ATMEL AT28C040-20LI 4-megabit (512k x 8) paged parallel eeprom Datasheet

Features
• Read Access Time – 200 ns
• Automatic Page Write Operation
•
•
•
•
•
•
•
•
– Internal Address and Data Latches for 256 Bytes
– Internal Control Timer
Fast Write Cycle Time
– Page Write Cycle Time – 10 ms Maximum
– 1 to 256 Byte Page Write Operation
Low Power Dissipation
– 50 mA Active Current
Hardware and Software Data Protection
DATA Polling for End of Write Detection
High Reliability CMOS Technology
– Endurance: 10,000 Cycles
– Data Retention: 10 Years
Single 5V ± 10% Supply
CMOS and TTL Compatible Inputs and Outputs
JEDEC Approved Byte-Wide Pinout
4-Megabit
(512K x 8)
Paged Parallel
EEPROMs
AT28C040
1. Description
The AT28C040 is a high-performance electrically erasable and programmable readonly memory (EEPROM). Its 4 megabits of memory is organized as 524,288 words by
8 bits. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the device
offers access times to 200 ns with power dissipation of just 440 mW.
The AT28C040 is accessed like a static RAM for the read or write cycle without the
need for external components. The device contains a 256-byte page register to allow
writing of up to 256 bytes simultaneously. During a write cycle, the address and 1 to
256 bytes of data are internally latched, freeing the address and data bus for other
operations. Following the initiation of a write cycle, the device will automatically write
the latched data using an internal control timer. The end of a write cycle can be
detected by Data Polling of I/O7. Once the end of a write cycle has been detected, a
new access for a read or write can begin.
Atmel's AT28C040 has additional features to ensure high quality and manufacturability. The device utilizes internal error correction for extended endurance and improved
data retention characteristics. An optional software data protection mechanism is
available to guard against inadvertent writes. The device also includes an extra 256
bytes of EEPROM for device identification or tracking.
0542E–PEEPR–1/08
2. Pin Configurations
Pin Name
Function
A0 - A18
Addresses
CE
Chip Enable
OE
Output Enable
WE
Write Enable
I/O0 - I/O7
Data Inputs/Outputs
NC
No Connect
2.3
44-lead LCC – Top View
6
5
4
3
2
1
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
18
19
20
21
22
23
24
25
26
27
28
7
8
9
10
11
12
13
14
15
16
17
A0
I/O0
I/O1
I/O2
VSS
NC
I/O3
I/O4
I/O5
I/O6
I/O7
A12
A7
A6
A5
NC
NC
NC
A4
A3
A2
A1
2
48-lead TSOP – Top View
NC
NC
NC
NC
A11
A9
A8
A13
A14
A17
WE
VCC
A18
A16
A15
A12
A7
A6
A5
A4
NC
NC
NC
NC
A15
A16
A18
NC
NC
NC
VCC
WE
NC
A17
A14
2.1
2.2
A13
A8
A9
A11
NC
NC
NC
NC
OE
A10
CE
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
NC
NC
NC
NC
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
VSS
I/O2
I/O1
I/O0
A0
A1
A2
A3
NC
NC
NC
NC
32-lead Flatpack – Top View
A18
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
WE
A17
A14
A13
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
AT28C040
0542E–PEEPR–1/08
AT28C040
3. Block Diagram
4. Absolute Maximum Ratings*
Temperature Under Bias............................... -55° C to +125° C
Storage Temperature .................................... -65° C to +150° C
All Input Voltages
(including NC pins)
with Respect to Ground ...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground .............................-0.6V to VCC + 0.6V
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
Voltage on OE and A9
with Respect to Ground ...................................-0.6V to +13.5V
3
0542E–PEEPR–1/08
5. Device Operation
5.1
Read
The AT28C040 is accessed like a static RAM. When CE and OE are low and WE is high, the
data stored at the memory location determined by the address pins is asserted on the outputs.
The outputs are put in the high impedance state when either CE or OE is high. This dual-line
control gives designers flexibility in preventing bus contention in their systems.
5.2
Byte Write
A low pulse on the WE or CE input with CE or WE low (respectively) and OE high initiates a write
cycle. The address is latched on the falling edge of CE or WE, whichever occurs last. The data is
latched by the first rising edge of CE or WE. Once a byte write has been started, it will automatically time itself to completion. Once a programming operation has been initiated and for the
duration of tWC, a read operation will effectively be a polling operation.
5.3
Page Write
The page write operation of the AT28C040 allows 1 to 256 bytes of data to be written into the
device during a single internal programming period. A page write operation is initiated in the
same manner as a byte write; the first byte written can then be followed by 1 to 255 additional
bytes. Each successive byte must be written within 150 µs (tBLC) of the previous byte. If the tBLC
limit is exceeded, the AT28C040 will cease accepting data and commence the internal programming operation. All bytes during a page write operation must reside on the same page as
defined by the state of the A8 - A18 inputs. For each WE high to low transition during the page
write operation, A8 - A18 must be the same.
The A0 to A7 inputs specify which bytes within the page are to be written. The bytes may be
loaded in any order and may be altered within the same load period. Only bytes which are specified for writing will be written; unnecessary cycling of other bytes within the page does not occur.
5.4
Data Polling
The AT28C040 features Data Polling to indicate the end of a write cycle. During a byte or page
write cycle an attempted read of the last byte written will result in the complement of the written
data to be presented on I/O7. Once the write cycle has been completed, true data is valid on all
outputs, and the next write cycle may begin. Data Polling may begin at anytime during the write
cycle.
5.5
Toggle Bit
In addition to Data Polling, the AT28C040 provides another method for determining the end of a
write cycle. During the write operation, successive attempts to read data from the device will
result in I/O6 toggling between one and zero. Once the write has completed, I/O6 will stop toggling and valid data will be read. Reading the toggle bit may begin at any time during the write
cycle.
5.6
Data Protection
If precautions are not taken, inadvertent writes may occur during transitions of the host system
power supply. Atmel® has incorporated both hardware and software features that will protect the
memory against inadvertent writes.
4
AT28C040
0542E–PEEPR–1/08
AT28C040
5.6.1
Hardware Protection
Hardware features protect against inadvertent writes to the AT28C040 in the following ways:
(a) VCC sense – if VCC is below 3.8V (typical) the write function is inhibited; (b) VCC power-on
delay – once VCC has reached 3.8V the device will automatically time out 5 ms (typical) before
allowing a write: (c) write inhibit – holding any one of OE low, CE high or WE high inhibits write
cycles; (d) noise filter – pulses of less than 15 ns (typical) on the WE or CE inputs will not initiate
a write cycle.
5.6.2
Software Data Protection
A software controlled data protection feature has been implemented on the AT28C040. When
enabled, the software data protection (SDP), will prevent inadvertent writes. The SDP
feature may be enabled or disabled by the user; the AT28C040 is shipped from Atmel with SDP
disabled.
SDP is enabled when the host system issues a series of three write commands; three specific
bytes of data are written to three specific addresses (refer to Software Data Protection Algorithm). After writing the 3-byte command sequence and after tWC, the entire AT28C040 will be
protected against inadvertent write operations. It should be noted that once protected, the host
can still perform a byte or page write to the AT28C040. To do so, the same 3-byte command
sequence used to enable SDP must precede the data to be written.
Once set, SDP will remain active unless the disable command sequence is issued. Power transitions do not disable SDP, and SDP will protect the AT28C040 during power-up and power-down
conditions. All command sequences must conform to the page write timing specifications. The
data in the enable and disable command sequences is not written to the device, and the
memory addresses used in the sequence may be written with data in either a byte or page write
operation.
After setting SDP, any attempt to write to the device without the 3-byte command sequence will
start the internal write timers. No data will be written to the device; however, for the duration of
tWC, read operations will effectively be polling operations.
5.7
Device Identification
An extra 256 bytes of EEPROM memory are available to the user for device identification. By
raising A9 to 12V ± 0.5V and using address locations 7FF80H to 7FFFFH, the bytes may be written to or read from in the same manner as the regular memory array.
5.8
Optional Chip Erase Mode
The entire device can be erased using a 6-byte software erase code. Please see Software Chip
Erase application note for details.
5
0542E–PEEPR–1/08
6. DC and AC Operating Range
AT28C040-20 Operation
Read
Program
Industrial
-40°C - 85°C
-40°C - 85°C
Extended
-55°C - 125°C
-40°C - 85°C
5V ± 10%
5V ± 10%
Operating Temperature (Case)
VCC Power Supply
7. Operating Modes
Mode
CE
OE
WE
I/O
Read
VIL
VIL
VIH
DOUT
Write(2)
VIL
VIH
VIL
DIN
Write Inhibit
X
X
VIH
Write Inhibit
X
VIL
X
Output Disable
X
VIH
X
Notes:
High Z
1. X can be VIL or VIH.
2. Refer to AC Programming Waveforms.
8. DC Characteristics
Symbol
Parameter
Condition
ILI
Input Load Current
ILO
Max
Units
VIN = 0V to VCC + 1V
10
µA
Output Leakage Current
VI/O = 0V to VCC
10
µA
ICC
VCC Active Current
f = 5 MHz; IOUT = 0 mA
50
mA
VIL
Input Low Voltage
0.8
V
VIH
Input High Voltage
VOL
Output Low Voltage
IOL = 2.1 mA
VOH1
Output High Voltage
IOH = -400 µA
2.4
V
VOH2
Output High Voltage CMOS
IOH = -100 µA; VCC = 4.5V
4.2
V
6
Min
2.0
V
0.45
V
AT28C040
0542E–PEEPR–1/08
AT28C040
9. AC Read Characteristics
AT28C040-20
Symbol
Parameter
Min
tACC
Address to Output Delay
tCE(1)
tOE(2)
tDF(3)(4)
CE to Output Delay
tOH
Max
Units
200
ns
200
ns
OE to Output Delay
0
55
ns
CE or OE to Output Float
0
55
ns
Output Hold from OE, CE or Address, whichever occurred first
0
ns
10. AC Read Waveforms(1)(2)(3)(4)
Notes:
1. CE May be delayed up to tACC - tCE after the address transition without impact on tACC.
2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change
without impact on tACC.
3. tDF is specified from OE or CE, whichever occurs first (CL = 5 pF).
4. This parameter is characterized and is not 100% tested.
11. Input Test Waveforms and Measurement Level
tR, tF < 5 ns
12. Output Test Load
13. Pin Capacitance
f = 1 MHz, T = 25°C(1)
Symbol
CIN
COUT
Note:
Typ
Max
Units
Conditions
4
10
pF
VIN = 0V
8
12
pF
VOUT = 0V
1. This parameter is characterized and is not 100% tested.
7
0542E–PEEPR–1/08
14. AC Write Characteristics
Symbol
Parameter
Min
Max
Units
tAS, tOES
Address, OE Set-up Time
0
ns
tAH
Address Hold Time
50
ns
tCS
Chip Select Set-up Time
0
ns
tCH
Chip Select Hold Time
0
ns
tWP
Write Pulse Width (WE or CE)
100
ns
tDS
Data Set-up Time
50
ns
tDH, tOEH
Data, OE Hold Time
0
ns
15. AC Write Waveforms
15.1
WE Controlled
15.2
CE Controlled
8
AT28C040
0542E–PEEPR–1/08
AT28C040
16. Page Mode Characteristics
Symbol
Parameter
Min
Max
Units
tWC
Write Cycle Time
10
ms
tAS
Address Set-up Time
0
ns
tAH
Address Hold Time
50
ns
tDS
Data Set-up Time
50
ns
tDH
Data Hold Time
0
ns
tWP
Write Pulse Width
100
ns
tBLC
Byte Load Cycle Time
tWPH
Write Pulse Width High
150
50
µs
ns
17. Page Mode Write Waveforms(1)(2)
Notes:
1. A8 through A18 must specify the page address during each high to low transition of WE (or CE).
2. OE must be high only when WE and CE are both low.
9
0542E–PEEPR–1/08
18. Software Data
Protection Enable Algorithm(1)
Notes:
19. Software Data
Protection Disable Algorithm(1)
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA A0
TO
ADDRESS 5555
LOAD DATA 80
TO
ADDRESS 5555
WRITES ENABLED(2)
LOAD DATA XX
TO
ANY ADDRESS(4)
LOAD DATA AA
TO
ADDRESS 5555
LOAD LAST BYTE
TO
LAST ADDRESS
LOAD DATA 55
TO
ADDRESS 2AAA
ENTER DATA
PROTECT STATE
1. Data Format: I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).
2. Write Protect state will be activated at end of write
even if no other data is loaded.
3. Write Protect state will be deactivated at end of write
period even if no other data is loaded.
4. 1 to 256 bytes of data are loaded.
LOAD DATA 20
TO
ADDRESS 5555
EXIT DATA
PROTECT STATE(3)
LOAD DATA XX
TO
ANY ADDRESS(4)
LOAD LAST BYTE
TO
LAST ADDRESS
20. Software Protected Program Cycle Waveform(1)(2)(3)
Notes:
1. A0 - A14 must conform to the addressing sequence for the first 3 bytes as shown above.
2. After the command sequence has been issued and a page write operation follows, the page address inputs (A8 - A18) must
be the same for each high to low transition of WE (or CE).
3. OE must be high only when WE and CE are both low.
10
AT28C040
0542E–PEEPR–1/08
AT28C040
21. Data Polling Characteristics(1)
Symbol
Parameter
tDH
Data Hold Time
tOEH
OE Hold Time
Typ
Max
ns
10
ns
OE to Output Delay
tWR
Write Recovery Time
Units
10
(2)
tOE
Notes:
Min
ns
0
ns
1. These parameters are characterized and not 100% tested.
2. See AC Read Characteristics.
22. Data Polling Waveforms
23. Toggle Bit Characteristics(1)
Symbol
Parameter
tDH
Data Hold Time
10
ns
tOEH
OE Hold Time
10
ns
tOE
OE to Output Delay(2)
tOEHP
OE High Pulse
tWR
Write Recovery Time
Notes:
Min
Typ
Max
Units
ns
150
ns
0
ns
1. These parameters are characterized and not 100% tested.
2. See AC Read Characteristics.
24. Toggle Bit Waveforms(1)(2)(3)
Notes:
1. Toggling either OE or CE or both OE and CE will operate toggle bit.
2. Beginning and ending state of I/O6 will vary.
3. Any address location may be used but the address should not vary.
11
0542E–PEEPR–1/08
25. Ordering Information
25.1
Standard Packaging
ICC (mA)
tACC
(ns)
Active
Ordering Code
Package
50
AT28C040-20TI
AT28C040-20FI
AT28C040-20LI
48T
32F
44L
Industrial
(-40° to 85° C)
50
AT28C040-20FI SL703
AT28C040-20LI SL703
32F
44L
Extended
(See DC and AC Operating
Range Table)
200
Note:
Operation Range
1. See Valid Part Numbers.
26. Valid Part Numbers
The following table lists standard Atmel products that can be ordered.
Device Numbers
AT28C040
Speed
20
Package and Temperature Combinations
FI, LI, TI, FI SL703, LI SL703
Package Type
48T
48-Lead, Plastic Thin Small Outline Package (TSOP)
32F
32-Lead, Non-Windowed, Ceramic Bottom-Brazed Flat Package (Flatpack)
44L
44-Pad, Non-Windowed, Ceramic Leadless Chip Carrier (LCC)
Options
Blank
12
Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms
AT28C040
0542E–PEEPR–1/08
AT28C040
27. Packaging Information
27.1
48T – TSOP
PIN 1
0º ~ 8º
c
Pin 1 Identifier
D1 D
L
b
e
L1
A2
E
A
GAGE PLANE
SEATING PLANE
COMMON DIMENSIONS
(Unit of Measure = mm)
A1
MIN
NOM
MAX
A
–
–
1.20
A1
0.05
–
0.15
SYMBOL
Notes:
1. This package conforms to JEDEC reference MO-142, Variation DD.
2. Dimensions D1 and E do not include mold protrusion. Allowable
protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side.
3. Lead coplanarity is 0.10 mm maximum.
NOTE
A2
0.95
1.00
1.05
D
19.80
20.00
20.20
D1
18.30
18.40
18.50
Note 2
E
11.90
12.00
12.10
Note 2
L
0.50
0.60
0.70
L1
0.25 BASIC
b
0.17
0.22
0.27
c
0.10
–
0.21
e
0.50 BASIC
10/18/01
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
48T, 48-lead (12 x 20 mm Package) Plastic Thin Small Outline
Package, Type I (TSOP)
DRAWING NO.
REV.
48T
B
13
0542E–PEEPR–1/08
27.2
32F – Flatpack
Dimensions in Millimeters and (Inches).
Controlling dimension: Inches.
JEDEC Outline MO-115 AA
PIN #1 ID
9.40(0.370)
6.86(0.270)
0.51(0.020)
0.38(0.015)
21.08(0.830)
20.60(0.811)
1.27(0.050) BSC
1.14(0.045) MAX
12.40(0.488)
11.99(0.472)
3.05(0.120)
2.49(0.098)
0.18(0.007)
0.10(0.004)
10.36(0.408)
9.02(0.355)
1.14(0.045)
0.66(0.026)
1.83(0.072)
0.76(0.030)
10/21/03
R
14
2325 Orchard Parkway
San Jose, CA 95131
TITLE
32F, 32-lead, Non-windowed, Ceramic Bottom-brazed
Flat Package (FlatPack)
DRAWING NO.
REV.
32F
B
AT28C040
0542E–PEEPR–1/08
AT28C040
27.3
44L – LCC
Dimensions in Millimeters and (Inches)
Controlling dimension: Inches
MIL-STD-1835 C-5
16.81(0.662)
16.26(0.640)
2.74(0.108)
2.16(0.085)
16.81(0.662)
16.26(0.640)
PIN 1
2.41(0.095)
1.91(0.075)
1.40(0.055)
1.14(0.045)
2.03(0.080)
1.40(0.055)
INDEX CORNER
0.635(0.025)
X 45˚
0.381(0.015)
0.305(0.012)
RADIUS
0.178(0.007)
12.70(0.500) BSC
0.737(0.029)
0.533(0.021)
1.27(0.050) TYP
1.02(0.040) X 45˚
12.70(0.500) BSC
2.16(0.085)
1.65(0.065)
04/11/01
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
44L, 44-pad (0.600" Wide), Non-windowed, Ceramic Lid, Leadless
Chip Carrier (LCC)
DRAWING NO.
REV.
44L
A
15
0542E–PEEPR–1/08
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0542E–PEEPR–1/08