LNK302/304-306 LinkSwitch-TN Family ® Lowest Component Count, Energy-Efficient Off-Line Switcher IC Product Highlights Cost Effective Linear/Cap Dropper Replacement • Lowest cost and component count buck converter solution • Fully integrated auto-restart for short-circuit and open loop fault protection – saves external component costs • LNK302 uses a simplified controller without auto-restart for very low system cost • 66 kHz operation with accurate current limit – allows low cost off-the-shelf 1 mH inductor for up to 120 mA output current • Tight tolerances and negligible temperature variation • High breakdown voltage of 700 V provides excellent input surge withstand • Frequency jittering dramatically reduces EMI (~10 dB) – minimizes EMI filter cost • High thermal shutdown temperature (+135 °C minimum) Much Higher Performance over Discrete Buck and Passive Solutions • Supports buck, buck-boost and flyback topologies • System level thermal overload, output short-circuit and open control loop protection • Excellent line and load regulation even with typical configuration • High bandwidth provides fast turn-on with no overshoot • Current limit operation rejects line ripple • Universal input voltage range (85 VAC to 265 VAC) • Built-in current limit and hysteretic thermal protection • Higher efficiency than passive solutions • Higher power factor than capacitor-fed solutions • Entirely manufacturable in SMD EcoSmart – Extremely Energy Efficient • Consumes typically only 50/80 mW in self-powered buck topology at 115/230 VAC input with no load (opto feedback) • Consumes typically only 7/12 mW in flyback topology with external bias at 115/230 VAC input with no load • Meets California Energy Commission (CEC), Energy Star, and EU requirements ® Applications • Appliances and timers • LED drivers and industrial controls Description LinkSwitch-TN is specifically designed to replace all linear and capacitor-fed (cap dropper) non-isolated power supplies in the under 360 mA output current range at equal system cost while offering much higher performance and energy efficiency. FB D + Wide Range HV DC Input BP S + DC Output LinkSwitch-TN PI-3492-111903 Figure 1. Typical Buck Converter Application (See Application Examples Section for Other Circuit Configurations). OUTPUT CURRENT TABLE1 PRODUCT4 LNK302P/G/D 230 VAC ±15% MDCM 2 CCM 3 85-265 VAC MDCM2 CCM3 80 mA 63 mA 80 mA 63 mA LNK304P/G/D 120 mA 170 mA 120 mA 170 mA LNK305P/G/D 175 mA 280 mA 175 mA 280 mA LNK306P/G/D 225 mA 360 mA 225 mA 360 mA Table 1. Output Current Table. Notes: 1. Typical output current in a non-isolated buck converter. Output power capability depends on respective output voltage. See Key Applications Considerations Section for complete description of assumptions, including fully discontinuous conduction mode (DCM) operation. 2. Mostly discontinuous conduction mode. 3. Continuous conduction mode. 4. Packages: P: DIP-8B, G: SMD-8B, D: SO-8C. LinkSwitch-TN devices integrate a 700 V power MOSFET, oscillator, simple On/Off control scheme, a high voltage switched current source, frequency jittering, cycle-by-cycle current limit and thermal shutdown circuitry onto a monolithic IC. The startup and operating power are derived directly from the voltage on the DRAIN pin, eliminating the need for a bias supply and associated circuitry in buck or flyback converters. The fully integrated auto-restart circuit in the LNK304-306 safely limits output power during fault conditions such as short-circuit or open loop, reducing component count and system-level load protection cost. A local supply provided by the IC allows use of a non-safety graded optocoupler acting as a level shifter to further enhance line and load regulation performance in buck and buck-boost converters, if required. December 2006 LNK302/304-306 BYPASS (BP) DRAIN (D) REGULATOR 5.8 V BYPASS PIN UNDER-VOLTAGE + 5.8 V 4.85 V - CURRENT LIMIT COMPARATOR 6.3 V + VI - LIMIT JITTER CLOCK DCMAX THERMAL SHUTDOWN OSCILLATOR FEEDBACK (FB) 1.65 V -VT S Q R Q LEADING EDGE BLANKING SOURCE (S) PI-3904-020805 Figure 2a. Functional Block Diagram (LNK302). DRAIN (D) BYPASS (BP) REGULATOR 5.8 V FAULT PRESENT AUTORESTART COUNTER CLOCK RESET + 5.8 V 4.85 V BYPASS PIN UNDER-VOLTAGE - CURRENT LIMIT COMPARATOR 6.3 V + - VI LIMIT JITTER CLOCK DCMAX OSCILLATOR FEEDBACK (FB) THERMAL SHUTDOWN 1.65 V -VT S Q R Q LEADING EDGE BLANKING SOURCE (S) PI-2367-021105 Figure 2b. Functional Block Diagram (LNK304-306). 2-2 2 Rev. H 12/06 LNK302/304-306 Pin Functional Description DRAIN (D) Pin: Power MOSFET drain connection. Provides internal operating current for both start-up and steady-state operation. BYPASS (BP) Pin: Connection point for a 0.1 μF external bypass capacitor for the internally generated 5.8 V supply. FEEDBACK (FB) Pin: During normal operation, switching of the power MOSFET is controlled by this pin. MOSFET switching is terminated when a current greater than 49 μA is delivered into this pin. SOURCE (S) Pin: This pin is the power MOSFET source connection. It is also the ground reference for the BYPASS and FEEDBACK pins. P Package (DIP-8B) G Package (SMD-8B) S 1 8 S S 2 7 S BP 3 FB 5 4 3a D D Package (SO-8C) BP 1 8 S FB 2 7 S D 4 6 S 5 S 3b The LinkSwitch-TN oscillator incorporates circuitry that introduces a small amount of frequency jitter, typically 4 kHz peak-to-peak, to minimize EMI emission. The modulation rate of the frequency jitter is set to 1 kHz to optimize EMI reduction for both average and quasi-peak emissions. The frequency jitter should be measured with the oscilloscope triggered at the falling edge of the DRAIN waveform. The waveform in Figure 4 illustrates the frequency jitter of the LinkSwitch-TN. Feedback Input Circuit The feedback input circuit at the FB pin consists of a low impedance source follower output set at 1.65 V. When the current delivered into this pin exceeds 49 μA, a low logic level (disable) is generated at the output of the feedback circuit. This output is sampled at the beginning of each cycle on the rising edge of the clock signal. If high, the power MOSFET is turned on for that cycle (enabled), otherwise the power MOSFET remains off (disabled). Since the sampling is done only at the beginning of each cycle, subsequent changes in the FB pin voltage or current during the remainder of the cycle are ignored. 5.8 V Regulator and 6.3 V Shunt Voltage Clamp The 5.8 V regulator charges the bypass capacitor connected to the BYPASS pin to 5.8 V by drawing a current from the voltage on the DRAIN, whenever the MOSFET is off. The BYPASS pin is the internal supply voltage node for the LinkSwitch-TN. When the MOSFET is on, the LinkSwitch-TN runs off of the energy stored in the bypass capacitor. Extremely low power consumption of the internal circuitry allows the LinkSwitch-TN to operate continuously from the current drawn from the DRAIN pin. A bypass capacitor value of 0.1 μF is sufficient for both high frequency decoupling and energy storage. PI-3491-120706 Figure 3. Pin Configuration. LinkSwitch-TN Functional Description LinkSwitch-TN combines a high voltage power MOSFET switch with a power supply controller in one device. Unlike conventional PWM (pulse width modulator) controllers, LinkSwitch-TN uses a simple ON/OFF control to regulate the output voltage. The LinkSwitch-TN controller consists of an oscillator, feedback (sense and logic) circuit, 5.8 V regulator, BYPASS pin undervoltage circuit, over-temperature protection, frequency jittering, current limit circuit, leading edge blanking and a 700 V power MOSFET. The LinkSwitch-TN incorporates additional circuitry for auto-restart. Oscillator The typical oscillator frequency is internally set to an average of 66 kHz. Two signals are generated from the oscillator: the maximum duty cycle signal (DCMAX) and the clock signal that indicates the beginning of each cycle. In addition, there is a 6.3 V shunt regulator clamping the BYPASS pin at 6.3 V when current is provided to the BYPASS pin through an external resistor. This facilitates powering of LinkSwitch-TN externally through a bias winding to decrease the no-load consumption to about 50 mW. BYPASS Pin Under-Voltage The BYPASS pin under-voltage circuitry disables the power MOSFET when the BYPASS pin voltage drops below 4.85 V. Once the BYPASS pin voltage drops below 4.85 V, it must rise back to 5.8 V to enable (turn-on) the power MOSFET. Over-Temperature Protection The thermal shutdown circuitry senses the die temperature. The threshold is set at 142 °C typical with a 75 °C hysteresis. When the die temperature rises above this threshold (142 °C) the power MOSFET is disabled and remains disabled until the die temperature falls by 75 °C, at which point it is re-enabled. Current Limit The current limit circuit senses the current in the power MOSFET. When this current exceeds the internal threshold (ILIMIT), the 2-3 3 Rev. H 12/06 LNK302/304-306 PI-3660-081303 600 500 VDRAIN 400 12 V, 120 mA non-isolated power supply used in appliance control such as rice cookers, dishwashers or other white goods. This circuit may also be applicable to other applications such as night-lights, LED drivers, electricity meters, and residential heating controllers, where a non-isolated supply is acceptable. 300 The input stage comprises fusible resistor RF1, diodes D3 and D4, capacitors C4 and C5, and inductor L2. Resistor RF1 is a flame proof, fusible, wire wound resistor. It accomplishes several functions: a) Inrush current limitation to safe levels for rectifiers D3 and D4; b) Differential mode noise attenuation; c) Input fuse should any other component fail short-circuit (component fails safely open-circuit without emitting smoke, fire or incandescent material). 200 100 0 68 kHz 64 kHz 0 20 Time (μs) Figure 4. Frequency Jitter. power MOSFET is turned off for the remainder of that cycle. The leading edge blanking circuit inhibits the current limit comparator for a short time (tLEB) after the power MOSFET is turned on. This leading edge blanking time has been set so that current spikes caused by capacitance and rectifier reverse recovery time will not cause premature termination of the switching pulse. Auto-Restart (LNK304-306 only) In the event of a fault condition such as output overload, output short, or an open loop condition, LinkSwitch-TN enters into autorestart operation. An internal counter clocked by the oscillator gets reset every time the FB pin is pulled high. If the FB pin is not pulled high for 50 ms, the power MOSFET switching is disabled for 800 ms. The auto-restart alternately enables and disables the switching of the power MOSFET until the fault condition is removed. Applications Example A 1.44 W Universal Input Buck Converter The circuit shown in Figure 5 is a typical implementation of a The power processing stage is formed by the LinkSwitch-TN, freewheeling diode D1, output choke L1, and the output capacitor C2. The LNK304 was selected such that the power supply operates in the mostly discontinuous-mode (MDCM). Diode D1 is an ultra-fast diode with a reverse recovery time (trr) of approximately 75 ns, acceptable for MDCM operation. For continuous conduction mode (CCM) designs, a diode with a trr of ≤35 ns is recommended. Inductor L1 is a standard off-the- shelf inductor with appropriate RMS current rating (and acceptable temperature rise). Capacitor C2 is the output filter capacitor; its primary function is to limit the output voltage ripple. The output voltage ripple is a stronger function of the ESR of the output capacitor than the value of the capacitor itself. To a first order, the forward voltage drops of D1 and D2 are identical. Therefore, the voltage across C3 tracks the output voltage. The voltage developed across C3 is sensed and regulated via the resistor divider R1 and R3 connected to U1’s FB pin. The values of R1 and R3 are selected such that, at the desired output voltage, the voltage at the FB pin is 1.65 V. Regulation is maintained by skipping switching cycles. As the output voltage rises, the current into the FB pin will rise. If this exceeds IFB then subsequent cycles will be skipped until the current reduces below IFB. Thus, as the output load is reduced, more cycles will be skipped and if the load increases, fewer R1 13.0 kΩ 1% RF1 8.2 Ω 2W 85-265 VAC L2 1 mH D3 1N4007 D4 1N4007 FB D C4 4.7 μF 400 V C5 4.7 μF 400 V BP C1 100 nF R3 2.05 kΩ 1% S LinkSwitch-TN LNK304 C3 10 μF 35 V L1 1 mH 280 mA D1 UF4005 D2 1N4005GP 12 V, 120 mA C2 100 μF 16 V R4 3.3 kΩ RTN Figure 5. Universal Input, 12 V, 120 mA Constant Voltage Power Supply Using LinkSwitch-TN. 2-4 4 Rev. H 12/06 PI-3757-112103 LNK302/304-306 LinkSwitch-TN RF1 D3 L2 D FB D2 R1 + BP AC INPUT C4 C5 S S S S C1 R3 L1 C3 C2 DC OUTPUT D1 D4 Optimize hatched copper areas ( ) for heatsinking and EMI. PI-3750-121106 Figure 6a. Recommended Printed Circuit Layout for LinkSwitch-TN in a Buck Converter Configuration using P or G Package. D3 RF1 L2 FB BP AC INPUT C4 S LinkSwitch-TN D S L1 + S D1 S C3 C5 C1 R3 D2 C2 R1 DC OUTPUT D4 Optimize hatched copper areas ( ) for heatsinking and EMI. PI-4546-011807 Figure 6b. Recommended Printed Circuit Layout for LinkSwitch-TN in a Buck Converter Configuration using D Package to Bottom Side of the Board. cycles are skipped. To provide overload protection if no cycles are skipped during a 50 ms period, LinkSwitch-TN will enter auto-restart (LNK304-306), limiting the average output power to approximately 6% of the maximum overload power. Due to tracking errors between the output voltage and the voltage across C3 at light load or no load, a small pre-load may be required (R4). For the design in Figure 5, if regulation to zero load is required, then this value should be reduced to 2.4 kΩ. Key Application Considerations LinkSwitch-TN Design Considerations Output Current Table Data sheet maximum output current table (Table 1) represents the maximum practical continuous output current for both mostly discontinuous conduction mode (MDCM) and continuous conduction mode (CCM) of operation that can be delivered from a given LinkSwitch-TN device under the following assumed conditions: 1) Buck converter topology. 2) The minimum DC input voltage is ≥70 V. The value of input capacitance should be large enough to meet this criterion. 3) For CCM operation a KRP* of 0.4. 4) Output voltage of 12 VDC. 5) Efficiency of 75%. 6) A catch/freewheeling diode with trr ≤75 ns is used for MDCM operation and for CCM operation, a diode with trr ≤35 ns is used. 7) The part is board mounted with SOURCE pins soldered to a sufficient area of copper to keep the SOURCE pin temperature at or below 100 °C. *KRP is the ratio of ripple to peak inductor current. LinkSwitch-TN Selection and Selection Between MDCM and CCM Operation Select the LinkSwitch-TN device, freewheeling diode and output inductor that gives the lowest overall cost. In general, MDCM 2-5 5 Rev. H 12/06 LNK302/304-306 TOPOLOGY BASIC CIRCUIT SCHEMATIC High-Side Buck – Direct Feedback FB 1. Output referenced to input 2. Positive output (VO) with respect to -VIN 3. Step down – VO < VIN 4. Low cost direct feedback (±10% typ.) BP S D + KEY FEATURES + LinkSwitch-TN VIN VO PI-3751-121003 High-Side Buck – Optocoupler Feedback BP FB D + S + LinkSwitch-TN VO VIN PI-3752-121003 Low-Side Buck – Optocoupler Feedback + + LinkSwitch-TN VO VIN BP FB D S Low-Side Buck – Constant Current LED Driver PI-3753-111903 + IO LinkSwitch-TN VF + VIN BP D R= High-Side Buck Boost – Direct Feedback FB VF PI-3754-112103 IO BP S D + LinkSwitch-TN VIN VO + PI-3755-121003 300 Ω RSENSE = 2 kΩ FB + D BP RSENSE 2V IO IO S LinkSwitch-TN VIN 1. Output referenced to input 2. Negative output (VO) with respect to +VIN 3. Step down – VO < VIN 4. Optocoupler feedback - Accuracy only limited by reference choice - Low cost non-safety rated opto - No pre-load required - Ideal for driving LEDs FB S High-Side Buck Boost – Constant Current LED Driver 1. Output referenced to input 2. Positive output (VO) with respect to -VIN 3. Step down – VO < VIN 4. Optocoupler feedback - Accuracy only limited by reference choice - Low cost non-safety rated opto - No pre-load required 5. Minimum no-load consumption 10 μF 50 V 100 nF 1. Output referenced to input 2. Negative output (VO) with respect to +VIN 3. Step up/down – VO > VIN or VO < VIN 4. Low cost direct feedback (±10% typ.) 5. Fail-safe – output is not subjected to input voltage if the internal MOSFET fails 6. Ideal for driving LEDs – better accuracy and temperature stability than Low-side Buck constant current LED driver PI-3779-120803 Table 2. Common Circuit Configurations Using LinkSwitch-TN. (continued on next page) 2-6 6 Rev. H 12/06 LNK302/304-306 TOPOLOGY Low-Side Buck Boost – Optocoupler Feedback BASIC CIRCUIT SCHEMATIC KEY FEATURES + LinkSwitch-TN VO VIN BP S FB D + PI-3756-111903 1. Output referenced to input 2. Positive output (VO) with respect to +VIN 3. Step up/down – VO > VIN or VO < VIN 4. Optocoupler feedback - Accuracy only limited by reference choice - Low cost non-safety rated opto - No pre-load required 5. Fail-safe – output is not subjected to input voltage if the internal MOSFET fails Table 2 (cont). Common Circuit Configurations Using LinkSwitch-TN. provides the lowest cost and highest efficiency converter. CCM designs require a larger inductor and ultra-fast (trr ≤35 ns) freewheeling diode in all cases. It is lower cost to use a larger LinkSwitch-TN in MDCM than a smaller LinkSwitch-TN in CCM because of the additional external component costs of a CCM design. However, if the highest output current is required, CCM should be employed following the guidelines below. Topology Options LinkSwitch-TN can be used in all common topologies, with or without an optocoupler and reference to improve output voltage tolerance and regulation. Table 2 provide a summary of these configurations. For more information see the Application Note – LinkSwitch-TN Design Guide. Component Selection Referring to Figure 5, the following considerations may be helpful in selecting components for a LinkSwitch-TN design. Freewheeling Diode D1 Diode D1 should be an ultra-fast type. For MDCM, reverse recovery time trr ≤75 ns should be used at a temperature of 70 °C or below. Slower diodes are not acceptable, as continuous mode operation will always occur during startup, causing high leading edge current spikes, terminating the switching cycle prematurely, and preventing the output from reaching regulation. If the ambient temperature is above 70 °C then a diode with trr ≤35 ns should be used. For CCM an ultra-fast diode with reverse recovery time trr ≤35 ns should be used. A slower diode may cause excessive leading edge current spikes, terminating the switching cycle prematurely and preventing full power delivery. Fast and slow diodes should never be used as the large reverse recovery currents can cause excessive power dissipation in the diode and/or exceed the maximum drain current specification of LinkSwitch-TN. Feedback Diode D2 Diode D2 can be a low-cost slow diode such as the 1N400X series, however it should be specified as a glass passivated type to guarantee a specified reverse recovery time. To a first order, the forward drops of D1 and D2 should match. Inductor L1 Choose any standard off-the-shelf inductor that meets the design requirements. A “drum” or “dog bone” “I” core inductor is recommended with a single ferrite element due to its low cost and very low audible noise properties. The typical inductance value and RMS current rating can be obtained from the LinkSwitch-TN design spreadsheet available within the PI Expert design suite from Power Integrations. Choose L1 greater than or equal to the typical calculated inductance with RMS current rating greater than or equal to calculated RMS inductor current. Capacitor C2 The primary function of capacitor C2 is to smooth the inductor current. The actual output ripple voltage is a function of this capacitor’s ESR. To a first order, the ESR of this capacitor should not exceed the rated ripple voltage divided by the typical current limit of the chosen LinkSwitch-TN. Feedback Resistors R1 and R3 The values of the resistors in the resistor divider formed by R1 and R3 are selected to maintain 1.65 V at the FB pin. It is recommended that R3 be chosen as a standard 1% resistor of 2 kΩ. This ensures good noise immunity by biasing the feedback network with a current of approximately 0.8 mA. Feedback Capacitor C3 Capacitor C3 can be a low cost general purpose capacitor. It provides a “sample and hold” function, charging to the output voltage during the off time of LinkSwitch-TN. Its value should be 10 μF to 22 μF; smaller values cause poorer regulation at light load conditions. 2-7 7 Rev. H 12/06 LNK302/304-306 Pre-load Resistor R4 In high-side, direct feedback designs where the minimum load is <3 mA, a pre-load resistor is required to maintain output regulation. This ensures sufficient inductor energy to pull the inductor side of the feedback capacitor C3 to input return via D2. The value of R4 should be selected to give a minimum output load of 3 mA. In designs with an optocoupler the Zener or reference bias current provides a 1 mA to 2 mA minimum load, preventing “pulse bunching” and increased output ripple at zero load. LinkSwitch-TN Layout Considerations In the buck or buck-boost converter configuration, since the SOURCE pins in LinkSwitch-TN are switching nodes, the copper area connected to SOURCE should be minimized to minimize EMI within the thermal constraints of the design. In the boost configuration, since the SOURCE pins are tied to DC return, the copper area connected to SOURCE can be maximized to improve heatsinking. The loop formed between the LinkSwitch-TN, inductor (L1), freewheeling diode (D1), and output capacitor (C2) should be kept as small as possible. The BYPASS pin capacitor C1 (Figure 6) should be located physically close to the SOURCE (S) and BYPASS (BP) pins. To minimize direct coupling from switching nodes, the LinkSwitch-TN should be placed away from AC input lines. It may be advantageous to place capacitors C4 and C5 in-between LinkSwitch-TN and the AC input. The second rectifier diode D4 is optional, but may be included for better EMI performance and higher line surge withstand capability. 2-8 8 Rev. H 12/06 Quick Design Checklist As with any power supply design, all LinkSwitch-TN designs should be verified for proper functionality on the bench. The following minimum tests are recommended: 1) Adequate DC rail voltage – check that the minimum DC input voltage does not fall below 70 VDC at maximum load, minimum input voltage. 2) Correct Diode Selection – UF400x series diodes are recommended only for designs that operate in MDCM at an ambient of 70 °C or below. For designs operating in continuous conduction mode (CCM) and/or higher ambients, then a diode with a reverse recovery time of 35 ns or better, such as the BYV26C, is recommended. 3) Maximum drain current – verify that the peak drain current is below the data sheet peak drain specification under worst-case conditions of highest line voltage, maximum overload (just prior to auto-restart) and highest ambient temperature. 4) Thermal check – at maximum output power, minimum input voltage and maximum ambient temperature, verify that the LinkSwitch-TN SOURCE pin temperature is 100 °C or below. This figure ensures adequate margin due to variations in RDS(ON) from part to part. A battery powered thermocouple meter is recommended to make measurements when the SOURCE pins are a switching node. Alternatively, the ambient temperature may be raised to indicate margin to thermal shutdown. In a LinkSwitch-TN design using a buck or buck boost converter topology, the SOURCE pin is a switching node. Oscilloscope measurements should therefore be made with probe grounded to a DC voltage, such as primary return or DC input rail, and not to the SOURCE pins. The power supply input must always be supplied from an isolated source (e.g. via an isolation transformer). LNK302/304-306 ABSOLUTE MAXIMUM RATINGS(1,5) DRAIN Voltage .................................................. -0.3 V to 700 V Peak DRAIN Current (LNK302).................200 mA (375 mA)(2) Peak DRAIN Current (LNK304).................400 mA (750 mA)(2) Peak DRAIN Current (LNK305).................800 mA (1500 mA)(2) Peak DRAIN Current (LNK306).................1400 mA (2600 mA)(2) FEEDBACK Voltage .........................................-0.3 V to 9 V FEEDBACK Current.............................................100 mA BYPASS Voltage ..........................................-0.3 V to 9 V Storage Temperature .......................................... -65 °C to 150 °C Operating Junction Temperature(3) ..................... -40 °C to 150 °C Lead Temperature(4) ........................................................260 °C Notes: 1. All voltages referenced to SOURCE, TA = 25 °C. 2. The higher peak DRAIN current is allowed if the DRAIN to SOURCE voltage does not exceed 400 V. 3. Normally limited by internal circuitry. 4. 1/16 in. from case for 5 seconds. 5. Maximum ratings specified may be applied, one at a time, without causing permanent damage to the product. Exposure to Absolute Maximum Rating conditions for extended periods of time may affect product reliability. THERMAL IMPEDANCE Thermal Impedance: P or G Package: (θJA) ........................... 70 °C/W(3); 60 °C/W(4) (θJC)(1) ............................................... 11 °C/W D Package: (θJA) ..................... .... 100 °C/W(3); 80 °C/W(4) (θJC)(2) ............................................... 30 °C/W Notes: 1. Measured on pin 2 (SOURCE) close to plastic interface. 2. Measured on pin 8 (SOURCE) close to plastic interface. 3. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad. 4. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad. Conditions Parameter Symbol SOURCE = 0 V; TJ = -40 to 125 °C See Figure 7 (Unless Otherwise Specified) Min Typ Max 62 66 70 Units CONTROL FUNCTIONS Output Frequency Maximum Duty Cycle FEEDBACK Pin Turnoff Threshold Current FEEDBACK Pin Voltage at Turnoff Threshold fOSC TJ = 25 °C Average Peak-Peak Jitter 4 kHz DCMAX S2 Open 66 69 72 % IFB TJ = 25 °C 30 49 68 μA 1.54 1.65 1.76 V 160 220 μA LNK302/304 200 260 LNK305 220 280 LNK306 250 310 VFB IS1 DRAIN Supply Current IS2 VFB ≥2 V (MOSFET Not Switching) See Note A FEEDBACK Open (MOSFET Switching) See Notes A, B μA 2-9 9 Rev. H 12/06 LNK302/304-306 Conditions Parameter Symbol SOURCE = 0 V; TJ = -40 to 125 °C See Figure 7 (Unless Otherwise Specified) Min Typ Max Units CONTROL FUNCTIONS (cont.) BYPASS Pin Charge Current ICH1 VBP = 0 V TJ = 25 °C LNK302/304 -5.5 -3.3 -1.8 LNK305/306 -7.5 -4.6 -2.5 ICH2 VBP = 4 V TJ = 25 °C LNK302/304 -3.8 -2.3 -1.0 LNK305/306 -4.5 -3.3 -1.5 mA BYPASS Pin Voltage VBP 5.55 5.8 6.10 V BYPASS Pin Voltage Hysteresis VBPH 0.8 0.95 1.2 V BYPASS Pin Supply Current IBPSC See Note D μA 68 CIRCUIT PROTECTION di/dt = 55 mA/μs TJ = 25 °C di/dt = 65 mA/μs TJ = 25 °C Current Limit TSD 2-10 10 Rev. H 12/06 185 240 257 275 271 308 345 375 401 396 450 504 450 482 515 508 578 647 LNK302/304 280 360 475 LNK305 360 460 610 LNK306 400 500 675 170 215 135 142 LNK305 LNK306 tON(MIN) Thermal Shutdown Temperature 165 350 di/dt = 610 mA/μs TJ = 25 °C tLEB 145 mA di/dt = 75 mA/μs TJ = 25 °C di/dt = 95 mA/μs TJ = 25 °C Leading Edge Blanking Time 146 LNK304 di/dt = 415 mA/μs TJ = 25 °C di/dt = 500 mA/μs TJ = 25 °C Minimum On Time 136 LNK302 di/dt = 250 mA/μs TJ = 25 °C ILIMIT (See Note E) 126 TJ = 25 °C See Note F ns ns 150 °C LNK302/304-306 Conditions Parameter Symbol SOURCE = 0 V; TJ = -40 to 125 °C See Figure 7 (Unless Otherwise Specified) Min Typ Max Units CIRCUIT PROTECTION (cont.) Thermal Shutdown Hysteresis TSHD See Note G °C 75 OUTPUT LNK302 ID = 13 mA ON-State Resistance RDS(ON) LNK304 ID = 25 mA LNK305 ID = 35 mA LNK306 ID = 45 mA OFF-State Drain Leakage Current Breakdown Voltage Rise Time Fall Time IDSS BVDSS tR tF VBP = 6.2 V, VFB ≥2 V, VDS = 560 V, TJ = 25 °C TJ = 25 °C 48 55.2 TJ = 100 °C 76 88.4 TJ = 25 °C 24 27.6 TJ = 100 °C 38 44.2 TJ = 25 °C 12 13.8 TJ = 100 °C 19 22.1 TJ = 25 °C 7 8.1 TJ = 100 °C 11 12.9 LNK302/304 50 LNK305 70 LNK306 90 VBP = 6.2 V, VFB ≥2 V, TJ = 25 °C 700 Measured in a Typical Buck Converter Application DRAIN Supply Voltage tEN Output Disable Setup Time tDST Auto-Restart ON-Time tAR 50 ns 50 ns Auto-Restart Duty Cycle DCAR V See Figure 9 10 0.5 TJ = 25 °C See Note H μA V 50 Output Enable Delay Ω LNK302 Not Applicable LNK304-306 50 LNK302 Not Applicable LNK304-306 6 μs μs ms % 2-11 11 Rev. H 12/06 LNK302/304-306 NOTES: A. Total current consumption is the sum of IS1 and IDSS when FEEDBACK pin voltage is ≥2 V (MOSFET not switching) and the sum of IS2 and IDSS when FEEDBACK pin is shorted to SOURCE (MOSFET switching). B Since the output MOSFET is switching, it is difficult to isolate the switching current from the supply current at the DRAIN. An alternative is to measure the BYPASS pin current at 6 V. C. See Typical Performance Characteristics section Figure 14 for BYPASS pin start-up charging waveform. D. This current is only intended to supply an optional optocoupler connected between the BYPASS and FEEDBACK pins and not any other external circuitry. E. For current limit at other di/dt values, refer to Figure 13. F. This parameter is guaranteed by design. G. This parameter is derived from characterization. H. Auto-restart on time has the same temperature characteristics as the oscillator (inversely proportional to frequency). 470 Ω 5W 470 kΩ D S1 FB S2 BP 50 V S S S S 50 V 0.1 μF PI-3490-060204 Figure 7. LinkSwitch-TN General Test Circuit. DCMAX t2 (internal signal) t1 tP HV 90% 90% FB DRAIN VOLTAGE t D= 1 t2 VDRAIN tEN 10% 0V tP = 1 fOSC PI-3707-112503 PI-2048-033001 Figure 8. LinkSwitch-TN Duty Cycle Measurement. 2-12 12 Rev. H 12/06 Figure 9. LinkSwitch-TN Output Enable Timing. LNK302/304-306 Typical Performance Characteristics 1.0 PI-2680-012301 1.2 Output Frequency (Normalized to 25 °C) PI-2213-012301 1.0 0.8 0.6 0.4 0.2 0.9 0 -50 -25 0 25 50 75 100 125 150 -50 -25 Junction Temperature (°C) 0.8 Normalized di/dt di/dt = 1 di/dt = 6 0.4 0.2 0 -50 100 125 PI-3710-071204 1.2 1.0 0.8 0.6 LNK302 LNK304 LNK305 LNK306 0.4 0.2 Normalized di/dt = 1 55 mA/μs 65 mA/μs 75 mA/μs 95 mA/μs Normalized Current Limit = 1 136 mA 257 mA 375 mA 482 mA 0 0 50 100 1 150 2 3 4 5 6 Normalized di/dt Temperature (°C) Figure 13. Current Limit vs. di/dt. PI-2240-012301 7 6 5 4 3 2 1 0 400 350 DRAIN Current (mA) Figure 12. Current Limit vs. Temperature at Normalized di/dt. BYPASS Pin Voltage (V) 75 1.4 Normalized Current Limit 1.0 0.6 50 Figure 11. Frequency vs. Temperature. PI-3709-111203 Current Limit (Normalized to 25 °C) 1.2 25 Junction Temperature (°C) Figure 10. Breakdown vs. Temperature. 1.4 0 PI-3661-071404 Breakdown Voltage (Normalized to 25 °C) 1.1 25 °C 300 100 °C 250 200 150 Scaling Factors: LNK302 0.5 LNK304 1.0 LNK305 2.0 LNK306 3.4 100 50 0 0 0.2 0.4 0.6 0.8 Time (ms) Figure 14. BYPASS Pin Start-up Waveform. 1.0 0 2 4 6 8 10 12 14 16 18 20 DRAIN Voltage (V) Figure 15. Output Characteristics. 2-13 13 Rev. H 12/06 LNK302/304-306 Typical Performance Characteristics (cont.) PI-3711-071404 Drain Capacitance (pF) 1000 100 Scaling Factors: LNK302 0.5 LNK304 1.0 LNK305 2.0 LNK306 3.4 10 1 0 100 200 300 400 500 600 Drain Voltage (V) Figure 16. COSS vs. Drain Voltage. PART ORDERING INFORMATION LinkSwitch Product Family TN Series Number Package Identifier G Plastic Surface Mount DIP P Plastic DIP D Plastic SO-8C Lead Finish N Pure Matte Tin (Pb-Free) Tape & Reel and Other Options Blank Standard Configurations LNK 304 G N - TL 2-14 14 Rev. H 12/06 TL Tape & Reel, 1 k pcs minimum for G Package. 2.5 k pcs for D Package. Not available for P Package. LNK302/304-306 DIP-8B ⊕ D S .004 (.10) -E- Notes: 1. Package dimensions conform to JEDEC specification MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP) package with .300 inch row spacing. 2. Controlling dimensions are inches. Millimeter sizes are shown in parentheses. 3. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side. 4. Pin locations start with Pin 1, and continue counter-clockwise to Pin 8 when viewed from the top. The notch and/or dimple are aids in locating Pin 1. Pin 6 is omitted. 5. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm). 6. Lead width measured at package body. 7. Lead spacing measured with the leads constrained to be perpendicular to plane T. .137 (3.48) MINIMUM .240 (6.10) .260 (6.60) Pin 1 -D- .367 (9.32) .387 (9.83) .125 (3.18) .145 (3.68) .057 (1.45) .068 (1.73) (NOTE 6) .015 (.38) MINIMUM -TSEATING PLANE .100 (2.54) BSC .008 (.20) .015 (.38) .120 (3.05) .140 (3.56) .300 (7.62) BSC (NOTE 7) .300 (7.62) .390 (9.91) .048 (1.22) .053 (1.35) .014 (.36) .022 (.56) ⊕ T E D S .010 (.25) M P08B PI-2551-121504 SMD-8B ⊕ D S .004 (.10) .137 (3.48) MINIMUM -E- .372 (9.45) .388 (9.86) ⊕ E S .010 (.25) .240 (6.10) .260 (6.60) Pin 1 .100 (2.54) (BSC) -D- .367 (9.32) .387 (9.83) .057 (1.45) .068 (1.73) (NOTE 5) .125 (3.18) .145 (3.68) .032 (.81) .037 (.94) .048 (1.22) .053 (1.35) Notes: 1. Controlling dimensions are inches. Millimeter sizes are shown in parentheses. 2. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side. .420 3. Pin locations start with Pin 1, and continue counter-clock.046 .060 .060 .046 wise to Pin 8 when viewed from the top. Pin 6 is omitted. 4. Minimum metal to metal .080 spacing at the package body Pin 1 for the omitted lead location is .137 inch (3.48 mm). .086 5. Lead width measured at .186 package body. .286 6. D and E are referenced Solder Pad Dimensions datums on the package body. .004 (.10) .009 (.23) .004 (.10) .012 (.30) .036 (0.91) .044 (1.12) 0°- 8° G08B PI-2546-121504 2-15 15 Rev. H 12/06 LNK302/304-306 SO-8C 4 B 0.10 (0.004) C A-B 2X 2 DETAIL A 4.90 (0.193) BSC A 4 8 D 5 GAUGE PLANE 2 3.90 (0.154) BSC SEATING PLANE 6.00 (0.236) BSC 0-8 C 1.04 (0.041) REF 0.10 (0.004) C D 2X Pin 1 ID 1 4 0.25 (0.010) BSC 0.40 (0.016) 1.27 (0.050) 0.20 (0.008) C 2X 7X 0.31 - 0.51 (0.012 - 0.020) 0.25 (0.010) M C A-B D 1.27 (0.050) BSC 1.25 - 1.65 (0.049 - 0.065) 1.35 (0.053) 1.75 (0.069) o DETAIL A 0.10 (0.004) 0.25 (0.010) 0.10 (0.004) C H 7X SEATING PLANE C Reference Solder Pad Dimensions + 2.00 (0.079) + D07C 2-16 16 Rev. H 12/06 0.17 (0.007) 0.25 (0.010) 1.27 (0.050) 4.90 (0.193) + + Notes: 1. JEDEC reference: MS-012. 2. Package outline exclusive of mold flash and metal burr. 3. Package outline inclusive of plating thickness. 4. Datums A and B to be determined at datum plane H. 5. Controlling dimensions are in millimeters. Inch dimensions are shown in parenthesis. Angles in degrees. 0.60 (0.024) PI-4526-040207 LNK302/304-306 Notes 2-17 17 Rev. H 12/06 LNK302/304-306 Notes 2-18 18 Rev. H 12/06 LNK302/304-306 Revision Notes Date C 1) Released final data sheet. 3/03 D 1) Corrected Minimum On Time. 1/04 E 1) Added LNK302. 8/04 F 1) Added lead-free ordering information. 12/04 G 1) Minor error corrections. 2) Renamed Feedback Pin Voltage parameter to Feedback Pin Voltage at Turnoff Threshold and removed condition. 3/05 H 1) Added SO-8C package. 12/06 2-19 19 Rev. H 12/06 LNK302/304-306 For the latest updates, visit our website: www.powerint.com Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. PATENT INFORMATION The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations’ patents may be found at www.powerint.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm. LIFE SUPPORT POLICY POWER INTEGRATIONS’ PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein: 1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or death to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. The PI logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, PeakSwitch, Clampless, EcoSmart, E-Shield, Filterfuse, StackFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©Copyright 2006, Power Integrations, Inc. Power Integrations Worldwide Sales Support Locations WORLD HEADQUARTERS 5245 Hellyer Avenue San Jose, CA 95138, USA. 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