BZW06-5V8/376 BZW06-5V8B/376B ® TRANSILTM FEATURES ■ ■ ■ ■ ■ ■ PEAK PULSE POWER : 600 W (10/1000µs) STAND-OFF VOLTAGE RANGE : From 5.8V to 376 V UNI AND BIDIRECTIONAL TYPES LOW CLAMPING FACTOR FAST RESPONSE TIME UL RECOGNIZED DESCRIPTION Transil diodes provide high overvoltage protection by clamping action. Their instantaneous response to transient overvoltages makes them particularly suited to protect voltage sensitive devices such as MOS Technology and low voltage supplied IC’s. DO-15 ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C) Symbol Parameter Value Unit Peak pulse power dissipation (see note 1) Tj initial = Tamb 600 W Power dissipation on infinite heatsink Tamb = 75°C 1.7 W IFSM Non repetitive surge peak forward current for unidirectional types tp = 10ms Tj initial = Tamb 100 A Tstg Tj Storage temperature range Maximum junction temperature - 65 to + 175 175 °C °C TL Maximum lead temperature for soldering during 10s a 5mm from case. 230 °C PPP P Note 1 : For a surge greater than the maximum values, the diode will fail in short-circuit. THERMAL RESISTANCES Symbol Parameter Rth (j-l) Junction to leads Rth (j-a) Junction to ambient on printed circuit. February 2003 - Ed : 3A Llead = 10 mm Value Unit 60 °C/W 100 °C/W 1/6 BZW06-xx I ELECTRICAL CHARACTERISTICS (Tamb = 25°C) Symbol IF Parameter VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage IRM Leakage current @ VRM IPP Peak pulse current αT Voltage temperature coefficient VF Forward voltage drop Types VCL V RM V I PP IRM @ VRM VBR @ IR min µA VCL @ IPP max note2 Bidirectional VF I RM max Unidirectional VBR VCL @ IPP max 10/1000µs 8/20µs αT C max typ note3 note4 -4 V V mA V A V A 10 /°C pF BZW06-5V8 BZW06-5V8B 1000 5.8 6.45 10 10.5 57.0 13.4 298 5.7 4000 BZW06-6V4 BZW06-6V4B 500 6.4 7.13 10 11.3 53.0 14.5 276 6.1 3700 BZW06-8V5 BZW06-8V5B 10 8.5 9.5 1 14.5 41 18.6 215 7.3 2800 BZW06-10 BZW06-10B 5 10.2 11.4 1 16.7 36.0 21.7 184 7.8 2300 BZW06-13 BZW06-13B 5 12.8 14.3 1 21.2 28.0 27.2 147 8.4 1900 BZW06-15 BZW06-15B 1 15.3 17.1 1 25.2 24.0 32.5 123 8.8 1600 BZW06-19 BZW06-19B 1 18.8 20.9 1 30.6 19.6 39.3 102 9.2 1350 BZW06-20 BZW06-20B 1 20.5 22.8 1 33.2 18.0 42.8 93 9.4 1250 BZW06-23 BZW06-23B 1 23.1 25.7 1 37.5 16.0 48.3 83 9.6 1150 BZW06-26 BZW06-26B 1 25.6 28.5 1 41.5 14.5 53.5 75 9.7 1075 BZW06-28 BZW06-28B 1 28.2 31.4 1 45.7 13.1 59.0 68 9.8 1000 BZW06-31 BZW06-31B 1 30.8 34.2 1 49.9 12.0 64.3 62 9.6 950 BZW06-33 BZW06-33B 1 33.3 37.1 1 53.9 11.1 69.7 57 10.0 900 BZW06-40 BZW06-40B 1 40.2 44.7 1 64.8 9.3 84 48 10.1 800 BZW06-48 BZW06-48B 1 47.8 53.2 1 77.0 7.8 100 40 10.3 700 BZW06-58 BZW06-58B 1 58.1 64.6 1 92.0 6.5 121 33 10.4 625 BZW06-70 BZW06-70B 1 70.1 77.9 1 113 5.3 146 27.0 10.5 550 BZW06-85 BZW06-85B 1 85.5 95.0 1 137 4.4 178 22.5 10.6 500 BZW06-102 BZW06-102B 1 102 114 1 165 3.6 212 19.0 10.7 450 BZW06-128 BZW06-128B 1 128 143 1 207 2.9 265 15.0 10.8 400 BZW06-154 BZW06-154B 1 154 171 1 246 2.4 317 12.6 10.8 360 BZW06-171 BZW06-171B 1 171 190 1 274 2.2 353 11.3 10.8 350 2/6 BZW06-xx Types IRM @ VRM VBR @ IR min max note2 Unidirectional Bidirectional µA VCL @ IPP VCL @ IPP max 10/1000µs 8/20µs αT C max typ note3 note4 -4 V V mA V A V A 10 /°C pF 188 209 1 328 2.0 388 10.3 10.8 330 BZW06-188 BZW06-188B 1 BZW06-213 BZW06-213B 1 231 237 1 344 2.0 442 9.0 11.0 310 BZW06-256 BZW06-256B 1 256 285 1 414 1.6 529 7.6 11.0 290 BZW06-273 BZW06-273B 1 273 304 1 438 1.6 564 7.1 11.0 280 BZW06-299 BZW06-299B 1 299 332 1 482 1.6 618 6.5 11.0 270 BZW06-342 BZW06-342B 1 342 380 1 548 1.3 706 5.7 11.0 360 BZW06-376 BZW06-376B 1 376 418 1 603 1.3 776 5.7 11.0 350 Fig. 1: Peak pulse power dissipation versus initial junction temperature (printed circuit board). % I PP 100 10 s PULSE WAVEFORM 10/1000 s 50 0 t 1000 s Note 2 : Note 3 : Note 4 : Pulse test: tp < 50 ms. ∆VBR = αT * (Tamb - 25) * VBR(25°C) VR = 0 V, F = 1 MHz. For bidirectional types, capacitance value is divided by 2 3/6 BZW06-xx Fig. 2 : Peak pulse power versus exponential pulse duration. Ppp (W) 1E5 Tj initial = 25ø °C 1E4 1E3 1E2 tp (m S ) EXPO. 1E1 0.001 0.01 0.1 1 10 100 Fig. 3 : Clamping voltage versus peak pulse current. Exponential waveform tp = 20 µs________ tp = 1 ms——————tp = 10 m............... Note : The curves of the figure 3 are specified for a junction temperature of 25°C before surge. The given results may be extrapolated for other junction temperatures by using the following formula : ∆VBR = αT * (Tamb -25) * VBR (25°C). For intermediate voltages, extrapolate the given results. 4/6 BZW06-xx Fig. 4a : Capacitance versus reverse applied voltage for unidirectional types (typical values). Fig. 4b : Capacitance versus reverse applied voltage for bidirectional types (typical values). Fig. 5 : Peak forward voltage drop versus peak forward current (typical values for unidirectional types). Fig. 6 : Transient thermal impedance junction ambient versus pulse duration (For FR4 PC Board with L lead = 10mm). Fig. 7 : Relative variation of leakage current versus junction temperature. 5/6 BZW06-xx ORDER BZW 06 - 10 B RL PACKAGING: ‘ ‘ = Ammopack tape ‘RL’ = Tape & reel 600W BIDIRECTIONAL No suffix: Unidirectional STAND-OFF VOLTAGE MARKING : Logo, Date Code, Type Code, Cathode Band (for unidirectional types only). PACKAGE MECHANICAL DATA DO-15 (Plastic) REF. C A D C B DIMENSIONS Millimeters Inches Min. Max. Min. Max. A 6.05 6.75 0.238 0.266 B 2.95 3.53 0.116 0.139 C 26 31 1.024 1.220 D 0.71 0.88 0.028 0.035 Packaging : standard packaging is in tape and reel. Weight = 0.4 g. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 6/6