DS25CP152Q www.ti.com SNLS294E – MAY 2008 – REVISED APRIL 2013 DS25CP152Q Automotive 3.125 Gbps LVDS 2x2 Crosspoint Switch Check for Samples: DS25CP152Q FEATURES DESCRIPTION • • The DS25CP152Q is a 3.125 Gbps 2x2 LVDS crosspoint switch optimized for high-speed signal routing and switching over lossy FR-4 printed circuit board backplanes and balanced cables. Fully differential signal paths ensure exceptional signal integrity and noise immunity. The non-blocking architecture allows connections of any input to any output or outputs. 1 2 • • • • AECQ-100 Grade 3 DC - 3.125 Gbps Low Jitter, Low Skew, Low Power Operation Pin Configurable, Fully Differential, NonBlocking Architecture On-chip 100Ω Input and Output Terminations Minimize Return Losses, Reduce Component Count and Minimize Board Space 8 kV ESD on LVDS I/O Pins Protects Adjoining Components Small 4 mm x 4 mm WQFN-16 Space Saving Package Wide input common mode range allows the switch to accept signals with LVDS, CML and LVPECL levels; the output levels are LVDS. A very small package footprint requires a minimal space on the board while the flow-through pinout allows easy board layout. Each differential input and output is internally terminated with a 100Ω resistor to lower device return losses, reduce component count and further minimize board space. APPLICATIONS • • • • Automotive Display Applications Clock and Data Buffering and Muxing OC-48 / STM-16 SD/HD/3G HD SDI Routers Typical Application DS25CP152Q RED RED Navigation Computer 24 TO 1 1 TO 24 GREEN GREEN MONITOR 1 BLUE BLUE SEL0 DS90UR241Q DS90UR124Q SEL1 RED RED Entertainment System 1 TO 24 GREEN GREEN 24 TO 1 MONITOR 2 BLUE BLUE 2x2 CROSSPOINT DS90UR241Q DS90UR124Q 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2013, Texas Instruments Incorporated DS25CP152Q SNLS294E – MAY 2008 – REVISED APRIL 2013 www.ti.com Block Diagram SEL1 SEL0 EN0 IN0+ OUT0+ OUT0- IN02X2 EN1 IN1+ OUT1+ IN1- OUT1- IN0+ VCC NC EN0 EN1 16 15 14 13 Connection Diagram 1 8 SEL1 4 7 IN1- SEL0 (GND) 6 3 NC IN1+ 5 2 GND IN0- DAP 12 OUT0+ 11 OUT0- 10 OUT1+ 9 OUT1- Figure 1. DS25CP152Q Pin Diagram PIN DESCRIPTIONS Pin Name Pin Number IN0+, IN0- , IN1+, IN1- I/O, Type Pin Description 1, 2, 3, 4 I, LVDS Inverting and non-inverting high speed LVDS input pins. OUT0+, OUT0-, OUT1+, OUT1- 12, 11, 10, 9 O, LVDS Inverting and non-inverting high speed LVDS output pins. SEL0, SEL1 7, 8 I, LVCMOS Switch configuration pins. There is a 20 kΩ pulldown resistor on each pin. EN0, EN1 14, 13 I, LVCMOS Output enable pins. There is a 20 kΩ pulldown resistor on each pin. NC 6, 15 I, LVCMOS "NO CONNECT" pins. VDD 16 Power Power supply pin. GND 5, DAP Power Ground pin and Device Attach Pad (DAP) ground. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS25CP152Q DS25CP152Q www.ti.com SNLS294E – MAY 2008 – REVISED APRIL 2013 Absolute Maximum Ratings (1) (2) −0.3V to +4V Supply Voltage −0.3V to (VCC + 0.3V) LVCMOS Input Voltage −0.3V to +4V LVDS Input Voltage Differential Input Voltage |VID| 1.0V −0.3V to (VCC + 0.3V) LVDS Output Voltage LVDS Differential Output Voltage 0V to 1.0V LVDS Output Short Circuit Current Duration 5 ms Junction Temperature +105°C −65°C to +150°C Storage Temperature Range Lead Temperature Range Soldering (4 sec.) +260°C Maximum Package Power Dissipation at 25°C RGH0016A Package 1.91W Derate RGH0016A Package 23.9 mW/°C above +25°C Package Thermal Resistance θJA +41.8°C/W θJC +6.9°C/W ESD Susceptibility HBM MM (3) CDM (1) (2) (3) (4) (5) ≥8 kV (4) ≥250V (5) ≥1250V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. Human Body Model, applicable std. JESD22-A114C Machine Model, applicable std. JESD22-A115-A Field Induced Charge Device Model, applicable std. JESD22-C101-C Recommended Operating Conditions Supply Voltage (VCC) Receiver Differential Input Voltage (VID) Operating Free Air Temperature (TA) Min Typ Max Units 3.0 3.3 3.6 V 0 −40 +25 1 V +85 °C DC Electrical Characteristics Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Parameter Conditions (1) (2) (3) Min Typ Max Units V LVCMOS DC SPECIFICATIONS VIH High Level Input Voltage 2.0 VCC VIL Low Level Input Voltage GND 0.8 V IIH High Level Input Current VIN = 3.6V VCC = 3.6V 175 250 μA IIL Low Level Input Current VIN = GND VCC = 3.6V 0 ±10 μA (1) (2) (3) 40 The Electrical Characteristics tables list ensure specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not ensured. Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD and ΔVOD. Typical values represent most likely parametric norms for VCC = +3.3V and TA = +25°C, and at the Recommended Operating Conditions at the time of product characterization and are not ensured. Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS25CP152Q 3 DS25CP152Q SNLS294E – MAY 2008 – REVISED APRIL 2013 www.ti.com DC Electrical Characteristics (continued) Over recommended operating supply and temperature ranges unless otherwise specified. (1)(2)(3) Symbol VCL Parameter Conditions Min ICL = −18 mA, VCC = 0V Input Clamp Voltage Typ Max Units −0.9 −1.5 V 1 V 0 +100 mV LVDS INPUT DC SPECIFICATIONS VID Input Differential Voltage VTH Differential Input High Threshold 0 VTL Differential Input Low Threshold VCMR Common Mode Voltage Range VID = 100 mV IIN Input Current VIN = +3.6V or 0V VCC = 3.6V or 0V CIN Input Capacitance Any LVDS Input Pin to GND 1.7 pF RIN Input Termination Resistor Between IN+ and IN- 100 Ω VCM = +0.05V or VCC-0.05V −100 0 0.05 ±1 mV VCC 0.05 V ±10 μA LVDS OUTPUT DC SPECIFICATIONS VOD Differential Output Voltage ΔVOD Change in Magnitude of VOD for Complimentary Output States 250 VOS Offset Voltage ΔVOS Change in Magnitude of VOS for Complimentary Output States IOS Output Short Circuit Current RL = 100Ω -35 1.05 (4) 350 RL = 100Ω 1.2 -35 450 mV 35 mV 1.375 V 35 mV OUT to GND -35 -55 mA OUT to VCC 7 55 mA COUT Output Capacitance Any LVDS Output Pin to GND 1.2 pF ROUT Output Termination Resistor Between OUT+ and OUT- 100 Ω SUPPLY CURRENT ICC Supply Current EN0 = EN1 = High 64 77 mA ICCZ Supply Current with Outputs Disabled EN0 = EN1 = Low 23 29 mA Typ Max Units 340 500 ps 344 500 ps (4) Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. AC Electrical Characteristics Over recommended operating supply and temperature ranges unless otherwise specified Symbol Parameter Conditions (1) (2) (3) Min LVDS OUTPUT AC SPECIFICATIONS tPLHD Differential Propagation Delay Low to High tPHLD Differential Propagation Delay High to Low tSKD1 Pulse Skew |tPLHD − tPHLD| 4 35 ps tSKD2 Channel to Channel Skew 12 40 ps tSKD3 Part to Part Skew 50 150 ps (1) (2) (3) (4) (5) (6) 4 RL = 100Ω (4) (5) (6) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not ensured. Typical values represent most likely parametric norms for VCC = +3.3V and TA = +25°C, and at the Recommended Operation Conditions at the time of product characterization and are not ensured. Specification is ensured by characterization and is not tested in production. tSKD1, |tPLHD − tPHLD|, Pulse Skew, is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the same channel. tSKD2, Channel to Channel Skew, is the difference in propagation delay (tPLHD or tPHLD) among all output channels in Broadcast mode (any one input to all outputs). tSKD3, Part to Part Skew, is defined as the difference between the minimum and maximum differential propagation delays. This specification applies to devices at the same VCC and within 5°C of each other within the operating temperature range. Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS25CP152Q DS25CP152Q www.ti.com SNLS294E – MAY 2008 – REVISED APRIL 2013 AC Electrical Characteristics (continued) Over recommended operating supply and temperature ranges unless otherwise specified (1)(2)(3) Symbol Parameter Conditions Min Typ Max Units 65 120 ps 65 120 ps tLHT Rise Time tHLT Fall Time tON Output Enable Time ENn = LH to output active 7 20 μs tOFF Output Disable Time ENn = HL to output inactive 5 12 ns tSEL Select Time SELn LH or HL to output 3.5 12 ns VID = 350 mV VCM = 1.2V Clock (RZ) 2.5 Gbps 0.5 1 ps 3.125 Gbps 0.5 1 ps VID = 350 mV VCM = 1.2V K28.5 (NRZ) 2.5 Gbps 8 25 ps 3.125 Gbps 3 19 ps VID = 350 mV VCM = 1.2V PRBS-23 (NRZ) 2.5 Gbps 0.04 0.08 UIP-P 3.125 Gbps 0.03 0.09 UIP-P JITTER PERFORMANCE tRJ1 tRJ2 tDJ1 tDJ2 tTJ1 tTJ2 (7) (8) (9) RL = 100Ω (3) Random Jitter (RMS Value) (7) Deterministic Jitter (Peak to Peak) (8) Total Jitter (Peak to Peak) (9) Measured on a clock edge with a histogram and an accumulation of 1500 histogram hits. Input stimulus jitter is subtracted geometrically. Tested with a combination of the 1100000101 (K28.5+ character) and 0011111010 (K28.5- character) patterns. Input stimulus jitter is subtracted algebraically. Measured on an eye diagram with a histogram and an accumulation of 3500 histogram hits. Input stimulus jitter is subtracted. DC Test Circuits VOH Power Supply OUT+ IN+ R D RL Power Supply IN- OUTVOL AC Test Circuits and Timing Diagrams OUT+ IN+ R Signal Generator D IN- RL OUT- Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS25CP152Q 5 DS25CP152Q SNLS294E – MAY 2008 – REVISED APRIL 2013 www.ti.com FUNCTIONAL DESCRIPTION The DS25CP152Q is a 3.125 Gbps 2x2 LVDS digital crosspoint switch optimized for high-speed signal routing and switching over lossy FR-4 printed circuit board backplanes and balanced cables. Switch Configuration Truth Table S1 S0 OUT1 OUT0 0 0 IN0 IN0 0 1 IN0 IN1 1 0 IN1 IN0 1 1 IN1 IN1 Output Enable Truth Table EN1 EN0 OUT1 OUT0 0 0 Disabled Disabled 0 1 Disabled Enabled 1 0 Enabled Disabled 1 1 Enabled Enabled Input Interfacing The DS25CP152Q accepts differential signals and allows simple AC or DC coupling. With a wide common mode range, the DS25CP152Q can be DC-coupled with all common differential drivers (i.e. LVPECL, LVDS, CML). The following three figures illustrate typical DC-coupled interface to common differential drivers. Note that the DS25CP152Q inputs are internally terminated with a 100Ω resistor. LVDS Driver DS25CP152 Receiver 100: Differential T-Line OUT+ IN+ 100: IN- OUT- Figure 2. Typical LVDS Driver DC-Coupled Interface to DS25CP152Q Input CML3.3V or CML2.5V Driver VCC 50: DS25CP152 Receiver 100: Differential T-Line 50: OUT+ IN+ 100: OUT- IN- Figure 3. Typical CML Driver DC-Coupled Interface to DS25CP152Q Input 6 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS25CP152Q DS25CP152Q www.ti.com SNLS294E – MAY 2008 – REVISED APRIL 2013 LVPECL Driver OUT+ 100: Differential T-Line LVDS Receiver IN+ 100: OUT150-250: IN150-250: Figure 4. Typical LVPECL Driver DC-Coupled Interface to DS25CP152Q Input Output Interfacing The DS25CP152Q outputs signals that are compliant to the LVDS standard. Its outputs can be DC-coupled to most common differential receivers. The following figure illustrates typical DC-coupled interface to common differential receivers and assumes that the receivers have high impedance inputs. While most differential receivers have a common mode input range that can accommodate LVDS compliant signals, it is recommended to check the respective receiver's data sheet prior to implementing the suggested interface implementation. DS25CP152 Driver Differential Receiver 100: Differential T-Line IN+ OUT+ 100: CML or LVPECL or LVDS 100: OUT- IN- Figure 5. Typical DS25CP152Q Output DC-Coupled Interface to an LVDS, CML or LVPECL Receiver Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS25CP152Q 7 DS25CP152Q SNLS294E – MAY 2008 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics Figure 6. A 3.125 Gbps NRZ PRBS-7 After 2" Differential FR-4 Stripline V:100 mV / DIV, H:50 ps / DIV Figure 7. A 2.5 Gbps NRZ PRBS-7 After 2" Differential FR-4 Stripline V:100 mV / DIV, H:75 ps / DIV 60 60 VCC = 3.3V VCC = 3.3V 40 30 20 10 40 30 20 10 0 0 0 0.66 1.32 1.98 2.64 3.3 0 INPUT COMMON MODE VOLTAGE (V) Figure 8. Total Jitter as a Function of Input Common Mode Voltage 8 TA = 25°C NRZ PRBS-7 50 TA = 25°C 3.125 Gbps NRZ PRBS-7 VID = 350 mV TOTAL JITTER (ps) TOTAL JITTER (ps) 50 0.8 1.6 2.4 3.2 4.0 DATA RATE (Gbps) Figure 9. Total Jitter as a Function of Data Rate Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS25CP152Q DS25CP152Q www.ti.com SNLS294E – MAY 2008 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision D (April 2013) to Revision E • Page Changed layout of National Data Sheet to TI format ............................................................................................................ 8 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS25CP152Q 9 PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) DS25CP152QSQ/NOPB ACTIVE WQFN RGH 16 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2C152QS DS25CP152QSQX/NOPB ACTIVE WQFN RGH 16 4500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2C152QS (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS25CP152QSQ/NOPB WQFN RGH 16 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 DS25CP152QSQX/NOPB WQFN RGH 16 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS25CP152QSQ/NOPB WQFN RGH 16 1000 210.0 185.0 35.0 DS25CP152QSQX/NOPB WQFN RGH 16 4500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE RGH0016A WQFN - 0.8 mm max height SCALE 3.500 WQFN 4.1 3.9 B A PIN 1 INDEX AREA 0.5 0.3 0.3 0.2 4.1 3.9 DETAIL OPTIONAL TERMINAL TYPICAL C 0.8 MAX SEATING PLANE (0.1) TYP 2.6 0.1 5 8 SEE TERMINAL DETAIL 12X 0.5 4 9 4X 1.5 1 12 16X PIN 1 ID (OPTIONAL) 13 16 16X 0.3 0.2 0.1 0.05 C A C B 0.5 0.3 4214978/A 10/2013 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com EXAMPLE BOARD LAYOUT RGH0016A WQFN - 0.8 mm max height WQFN ( 2.6) SYMM 16 13 SEE DETAILS 16X (0.6) 16X (0.25) 1 12 (0.25) TYP SYMM (3.8) (1) 9 4 12X (0.5) 5X ( 0.2) VIA 8 5 (1) (3.8) LAND PATTERN EXAMPLE SCALE:15X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND METAL SOLDER MASK OPENING METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214978/A 10/2013 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see QFN/SON PCB application report in literature No. SLUA271 (www.ti.com/lit/slua271). www.ti.com EXAMPLE STENCIL DESIGN RGH0016A WQFN - 0.8 mm max height WQFN SYMM (0.675) METAL TYP 13 16 16X (0.6) 16X (0.25) 12 1 (0.25) TYP (0.675) SYMM (3.8) 12X (0.5) 9 4 8 5 4X (1.15) (3.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 78% PRINTED SOLDER COVERAGE BY AREA SCALE:15X 4214978/A 10/2013 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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