Vicor B048F096M24 Bus converter Datasheet

B048F096T24
B048F096M24
BCMTM
Bus Converter
• 48 V to 9.6 V V•I Chip™ Bus Converter • Typical efficiency 96%
• 240 Watt (360 Watt for 1 ms)
• 125°C operation (TJ)
• High density – 813 W/in3
• <1 µs transient response
• Small footprint – 210 W/in2
• Low weight – 0.5 oz (15 g)
• ZVS / ZCS isolated Sine
Amplitude Converter™
©
VIN = 38 - 55 V
VOUT = 7.60 - 11.0 V
IOUT = 25 A
• 3.5 million hours MTBF
• No output filtering required K = 1/5
ROUT = 12.0 mΩ max
Product Description
Absolute Maximum Ratings
The V•I Chip™ bus converter is a high efficiency (>96%),
narrow input range Sine Amplitude ConverterTM (SACTM)
operating from a 38 to 55 Vdc primary bus to deliver an
isolated 7.60 V to 11.0 V secondary. The bus converter
may be used to power non-isolated POL converters or as
an independent 7.60 – 11.0 V source. Due to the fast
response time and low noise of the bus converter, the
need for limited life aluminum electrolytic or tantalum
capacitors at the load is reduced—or eliminated—
resulting in savings of board area, materials and total
system cost.
The bus converter achieves a power density of 813 W/in3
in a V•I Chip package compatible with standard pickand-place and surface mount assembly process. The
V•I Chip package provides flexible thermal management
through its low junction-to-board and junction-to-case
thermal resistance. Owing to its high conversion
efficiency and safe operating temperature range, the bus
converter does not require a discrete heat sink in typical
applications. Low junction-to-case and junction-to-lead
thermal impedances assure low junction temperatures
and long life in the harshest environments.
Parameter
+In to -In
Values
Unit
-1.0 to 60
Vdc
100
Vdc
PC to -In
-0.3 to 7.0
Vdc
+Out to -Out
-0.5 to 16
Vdc
2,250
Vdc
Isolation voltage
Notes
For 100 ms
Input to output
Output current
31.5
A
Continuous
Peak output current
37.5
A
For 1 ms
Output power
240
W
Continuous
Peak output power
360
W
For 1 ms
225
°C
MSL 5
245
°C
MSL 6, TOB = 4 hrs
-40 to 125
°C
T-Grade
-55 to 125
°C
M-Grade
-40 to 125
°C
T-Grade
-65 to 125
°C
M-Grade
Case temperature during reflow
Operating junction temperature
[a]
[b]
Storage temperature
Notes:
[a] 245°C reflow capability applies to product with manufacturing date code 1001 and greater.
[b] The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
Part Numbering
B
Bus Converter
048
F
800-735-6200
T
Output Voltage
Designator
(=VOUT x10)
Input Voltage
Designator
Configuration
F = J-lead
T = Through hole
vicorpower.com
096
BCM™ Bus Converter
24
Output Power
Designator
(=POUT /10)
Product Grade Temperatures (°C)
Grade
Storage
Operating (TJ)
T
-40 to125
-40 to125
M
-65 to 125
-55 to 125
B048F096T24
Rev. 4.9
Page 1 of 12
Specifications
Input (Conditions are at 48 VIN, full load, and 25°C ambient unless otherwise specified)
Parameter
Input voltage range
Input dV/dt
Input undervoltage turn on
Input undervoltage turn off
Input overvoltage turn on
Input overvoltage turn off
Input quiescent current
Inrush current overshoot
Input current
Input reflected ripple current
No load power dissipation
Internal input capacitance
Internal input inductance
Recommended external input capacitance
Min
Typ
Max
Unit
38
48
55
1
38.0
Vdc
V/µs
Vdc
Vdc
Vdc
Vdc
mA
A
Adc
mA p-p
W
µF
nH
µF
32.0
55.0
60.0
2.5
5.3
5.4
140
3.1
4.0
5
47
4.1
Note
PC low
Using test circuit in Figure 20; See Figure 1
Using test circuit in Figure 20; See Figure 4
200 nH maximum source inductance; See Figure 20
Input Waveforms
Figure 1 — Inrush transient current at full load and 48 VIN
with PC enabled
Figure 2 — Output voltage turn on waveform with PC enabled
at full load and 48 VIN
Figure 3 — Output voltage turn on waveform with input turn on
at full load and 48 VIN
Figure 4 — Input reflected ripple current at full load and 48 VIN
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BCM™ Bus Converter
B048F096T24
Rev. 4.9
Page 2 of 12
Specifications
(continued)
Output (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Min
Typ
7.60
7.30
0
0
0
Output voltage
Output power
Rated DC current
Peak repetitive power
Current share accuracy
Efficiency
Half load
Full load
Internal output inductance
Internal output capacitance
Load capacitance
Output overvoltage set point
Output ripple voltage
No external bypass
10 µF bypass capacitor
Short circuit protection set point
Average short circuit current
Effective switching frequency
Line regulation
K
Load regulation
ROUT
Transient response
Voltage overshoot
Response time
Recovery time
Output overshoot
Input turn on
PC enable
Output turn on delay
From application of power
From release of PC pin
5
95.5
95.5
Max
Unit
Note
11.0
10.7
240
227
31.5
Vdc
Vdc
W
W
Adc
360
W
10
%
No load
Full load
40 - 55 VIN
38 - 55 VIN
POUT ≤ 240 W
Max pulse width 1ms, max duty cycle 10%,
baseline power 50%
See Parallel Operation on Page 10
96.2
96.2
1.6
55
1,600
11.0
176
17
200
33
3.0
0.43
3.1
3.4
0.1980
1/5
0.2020
8.9
12.0.
%
%
nH
µF
µF
Vdc
See Figure 5
See Figure 5
Effective value
Module will shut down
mVp-p
mVp-p
Adc
A
MHz
See Figures 7 and 9
See Figure 8
Module will shut down
Fixed, 1.6 MHz per phase
VOUT = K•VIN at no load
mΩ
92
200
1
mV
ns
µs
100% load step; See Figures 10 and 11
See Figures 10 and 11
See Figures 10 and 11
0
0
mV
mV
No output filter; See Figure 3
No output filter; See Figure 2
288
70
ms
ms
No output filter; See Figure 3
No output filter
Output Waveforms
Efficiency vs. Output Power
98
96
9
Power Dissipation (W)
Efficiency (%)
Power Dissipation
10
94
92
90
88
86
84
0
24
48
72
96
120
144
168
192
216
240
8
7
6
5
4
3
2
0
24
48
Output Power (W)
Figure 5 — Efficiency vs. output power
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72
96
120
144
Output Power (W)
168
192
216
240
Figure 6 — Power dissipation as a function of output power
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BCM™ Bus Converter
B048F096T24
Rev. 4.9
Page 3 of 12
Specifications
(continued)
Output Waveforms
Figure 8 — Output voltage ripple at full load and 48 VIN
with 10 µF ceramic external bypass capacitor and 20 nH
of distribution inductance.
Figure 7 — Output voltage ripple at full load and 48 VIN
without any external bypass capacitor.
Ripple vs. Output Power
Output Ripple (mVpk-pk)
180
160
140
120
100
80
60
40
0
24
48
72
96
120
144
168
192
216
240
Output Power (W)
Figure 9 — Output voltage ripple vs. output power at 48 VIN
without any external bypass capacitor.
Figure 10 — 0 – 25 A load step with 100 µF input capacitor
and no output capacitor.
Figure 11 — 25 – 0 A load step with 100 µF input capacitor
and no output capacitor.
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BCM™ Bus Converter
B048F096T24
Rev. 4.9
Page 4 of 12
Specifications
(continued)
General
Parameter
Min
MTBF
MIL-HDBK-217F
Isolation specifications
Voltage
Capacitance
Resistance
Typ
Max
Unit
Note
3.5
Mhrs
25°C, GB
3,000
Vdc
pF
MΩ
Input to output
Input to output
Input to output
UL /CSA 60950-1, EN 60950-1
Low voltage directive
2,250
10
cTÜVus
CE Mark
RoHS
Agency approvals
Mechanical
Weight
Dimensions
Length
Width
Height
Thermal
Overtemperature shutdown
Thermal capacity
Junction-to-case thermal impedance (RθJC)
Junction-to-board thermal impedance (RθJB)
See mechanical drawings, Figures 15 – 18
0.53/15
oz /g
1.28/ 32,5
0.87 / 22
0.265 / 6,73
in / mm
in / mm
in / mm
125
130
9.3
1.1
2.1
135
°C
Ws /°C
°C / W
°C / W
Junction temperature
See Thermal Considerations on Page 10
Auxiliary Pins (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Min
Typ
Max
5.2
Unit
Note
Primary control (PC)
DC voltage
4.8
5.0
Module disable voltage
2.4
2.5
Module enable voltage
Current limit
2.4
Vdc
Vdc
2.5
2.6
Vdc
2.5
2.9
mA
Enable delay time
70
ms
Disable delay time
20
µs
See Figure 12, time from PC low to output low
Figure 13 — PC signal during fault
Figure 12 — VOUT at full load vs. PC disable
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Source only
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BCM™ Bus Converter
B048F096T24
Rev. 4.9
Page 5 of 12
Pin / Control Functions
+In / -In – DC Voltage Input Ports
The V•I Chip™ module input voltage range should not be exceeded.
An internal undervoltage /overvoltage lockout function prevents
operation outside of the normal operating input range. The BCM™ bus
converter turns on within an input voltage window bounded by the
“Input undervoltage turn on” and “Input overvoltage turn off” levels,
as specified. The module may be protected against accidental
application of a reverse input voltage by the addition of a rectifier in
series with the positive input, or a reverse rectifier in shunt with the
positive input located on the load side of the input fuse.
The connection of the module to its power source should be
implemented with minimal distribution inductance. If the interconnect
inductance exceeds 100 nH, the input should be bypassed with a RC
damper to retain low source impedance and stable operation. With an
interconnect inductance of 200 nH, the RC damper may be 47 µF in
series with 0.3Ω. A single electrolytic or equivalent low-Q capacitor may
be used in place of the series RC bypass.
PC – Primary Control
The Primary Control port is a multifunction node that provides the
following functions:
Enable / Disable – If the PC port is left floating, the BCM™ module
output is enabled. Once this port is pulled lower than 2.4 Vdc with
respect to –In, the output is disabled. This action can be realized by
employing a relay, opto-coupler, or open collector transistor. Refer
to Figures 1-3, 12 and 13 for the typical enable /disable
characteristics. This port should not be toggled at a rate higher
than 1 Hz. The PC port should also not be driven by or pulled up to
an external voltage source.
4
3
2
+Out
B
B
C
C
D
D
+In
E
E
-Out
1
A
A
F
G
H
TM
H
J
RSV
J
K
PC
K
+Out
-Out
L
L
M
M
N
N
P
P
R
R
-In
T
T
Bottom View
Signal
Name
+In
–In
TM
RSV
PC
+Out
–Out
Designation
A1-E1, A2-E2
L1-T1, L2-T2
H1, H2
J1, J2
K1, K2
A3-D3, A4-D4,
J3-M3, J4-M4
E3-H3, E4-H4,
N3-T3, N4-T4
Primary Auxiliary Supply – The PC port can source up to 2.4 mA at
5.0 Vdc. The PC port should never be used to sink current.
Alarm – The module contains circuitry that monitors output
overload, input overvoltage or undervoltage, and internal junction
temperatures. In response to an abnormal condition in any of the
monitored parameters, the PC port will toggle. Refer to Figure 13
for PC alarm characteristics.
Figure 14 — BCM™ bus converter pin configuration
TM and RSV – Reserved for factory use.
+Out / -Out – DC Voltage Output Ports
Two sets of contacts are provided for the +Out port. They must be
connected in parallel with low interconnect resistance. Similarly, two
sets of contacts are provided for the –Out port. They must be
connected in parallel with low interconnect resistance. Within the
specified operating range, the average output voltage is defined by the
Level 1 DC behavioral model of Figure 21. The current source capability
of the module is rated in the specifications section of this document.
The low output impedance of the module reduces or eliminates the
need for limited life aluminum electrolytic or tantalum capacitors at the
input of POL converters.
Total load capacitance at the output of the modules should not exceed
the specified maximum. Owing to the wide bandwidth and low output
impedance of the module, low frequency bypass capacitance and
significant energy storage may be more densely and efficiently provided
by adding capacitance at the input of the BCM module.
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BCM™ Bus Converter
B048F096T24
Rev. 4.9
Page 6 of 12
Mechanical Drawings
BOTTOM VIEW
TOP VIEW ( COMPONENT SIDE )
NOTES:
mm
1. DIMENSIONS ARE inch .
2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005]
3. PRODUCT MARKING ON TOP SURFACE
DXF and PDF files are available on vicorpower.com
Figure 15 — BCM ™ module J-Lead mechanical outline; onboard mounting
RECOMMENDED LAND PATTERN
( COMPONENT SIDE SH OWN )
NOTES:
mm
1. DIMENSIONS ARE inch .
2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005]
3. PRODUCT MARKING ON TOP SURFACE
DXF and PDF files are available on vicorpower.com
Figure 16 — BCM™ module PCB land layout information
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800-735-6200
BCM™ Bus Converter
B048F096T24
Rev. 4.9
Page 7 of 12
Mechanical Drawings (continued)
TOP VIEW ( COMPONENT SIDE )
BOTTOM VIEW
NOTES:
(mm)
1. DIMENSIONS ARE inch .
2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE:
X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005]
3. RoHS COMPLIANT PER CST-0001 LATEST REVISION
DXF and PDF files are available on vicorpower.com
Figure 17 — BCM™ through-hole module mechanical outline
NOTES:
(mm)
1. DIMENSIONS ARE inch .
RECOMMENDED HOLE PATTERN
( COMPONENT SIDE SHOWN )
2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE:
X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005]
3. RoHS COMPLIANT PER CST-0001 LATEST REVISION
DXF and PDF files are available on vicorpower.com
Figure 18 — BCM™ through-hole module PCB layout information
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800-735-6200
BCM™ Bus Converter
B048F096T24
Rev. 4.9
Page 8 of 12
Configuration Options
RECOMMENDED LAND PATTERN
(NO GROUNDING CLIPS)
TOP SIDE SHOWN
NOTES:
1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE
FREE OF COPPER, ALL PCB LAYERS.
2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555],
THIS PROVIDES 7.00 [0.275] COMPONENT
EDGE-TO-EDGE SPACING, AND 0.50 [0.020]
CLEARANCE BETWEEN VICOR HEAT SINKS.
(B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614],
THIS PROVIDES 8.50 [0.334] COMPONENT
EDGE-TO-EDGE SPACING, AND 2.00 [0.079]
CLEARANCE BETWEEN VICOR HEAT SINKS.
RECOMMENDED LAND PATTERN
(With GROUNDING CLIPS)
TOP SIDE SHOWN
3. V•I CHIP™ MODULE LAND PATTERN SHOWN FOR REFERENCE ONLY;
ACTUAL LAND PATTERN MAY DIFFER.
DIMENSIONS FROM EDGES OF LAND PATTERN
TO PUSH-PIN HOLES WILL BE THE SAME FOR
ALL FULL SIZE V•ICHIP PRODUCTS.
4. RoHS COMPLIANT PER CST-0001 LATEST REVISION.
5. UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE MM [INCH].
TOLERANCES ARE:
X.X [X.XX] = ±0.3 [0.01]
X.XX [X.XXX] = ±0.13 [0.005]
6. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855)
SHOWN FOR REFERENCE. HEAT SINK ORIENTATION AND
DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION.
Figure 19 — Hole location for push pin heat sink relative to V•I Chip™ module
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BCM™ Bus Converter
B048F096T24
Rev. 4.9
Page 9 of 12
Application Note
Parallel Operation
Input Impedance Recommendations
The BCM™ bus converter will inherently current share when operated
in an array. Arrays may be used for higher power or redundancy in an
application.
To take full advantage of the BCM™ bus converter capabilities, the
impedance presented to its input terminals must be low from DC to
approximately 5 MHz. The source should exhibit low inductance and
should have a critically damped response. If the interconnect inductance
is excessive, the module input pins should be bypassed with an RC
damper (e.g., 47 µF in series with 0.3 ohm) to retain low source
impedance and proper operation. Given the wide bandwidth of the
module, the source response is generally the limiting factor in the
overall system response.
Current sharing accuracy is maximized when the source and load
impedance presented to each bus converter within an array are equal.
The recommended method to achieve matched impedances is to
dedicate common copper planes within the PCB to deliver and return
the current to the array, rather than rely upon traces of varying lengths.
In typical applications the current being delivered to the load is larger
than that sourced from the input, allowing traces to be utilized on the
input side if necessary. The use of dedicated power planes is, however,
preferable.
The bus converter power train and control architecture allow bidirectional power transfer, including reverse power processing from the
module output to its input. Reverse power transfer is enabled if the
module input is within its operating range and the module is otherwise
enabled. The bus converter’s ability to process power in reverse
improves the module’s transient response to an output load dump.
Thermal Considerations
V•I Chip™ products are multi-chip modules whose temperature
distribution varies greatly for each part number as well as with the
input /output conditions, thermal management and environmental
conditions. Maintaining the top of the B048F096T24 case to less than
100°C will keep all junctions within the module below 125°C for most
applications. The percent of total heat dissipated through the top
surface versus through the J-lead is entirely dependent on the particular
mechanical and thermal environment. The heat dissipated through the
top surface is typically 60%. The heat dissipated through the J-lead
onto the PCB board surface is typically 40%. Use 100% top surface
dissipation when designing for a conservative cooling solution.
It is not recommended to use a module for an extended period of time
at full load without proper heat sinking.
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Anomalies in the response of the source will appear at the output of
the module multiplied by its K factor. The DC resistance of the source
should be kept as low as possible to minimize voltage deviations. This is
especially important if the module is operated near low or high line as
the overvoltage /undervoltage detection circuitry could be activated.
Input Fuse Recommendations
V•I Chip modules are not internally fused in order to provide flexibility
in configuring power systems. However, input line fusing of the
modules must always be incorporated within the power system. A fast
acting fuse should be placed in series with the +In port.
Application Notes
For application notes on soldering, thermal management, board layout,
and system design click on the link below:
http://www.vicorpower.com/technical_library/application_information/chips/
BCM™ Bus Converter
B048F096T24
Rev. 4.9
Page 10 of 12
Application Note (continued)
Input reflected ripple
measurement point
F1
7A
Fuse
Notes:
+Out
+
+In
Enable / Disable Switch
C1
47 µF
electrolytic
R3
10 mΩ
-Out
SW1 D1
TM
RSV
PC
R2
2 kΩ
BCM™
-In
K
Ro
Load
C3
10 µF
+Out
Source inductance should be no more than 200 nH. If source inductance is
greater than 200 nH, additional bypass capacitance may be required.
C3 should be placed close to the load.
R3 may be ESR of C3 or a separate damping resistor.
–
-Out
D1 power good indicator will dim when a module fault is detected.
Figure 20 — BCM™ module test circuit
BCM™ Bus Converter Level 1 DC Behavioral Model for 48 V to 9.6 V, 240 W
ROUT
IOUT
+
+
8.9 mΩ
1/5 • Iout
VIN
V•I
+
+
–
IQ
64 mA
1/5 • Vin
VOUT
–
K
–
–
©
Figure 21 — This model characterizes the DC operation of the bus converter, including the converter transfer function and its losses. The model enables estimates
or simulations of output voltage as a function of input voltage and output load, as well as total converter power dissipation or heat generation.
BCM™ Bus Converter Level 2 Transient Behavioral Model for 48 V to 9.6 V, 240 W
5.5 nH
IOUT
LIN = 5 nH
ROUT
+
8.9 mΩ
RCIN
1.3 mΩ
VIN
Lout
CIN
V•I
1/5 • Iout
4.0 µF
+
+
–
–
+
0.2 mΩ
1/5 • Vin
IQ
64 mA
RCOUT
25 mΩ
1.6 nH
COUT
55 µF
VOUT
K
–
–
©
Figure 22 — This model characterizes the AC operation of the bus converter including response to output load or input voltage transients or steady state
modulations. The model enables estimates or simulations of input and output voltages under transient conditions, including response to a stepped load with or
without external filtering elements.
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BCM™ Bus Converter
B048F096T24
Rev. 4.9
Page 11 of 12
Warranty
Vicor products are guaranteed for two years from date of shipment against defects in material or workmanship when in
normal use and service. This warranty does not extend to products subjected to misuse, accident, or improper
application or maintenance. Vicor shall not be liable for collateral or consequential damage. This warranty is extended
to the original purchaser only.
EXCEPT FOR THE FOREGOING EXPRESS WARRANTY, VICOR MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING,
BUT NOT LIMITED TO, THE WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
Vicor will repair or replace defective products in accordance with its own best judgement. For service under this
warranty, the buyer must contact Vicor to obtain a Return Material Authorization (RMA) number and shipping
instructions. Products returned without prior authorization will be returned to the buyer. The buyer will pay all charges
incurred in returning the product to the factory. Vicor will pay all reshipment charges if the product was defective within
the terms of this warranty.
Information published by Vicor has been carefully checked and is believed to be accurate; however, no responsibility is
assumed for inaccuracies. Vicor reserves the right to make changes to any products without further notice to improve
reliability, function, or design. Vicor does not assume any liability arising out of the application or use of any product or
circuit; neither does it convey any license under its patent rights nor the rights of others. Vicor general policy does not
recommend the use of its components in life support applications wherein a failure or malfunction may directly threaten
life or injury. Per Vicor Terms and Conditions of Sale, the user of Vicor components in life support applications assumes
all risks of such use and indemnifies Vicor against all damages.
Vicor’s comprehensive line of power solutions includes high density AC-DC
and DC-DC modules and accessory components, fully configurable AC-DC
and DC-DC power supplies, and complete custom power systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for
its use. Vicor components are not designed to be used in applications, such as life support systems, wherein a failure or
malfunction could result in injury or death. All sales are subject to Vicor’s Terms and Conditions of Sale, which are
available upon request.
Specifications are subject to change without notice.
Intellectual Property Notice
Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent
applications) relating to the products described in this data sheet. Interested parties should contact Vicor's
Intellectual Property Department.
The products described on this data sheet are protected by the following U.S. Patents Numbers:
5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917;
7,166,898; 7,187,263; 7,361,844; D496,906; D505,114; D506,438; D509,472 and for use under 6,975,098 and
6,984,965
Vicor Corporation
25 Frontage Road
Andover, MA, USA 01810
Tel: 800-735-6200
Fax: 978-475-6715
email
Customer Service: [email protected]
Technical Support: [email protected]
vicorpower.com
800-735-6200
BCM™ Bus Converter
B048F096T24
Rev. 4.9
7/2011