Maxim MAX8559EBAP2 Dual, 300ma, low-noise linear regulator with independent shutdown in ucsp or tdfn Datasheet

19-3121; Rev 0; 1/04
KIT
ATION
EVALU
E
L
B
AVAILA
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
The MAX8559 dual, low-noise, low-dropout (LDO) linear
regulator operates from a 2.5V to 6.5V input voltage
and delivers at least 300mA of continuous output current. It offers low output noise and low dropout of only
60mV at 100mA. Typical output noise for this device is
32µVRMS, and PSRR is 70dB at 10kHz. Designed with
an internal P-channel MOSFET pass transistor, the
MAX8559 maintains a low 115µA supply current per
LDO, independent of the load current and dropout voltage. Other features include short-circuit protection and
thermal-shutdown protection. The MAX8559 includes
two independent logic-controlled shutdown inputs and
is capable of operating without a bypass capacitor to
further reduce total solution size. The MAX8559 is available in a miniature 8-bump UCSP (2mm x 1mm) or
8-pin TDFN (3mm x 3mm) package.
Features
♦
♦
♦
♦
Two Low-Dropout-Voltage Regulators
Low 32µVRMS Output Noise
300mA Output Current for Each LDO
70dB PSRR at 10kHz
♦
♦
♦
♦
♦
Independent Shutdown Controls
Low 60mV Dropout at 100mA Load
115µA Operating Supply Current per LDO
1.5V to 3.3V Factory-Preset Output
Small Ceramic Output Capacitors
♦ Output Current Limit
♦ Thermal-Overload and Short-Circuit Protection
♦ 1.95W Power-Dissipation Capability (TDFN)
♦ 2mm2 Footprint (UCSP)
Applications
Ordering Information
Cellular and Cordless Phones
PDAs and Palmtop Computers
Notebook Computers
Digital Cameras
PCMCIA Cards
PART
TEMP RANGE
PIN-PACKAGE
MAX8559EBAxy*†
-40°C to +85°C
8 UCSP (B8-1)
MAX8559ETAxy*
-40°C to +85°C
8 TDFN-EP**
*xy = Output voltage code (see the Output Voltage
Selector Guide).
Wireless LAN Cards
**EP = Exposed pad.
†Future product—contact factory for availability.
Hand-Held Instruments
Typical Operating Circuit
ON
OFF
SHDNA
MAX8559
OUTB
BP
GND
OUTB
6
5
MAX8559ETA
1.5V TO 3.3V
2.2µF/150mA
4.7µF/300mA
SHDNB
GND
7
2.2µF/150mA
4.7µF/300mA
ON
OFF
8
0.01µF
(OPTIONAL)
1
2
3
4
INB
INB
1.5V TO 3.3V
SHDNB
OUTA
SHDNA
2.2µF
min
INA
INA
INPUT
2.5V TO 6.5V
BP
TOP VIEW
OUTA
Pin Configurations
TDFN
3mm x 3mm
Pin Configurations continued at end of data sheet.
Output Voltage Selector Guide appears at end of data sheet.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
MAX8559
General Description
MAX8559
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
ABSOLUTE MAXIMUM RATINGS
INA, INB, SHDNA, SHDNB, BP to GND ...................-0.3V to +7V
INA to INB..............................................................-0.3V to +0.3V
OUTA, OUTB to GND ..................................-0.3V to (VIN + 0.3V)
Output Short-Circuit Duration.....................................Continuous
Continuous Power Dissipation (TA = +70°C)
8-Bump UCSP (derate 4.7mW/°C above +70°C)..........379mW
8-Pin TDFN (derate 24.4mW/°C above +70°C) ..........1951mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
8-Pin TDFN Lead Temperature (soldering, 10s)..............+300°C
8-Bump UCSP Solder Profile...........................................(Note 1)
Note 1: For UCSP solder profile information, please refer to the application note APP_1891 on the Maxim website, www.maxim-ic.com.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN = 3.8V, SHDNA = SHDNB = IN_, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)
PARAMETER
Input Voltage
Undervoltage-Lockout Threshold
SYMBOL
CONDITIONS
VIN
VUVLO
Output Voltage Accuracy
Maximum Output Current
IOUT_
Output Current Limit
ILIM_
MIN
TYP
2.5
2.35
MAX
UNITS
6.5
V
2.45
V
VIN rising, hysteresis is 40mV (typ)
2.15
TA = +25°C, IOUTA = IOUTB = 1mA
-1
+1
TA = -40°C to +85°C, IOUTA = IOUTB = 1mA
-2
+2
TA = -40°C to +85°C, IOUTA or IOUTB =
0.1mA to 300mA
-3
+3
300
310
mA
550
920
No load
180
290
No load, one LDO shutdown
115
Ground Current
IQ
IOUTA = IOUTB = 100mA
220
Dropout Voltage
(Note 2)
VOUT_ VIN_
IOUT_ = 1mA
0.6
IOUT_ = 100mA
60
120
Line Regulation
∆VLNR
VIN_ = (VOUT_ + 0.1V) to 6.5V, IOUT_ = 1mA
0
+0.15
Output Voltage Noise
Power-Supply Ripple Rejection
PSRR
-0.15
%
100Hz to 100kHz, COUT_ = 10µF,
IOUT_ = 1mA, CBP = 0.01µF
32
100Hz to 100kHz, COUT_ = 10µF,
IOUT_ = 1mA, CBP = not installed
254
mA
µA
mV
%/ V
µVRMS
VIN_ = VOUT_ + 1V, 10kHz
CBP = 0.01µF,
COUT_ = 2.2µF,
100kHz
IOUT_ = 50mA
70
dB
54
SHUTDOWN
Shutdown Supply Current
SHDN Input Threshold
2
ISHDN
SHDN_ = 0V
VIH
Input high voltage
VIL
Input low voltage
TA = +25°C
0.01
TA = -40°C to +85°C
0.1
1
1.6
_______________________________________________________________________________________
0.4
µA
V
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
(VIN = 3.8V, SHDNA = SHDNB = IN_, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)
PARAMETER
SYMBOL
SHDN Input Bias Current
ISHDN
VOUT_ Discharge Resistance in
Shutdown
CONDITIONS
SHDN_ = IN or
GND
MIN
TYP
MAX
TA = +25°C
10
100
TA = -40°C to +85°C
100
SHDN_ = GND
UNITS
nA
385
Ω
+160
°C
10
°C
THERMAL PROTECTION
Thermal-Shutdown Temperature
TSHDN
TJ rising
∆TSHDN
Thermal-Shutdown Hysteresis
Note 1: All units are 100% production tested at TA = +25°C. Limits over the operating temperature range are guaranteed by design.
Note 2: The dropout voltage is defined as VIN - VOUT when VOUT is 100mV below the nominal value of VOUT. Specification only
applies when VOUT ≥ 2.5V.
Typical Operating Characteristics
(VOUTA = VOUTB = 2.85V, VINA = VINB = 3.8V, COUT = 2.2µF (or 4.7µF for 300mA), CBP = 0.01µF, and CIN = 2.2µF (or 4.7µF for
300mA), unless otherwise noted.)
GROUND CURRENT
vs. LOAD CURRENT
150
100
NO LOAD, BOTH OUTPUTS
MAX8559 toc02
BOTH OUTPUTS LOADED
175
150
125
100
75
1
2
3
4
SUPPLY VOLTAGE (V)
5
6
100mA LOAD, BOTH OUTPUTS
200
175
NO LOAD, BOTH OUTPUTS
150
125
100
75
50
25
25
0
0
225
50
50
0
250
GROUND CURRENT (µA)
GROUND CURRENT (µA)
200
200
GROUND CURRENT (µA)
100mA LOAD, BOTH OUTPUTS
250
225
MAX8559 toc01
300
GROUND CURRENT
vs. TEMPERATURE
MAX8559 toc03
GROUND CURRENT
vs. SUPPLY VOLTAGE
0
0
50
100
150
200
LOAD CURRENT (mA)
250
300
-40
-15
10
35
60
85
TEMPERATURE (°C)
_______________________________________________________________________________________
3
MAX8559
ELECTRICAL CHARACTERISTICS (continued)
Typical Operating Characteristics (continued)
(VOUTA = VOUTB = 2.85V, VINA = VINB = 3.8V, COUT = 2.2µF (or 4.7µF for 300mA), CBP = 0.01µF, and CIN = 2.2µF (or 4.7µF for
300mA), unless otherwise noted.)
DROPOUT VOLTAGE
vs. LOAD CURRENT
OUTPUT VOLTAGE ACCURACY
vs. LOAD CURRENT
140
120
100
80
60
40
20
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
0
0
50
100
150
250
200
300
0
50
100
LOAD CURRENT (mA)
OUTPUT VOLTAGE ACCURACY
vs. TEMPERATURE
250
300
PSRR vs. FREQUENCY
100mA LOAD, BOTH OUTPUTS
MAX8559 toc07
70
60
0.1
PSRR (dB)
OUTPUT VOLTAGE ACCURACY (%)
0.3
0
-0.1
-0.2
50
40
30
-0.3
20
-0.4
100mA LOAD, BOTH OUTPUTS
10
-0.5
IOUTA = 50mA
0
-0.6
-40
-15
10
35
60
0.01
85
0.1
1
10
100
1000
TEMPERATURE (°C)
FREQUENCY (kHz)
CHANNEL-TO-CHANNEL ISOLATION
vs. FREQUENCY
OUTPUT-NOISE SPECTRAL DENSITY
vs. FREQUENCY
MAX8559 toc08
100
90
10,000
RLOAD = 100Ω
NOISE DENSITY (nV/√Hz)
80
70
60
50
40
30
1000
100
20
10
IOUTA = 10mA
10
0
0.01
0.1
1
10
FREQUENCY (kHz)
4
200
80
MAX8559 toc06
0.4
0.2
150
LOAD CURRENT (mA)
MAX8559 toc09
DROPOUT VOLTAGE (mV)
160
0
MAX8559 toc05
180
OUTPUT VOLTAGE ACCURACY (%)
MAX8559 toc04
200
CHANNEL-TO-CHANNEL ISOLATION (dB)
MAX8559
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
100
1000
0.01
0.1
1
10
FREQUENCY (kHz)
_______________________________________________________________________________________
100
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
OUTPUT NOISE
(10Hz to 100kHz)
LINE TRANSIENT
MAX8559 toc10
MAX8559 toc11
4.5V
VINA
3.5V
1V/div
VOUT_
500µV/div
10mV/div
AC-COUPLED
VOUTA
IOUTA = 100mA
1ms/div
40µs/div
LOAD TRANSIENT
LOAD TRANSIENT
NEAR DROPOUT
MAX8559 toc13
MAX8559 toc12
VOUTA
VOUTA
20mV/div
AC-COUPLED
100mA/div
IOUTA
20mV/div
AC-COUPLED
100mA/div
IOUTA
0
0
10µs/div
10µs/div
SHUTDOWN RESPONSE
MAX8559 toc14
VOUTA
1V/div
0
1V/div
VSHDNA
0
1ms/div
_______________________________________________________________________________________
5
MAX8559
Typical Operating Characteristics (continued)
(VOUTA = VOUTB = 2.85V, VINA = VINB = 3.8V, COUT = 2.2µF (or 4.7µF for 300mA), CBP = 0.01µF, and CIN = 2.2µF (or 4.7µF for
300mA), unless otherwise noted.)
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
MAX8559
Pin Description
PIN
NAME
TDFN
UCSP
1
A1
2
A2
FUNCTION
LDO A Regulator Input. Connect to INB. Input voltage can range from 2.5V to 6.5V. Bypass INA
with a ceramic capacitor to GND (see the Capacitor Selection and Regulator Stability section).
INA
SHDNA
Shutdown A Input. A logic-low on SHDNA shuts down regulator A. If SHDNA and SHDNB are both
low, both regulators and the internal reference are off and the supply current is reduced to 10nA
(typ). If either SHDNA or SHDNB is a logic high, the internal reference is on. Connect SHDNA to
INA for always-on operation of regulator A.
Shutdown B Input. A logic-low on SHDNB shuts down regulator B. If SHDNA and SHDNB are both
low, both regulators and the internal reference are off and the supply current is reduced to 10nA
(typ). If either SHDNA or SHDNB is a logic high, the internal reference is on. Connect SHDNB to
INB for always-on operation of regulator B.
3
A3
SHDNB
4
A4
INB
LDO B Regulator Input. Connect to INA. Input voltage can range from 2.5V to 6.5V. Bypass INB
with a ceramic capacitor to GND (see the Capacitor Selection and Regulator Stability section).
5
B4
OUTB
Regulator B Output. OUTB can source up to 300mA continuous current. Bypass OUTB with a
ceramic capacitor to GND (see the Capacitor Selection and Regulator Stability section). During
shutdown, OUTB is internally discharged to GND through a 385Ω resistor.
6
B3
GND
Ground
7
B2
BP
Reference Noise Bypass. Bypass BP with a low-leakage 0.01µF ceramic capacitor for reduced
noise at both outputs.
8
B1
OUTA
Regulator A Output. OUTA can source up to 300mA continuous current. Bypass OUTA with a
ceramic capacitor to GND (see the Capacitor Selection and Regulator Stability section). During
shutdown, OUTB is internally discharged to GND through a 385Ω resistor.
EP
—
Exposed
Paddle
Connect to ground plane. EP also functions as a heatsink. Solder to the circuit-board ground
plane to maximize thermal dissipation.
Detailed Description
The MAX8559 is a dual, low-noise, low-dropout, low-quiescent-current linear regulator designed primarily for
battery-powered applications. The regulators are available with preset 1.5V to 3.3V output voltages. These outputs can supply loads up to 300mA with a 4.7µF output
capacitor, or up to 150mA with a 2.2µF output capacitor.
As illustrated in the Functional Diagram, the MAX8559
consists of a 1.25V reference, error amplifiers, P-channel pass transistors, internal feedback voltage-dividers,
and autodischarge circuitry.
Feedback Control Loop
The 1.25V bandgap reference is connected to the error
amplifier’s inverting input. The error amplifier compares
this reference with the feedback voltage and amplifies
the difference. If the feedback voltage is lower than the
reference voltage, the pass-transistor gate is pulled
6
lower, allowing more current to pass to the output and
increasing the output voltage. If the feedback voltage is
too high, the pass-transistor gate is pulled up, allowing
less current to pass to the output. The output voltage is
fed back through an internal resistor voltage-divider
connected to OUT_.
Internal P-Channel Pass Transistor
The MAX8559 features two 0.6Ω P-channel MOSFET
pass transistors. A P-channel MOSFET provides several advantages over similar designs using PNP pass
transistors, including longer battery life. It requires no
base drive, reducing quiescent current considerably.
PNP-based regulators waste considerable current in
dropout when the pass transistor saturates, and they
also use high base-drive currents under large loads.
The MAX8559 does not suffer from these problems,
and with both outputs on it only consumes 180µA of
_______________________________________________________________________________________
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
Current Limit
The MAX8559 contains two independent current limiters, one for each regulator output, monitoring and
controlling the pass transistor’s gate voltage and limiting the output current to 310mA (min). The outputs can
be shorted to ground continuously without damaging
the part.
Low-Noise Operation
An external 0.01µF bypass capacitor at BP in conjunction with an internal resistor creates a lowpass filter.
The MAX8559 exhibits less than 32µVRMS of output
voltage noise with CBP = 0.01µF and COUT = 10µF. The
Typical Operating Characteristics show a graph of
Output-Noise Spectral Density with these values. If output noise is not critical, the BP capacitor can be
removed to reduce total solution size and cost.
Shutdown
The MAX8559 has independent shutdown control
inputs (SHDNA and SHDNB). Drive SHDNA low to shut
down OUTA. Drive SHNDB low to shut down OUTB.
Drive both SHDNA and SHDNB low to shut down the
entire chip, reducing supply current to 0.01µA. Connect
SHDNA or SHDNB to a logic high or IN_ for always-on
operation of the corresponding LDO. Each LDO output
is internally discharged to ground through a 385Ω
resistor in shutdown mode.
Thermal-Overload Protection
Thermal-overload protection limits total power dissipation in the MAX8559. Each regulator has its own independent thermal detector. When one of the regulators’
junction temperature exceeds TJ = +160°C, that regulator’s pass transistor is turned off allowing the IC to
cool. The thermal sensor turns the pass transistor on
again after the IC’s junction temperature cools by 10°C.
This results in a pulsed output during continuous thermal-overload conditions.
Operating Region and Power Dissipation
The MAX8559 maximum power dissipation depends on
the thermal resistance of the case and the circuit board,
the temperature difference between the die junction and
ambient air, and the rate of airflow. The power dissipation across the device is P = IOUT x (VIN - VOUT).
The maximum power dissipation allowed is:
PMAX = (TJ - TA) / (RθJB + RθBA)
where TJ - TA is the temperature difference between
the MAX8559 die junction and the surrounding air,
RθJB (RθJC) is the thermal resistance of the package,
and RθBA is the thermal resistance through the printed
circuit board, copper traces, and other materials to the
surrounding air.
The exposed paddle of the TDFN package performs
the function of channeling heat away. Connect the
exposed paddle to the board ground plane.
Applications Information
Capacitor Selection and
Regulator Stability
For load currents up to 150mA, use a single 2.2µF
capacitor to bypass both inputs of the MAX8559 and a
2.2µF capacitor to bypass each output. Larger inputcapacitor values and lower ESRs provide better supplynoise rejection and line-transient response. To reduce
output noise and improve load-transient voltage dips,
use larger output capacitors up to 10µF. For stable operation over the full temperature range with load currents
up to 300mA, input and output capacitors should be a
minimum of 4.7µF.
Note that some ceramic dielectrics exhibit large capacitance and ESR variation with temperature. With
dielectrics such as Z5U and Y5V, it may be necessary to
use 4.7µF or more for up to 150mA load current to
ensure stability at temperatures below -10°C. With X7R
or X5R dielectrics, 2.2µF is sufficient at all operating temperatures. These regulators are optimized for ceramic
capacitors. Tantalum capacitors are not recommended.
Use a 0.01µF bypass capacitor at BP for low-output voltage noise. Increasing the capacitance slightly decreases the output noise, but increases the startup time.
PSRR and Operation from Sources Other
than Batteries
The MAX8559 is designed to deliver low-dropout voltages and low quiescent currents in battery-powered
systems. Power-supply rejection ratio is 70dB at 10kHz
(see Power-Supply Rejection Ratio vs. Frequency in
the Typical Operating Characteristics). When operating from sources other than batteries, improved supply-noise rejection and transient response is achieved
by increasing the values of the input and output
bypass capacitors and through passive RC or CRC filtering techniques.
_______________________________________________________________________________________
7
MAX8559
quiescent current at no load and 220µA with 100mA
load current on both outputs (see the Typical Operating
Characteristics). A PNP-based regulator has a high
dropout voltage that is independent of the load. A Pchannel MOSFET’s dropout voltage is proportional to
load current, providing for low dropout voltage at heavy
loads and extremely low dropout at lighter loads.
MAX8559
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
Load-Transient Considerations
The MAX8559 load-transient response graphs (see the
Typical Operating Characteristics) show two components of the output response: a DC shift in the output
voltage due to the different load currents and the transient response. Typical overshoot for step changes in
the load current from 10µA to 100mA is 15mV. Increase
the output capacitor’s value and decrease its ESR to
attenuate transient spikes.
Dropout Voltage
A regulator’s minimum input-output voltage differential
(or dropout voltage) determines the lowest usable supply voltage. In battery-powered systems, this determines
the useful end-of-life battery voltage. Because the
MAX8559 uses an internal P-channel MOSFET pass
transistor, its dropout voltage is a function of the drainto-source on-resistance (RDS(ON)) multiplied by the load
current (see the Typical Operating Characteristics).
Calculating the Maximum Output Power
in UCSP
The maximum output power of the MAX8559 is limited
by the maximum power dissipation of the package. By
calculating the power dissipation of the package as a
function of the input voltage, output voltages, and output currents, the maximum input voltage can be
obtained. The maximum power dissipation should not
exceed the package’s maximum power rating.
P = (VIN(MAX) - VOUTA) x IOUTA
+ (VIN(MAX) - VOUTB) x IOUTB
8
where:
VIN(MAX) = maximum input voltage
PMAX = maximum power dissipation of the package
(379mW for the UCSP and 1951mW for the TDFN)
VOUTA = output voltage of OUTA
VOUTB = output voltage of OUTB
IOUTA = maximum output current of OUTA
IOUTB = maximum output current of OUTB
P should be less than PMAX. If P is greater than PMAX,
consider the TDFN.
Layout Guidelines
Due to the low output noise and tight output voltage
accuracy required by most applications, careful PC
board layout is required. An evaluation kit
(MAX8559EVKIT) is available to speed design.
Follow these guidelines for good PC board layout:
• Keep the input and output paths short and wide if
possible, especially at the ground terminals.
• Use thick copper PC boards (2oz vs. 1oz) to
enhance thermal capabilities.
• Place output, input, and bypass capacitors as close
as possible to the IC.
• Ensure traces to BP and the BP capacitor are away
from noisy sources to ensure low output voltage noise.
_______________________________________________________________________________________
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
INA
MAX8559
SHDNA
SHDNB
SHUTDOWN
AND POWER-ON
CONTROL
MOS DRIVER
WITH ILIMIT
ERROR
AMP
P
OUTA
THERMAL
SENSOR
1.25V
REF
LDOA
SHDNA
GND
BP
INB
LDOB
OUTB
_______________________________________________________________________________________
9
MAX8559
Functional Diagram
1.80
3.00
AAF
MAX8559EBAP2
2.50
1.80
AAG
MAX8559EBAK2
2.80
1.80
AAH
MAX8559EBAJJ
2.85
2.85
AAC
MAX8559EBAJG
2.85
3.00
AAI
MAX8559EBAII
2.90
2.90
AAB
MAX8559EBAG2
3.00
1.80
AAJ
MAX8559EBAGJ
3.00
2.85
AAD
MAX8559EBAGG
3.00
3.00
AAA
MAX8559ETA8A
1.50
3.30
AIM
MAX8559ETA2G
1.80
3.00
ALK
MAX8559ETAP2
2.50
1.80
ALL
MAX8559ETAK2
2.80
1.80
ALM
MAX8559ETAKG
2.80
3.00
AIN
MAX8559ETAJ2
2.85
1.80
ALD
MAX8559ETAJJ
2.85
2.85
AIG
MAX8559ETAJG
2.85
3.00
ALN
MAX8559ETAII
2.90
2.90
AIF
MAX8559ETAG2
3.00
1.80
ALO
MAX8559ETAGG
3.00
3.00
AIE
INB
MAX8559EBA2G
TOP VIEW
A1
A2
A3
A4
MAX8559EBA
B1
B2
B3
B4
OUTB
AAE
SHDNB
TOP MARK
3.30
GND
VOUTB (y)
1.50
SHDNA
VOUTA (x)
BP
PART
MAX8559EBA8A
Pin Configurations (continued)
INA
Output Voltage Selector Guide
OUTA
MAX8559
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
UCSP
(2.06mm x 1.03mm)
Chip Information
TRANSISTOR COUNT: 634
PROCESS: BiCMOS
Note: Standard voltage options, shown in bold, are available.
Contact the factory for other output voltages between 1.5V and
3.3V. Minimum order quantity is 15,000 units.
10
______________________________________________________________________________________
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
UCSP 4x2.EPS
PACKAGE OUTLINE, 4x2 UCSP
21-0156
A
1
1
______________________________________________________________________________________
11
MAX8559
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
6, 8, &10L, DFN THIN.EPS
MAX8559
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
L
A
D
D2
A2
PIN 1 ID
1
N
1
C0.35
b
E
PIN 1
INDEX
AREA
[(N/2)-1] x e
REF.
E2
DETAIL A
e
k
A1
CL
CL
L
L
e
e
A
DALLAS
SEMICONDUCTOR
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, 6, 8 & 10L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY
APPROVAL
DOCUMENT CONTROL NO.
21-0137
REV.
D
1
2
COMMON DIMENSIONS
SYMBOL
A
MIN.
MAX.
0.70
0.80
D
2.90
3.10
E
2.90
3.10
A1
0.00
0.05
L
k
0.20
0.40
0.25 MIN.
A2
0.20 REF.
PACKAGE VARIATIONS
PKG. CODE
N
D2
E2
e
JEDEC SPEC
b
T633-1
6
1.50±0.10
2.30±0.10
0.95 BSC
MO229 / WEEA
0.40±0.05
1.90 REF
T833-1
8
1.50±0.10
2.30±0.10
0.65 BSC
MO229 / WEEC
0.30±0.05
1.95 REF
T1033-1
10
1.50±0.10
2.30±0.10
0.50 BSC
MO229 / WEED-3
0.25±0.05
2.00 REF
[(N/2)-1] x e
DALLAS
SEMICONDUCTOR
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, 6, 8 & 10L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
APPROVAL
DOCUMENT CONTROL NO.
21-0137
REV.
D
2
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
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