Spring Pin Socket Features 49.225 • Wide temperature range (-55C to +180C). • Current capability is 6A per pin at 14C temperature rise. • Excellent signal integrity at high frequencies. • Self inductance under 0.88nH • Bandwidth upto 15.7 GHz @ -1dB 45.000 Recommended torque is 10-13 in lb. 43 N 42.125 33.125 5.125 6.525 N 13.985 10.500 (2x ) Description: CBT-BGA602 23x23mm 0.8mm 28x28 array SECTION N-N Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-6039 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: Material <not specified> Finish: -Weight: 140.24 STATUS: Released SHEET: 1 OF 5 REV. B ENG: B. Schatz DRAWN BY: M. Raske SCALE: 1:1 FILE: CBT-BGA-6039 Dwg DATE: 3/20/2014 *Note: BGA pattern is not symmetrical with respect to the mounting holes. BGA array is shifted 0.375mm down from center. 49.225 30.7 Backing Plate 29.450 Bottom Guide 26.225 10.425±0.025* B 12.8625 +0.0250 0.8500 - 0.0125 non plated alignment holes 0.025 A B 10.3225 10.800±0.025 42.6 A 28 29.075 Bottom Guide 0.43 (x602) 7.7825 0.80 TYP 1.700±0.100 (x4) non plated mounting holes 0.035 A B 6.00 12.8625 Insulation Plate Outline 25.725 Mounting Holes Description: Recommended PCB Layout 28.225 Socket Base Bottom Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: same or higher than solder mask Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-6039 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: Material <not specified> Finish: -Weight: 140.24 STATUS: Released SHEET: 2 OF 5 REV. B ENG: B. Schatz DRAWN BY: M. Raske SCALE: 2:1 FILE: CBT-BGA-6039 Dwg DATE: 3/20/2014 Ironwood Package Code: BGA602A 0.2 D X Y 17.00 e Z 18.80 E 21.60 b 0.25 M 0.10 M X Y Z Z 0.25 Z L A 0.2 Z A1 DETAIL L SCALE 6 : 1 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. DIM Minimum Maximum A - 4 A1 0.3 0.5 b 0.4 0.60 D 23.00 BSC E 23.00 BSC e 0.8 BSC ARRAY PIN COUNT 28 X 28 602 Description: Compatible BGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-6039 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: Material <not specified> Finish: -Weight: 140.24 STATUS: Released SHEET: 3 OF 5 REV. B ENG: B. Schatz DRAWN BY: M. Raske SCALE: 2.25:1 FILE: CBT-BGA-6039 Dwg DATE: 3/20/2014 2 22 19 1 3 4 21 6 20 7 5 8 23 15 16 9 10 11 12 13 17 ITEM NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 DESCRIPTION Material Thread Locking Set Screw Calibration Set Screw Compression Screw Latch Compression Plate Socket Lid Compatible BGA Socket Base Floating Guide Middle Guide Bottom Guide Target PCB Insulation Plate Backing Plate 15 Stamped Spring Pin 16 17 18 19 20 21 22 23 Pin Guide Screw Floating Guide Spring Mounting Screw Compression Plate Screw Hinge Pin and Snap Ring Latch Spring Compression Plate Spring Dowel pin Alloy Steel Stainless Steel Aluminum Alloy Aluminum Alloy Aluminum Alloy Aluminum Alloy FR4 Aluminum Alloy Semitron MDS 100 Semitron MDS 100 Semitron MDS 100 FR4 FR4 Aluminum Alloy Contact: BeCu, Au Plated Spring: SS , Au Plated Polypropelene Alloy Steel Alloy Steel Stainless Steel Stainless Steel Steel Music Wire Steel Music Wire Stainless Steel 14 1.61 (x4) 25.725 18 PIN DETAIL Socket Assembly/Calibration Instructions: 30.725 1. Align and place the socket base assembly on to the target PCB 2. Secure socket base assembly to the PCB using backing plate and hardware that is provided with socket. 3. Drop the BGA IC into the socket base assembly-Note Pin A1 orientation. 4. Close the lid and turn the compression screw until it bottom's out on the lid. 5. Remove the Top set screw from the compression screw. 6. Using torque driver and 3/16" hex bit turn the inside calibration set screw to recommended torque. ( 15 In lbs) 7. Place the thread locking set screw to lock the inside set screw position. 8. Once calibrated socket should work at the calibrated height. Repeat calibration if needed. Description: Socket Assy, Insulation Plate Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-6039 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: Material <not specified> Finish: -Weight: 140.24 1.27 1.59 10.00 20.06 Insulation Plate Specification STATUS: Released SHEET: 4 OF 5 REV. B ENG: B. Schatz DRAWN BY: M. Raske SCALE: 1:1 FILE: CBT-BGA-6039 Dwg DATE: 3/20/2014 Re Date Initials Description v Changed spring pin and guides to new design, dowel pin protrusion adjusted, if needed, metal B 3/19/15 RP/MR screws replaced with plastic screws, if needed. Contact Ironwood for details. Description: Sheet1 Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-6039 Drawing ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: Finish: Weight: STATUS: Released SHEET: 5 OF 5 REV. B ENG: B. Schatz DRAWN BY: M. Raske SCALE: 1:1 FILE: CBT-BGA-6039 Dwg DATE: 3/20/2014