PD - 91364B
IRFR/U3910
HEXFET® Power MOSFET
Ultra Low On-Resistance
l Surface Mount (IRFR3910)
l Straight Lead (IRFU3910)
l Advanced Process Technology
l Fast Switching
l Fully Avalanche Rated
Description
l
D
VDSS = 100V
RDS(on) = 0.115Ω
G
ID = 16A
S
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve the
lowest possible on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient device for use in a wide
variety of applications.
The D-PAK is designed for surface mounting using
vapor phase, infrared, or wave soldering techniques.
The straight lead version (IRFU series) is for throughhole mounting applications. Power dissipation levels
up to 1.5 watts are possible in typical surface mount
applications.
D -P A K
T O -252 A A
I-P A K
T O -25 1A A
Absolute Maximum Ratings
Parameter
ID @ TC = 25°C
ID @ TC = 100°C
IDM
PD @TC = 25°C
VGS
EAS
IAR
EAR
dv/dt
TJ
TSTG
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Max.
Units
16
12
60
79
0.53
± 20
150
9.0
7.9
5.0
-55 to + 175
A
W
W/°C
V
mJ
A
mJ
V/ns
°C
300 (1.6mm from case )
Thermal Resistance
Parameter
RθJC
RθJA
RθJA
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Junction-to-Case
Junction-to-Ambient (PCB mount) **
Junction-to-Ambient
Typ.
Max.
Units
–––
–––
–––
1.9
50
110
°C/W
1
5/11/98
IRFR/U3910
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
RDS(on)
VGS(th)
gfs
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Min.
100
–––
–––
2.0
6.4
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ.
–––
0.12
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
6.4
27
37
25
IDSS
Drain-to-Source Leakage Current
LD
Internal Drain Inductance
–––
4.5
LS
Internal Source Inductance
–––
7.5
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
640
160
88
V(BR)DSS
∆V(BR)DSS/∆TJ
IGSS
Max. Units
Conditions
–––
V
V GS = 0V, ID = 250µA
––– V/°C Reference to 25°C, ID = 1mA
0.115
VGS = 10V, ID = 10A
4.0
V
VDS = VGS, ID = 250µA
–––
S
VDS = 50V, ID = 9.0A
25
VDS = 100V, VGS = 0V
µA
250
VDS = 80V, VGS = 0V, TJ = 150°C
100
VGS = 20V
nA
-100
V GS = -20V
44
ID = 9.0A
6.2
nC
VDS = 80V
21
VGS = 10V, See Fig. 6 and 13
–––
VDD = 50V
–––
ID = 9.0A
ns
–––
RG = 12Ω
–––
RD = 5.5Ω, See Fig. 10
Between lead,
–––
nH
6mm (0.25in.)
G
from package
–––
and center of die contact
–––
VGS = 0V
–––
pF
VDS = 25V
–––
ƒ = 1.0MHz, See Fig. 5
D
S
Source-Drain Ratings and Characteristics
IS
ISM
VSD
trr
Qrr
ton
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
D
MOSFET symbol
16
––– –––
showing the
A
G
integral reverse
––– –––
60
p-n junction diode.
S
––– ––– 1.3
V
TJ = 25°C, IS = 9.0A, VGS = 0V
––– 130 190
ns
TJ = 25°C, I F = 9.0A
––– 650 970
nC di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
VDD = 25V, starting TJ = 25°C, L = 3.1mH
RG = 25Ω, IAS = 9.0A. (See Figure 12)
Pulse width ≤ 300µs; duty cycle ≤ 2%
This is applied for I-PAK, Ls of D-PAK is measured between lead and
center of die contact
ISD ≤ 9.0A, di/dt ≤ 520A/µs, VDD ≤ V(BR)DSS, Uses IRF530N data and test conditions
TJ ≤ 175°C
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994
2
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IRFR/U3910
100
100
VG S
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
10
4.5V
20µs P U LS E W ID TH
T J = 25°C
1
0.1
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOT TOM 4.5V
TOP
I , D rain-to-S ourc e C urrent (A )
D
I , D rain-to-S ourc e C urrent (A )
D
TOP
1
10
A
10
4 .5V
20 µs P U LS E W ID TH
T J = 1 75°C
1
100
0.1
1
VD S , Drain-to-S ource Voltage (V)
Fig 2. Typical Output Characteristics
3.0
R D S (on) , Drain-to-S ource O n Resistance
(N orm alized)
I D , D ra in -to-S ourc e C urrent (A)
100
and
T J = 2 5 °C
T J = 1 75 °C
10
V DS = 5 0V
2 0µ s P U L S E W ID TH
4
5
6
7
8
9
V G S , G ate-to -So urce Voltag e (V)
Fig 3. Typical Transfer Characteristics
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A
100
V D S , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
1
10
10
A
I D = 1 5A
2.5
2.0
1.5
1.0
0.5
V G S = 10 V
0.0
-60
-40
-20
0
20
40
60
80
A
100 120 140 160 180
T J , Junction T em perature (°C )
Fig 4. Normalized On-Resistance
Vs. Temperature
3
IRFR/U3910
V GS
C is s
C rss
C os s
1000
=
=
=
=
20
0V ,
f = 1M H z
C g s + C gd , C ds S H O R T E D
C gd
C ds + C gd
V G S , G ate-to-S o urc e V oltage (V )
1200
V D S = 80 V
V D S = 50 V
V D S = 20 V
16
C iss
C , C apac itanc e (pF )
I D = 9 .0A
800
12
600
C oss
400
C rs s
200
0
1
10
100
A
8
4
FO R TE S T C IR C U IT
S E E F IG U R E 1 3
0
0
V D S , Drain-to-S ourc e Voltage (V)
15
20
25
30
35
40
A
45
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
100
1000
O P E R A TIO N IN TH IS A R E A L IM ITE D
B Y R D S (o n)
I D , Drain C urrent (A )
I S D , Reverse D rain C urrent (A)
10
Q G , T otal G ate C harge (nC )
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
T J = 1 75 °C
10
T J = 2 5°C
VG S = 0 V
1
0.4
0.6
0.8
1.0
1.2
1.4
V S D , S ourc e-to-D rain V oltage (V )
Fig 7. Typical Source-Drain Diode
Forward Voltage
4
5
A
1.6
100
10µ s
10
100µ s
1m s
T C = 25 °C
T J = 17 5°C
S ing le P u lse
1
1
10m s
10
100
A
1000
V D S , D rain-to-S ource V oltage (V )
Fig 8. Maximum Safe Operating Area
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IRFR/U3910
20
RD
VDS
VGS
I D , Drain Current (A)
15
D.U.T.
RG
+
-VDD
5.0V
10
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
Fig 10a. Switching Time Test Circuit
5
VDS
90%
0
25
50
75
100
125
150
175
TC , Case Temperature ( ° C)
Fig 9. Maximum Drain Current Vs.
Case Temperature
10%
VGS
td(on)
tr
t d(off)
tf
Fig 10b. Switching Time Waveforms
Thermal Response (Z thJC )
10
1
D = 0.50
0.20
0.10
P DM
0.05
0.1
0.02
0.01
SINGLE PULSE
(THERMAL RESPONSE)
t1
t2
Notes:
1. Duty factor D = t 1 / t 2
2. Peak T J = P DM x Z thJC + TC
0.01
0.00001
0.0001
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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5
IRFR/U3910
1 5V
L
VD S
D .U .T
RG
IA S
10V
tp
D R IV E R
+
V
- DD
A
0.0 1 Ω
Fig 12a. Unclamped Inductive Test Circuit
E A S , S ingle Pulse Avalanc he E nergy (m J)
350
TOP
300
B O TT O M
ID
3.7 A
6.4A
9 .0 A
250
200
150
100
50
0
V D D = 25 V
25
V (B R )D SS
50
A
75
100
125
150
175
S tarting T J , J unc tion T em perature (°C )
tp
Fig 12c. Maximum Avalanche Energy
Vs. Drain Current
IAS
Fig 12b. Unclamped Inductive Waveforms
Current Regulator
Same Type as D.U.T.
50KΩ
QG
12V
.2µF
.3µF
5.0 V
QGS
D.U.T.
QGD
+
V
- DS
VGS
VG
3mA
Charge
Fig 13a. Basic Gate Charge Waveform
6
IG
ID
Current Sampling Resistors
Fig 13b. Gate Charge Test Circuit
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IRFR/U3910
Peak Diode Recovery dv/dt Test Circuit
+
D.U.T
Circuit Layout Considerations
• Low Stray Inductance
• Ground Plane
• Low Leakage Inductance
Current Transformer
+
-
-
+
•
•
•
•
RG
dv/dt controlled by RG
Driver same type as D.U.T.
ISD controlled by Duty Factor "D"
D.U.T. - Device Under Test
Driver Gate Drive
D=
Period
P.W.
+
-
VDD
P.W.
Period
VGS=10V
*
D.U.T. ISD Waveform
Reverse
Recovery
Current
Body Diode Forward
Current
di/dt
D.U.T. VDS Waveform
Diode Recovery
dv/dt
Re-Applied
Voltage
Body Diode
VDD
Forward Drop
Inductor Curent
Ripple ≤ 5%
ISD
* VGS = 5V for Logic Level Devices
Fig 14. For N-Channel HEXFETS
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7
IRFR/U3910
Package Outline
TO-252AA Outline
Dimensions are shown in millimeters (inches)
2 .3 8 (.0 9 4 )
2 .1 9 (.0 8 6 )
6 .7 3 (.2 6 5 )
6 .3 5 (.2 5 0 )
1 .1 4 (.0 4 5 )
0 .8 9 (.0 3 5 )
-A 1 .2 7 (.0 5 0 )
0 .8 8 (.0 3 5 )
5 .4 6 (.2 1 5 )
5 .2 1 (.2 0 5 )
0 .5 8 (.0 2 3 )
0 .4 6 (.0 1 8 )
4
6 .4 5 (.2 4 5 )
5 .6 8 (.2 2 4 )
6 .2 2 (.2 4 5 )
5 .9 7 (.2 3 5 )
1 .0 2 (.0 4 0 )
1 .6 4 (.0 2 5 )
1
2
1 0 .4 2 (.4 1 0 )
9 .4 0 (.3 7 0 )
3
0 .5 1 (.0 2 0 )
M IN .
-B 1 .5 2 (.0 6 0 )
1 .1 5 (.0 4 5 )
3X
1 .1 4 (.0 4 5 )
2 X 0 .7 6 (.0 3 0 )
0 .8 9 (.0 3 5 )
0 .6 4 (.0 2 5 )
0 .2 5 (.0 1 0 )
2 .2 8 (.0 9 0 )
4 .5 7 (.1 8 0 )
L E A D A S S IG N M E N T S
1 - GATE
2 - D R A IN
3 - SOURCE
4 - D R A IN
0 .5 8 (.0 2 3 )
0 .4 6 (.0 1 8 )
M A M B
N O TE S :
1 D IM E N S IO N IN G & T O L E R A N C IN G P E R A N S I Y 1 4 .5 M , 1 9 8 2 .
2 C O N T R O L L IN G D IM E N S IO N : IN C H .
3 C O N F O R M S T O J E D E C O U T L IN E T O -2 5 2 A A .
4 D IM E N S IO N S S H O W N A R E B E F O R E S O L D E R D IP ,
S O L D E R D IP M A X . + 0 .1 6 (.0 0 6 ).
Part Marking Information
TO-252AA (D-PARK)
E XA M P L E : T H IS IS A N IR F R 1 2 0
W IT H A S S E M B L Y
LOT COD E 9U1P
IN T E R N A T IO N A L
R E C T IF IE R
LO GO
A
IR F R
120
9U
ASS EMB LY
LOT CODE
8
F IR S T P O R T IO N
OF PART NUMBER
1P
S E C O N D P O R TIO N
OF PART NUMBER
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IRFR/U3910
Package Outline
TO-251AA Outline
Dimensions are shown in millimeters (inches)
6 .7 3 (.2 6 5 )
6 .3 5 (.2 5 0 )
-A -
2 .3 8 (.0 9 4 )
2 .1 9 (.0 8 6 )
0 .5 8 (.0 2 3 )
0 .4 6 (.0 1 8 )
1 .2 7 (.0 5 0 )
0 .8 8 (.0 3 5 )
5 .4 6 (.2 1 5 )
5 .2 1 (.2 0 5 )
L E A D A S S IG N M E N T S
1 - GATE
2 - D R A IN
3 - SOURCE
4 - D R A IN
4
6 .4 5 (.2 4 5 )
5 .6 8 (.2 2 4 )
6 .2 2 (.2 4 5 )
5 .9 7 (.2 3 5 )
1 .5 2 (.0 6 0 )
1 .1 5 (.0 4 5 )
1
2
3
-B 2 .2 8 (.0 9 0 )
1 .9 1 (.0 7 5 )
3X
1 .1 4 (.0 4 5 )
0 .7 6 (.0 3 0 )
2 .2 8 (.0 9 0 )
N O TE S :
1 D IM E N S IO N IN G & T O L E R A N C IN G P E R A N S I Y 1 4 .5 M , 1 9 8 2 .
2 C O N T R O L L IN G D IM E N S IO N : IN C H .
3 C O N F O R M S T O J E D E C O U T L IN E T O -2 5 2 A A .
4 D IM E N S IO N S S H O W N A R E B E F O R E S O L D E R D IP ,
S O L D E R D IP M A X . + 0 .1 6 (.0 0 6 ).
9 .6 5 (.3 8 0 )
8 .8 9 (.3 5 0 )
3X
1 .1 4 (.0 4 5 )
0 .8 9 (.0 3 5 )
0 .8 9 (.0 3 5 )
0 .6 4 (.0 2 5 )
0 .2 5 (.0 1 0 )
2X
M A M B
0 .5 8 (.0 2 3 )
0 .4 6 (.0 1 8 )
Part Marking Information
TO-251AA (I-PARK)
E XA M P L E : TH IS IS A N IR F U 1 2 0
W IT H A S S E M B L Y
LOT CODE 9U1P
IN TE R N A T IO N A L
R E C TIF IE R
LO G O
IR F U
12 0
9U
AS SEMBLY
LOT CODE
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F IR S T P O R TIO N
OF PART NUMBER
1P
S E C O N D P O R TIO N
OF PART NUM BER
9
IRFR/U3910
Tape & Reel Information
TO-252AA
TR
TRR
1 6.3 ( .641 )
1 5.7 ( .619 )
12 .1 ( .4 76 )
11 .9 ( .4 69 )
F E E D D IR E C T IO N
TR L
16.3 ( .64 1 )
15.7 ( .61 9 )
8 .1 ( .3 18 )
7 .9 ( .3 12 )
F E E D D IR E C T IO N
NO T ES :
1. C O N T R O LL IN G D IM E N S IO N : M ILLIM E T E R .
2. A LL D IM E N S IO N S A R E S H O W N IN M ILL IM E T E R S ( IN C H E S ).
3. O U T L IN E C O N F O R M S T O E IA -4 81 & E IA -54 1.
13 IN C H
16 m m
NOTES :
1. O U T LIN E C O N F O R M S T O E IA -481 .
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331
EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020
IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T 3Z2, Tel: (905) 453 2200
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111
IR FAR EAST: 171 (K&H Bldg.) 30-4 Nishi-ikebukuro 3-chome, Toshima-ku, Tokyo Japan Tel: 81 33 983 0086
IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 16907 Tel: 65 221 8371
Data and specifications subject to change without notice.
5/98
10
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Note: For the most current drawings please refer to the IR website at:
http://www.irf.com/package/