plerowTM ALN1103R2 Internally Matched LNA Module Features Description · S21 = 33.9 dB@950 MHz = 31.1 dB@1250 MHz · NF of 0.65 dB over Frequency · Unconditionally Stable · Single 5 V Supply · High OIP3@Low Current The plerowTM ALN-series is the compactly designed surface-mount module for the use of the LNA with or without the following gain blocks in the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS, PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communication terminals, CATV and so on. It has an exceptional performance of low noise figure, high gain, high OIP3, and low bias current. The stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. The surface-mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. Specifications (in Production) Typ.@T = 25 °C, Vs = 5 V, Freq. = 1100 MHz, Zo.sys = 50 ohms Parameter Unit Frequency Range Specifications Min MHz 950 Gain dB 31.5 Gain Flatness dB Noise Figure dB Output IP3 (1) dBm S11/S22 (2) Typ dBm Switching Time (3) Max 1250 32.5 ±1.4 ±1.5 0.65 0.7 34 35 20 21 dB Output P1dB 2-stage Single Type -14/-14 msec - Supply Current mA 105 Supply Voltage V 5 Impedance W 50 125 Max. RF Input Power dBm C.W 29~31 (before fail) Package Type & Size mm Surface Mount Type, 10Wx10Lx3.8H Operating temperature is –40 °C to +85 °C. 1) OIP3 is measured with two tones at an output power of 4 dBm/tone separated by 1 MHz. 2) S11, S22 (max) is the worst value within the frequency band. 3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS. Outline Drawing (Unit: mm) plerow ALN1103R2 ASB Inc. (Top View) (Bottom View) Pin Number Function 2 RF In 4 Vs 6 RF Out Others Ground Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side. Solder Stencil Area (Side View) Ø0.4 plated thru holes to ground plane (Recommended Footprint) 1/4 www.asb.co.kr September 2012 plerowTM ALN1103R2 Internally Matched LNA Module S-parameters Typical Performance (Measured) 950~1250 +5 V Stability Factor (K) Noise Figure OIP3 2/4 P1dB www.asb.co.kr September 2012 plerowTM ALN1103R2 Internally Matched LNA Module RF Performance with Voltage Change 1. S-parameter 950 MHz 1100 MHz 1250 MHz S21 (dB) S11 (dB) S22 (dB) S21 (dB) G/F (dB) S11 (dB) S22 (dB) S21 (dB) S11 (dB) S22 (dB) 4.50 V 33.13 -16.55 -15.85 32.11 2.48 -18.88 -19.95 30.65 -18.57 -16.90 4.75 V 33.36 -16.38 -16.04 32.46 2.42 -19.20 -19.64 30.94 -19.02 -17.20 5.00 V 33.50 -16.23 -16.27 32.65 2.35 -19.64 -19.47 31.15 -19.81 -17.40 5.25 V 33.64 -15.99 -16.45 32.83 2.31 -20.36 -19.15 31.33 -20.21 -17.85 5.50 V 33.70 -15.90 -16.71 32.88 2.31 -20.73 -18.85 31.39 -20.45 -18.05 2. OIP3, P1dB & NF 950 MHz 1100 MHz 1250 MHz OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) 4.50 V 34.70 20.32 0.623 34.38 20.57 0.646 33.05 19.43 0.622 4.75 V 35.34 21.00 0.632 35.45 21.17 0.640 34.15 20.39 0.624 5.00 V 36.61 21.55 0.645 36.23 21.76 0.642 35.02 21.08 0.624 5.25 V 36.62 21.97 0.647 36.18 22.18 0.653 35.05 21.52 0.627 5.50 V 36.68 22.43 0.660 36.15 22.54 0.662 35.12 21.87 0.636 Note: tested at room temperature. RF Performance with Operating Temperature 1. S-parameter 950 MHz 1100 MHz 1250 MHz S21 (dB) S11 (dB) S22 (dB) S21 (dB) G/F (dB) S11 (dB) S22 (dB) S21 (dB) S11 (dB) S22 (dB) -45 °C 33.80 -18.77 -15.20 32.97 2.34 -19.53 -19.55 31.46 -17.40 -19.22 -10 °C 33.60 -17.10 -15.89 32.73 2.37 -19.58 -19.50 31.23 -18.51 -18.11 25 °C 33.48 -16.23 -16.27 32.60 2.38 -19.64 -19.47 31.10 -19.81 -17.40 60 °C 32.75 -18.65 -17.54 31.87 2.36 -19.45 -19.98 30.39 -18.75 -17.90 85 °C 32.13 -20.21 -17.85 31.16 2.39 -19.08 -21.73 29.74 -17.36 -18.99 2. OIP3, P1dB & NF 950 MHz 1100 MHz 1250 MHz OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) -45 °C 37.63 22.30 0.430 37.50 22.30 0.390 37.45 22.10 0.350 -10 °C 37.50 22.10 0.545 37.10 22.60 0.485 37.05 21.75 0.485 25 °C 36.70 21.60 0.645 36.20 22.00 0.638 36.12 21.20 0.625 60 °C 35.80 21.20 0.850 35.12 21.30 0.789 35.20 20.90 0.779 85 °C 35.40 20.70 0.910 34.82 20.80 0.865 34.65 20.15 0.843 Note: tested at Vs= 5V. 3/4 www.asb.co.kr September 2012 plerowTM ALN1103R2 Internally Matched LNA Module Application Circuit VS + - Tantal or MLC (Multi Layer Ceramic) Capacitor C1 C2 ALN IN OUT 1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer’s DC supply status. The capacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for the best electrical performance. 2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are included inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency. Recommended Soldering Reflow Process 20~40 sec 260 °C Ramp-up (3 °C/sec) 200 °C Evaluation Board Layout Ramp-down (6 °C/sec) OUT IN 150 °C 60~180 sec Vs Size 25x25 mm (for ALN-R Series – 10x10 mm) 4/4 www.asb.co.kr September 2012