HANBit HSD32M64D16A Synchronous DRAM Module 256Mbyte (32Mx64bit), DIMM based on16Mx8, 4Banks, 4K Ref., 3.3V Part No. HSD32M64D16A GENERAL DESCRIPTION The HSD32M64D16A is a 32M x 64 bit Synchronous Dynamic RAM high-density memory module. The module consists of sixteen CMOS 16M x 8 bit with 4banks Synchronous DRAMs in TSOP-II 400mil packages and 2K EEPROM in 8-pin TSSOP package on a 168-pin glass-epoxy. Two 0.1uF-decoupling capacitors are mounted on the printed circuit board in parallel for each SDRAM. The HSD32M64D16A is a DIMM (Dual in line Memory Module) and is intended for mounting into 168-pin edge connector sockets. Synchronous design allows precise cycle control with the use of system clock. I/O transactions are possible on every clock cycle. Range of operating frequencies, programmable latencies allows the same device to be useful for a variety of high bandwidth, high performance memory system applications All module components may be powered from a single 3.3V DC power supply and all inputs and outputs are LVTTL-compatible. FEATURES • Part Identification HSD32M64D16A-F/10L : 100MHz (CL=3) HSD32M64D16A-F/10 : 100MHz (CL=2) HSD32M64D16A-F/12 : 125MHz (CL=3) HSD32M64D16A-F/13 : 1335MHz (CL=3) F means Auto & Self refresh with Low-Power (3.3V) • Burst mode operation • Auto & self refresh capability (4096 Cycles/64ms) • LVTTL compatible inputs and outputs • Single 3.3V ±0.3V power supply • MRS cycle with address key programs - Latency (Access from column address) - Burst length (1, 2, 4, 8 & Full page) - Data scramble (Sequential & Interleave) • All inputs are sampled at the positive going edge of the system clock • The used device is 4M x 8bit x 4Banks SDRAM URL: www.hbe.co.kr REV 1.0 (August.2002) 1 HANBit Electronics Co.,Ltd. HANBit HSD32M64D16A PIN ASSIGNMENT PIN Symbol PIN Symbol PIN Symbol PIN Symbol PIN Symbol PIN Symbol 1 Vss 29 DQM1 57 DQ18 85 Vss 113 DQM5 141 DQ50 2 DQ0 30 /CE0 58 DQ19 86 DQ32 114 /CE1 142 DQ51 3 DQ1 31 NC 59 Vcc 87 DQ33 115 /RAS 143 Vcc 4 DQ2 32 Vss 60 DQ20 88 DQ34 116 Vss 144 DQ52 5 DQ3 33 A0 61 NC 89 DQ35 117 A1 145 NC 6 Vcc 34 A2 62 NC 90 Vcc 118 A3 146 NC 7 DQ4 35 A4 63 CKE1 91 DQ36 119 A5 147 NC 8 DQ5 36 A6 64 Vss 92 DQ37 120 A7 148 Vss 9 DQ6 37 A8 65 DQ21 93 DQ38 121 A9 149 DQ53 10 DQ7 38 A10 66 DQ22 94 DQ39 122 BA0 150 DQ54 11 DQ8 39 BA1 67 DQ23 95 DQ40 123 A11 151 DQ55 12 Vss 40 Vcc 68 Vss 96 Vss 124 Vcc 152 Vss 13 DQ9 41 Vcc 69 DQ24 97 DQ41 125 CLK1 153 DQ56 14 DQ10 42 CLK0 70 DQ25 98 DQ42 126 NC 154 DQ57 15 DQ11 43 Vss 71 DQ26 99 DQ43 127 Vss 155 DQ58 16 DQ12 44 NC 72 DQ27 100 DQ44 128 CKE0 156 DQ59 17 DQ13 45 /CE2 73 Vcc 101 DQ45 129 /CE3 157 Vcc 18 Vcc 46 DQM2 74 DQ28 102 Vcc 130 DQM6 158 DQ60 19 DQ14 47 DQM3 75 DQ29 103 DQ46 131 DQM7 159 DQ61 20 DQ15 48 NC 76 DQ30 104 DQ47 132 NC 160 DQ62 21 NC 49 Vcc 77 DQ31 105 NC 133 Vcc 161 DQ63 22 NC 50 NC 78 Vss 106 NC 134 NC 162 Vss 23 Vss 51 NC 79 CLK2 107 Vss 135 NC 163 CLK3 24 NC 52 NC 80 NC 108 NC 136 NC 164 NC 25 NC 53 NC 81 WP 109 NC 137 NC 165 SA0 26 Vcc 54 Vss 82 SDA 110 Vcc 138 Vss 166 SA1 27 /WE 55 DQ16 83 SCL 111 /CAS 139 DQ48 167 SA2 28 DQM0 56 DQ17 84 Vcc 112 DQM4 140 DQ49 168 Vcc * These pins are not used in this module ** These pins should be NC in the system which does not support SPD *Pin Names VREF : Power supply for reference CLK0 ~ CLK3 : Clock input CKE0 ~ CKE1 : Colck enable input /CE0 ~ /CE3 : Chip enable input Vcc : Power supply Vss : Ground SDA : Serial data I/O SCL : Serial clock SA0 ~ 2 : Address in EEPROM URL: www.hbe.co.kr REV 1.0 (August.2002) 2 HANBit Electronics Co.,Ltd. HANBit HSD32M64D16A FUNCTIONAL BLOCK DIAGRAM URL: www.hbe.co.kr REV 1.0 (August.2002) 3 HANBit Electronics Co.,Ltd. HANBit HSD32M64D16A PIN FUNCTION DESCRIPTION Pin Name Input Function CLK System clock Active on the positive going edge to sample all inputs. /CE Chip enable Disables or enables device operation by masking or enabling all inputs except CLK, CKE and DQM CKE Clock enable Masks system clock to freeze operation from the next clock cycle. CKE should be enabled at least one cycle prior to new command. Disable input buffers for power down in standby. CKE should be enabled 1CLK+tSS prior to valid command. A0 ~ A11 Address Row/column addresses are multiplexed on the same pins. Row address : RA0 ~ RA11, Column address : CA0 ~ CA9 BA0 ~ BA1 Bank select address Selects bank to be activated during row address latch time. Selects bank for read/write during column address latch time. /RAS Row address strobe Latches row addresses on the positive going edge of the CLK with RAS low. Enables row access & precharge. /CAS Column address strobe Latches column addresses on the positive going edge of the CLK with CAS low. Enables column access. /WE Write enable Enables write operation and row precharge. Latches data in starting from CAS, WE active. DQM0 ~ 7 Data input/output mask Makes data output Hi-Z, tSHZ after the clock and masks the output. Blocks data input when DQM active. (Byte masking) DQ0 ~ 63 Data input/output Data inputs/outputs are multiplexed on the same pins. Vcc/Vss Power supply/ground Power and ground for the input buffers and the core logic. ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATING VIN ,OUT -1V to 4.6V Voltage on Vcc Supply Relative to Vss Vcc -1V to 4.6V Power Dissipation PD 16W TSTG -55oC to 150oC Voltage on Any Pin Relative to Vss Storage Temperature Short Circuit Output Current IOS 50mA Notes: Permanent device damage may occur if " Absolute Maximum Ratings" are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. URL: www.hbe.co.kr REV 1.0 (August.2002) 4 HANBit Electronics Co.,Ltd. HANBit HSD32M64D16A DC OPERATING CONDITIONS (Recommended operating conditions (Voltage referenced to VSS = 0V, TA = 0 to 70° C) ) PARAMETER SYMBOL MIN TYP. MAX UNIT NOTE Supply Voltage Vcc 3.0 3.3 3.6 V Input High Voltage VIH 2.0 3.0 Vcc+0.3 V 1 Input Low Voltage VIL -0.3 0 0.8 V 2 Output High Voltage VOH 2.4 - - V IOH = -2mA Output Low Voltage VOL - - 0.4 V IOL = 2mA Input leakage current I LI -10 10 uA Notes : 1. VIH (max) = 5.6V AC. The overshoot voltage duration is ≤ 3ns. 2. VIL (min) = -2.0V AC. The undershoot voltage duration is ≤ 3ns. 3. Any input 0V ≤ VIN ≤ VDDQ. Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs. 3 CAPACITANCE (VCC = 3.3V, TA = 23° C, f = 1MHz, VREF =1.4V ± 200 mV) DESCRIPTION SYMBOL MIN MAX UNITS Clock CCLK 18 25 pF /RAS, /CAS,/WE,/CE, CKE, DQM CIN 50 95 pF Address CADD 50 95 pF DQ (DQ0 ~ DQ7) COUT 13 18 pF DC CHARACTERISTICS (Recommended operating condition unless otherwise noted, TA = 0 to 70° C) TEST PARAMETER VERSION SYMBOL CONDITION -13 -12 -10 10L 1920 1920 1760 1760 UNIT NOTE mA 1 Burst length = 1 Operating current ICC1 (One bank active) tRC ≥ tRC(min) IO = 0mA Precharge standby ICC2P CKE ≤ VIL(max) 16 mA 16 mA 320 mA tCC=10ns current in power-down mode ICC2PS CKE & CLK ≤ VIL(max) tCC=∞ CKE ≥ VIH(min) Precharge standby current in ICC2N CS* ≥ VIH(min), tCC=10ns non power-down Input signals are changed one mode time during 20ns URL: www.hbe.co.kr REV 1.0 (August.2002) 5 HANBit Electronics Co.,Ltd. HANBit HSD32M64D16A CKE ≥ VIH(min) ICC2NS CLK ≤ VIL(max), tCC=∞ 112 Input signals are stable Active standby ICC3P CKE ≤ VIL(max), tCC=10ns 80 ICC3PS CKE&CLK ≤ VIL(max) tCC=∞ 80 current in powerdown mode Active standby mA CKE≥VIH(min), CS*≥VIH(min) current in ICC3N non power-down tCC=10ns Input signals are 480 changed one time during 20ns mode ICC3NS (One bank active) mA CKE≥VIH(min) CLK ≤VIL(max) 320 tCC=∞ Input signals are stable IO = 0 mA Page burst Operating current ICC4 4Banks Activated 2400 2320 2000 2000 mA 1 3520 3520 3360 3360 mA 2 (Burst mode) tCCD = 2CLKs Refresh current ICC5 Self refresh current ICC6 tRC ≥ tRC(min) CKE ≤ 0.2V 24 mA 12.8 mA Notes: 1. Measured with outputs open. 2. Refresh period is 64ms. 3. Unless otherwise noticed, input swing level is CMOS(VIH/VIL=VDDQ/VSSQ). AC OPERATING TEST CONDITIONS (vcc = 3.3V ± 0.3V, TA = 0 to 70° C) PARAMETER AC Input levels (Vih/Vil) Input timing measurement reference level Input rise and fall time Output timing measurement reference level Output load condition URL: www.hbe.co.kr REV 1.0 (August.2002) Value UNIT 2.4/0.4 V 1.4 V tr/tf = 1/1 ns 1.4 V See Fig. 2 6 HANBit Electronics Co.,Ltd. HANBit HSD32M64D16A +3.3V Vtt=1.4V 1200Ω 50Ω DOUT 870Ω DOUT Z0=50Ω 50pF* 50pF VOH (DC) = 2.4V, IOH = -2mA VOL (DC) = 0.4V, IOL = 2mA (Fig. 2) AC output load circuit (Fig. 1) DC output load circuit OPERATING AC PARAMETER (AC operating conditions unless otherwise noted) VERSION PARAMETER SYMBOL -13 -12 -10 -10L UNIT NOTE Row active to row active delay tRRD(min) 15 16 20 20 ns 1 RAS to CAS delay tRP(min) 20 20 20 20 ns 1 Row precharge time tRP(min) 20 20 20 20 ns 1 tRAS(min) 45 48 50 50 ns 1 Row active time Row cycle time tRAS(max) tRC(min) 100 65 68 ns 70 70 ns 1 2 Last data in to row precharge tRDL(min) 2 CLK Last data in to Active delay tDAL(min) 2 CLK + 20 ns - Last data in to new col. address delay tCDL(min) 1 CLK 2 Last data in to burst stop tBDL(min) 1 CLK 2 Col. address to col. address delay tCCD(min) 1 CLK 3 ea 4 CAS latency=3 2 Number of valid output data CAS latency=2 - 1 Notes : 1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time and then rounding off to the next higher integer. 2. Minimum delay is required to complete write. 3. All parts allow every cycle column address change. 4. In case of row precharge interrupt, auto precharge and read burst stop. .5. For -8/H/L/10, tRDL=1CLK and tDAL=1CLK+20ns is also supported . ( recommend : tRDL=2CLK and tDAL=2CLK + 20ns.) URL: www.hbe.co.kr REV 1.0 (August.2002) 7 HANBit Electronics Co.,Ltd. HANBit HSD32M64D16A AC CHARACTERISTICS (AC operating conditions unless otherwise noted) -13 PARAMETER MIN CLK cycle time -12 -10 -10L SYMBOL MAX MIN MAX MIN MAX MIN UNIT NOTE ns 1 ns 1,2 ns 2 MAX CAS 7.5 8 10 10 latency=3 tCC 1000 1000 1000 1000 CAS - - 10 12 latency=2 CLK to valid CAS output delay latency=3 5.4 6 6 6 tSAC CAS - - 6 7 latency=2 Output data CAS hold time latency=3 2.7 3 3 3 tOH CAS - - 3 3 latency=2 CLK high pulse width tCH 2.5 3 3 3 ns 3 CLK low pulse width tCL 2.5 3 3 3 ns 3 Input setup time tSS 1.5 2 2 2 ns 3 Input hold time tSH 0.8 1 1 1 ns 3 CLK to output in Low-Z tSLZ 1 1 1 1 ns 3 2 CLK to output CAS in Hi-Z latency=3 5.4 6 6 6 ns - - 6 7 ns tSHZ CAS latency=2 Notes : 1. Parameters depend on programmed CAS latency. 2. If clock rising time is longer than 1ns, (tr/2-0.5)ns should be added to the parameter. 3. Assumed input rise and fall time (tr & tf) = 1ns. If tr & tf is longer than 1ns, transient time compensation should be considered ie., [(tr + tf)/2-1]ns should be added to the parameter. URL: www.hbe.co.kr REV 1.0 (August.2002) 8 HANBit Electronics Co.,Ltd. HANBit HSD32M64D16A SIMPLIFIED TRUTH TABLE CKE n-1 COMMAND Register Mode register set Auto refresh Refresh Entry Self refres Exit h Bank active & row addr. Read & column address Write & column address Auto H /C E /R A S /C A S /W E D Q M X L L L L X OP code L L L H X X X X H L BA 0,1 L H H H H X X X X L L H H X V X L H L H X V L H H H precharge disable Auto H CKE n precharge Auto L H L L X X L L H L X H X L L H L X Entry H L H X X X L V V V Exit L H X X X X Entry H L Exit L H All banks Clock suspend or active power down Precharge power down mode DQM No operation command 3 3 Address 4,5 H X X X L H H H H X X X L V V V H H X X H X X X L H H H X 9 4 4,5 X V L X H 6 X X X X X X V X X X (V=Valid, X=Don't care, H=Logic high, L=Logic low) Notes : 1. OP Code : Operand code A0 ~ A11 & BA0 ~ BA1 : Program keys. (@ MRS) 2. MRS can be issued only at all banks precharge state. A new command can be issued after 2 CLK cycles of MRS. 3. Auto refresh functions are as same as CBR refresh of DRAM. The automatical precharge without row precharge command is meant by "Auto". Auto/self refresh can be issued only at all banks precharge state. 4. BA0 ~ BA1 : Bank select addresses. If both BA0 and BA1 are "Low" at read, write, row active and precharge, bank A is selected. If both BA0 is "Low" and BA1 is "High" at read, write, row active and precharge, bank B is selected. If both BA0 is "High" and BA1 is "Low" at read, write, row active and precharge, bank C is selected. If both BA0 and BA1 are "High" at read, write, row active and precharge, bank D is selected. If A10/AP is "High" at row precharge, BA0 and BA1 is ignored and all banks are selected. 5. During burst read or write with auto precharge, new read/write command can not be issued. Another bank read/write command can be issued after the end of burst. New row active of the associated bank can be issued at tRP after the end of burst. 6. Burst stop command is valid at every burst length. 7. DQM sampled at positive going edge of a CLK and masks the data-in at the very CLK (Write DQM latency is 0), but makes Hi-Z state the data-out of 2 CLK cycles after. (Read DQM latency is 2) URL: www.hbe.co.kr REV 1.0 (August.2002) 4 (A0 ~ A9) H H Bank selection 3 (A0 ~ A9) V disable e 3 Column L X precharge Precharg 1,2 Column H Burst Stop NOTE Address H precharge disable A11 A9~A0 Row address L disable Auto A10/ AP HANBit Electronics Co.,Ltd. 7 HANBit HSD32M64D16A PACKAGING INFORMATION Unit : inch [mm] Tolerance : 0.008 [ ±0.20 ] PCB Thickness : 1.27 ±0.08 ORDERING INFORMATION Part Number Density Org. Package Ref. Vcc MODE HSD32M64D16A-13 256MByte 32M x 64 168 Pin-DIMM 4K 3.3V Unbuffered HSD32M64D16A-12 256MByte 32M x 64 168 Pin-DIMM 4K 3.3V Unbuffered HSD32M64D16A-10L 256MByte 32M x 64 168 Pin-DIMM 4K 3.3V Unbuffered HSD32M64D16A-10 256MByte 32M x 64 168 Pin-DIMM 4K 3.3V Unbuffered HSD32M64D16A-F13 256MByte 32M x 64 168 Pin-DIMM 4K 3.3V Unbuffered HSD32M64D16A-F12 256MByte 32M x 64 168 Pin-DIMM 4K 3.3V Unbuffered HSD32M64D16A-F10L 256MByte 32M x 64 168 Pin-DIMM 4K 3.3V Unbuffered HSD32M64D16A-F10 256MByte 32M x 64 168 Pin-DIMM 4K 3.3V Unbuffered MAX.frq CL3 133MHz CL3 125MHz CL3 100MHz CL2 100MHz CL3 133MHz CL3 125MHz CL3 100MHz CL2 100MHz F means Auto & Self refresh with Low-Power (3.3V) URL: www.hbe.co.kr REV 1.0 (August.2002) 10 HANBit Electronics Co.,Ltd.