MC74VHC1G135 2−Input NAND Schmitt−Trigger with Open Drain Output Features • • • • • • High Speed: tPD = 4.9 ns (Typ) at VCC = 5 V Low Internal Power Dissipation: ICC = 1 mA (Max) at TA = 25°C Power Down Protection Provided on Inputs Pin and Function Compatible with Other Standard Logic Families Chip Complexity: FETs = 70; Equivalent Gates = 18 Pb−Free Packages are Available http://onsemi.com MARKING DIAGRAMS 5 5 1 SC−88A/SOT−353/SC−70 DF SUFFIX CASE 419A M The MC74VHC1G135 is a single gate CMOS Schmitt NAND trigger with an open drain output fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including an open drain output which provides the capability to set the output switching level. This allows the MC74VHC1G135 to be used to interface 5 V circuits to circuits of any voltage between VCC and 7 V using an external resistor and power supply. The MC74VHC1G135 input structure provides protection when voltages up to 7 V are applied, regardless of the supply voltage. The MC74VHC1G135 can be used to enhance noise immunity or to square up slowly changing waveforms. VZ M G G 1 5 5 VZ M G G 1 TSOP−5/SOT−23/SC−59 DT SUFFIX CASE 483 1 VZ = Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. PIN ASSIGNMENT IN B 1 5 1 VCC OVT IN A GND 2 3 4 IN B 2 IN A 3 GND 4 OUT Y 5 VCC OUT Y FUNCTION TABLE Inputs Figure 1. Pinout (Top View) IN A IN B & Output A B Y L L H H L H L H Z Z Z L OUT Y ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Figure 2. Logic Symbol © Semiconductor Components Industries, LLC, 2007 February, 2007 − Rev. 15 1 Publication Order Number: MC74VHC1G135/D MC74VHC1G135 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage Characteristics −0.5 to +7.0 V VIN DC Input Voltage −0.5 to +7.0 V VOUT DC Output Voltage −0.5 to 7.0 V IIK Input Diode Current −20 mA IOK Output Diode Current +20 mA IOUT DC Output Current, per Pin +25 mA ICC DC Supply Current, VCC and GND +50 mA PD Power dissipation in still air SC−88A, TSOP−5 200 mW qJA Thermal resistance SC−88A, TSOP−5 333 °C/W TL Lead temperature, 1 mm from case for 10 secs 260 °C TJ Junction temperature under bias +150 °C °C VOUT < GND; VOUT > VCC Tstg Storage temperature −65 to +150 MSL Moisture Sensitivity Level 1 FR Flammability Rating VESD Oxygen Index: 28 to 34 ESD Withstand Voltage ILatchup Latchup Performance UL 94 V−0 @ 0.125 in Human Body Model (Note 1) Machine Model (Note 2) Charged Device Model (Note 3) Above VCC and Below GND at 125°C (Note 4) > 2000 > 200 N/A V ±500 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Tested to EIA/JESD22−A114−A 2. Tested to EIA/JESD22−A115−A 3. Tested to JESD22−C101−A 4. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit VCC DC Supply Voltage 2.0 5.5 V VIN DC Input Voltage 0.0 5.5 V DC Output Voltage 0.0 7.0 V −55 +125 °C 0 0 100 20 ns/V VOUT TA Operating Temperature Range tr , tf VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V Input Rise and Fall Time 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 TJ = 80° C 117.8 TJ = 90° C 1,032,200 TJ = 100° C 80 FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 110° C Time, Years TJ = 120° C Time, Hours TJ = 130° C Junction Temperature °C NORMALIZED FAILURE RATE Device Junction Temperature versus Time to 0.1% Bond Failures 1 1 10 100 1000 TIME, YEARS Figure 3. Failure Rate vs. Time Junction Temperature http://onsemi.com 2 MC74VHC1G135 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Test Conditions TA ≤ 85°C TA = 25°C −55 ≤ TA ≤ 125°C VCC (V) Min Typ Max Min Max Min Max Unit VT+ Positive Threshold Voltage 3.0 4.5 5.5 1.50 2.35 2.80 1.88 2.66 3.21 2.25 3.10 3.70 1.50 2.35 2.80 2.25 3.10 3.70 1.50 2.35 2.80 2.25 3.10 3.70 V VT− Negative Threshold Voltage 3.0 4.5 5.5 0.65 1.10 1.45 1.03 1.62 2.02 1.40 2.10 2.60 0.65 1.10 1.45 1.40 2.10 2.60 0.65 1.10 1.45 1.40 2.10 2.60 V VH Hysteresis Voltage 3.0 4.5 5.5 0.30 0.40 0.50 0.85 1.05 1.20 1.60 2.00 2.25 0.30 0.40 0.50 1.60 2.00 2.25 0.30 0.40 0.50 1.60 2.00 2.25 V VOL Maximum Low−Level Output Voltage 0.0 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V VIN = VIH or VIL IOL = 50 mA 2.0 3.0 4.5 IOL = 4 mA IOL = 8 mA 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V IIN Maximum Input Leakage Current VIN = 5.5 V or GND 0 to 5.5 ±0.1 ±1.0 ±1.0 mA ICC Maximum Quiescent Supply Current VIN = VCC or GND 5.5 1.0 20 40 mA IOFF Power Off−Output Leakage Current VOUT = 5.5 V VIN = 5.5 V 0 0.25 2.5 5 mA ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ AC ELECTRICAL CHARACTERISTICS Cload = 50 pF, Input tr/tf = 3.0 ns TA ≤ 85°C TA = 25°C Typ Max Min Max Min Max Unit VCC = 3.3 ± 0.3 V CL = 15 pF RL = RI = 500 W CL = 50 pF 7.6 10.1 11.9 15.4 1.0 1.0 14.0 17.5 1.0 1.0 16.1 19.6 ns VCC = 5.0 ± 0.5 V CL = 15 pF RL = RI = 500 W CL = 50 pF 4.9 6.4 7.7 9.7 1.0 1.0 9.0 11.0 1.0 1.0 10.3 12.3 VCC = 3.3 ± 0.3 V CL = 50 pF RL = RI = 500 W 10.1 15.4 17.5 19.6 VCC = 5.0 ± 0.5 V CL = 50 pF RL = RI = 500 W 6.4 9.7 11.0 12.3 5.0 10 10 10 Symbol Parameter Test Conditions tPZL Maximum Output Enable Time, A or B to Y tPLZ Maximum Output Disable Time CIN Maximum Input Capacitance CPD Power Dissipation Capacitance (Note 5) Min −55 ≤ TA ≤ 125°C ns pF Typical @ 25°C, VCC = 5.0 V 16 pF 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 MC74VHC1G135 VCC VCC − 7 V VCC A or B A 50% RL OVT GND tPZL B tPLZ HIGH IMPEDANCE 50% VCC Y Figure 4. Output Voltage Mismatch Application VOL +0.3 V Figure 5. Switching Waveforms VCC VCC x 2 R1 PULSE GENERATOR DUT RT CL RL CL = 50 pF equivalent (Includes jig and probe capacitance) RL = R1 = 500 W or equivalent RT = ZOUT of pulse generator (typically 50 W) Figure 6. Test Circuit MC74VHC1G135 VCC A 2.2 kW B MC74VHC1G03 C D E = (A • B) + (C+D) Figure 7. Complex Boolean Functions VCC B 1 A 2 3 VCC MC74VHC1G135 1.5 V 3.3 V 5 R LED A 4 220 W GTL B Figure 8. LED Driver Figure 9. GTL Driver ORDERING INFORMATION Device Package MC74VHC1G135DFT1 SC70−5 / SC−88A / SOT−353 M74VHC1G135DFT1G SC70−5 / SC−88A / SOT−353 (Pb−Free) MC74VHC1G135DFT2 SC70−5 / SC−88A / SOT−353 M74VHC1G135DFT2G SC70−5 / SC−88A / SOT−353 (Pb−Free) MC74VHC1G135DTT1 SOT23−5 / TSSOP−5 / SC59−5 M74VHC1G135DTT1G SOT23−5 / TSSOP−5 / SC59−5 (Pb−Free) Shipping † 3000 Units / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 MC74VHC1G135 PACKAGE DIMENSIONS SC−88A, SOT−353, SC−70 CASE 419A−02 ISSUE J A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) M B M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 MC74VHC1G135 PACKAGE DIMENSIONS TSOP−5 CASE 483−02 ISSUE F NOTE 5 2X 0.10 T 2X 0.20 T NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. D 5X 0.20 C A B 5 1 4 2 3 M B S K L DETAIL Z G A DIM A B C D G H J K L M S DETAIL Z J C 0.05 SEATING PLANE H T MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 6 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC74VHC1G135/D