJA = TA + PD (RqJA) Junction Temperature Ambient Temperature Power Dissipation Thermal Resistance Junction to Ambient 16 MTM15N50 ID = 15 A TA = 25°C 12 8.0 8.9 nF 4.0 2.0 nF 0 0 There are three basic components that make up total power to be dissipated when driving a capacitive load with respect to ground. They are: where: PD = PQ = PC = PT = 120 160 The flat region from 10 nC to 55 nC is caused by the drain−to−gate Miller capacitance, occurring while the MOSFET is in the linear region dissipating substantial amounts of power. The high output current capability of the MC34151 is able to quickly deliver the required gate charge for fast power efficient MOSFET switching. By operating the MC34151 at a higher VCC, additional charge can be provided to bring the gate above 10 V. This will reduce the ‘on’ resistance of the MOSFET at the expense of higher driver dissipation at a given operating frequency. The transition power dissipation is due to extremely short simultaneous conduction of internal circuit nodes when the Drive Outputs change state. The transition power dissipation per driver is approximately: ICCL (1−D) + ICCH (D) The capacitive load power dissipation is directly related to the load capacitance value, frequency, and Drive Output voltage swing. The capacitive load power dissipation per driver is: where: 80 Qg, GATE CHARGE (nC) PC(MOSFET) = VC Qg f ICCL = Supply Current with Low State Drive Outputs ICCH = Supply Current with High State Drive Outputs D = Output Duty Cycle PC = VOH = VOL = CL = f= 40 D Qg D VGS The capacitive load power dissipation is directly related to the required gate charge, and operating frequency. The capacitive load power dissipation per driver is: The quiescent power supply current depends on the supply voltage and duty cycle as shown in Figure 17. The device’s quiescent power dissipation is: where: CGS = Figure 18. Gate−To−Source Voltage versus Gate Charge PQ + PC + PT Quiescent Power Dissipation Capacitive Load Power Dissipation Transition Power Dissipation PQ = VCC VDS = 400 V VDS = 100 V PT = VCC (1.08 VCC CL f − 8 y 10−4) PT must be greater than zero. VCC (VOH − VOL) CL f High State Drive Output Voltage Low State Drive Output Voltage Load Capacitance frequency Switching time characterization of the MC34151 is performed with fixed capacitive loads. Figure 14 shows that for small capacitance loads, the switching speed is limited by transistor turn−on/off time and the slew rate of the internal nodes. For large capacitance loads, the switching speed is limited by the maximum output current capability of the integrated circuit. When driving a MOSFET, the calculation of capacitive load power PC is somewhat complicated by the changing gate to source capacitance CGS as the device switches. To aid in this calculation, power MOSFET manufacturers provide http://onsemi.com 7 MC34151, MC33151 LAYOUT CONSIDERATIONS optimum drive performance, it is recommended that the initial circuit design contains dual power supply bypass capacitors connected with short leads as close to the VCC pin and ground as the layout will permit. Suggested capacitors are a low inductance 0.1 mF ceramic in parallel with a 4.7 mF tantalum. Additional bypass capacitors may be required depending upon Drive Output loading and circuit layout. Proper printed circuit board layout is extremely critical and cannot be over emphasized. High frequency printed circuit layout techniques are imperative to prevent excessive output ringing and overshoot. Do not attempt to construct the driver circuit on wire−wrap or plug−in prototype boards. When driving large capacitive loads, the printed circuit board must contain a low inductance ground plane to minimize the voltage spikes induced by the high ground ripple currents. All high current loops should be kept as short as possible using heavy copper runs to provide a low impedance high frequency path. For VCC 47 Vin 0.1 6 + + ++ 5.7V Vin + + Rg 7 + D1 1N5819 + 5 4 100k TL494 or TL594 100k 100k 2 Series gate resistor Rg may be needed to damp high frequency parasitic oscillations caused by the MOSFET input capacitance and any series wiring inductance in the gate-source circuit. Rg will decrease the MOSFET switching speed. Schottky diode D1 can reduce the driver's power dissipation due to excessive ringing, by preventing the output pin from being driven below ground. 3 The MC34151 greatly enhances the drive capabilities of common switching regulators and CMOS/TTL logic devices. Figure 19. Enhanced System Performance with Common Switching Regulators Figure 20. MOSFET Parasitic Oscillations + + 100k 7 4X 1N5819 + + Isolation Boundary + 100k 100k 5 1N 5819 3 3 Output Schottky diodes are recommended when driving inductive loads at high frequencies. The diodes reduce the driver's power dissipation by preventing the output pins from being driven above VCC and below ground. Figure 21. Direct Transformer Drive Figure 22. Isolated MOSFET Drive http://onsemi.com 8 MC34151, MC33151 Vin IB Vin + 0 + Base Charge Removal - Rg(on) + 100k C1 100k Rg(off) The totem-pole outputs can furnish negative base current for enhanced transistor turn-off, with the addition of capacitor C1. In noise sensitive applications, both conducted and radiated EMI can be reduced significantly by controlling the MOSFET's turn-on and turn-off times. Figure 23. Controlled MOSFET Drive Figure 24. Bipolar Transistor Drive VCC = 15 V 4.7 0.1 + 6 + + + - + 5.7V + 6.8 10 7 + 100k 2 1N5819 47 + + VO ≈ 2.0 VCC + + 5 6.8 10 + 100k 4 330pF 1N5819 - VO ≈ - VCC 47 + 3 10k Output Load Regulation The capacitor's equivalent series resistance limits the Drive Output Current to 1.5 A. An additional series resistor may be required when using tantalum or other low ESR capacitors. Figure 25. Dual Charge Pump Converter http://onsemi.com 9 IO (mA) +VO (V) −VO (V) 0 1.0 10 20 30 50 27.7 27.4 26.4 25.5 24.6 22.6 −13.3 −12.9 −11.9 −11.2 −10.5 −9.4 MC34151, MC33151 ORDERING INFORMATION Package Shipping† MC34151DG SOIC−8 (Pb−Free) 98 Units / Rail MC34151DR2G SOIC−8 (Pb−Free) 2500 Tape & Reel MC34151PG PDIP−8 (Pb−Free) 50 Units / Rail MC33151DG SOIC−8 (Pb−Free) 98 Units / Rail MC33151DR2G SOIC−8 (Pb−Free) 2500 Tape & Reel MC33151PG PDIP−8 (Pb−Free) 50 Units / Rail MC33151VDR2G SOIC−8 (Pb−Free) 2500 Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 10 MC34151, MC33151 PACKAGE DIMENSIONS PDIP−8 P SUFFIX CASE 626−05 ISSUE N D A E H 8 5 E1 1 4 NOTE 8 b2 c B END VIEW TOP VIEW WITH LEADS CONSTRAINED NOTE 5 A2 A e/2 NOTE 3 L SEATING PLANE A1 C D1 M e 8X SIDE VIEW b 0.010 eB END VIEW M C A M B M NOTE 6 http://onsemi.com 11 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3. 4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT TO EXCEED 0.10 INCH. 5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR TO DATUM C. 6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE LEADS UNCONSTRAINED. 7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE LEADS, WHERE THE LEADS EXIT THE BODY. 8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE CORNERS). DIM A A1 A2 b b2 C D D1 E E1 e eB L M INCHES MIN MAX −−−− 0.210 0.015 −−−− 0.115 0.195 0.014 0.022 0.060 TYP 0.008 0.014 0.355 0.400 0.005 −−−− 0.300 0.325 0.240 0.280 0.100 BSC −−−− 0.430 0.115 0.150 −−−− 10 ° MILLIMETERS MIN MAX −−− 5.33 0.38 −−− 2.92 4.95 0.35 0.56 1.52 TYP 0.20 0.36 9.02 10.16 0.13 −−− 7.62 8.26 6.10 7.11 2.54 BSC −−− 10.92 2.92 3.81 −−− 10 ° MC34151, MC33151 PACKAGE DIMENSIONS SOIC−8 D SUFFIX CASE 751−07 ISSUE AK −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S DIM A B C D G H J K M N S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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