Panasonic AXK8L26125BG Narrow-pitch connectors for board-to-fpc connection Datasheet

NARROW-PITCH
CONNECTORS
FOR BOARD-TO-FPC
CONNECTION
Socket
Header
Compliance with RoHS Directive
2. Strong resistance to adverse
environments! Utilizes
construction
for high contact reliability.
(See Page 6 for details of the structure)
3. Improved mating strength between
the socket and header
The simple locking structures provided
for the soldering terminals and the
contact points improve the mating
strength and provide tactile feedback
when locked.
Socket
Header
NARROW PITCH (0.4mm)
CONNECTORS F4
5. Connectors for inspection available
Connectors for inspection are available
that are ideal for modular unit inspection
and inspection in device assembly
processes.
APPLICATIONS
Compact portable devices “Cellular
phones, DVD, DSC, etc”
Example of connection between a board and an FPC
Before mating
FPC
F4
connector
Reinforcing
plate
PCB
After mating
Locking structure of the soldering terminals
FEATURES
1. The lowest profile class among twopiece connectors in the world (Mated
height: 0.9mm)
Achieved both a 0.4 mm pitch and an
ultra low profile of 0.9 mm high when
mated, contributing to further thickness
reduction of products.
4. Easy to design product circuits
1) An insulating wall provided for the
bottom surface of the connector prevents
contact between the pattern on the PC
board and the metal pins, enabling
pattern wiring under the connector, and
thus contributing to the reduction in size
of PC boards.
<Socket>
<Header>
Pattern wiring under the connector is possible.
panasonic-electric-works.net/ac
0.9mm
Narrow-pitch connectors
AXK7L, 8L
Narrow-pitch connectors
AXK7L, 8L
ORDERING INFORMATION
AXK
G
AXK: Narrow Pitch Connector Series
Series name;
7L: F4 (0.4 mm pitch) Socket
8L: F4 (0.4 mm pitch) Header
Number of contacts (2 digits)
Mated height
<Socket>
2: For mated height 0.9 mm
<Header>
1: For mated height 0.9 mm
Functions
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion) Note 2
<Socket>
7: Ni plating on base, Au plating on surface (for Ni barrier available)
<Header>
5: Ni plating on base, Au plating on surface
Other specifications
<Header>
B: Soldering terminals with fork type terminal Note 1
Packing
G: 3,000 pieces embossed tape and plastic reel × 2
Notes: 1. “B” in the 11th digit of the header part number signifies a fork type soldering terminals to lessen the constraint on amount of solder when mounting,
and a construction that makes it difficult when mounting for excess solder to interfere with the socket.
Although compatible with the previous parts, these parts are not compatible with the recommended PC board pattern and recommended metal mask pattern.
2. The part number will be changed as follows due to the change in the plating specifications for the metal clips.
This change will apply to production from December 2009 onwards. (There will be no change to the contact portion and terminal portion.)
(Socket)
3: Ni plating on base, Au plating on surface (for Ni barrier available)
(Header)
4: Ni plating on base, Au plating on surface
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PRODUCT TYPES
Mated
height
Number of
contacts
Socket
0.9 mm
10
12
14
16
20
22
24
26
28
30
32
34
36
38
40
44
48
50
54
60
66
70
80
AXK7L10227G
AXK7L12227G
AXK7L14227G
AXK7L16227G
AXK7L20227G
AXK7L22227G
AXK7L24227G
AXK7L26227G
AXK7L28227G
AXK7L30227G
AXK7L32227G
AXK7L34227G
AXK7L36227G
AXK7L38227G
AXK7L40227G
AXK7L44227G
AXK7L48227G
AXK7L50227G
AXK7L54227G
AXK7L60227G
AXK7L66227G
AXK7L70227G
AXK7L80227G
Part number
Socket
Products with plating change
to soldering terminals
(in effect from Dec. ’09)
AXK7L10223G
AXK7L12223G
AXK7L14223G
AXK7L16223G
AXK7L20223G
AXK7L22223G
AXK7L24223G
AXK7L26223G
AXK7L28223G
AXK7L30223G
AXK7L32223G
AXK7L34223G
AXK7L36223G
AXK7L38223G
AXK7L40223G
AXK7L44223G
AXK7L48223G
AXK7L50223G
AXK7L54223G
AXK7L60223G
AXK7L66223G
AXK7L70223G
AXK7L80223G
Packing
Header
Header
Products with plating change
to soldering terminals
(in effect from Dec. ’09)
Inner carton
(1 reel)
Outer carton
AXK8L10125BG
AXK8L12125BG
AXK8L14125BG
AXK8L16125BG
AXK8L20125BG
AXK8L22125BG
AXK8L24125BG
AXK8L26125BG
AXK8L28125BG
AXK8L30125BG
AXK8L32125BG
AXK8L34125BG
AXK8L36125BG
AXK8L38125BG
AXK8L40125BG
AXK8L44125BG
AXK8L48125BG
AXK8L50125BG
AXK8L54125BG
AXK8L60125BG
AXK8L66125BG
AXK8L70125BG
AXK8L80125BG
AXK8L10124BG
AXK8L12124BG
AXK8L14124BG
AXK8L16124BG
AXK8L20124BG
AXK8L22124BG
AXK8L24124BG
AXK8L26124BG
AXK8L28124BG
AXK8L30124BG
AXK8L32124BG
AXK8L34124BG
AXK8L36124BG
AXK8L38124BG
AXK8L40124BG
AXK8L44124BG
AXK8L48124BG
AXK8L50124BG
AXK8L54124BG
AXK8L60124BG
AXK8L66124BG
AXK8L70124BG
AXK8L80124BG
3,000 pieces
6,000 pieces
(2 reels)
Notes: 1. Regarding ordering units;
During production: Please make orders in 1-reel units.
Samples for mounting confirmation: Available in units of 50 pieces. Please contact us.
Samples: Available. Please contact us.
2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our
sales office.
3. Please contact us regarding different number of contacts.
4. “B” in the 11th digit of the header part number signifies a fork type soldering terminals to lessen the constraint on amount of solder when mounting, and a
construction that makes it difficult when mounting for excess solder to interfere with the socket.
Although compatible with the previous parts, these parts are not compatible with the recommended PC board pattern and recommended metal mask pattern.
5. Since the plating specifications for the metal clips will be changed starting with production in December 2009 onwards, the digit “7” in the 10th place of the part
number for sockets will be changed to “3”, and “5” for headers will be changed to “4”.
Be careful when placing an order.
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Item
Rated current
Rated voltage
Specifications
0.3A/terminal (Max. 5 A at total terminals)
60V AC/DC
Breakdown voltage
150V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (Initial)
Contact resistance
Max. 90mΩ
Ambient temperature
Soldering heat resistance
Storage temperature
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H2S resistance
(header and socket mated)
Lifetime
characteristics
Unit weight
Insertion and removal life
Conditions
—
—
Rated voltage is applied for one minute and check for
short circuit or damage with a detection current of 1mA
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
No freezing at low temperatures
–55°C to +85°C
Max. peak temperature of 260°C (on the surface of the
PC board around the connector terminals)
300°C within 5 sec, 350°C within 3 sec.
–55°C to +85°C (Product only)
–40°C to +50°C (Emboss packing)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
48 hours,
contact resistance max. 90mΩ
50 times
20 contacts; Socket: 0.03g Header: 0.01g
Infrared reflow soldering
Soldering iron
No freezing at low temperatures
Sequence
1. –55 –30 °C, 30 min.
2. ~ , Max. 5 min.
3. 85 +30 °C, 30 min.
4. ~ , Max. 5 min.
Temperature 40±2°C,
humidity 90 to 95% R.H.
Temperature 35±2°C,
saltwater concentration 5±1%
Temperature 40±2°C,
gas concentration 3±1 ppm, humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200
times/hours
—
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Narrow-pitch connectors
AXK7L, 8L
2. Material and surface treatment
Part name
Molded portion
Material
LCP resin (UL94V-0)
Contact/Post
Surface treatment
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for front edge of terminal)
However, the area adjacent to the socket terminal is exposed to Ni on base.
Metal clips Note): Ni plating on base, Sn plating on surface
(Socket: except for front edge of the terminal)
Copper alloy
Note: The following change will apply to production from December 2009 onwards.
Socket: Ni plating on base, Pd + Au flash plating on surface (Expect for front edge of terminal)
Header: Ni plating on base, Au plating on surface (Expect for front edge of terminal)
DIMENSIONS (unit: mm)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://panasonic-electric-works.net/ac
• Socket (Mated height 0.9 mm)
Dimension table (mm)
CAD Data
Terminal coplanarity
0.08
(Contact and clips
(soldering terminal))
0.87
F
4.40
Soldering
terminal
0.10±0.03
F-F cross section
0.50
(5.00)
0.40±0.05
C±0.15
Suction
face
0.80
5.00
F
0.60
Soldering
terminal
This surface
C0.15
5.00
A
B±0.1
0.40±0.05
0.15±0.03
General tolerance: ±0.2
Number of contacts/
Dimensions
10
4.4
1.6
3.0
12
14
16
20
22
24
26
28
30
32
34
36
38
40
44
48
50
54
60
66
70
80
4.8
5.2
5.6
6.4
6.8
7.2
7.6
8.0
8.4
8.8
9.2
9.6
10.0
10.4
11.2
12.0
12.4
13.2
14.4
15.6
16.4
18.4
2.0
2.4
2.8
3.6
4.0
4.4
4.8
5.2
5.6
6.0
6.4
6.8
7.2
7.6
8.4
9.2
9.6
10.4
11.6
12.8
13.6
15.6
3.4
3.8
4.2
5.0
5.4
5.8
6.2
6.6
7.0
7.4
7.8
8.2
8.6
9.0
9.8
10.6
11.0
11.8
13.0
14.2
15.0
17.0
A
B
C
A
B
C
• Header (Mated height: 0.9 mm)
Dimension table (mm)
CAD Data
Terminal coplanarity
0.80±0.05
1.20±0.05
Suction face 2.30
0.63
5
0.65
4.10
5
.1
R0
Soldering
terminal
.1
0.08
(Contact and
soldering terminal)
3.36
A
B
C±0.1
0.40±0.05
0.15±0.03
0.08±0.03
R0
Narrow-pitch connectors
AXK7L, 8L
0.27
Clips (soldering terminals)
General tolerance: ±0.2
Number of contacts/
Dimensions
10
4.0
3.74
1.6
12
14
16
20
22
24
26
28
30
32
34
36
38
40
4.4
4.8
5.2
6.0
6.4
6.8
7.2
7.6
8.0
8.4
8.8
9.2
9.6
10.0
4.14
4.54
4.94
5.74
6.14
6.54
6.94
7.34
7.74
8.14
8.54
8.94
9.34
9.74
2.0
2.4
2.8
3.6
4.0
4.4
4.8
5.2
5.6
6.0
6.4
6.8
7.2
7.6
44
48
50
54
60
66
70
80
10.8
11.6
12.0
12.8
14.0
15.2
16.0
18.0
10.54
11.34
11.74
12.54
13.74
14.94
15.74
17.74
8.4
9.2
9.6
10.4
11.6
12.8
13.6
15.6
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Narrow-pitch connectors
AXK7L, 8L
Socket
Header
0.90±0.15
• Socket and header are mated
EMBOSSED TAPE DIMENSIONS (unit: mm) (Common for respective contact type, socket and header)
Tape dimensions (Conforming to JIS C 0806-1990. However,
some tapes have mounting hole pitches that do not comply with
the standard.)
Tape I
Tape II
A±0.3
Plastic reel dimensions (Conforming to EIAJ ET–7200B)
A±0.3
C
C
8.0
Top cover tape
4
2
Pull out direction
4
2
1.75
380 dia.
1.75
Pull out direction
Taping reel
D±1
B
Embossed carrier tape
Embossed mounting-hole
8.0
1.5+0.1
0 dia.
1.5+0.1
0 dia.
TABLE OF DIMENSIONS
Mated height
Number of contacts
Type of taping
A
B
C
D
Quantity per reel
Common for
socket and header:
0.9mm
Max. 24
26 to 70
80
Tape I
Tape I
Tape II
16.0
24.0
32.0
—
—
28.4
7.5
11.5
14.2
17.4
25.4
33.4
3000
3000
3000
Connector orientation with respect to direction of progress of embossed tape
Type
Common for F4
Direction of
tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
panasonic-electric-works.net/ac
AXK7L, 8L
Narrow-pitch connectors
CONNECTOR FOR INSPECTION
USAGE APPLICATIONS WITH
3,000 INSERTION AND
(0.4 mm PITCHES)
REMOVAL TIMES
NARROW PITCH CONNECTOR F4
FOR INSPECTION USAGE
Socket
Header
Compliance with RoHS Directive
FEATURES
APPLICATIONS
1. 3,000 insertion and removals (when
as recommended)
2. Same external dimensions and foot
pattern as standard type.
3. Improved mating
Insertion and removal have become
easier due to a reduction in the mating
retention force required by the simple
locking structure and also in the amount
of force needed for insertion and
removal. (We cannot warrant anything
regarding mating retention.)
Ideal for module unit inspection and
equipment assembly inspection
TABLE OF PRODUT TYPES
✩: Available for sale
Product name
F4
for inspection
10
✩
12
✩
14
✩
16
✩
20
✩
22
✩
24
✩
26
✩
28
✩
30
✩
Number of contacts
32
34
36
38
✩
✩
✩
✩
40
✩
44
✩
48
✩
50
✩
54
✩
60
✩
66
✩
70
✩
80
✩
Notes: 1. Please inquire about numbers of contacts other than those given above.
2. Please inquire with us regarding delivery times.
3. Please keep the minimum unit for ordering no less than 50 pieces per lot.
4. Please inquire for further information.
PRODUCT TYPES
Socket
Specifications
Without positioning bosses
Part No.
AXK7LE∗∗26G
Header
Specifications
Without positioning bosses
Part No.
AXK8LE∗∗26BG
Notes: 1. When placing an order, substitute the “∗” (asterisk) in the above part number with the number of contacts for the required connector.
2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our
sales office.
panasonic-electric-works.net/ac
AXK7L, 8L
Socket
Header
Recommended PC board pattern
(Mount pad arrangement pattern)
1.40±0.03
Recommended PC board pattern
(Mount pad arrangement pattern)
1.40±0.03
0.40±0.03
0.23±0.03
0.57±0.03
0.40±0.03
1.40±0.03
3.20±0.03
4.70±0.03
Max. 2.20
4.00±0.03
5.60±0.03
C
0.
40
0.40±0.03
0.23±0.03
3.60±0.03
1. Removal by pulling up from an end
causes the entire connector removal
force to concentrate on the soldering
terminals and end terminals.
Therefore, please lift and remove from
the side. Doing so will also prevent
cracking of the soldered parts.
Narrow-pitch connectors
NOTES
: Insulation area
1.00±0.03
Relation between connector and mounting pad
(Max. 2.20)
(3.20±0.03)
(4.70±0.03)
NG
Metal mask thickness: Here, 150 µm
(Terminal portion opening area ratio: 52 %)
(Metal portion opening area ratio: 80 %)
3.60±0.01
4.50±0.01
0.40±0.01
1.40±0.01
(0.49)
4.42±0.01
5.40±0.01
5.60±0.01
3.60±0.01
40
(1.00)
0.20±0.01
0.40±0.01
0.
0.20±0.01
0.40±0.01
C
Recommended metal mask pattern
Metal mask thickness: Here, 120 µm
(Terminal portion opening area ratio: 66 %)
(Metal portion opening area ratio: 100 %)
Metal mask thickness: Here, 120 µm
(Terminal portion opening area ratio: 66 %)
(Metal portion opening area ratio: 100 %)
1.40±0.01
4.18±0.01
5.40±0.01
0.40±0.01
0.20±0.01
0.40±0.01
40
(1.00)
0.
0.20±0.01
0.40±0.01
4.50±0.01
1.40±0.01
0.57±0.01
5.60±0.01
3.60±0.01
1.40±0.01
1.00±0.01
(0.57)
3.36±0.01
Recommended metal mask pattern
C
In particular, if a lot of solder is
used in the header retaining
soldering terminals, it might
interfere with and cause incomplete
socket mating. Therefore, please
follow the recommended
conditions give on the right.
1.40±0.01
0.46±0.01
(0.45)
Recommended metal mask pattern
Metal mask thickness: Here, 150 µm
(Terminal portion opening area ratio: 53 %)
(Metal portion opening area ratio: 100 %)
1.40±0.01
1.00±0.01
2. PC Boards and Recommended
Metal Mask Patterns
Connectors are mounted with high
density, with a pitch interval of 0.4 to 0.5
mm.
In order to reduce solder bridge and
other issues make sure the proper levels
of solder are used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
: Insulation area
Recommended metal mask pattern
(0.61)
Pull
Mounting pad
For other details, please verify with
the product specification sheets.
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