Order this document by MPX4101/D SEMICONDUCTOR TECHNICAL DATA #!# !""$! "! "$# !""$! "! # !#$! INTEGRATED PRESSURE SENSOR 15 to 102 kPa (2.18 to 14.8 psi) 0.25 to 4.95 V Output "# !# The Motorola MPX4101 series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The small form factor and high reliability of on–chip integration makes the Motorola MAP sensor a logical and economical choice for automotive system designers. Features • 1.7% Maximum Error Over 0° to 85°C • Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems • Ideally Suited for Microprocessor Interfacing BASIC CHIP CARRIER ELEMENT CASE 867–08, STYLE 1 • Patented Silicon Shear Stress Strain Gauge • Temperature Compensated Over – 40°C to +125°C • Durable Epoxy Unibody Element • Ideal for Non–Automotive Applications PIN NUMBER Application Examples • Manifold Sensing for Automotive Systems 1 Vout 4 N/C 2 Gnd 5 N/C 3 VS 6 N/C NOTE: Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the Lead. VS 3 THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 X–ducer SENSING ELEMENT 2 GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY 1 Vout PINS 4, 5 AND 6 ARE NO CONNECTS The MPX4101 series piezoresistive transducer is a state– of–the–art, monolithic, signal conditioned, silicon pressure sensor. This sensor, with its patented transducer, combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. GND Figure 1. Fully Integrated Pressure Sensor Schematic Senseon and X–ducer are trademarks of Motorola, Inc. Motorola Sensor Device Data Motorola, Inc. 1997 1 MAXIMUM RATINGS(1) Symbol Value Unit Overpressure(2) (P1 > P2) Parametric Pmax 400 kPa Burst Pressure(2) (P1 > P2) Pburst 1000 kPa Tstg – 40 to +125 °C TA – 40 to +125 °C Storage Temperature Operating Temperature 1. TC = 25°C unless otherwise noted. 2. Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 15 — 102 kPa Supply Voltage(1) VS 4.85 5.1 5.35 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(3) @ VS = 5.1 Volts (0 to 85°C) Voff 0.171 0.252 0.333 Vdc Full Scale Output(4) @ VS = 5.1 Volts (0 to 85°C) VFSO 4.870 4.951 5.032 Vdc Full Scale Span(5) @ VS = 5.1 Volts (0 to 85°C) VFSS — 4.7 — Vdc Accuracy(6) (0 to 85°C) — — — ±1.72 %VFSS mV/kPa Sensitivity V/P — 54 — Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output Io+ — 0.1 — mAdc Warm–Up Time(8) — — 20 — ms Offset Stability(9) — — ± 0.5 — %VFSS Symbol Min Typ Max Unit Weight, Basic Element (Case 867) — — 4.0 — Grams Common Mode Line Pressure(10) — — — 690 kPa Decoupling circuit shown in Figure 3 required to meet electrical specifications. MECHANICAL CHARACTERISTICS Characteristic NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 10. Common mode pressures beyond specified may result in leakage at the case–to–lead interface. 2 Motorola Sensor Device Data FLUORO SILICONE GEL DIE COAT DIE ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ P1 WIRE BOND LEAD FRAME SENSOR OUTPUT (PIN 1) STAINLESS STEEL CAP EPOXY PLASTIC CASE A/D 50 pF 51 k µ PROCESSOR DIE BOND ABSOLUTE ELEMENT P2 SEALED VACUUM REFERENCE Figure 2. Cross Sectional Diagram (Not to Scale) Figure 3. Decoupling Filter for Sensor to Microprocessor Interface Figure 2 illustrates an absolute sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4101A series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long–term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows a typical decoupling circuit for interfacing the integrated MAP sensor to the A/D input of a microprocessor. Proper decoupilng of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C. (The output will saturate outside of the specified pressure range.) 6.0 OUTPUT (Volts) 5.0 4.0 TRANSFER FUNCTION: Vout = Vs* (.01059*P–.109) ± Error VS = 5.1 Vdc TEMP = 0 to 85°C 15 kPa TO 102 kPa MPX4101A MAX 3.0 TYP 2.0 1.0 MIN 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 0.0 Pressure (ref: to sealed vacuum) in kPa Figure 4. Output versus Absolute Pressure Motorola Sensor Device Data 3 Transfer Function (MPX4101A) Nominal Transfer Value: Vout = VS (P x 0.01059 – 0.10941) +/– (Pressure Error x Temp. Factor x 0.01059 x VS) VS = 5.1 V ± 0.25 Vdc Temperature Error Band MPX4101A Series 4.0 3.0 Temperature Error Factor 2.0 Temp Multiplier – 40 0 to 85 +125 3 1 3 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0° to – 40°C and from 85° to 125°C. Pressure Error Band Error Limits for Pressure Pressure Error (kPa) 3.0 2.0 1.0 0.0 Pressure (in kPa) 0 15 30 45 60 75 90 105 120 –1.0 – 2.0 – 3.0 4 Pressure Error (Max) 15 to 102 (kPa) ± 1.5 (kPa) Motorola Sensor Device Data PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Motorola MPX Part Number pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Case Type MPX4101A 867–08 Stainless Steel Cap MPX4101AP 867B–04 Side with Port Marking MPX4101AS 867E–03 Side with Port Attached MPX4101ASX 867F–03 Side with Port Attached ORDERING INFORMATION The MPX4101A series MAP silicon pressure sensors are available in the Basic Element, or with pressure port fittings that provide mounting ease and barbed hose connections. MPX Series D i T Device Type O i Options C Case Type T Order Number Device Marking Basic Element Absolute, Element Only 867–08 MPX4101A MPX4101A Ported Elements Absolute, Ported 867B–04 MPX4101AP MPX4101AP Absolute, Stove Pipe Port 867E–03 MPX4101AS MPX4101A Absolute, Axial Port 867F–03 MPX4101ASX MPX4101A Motorola Sensor Device Data 5 PACKAGE DIMENSIONS C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). R POSITIVE PRESSURE (P1) M B –A– N PIN 1 SEATING PLANE 1 2 3 4 5 DIM A B C D F G J L M N R S L 6 –T– G J S F D 6 PL 0.136 (0.005) T A M M INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _NOM 0.475 0.495 0.430 0.450 0.090 0.105 STYLE 1: PIN 1. 2. 3. 4. 5. 6. CASE 867–08 ISSUE N MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _NOM 12.07 12.57 10.92 11.43 2.29 2.66 VOUT GROUND VCC V1 V2 VEX BASIC ELEMENT (A, D) –T– A U L SEATING PLANE R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. PORT #1 POSITIVE PRESSURE (P1) V DIM A B C D F G J K L N P Q R S U V –Q– N B K 1 PIN 1 –P– C J 0.25 (0.010) M T Q 3 4 5 6 S G M 2 F D 6 PL 0.13 (0.005) M T P CASE 867B–04 ISSUE E S Q S INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC 4.62 4.93 VOUT GROUND VCC V1 V2 VEX PRESSURE SIDE PORTED (AP, GP) 6 Motorola Sensor Device Data PACKAGE DIMENSIONS—CONTINUED C –B– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A DIM A B C D E F G J K N S V V PIN 1 PORT #1 POSITIVE PRESSURE (P1) 6 K 4 3 2 1 S J N 5 G F E D –T– STYLE 1: PIN 1. 2. 3. 4. 5. 6. 6 PL 0.13 (0.005) M T B INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.027 0.033 0.178 0.186 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.220 0.240 0.182 0.194 M MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.69 0.84 4.52 4.72 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 5.59 6.10 4.62 4.93 VOUT GROUND VCC V1 V2 VEX CASE 867E–03 ISSUE D PRESSURE SIDE PORTED (AS, GS) –T– C A E –Q– U N V B R PIN 1 PORT #1 POSITIVE PRESSURE (P1) –P– 0.25 (0.010) T Q M 6 M 5 4 3 2 1 S K J 0.13 (0.005) M T P S D 6 PL Q S G F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.027 0.033 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.68 0.84 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.93 VOUT GROUND VCC V1 V2 VEX CASE 867F–03 ISSUE D PRESSURE SIDE PORTED (ASX, GSX) Motorola Sensor Device Data 7 Motorola reserves the right to make changes without further notice to any products herein. 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