Stacked Film Capacitor Chips NSPU Series FEATURES • STACKED METALLIZED ACRYLIC RESIN FILM (THERMO-CURE TYPE) • STANDARD EIA 0805, 1206 AND 1210 SIZES • HIGH HEAT AND MOISTURE RESISTANT • STABLE TEMPERATURE, FREQUENCY & BIAS CHARACTERISTICS • REFLOW SOLDERING ONLY • TAPE AND REEL PACKAGING NSPU IS RECOMMENDED FOR NEW DESIGNS Case Sizes 1206 1210 Capacitance Range 0.15μF ~ 0.068μF 1.0μF Voltage Ratings 16Vdc Capacitance Tolerance ±20% (M) Temperature Range -40°C ~ +85°C Dissipation Factor (20°C) 1.5% @ 1KHz/25°C Insulation Resistance (20°C) C < 0.33μF = 1000MΩ, C > 0.47μF = 300MΩ/μF @ 10Vdc 175% of Rated Voltage (5 seconds) Dielectric Withstanding Voltage 150% of Rated Voltage (60 seconds) Temperature Characteristic -20% ~ +5% ΔC Maximum Over Temperature Range SPECIFICATIONS 0805 0.1μF RoHS Compliant includes all homogeneous materials *See Part Number System for Details ENVIRONMENTAL CHARACTERISTICS Life Test At +85°C 1,000 Hours at 125% of Rated Voltage Resistance to Soldering Heat Reflow: 240°C Peak Capacitance Change Dissipation Factor Insulation Resistance Capacitance Change Dissipation Factor Insulation Resistance Within +7% ~ -20% of Initial Value 1.65% Maximum @ 1KHz C < 0.33μF = 300MΩ Min., C > 0.47μF = 100MΩ/μF Within +3% ~ -15% of Initial Value 1.65% Maximum ~ 1KHz C < 0.33μF = 500MΩ Min., C > 0.47μF = 150MΩ/μF 150% of rated voltage for 60 seconds 175% of rated voltage for 5 seconds Within +20%/-3% of Initial value 2.25% Maximum C < 0.33μF = 100MΩ Min., C > 0.47μF = 30MΩ/μF 130% of rated voltage for 60 seconds Withstanding Voltage Humidity Load Life +40°C & 90% ~ 95% RH 500 Hours @ rated voltage Solderability with 25% Wt Rosin-Methanol Flux Capacitance Change Dissipation Factor Insulation Resistance Withstanding Voltage 90% Minimum Coverage After 2.5 Second Dip into 245°C Solder Pot PART NUMBER SYSTEM NSPU 104 M 16 TR A3 F RoHS compliant Size Code Tape & Reel Voltage Tolerance Code: M=±20% Capacitance in pF, 1st two digits are significant, 3rd digit is no. of zeros Series ® 68 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com Stacked Film Capacitor Chips NSPU Series STANDARD VALUES AND CASE SIZES (mm) Part Number Capacitance Value NSPU104M16TRA3F NSPU154M16TRB4F NSPU224M16TRB4F NSPU334M16TRB5F NSPU474M16TRB6F NSPU684M16TRB6F NSPU105M16TRC4F 0.1μF 0.15μF 0.22μF 0.33μF 0.47μF 0.68μF 1.0μF Stacked Element Terminations: Dimensions (mm) W ± 0.2 H ± 0.2 1.25 1.0 0.8 0.8 1.6 1.0 1.4 1.4 2.5 1.4 L ± 0.2 2.0 3.2 EIA Size 0805 1206 1206 1206 1206 1206 1210 P 0.45 ± 0.25 0.65 ± 0.30 Reel Qty 3,000 3,000 3,000 3,000 2,000 2,000 2,000 LAND PATTERN DIMENSIONS (mm) 95.5% Sn, 4% Ag and 0.5% Cu over phenolic resin/Ag/Ni/Cu barrier over Cu base. EIA Size 0805 1206 1210 A ± 0.1 1.55 1.9 1.9 B ± 0.1 2.3 3.5 3.5 C ± 0.2 1.3 1.5 1.9 C H L2 p W p RECOMMENDED REFLOW PROFILE A B L1 Temperature - Deg. C 300 Peak Temperature 240°C 250 200 150 Cool Down 100 Time above 220°C 30 sec. max. 50 25 0 Pre-heat 150°C ~ 180°C 120 sec. max. Ramp-up 25°C ~ 150°C 90 sec. max. Time Note: These capacitors are sensitive to moisture. Capacitors should be stored in moisture barrier packaging at +25°C and a relative humidity of <70% (six months maximum). The components should be soldered within 72 hours of breaking the moisture barrier packaging seal and stored during those 72 hours at <+25°C and <70% relative humidity. If the parts are to be storage outside of the moisture barrier packaging the conditions should be <+20°C and relative humidity of less then 50%. TAPE AND REEL DIMENSIONS (mm) Case Code A3 B4, B5 B6 C4 A ± 0.1 1.55 1.9 1.9 2.8 B ± 0.1 2.3 3.5 3.5 3.5 C ± 0.2 1.3 1.5 1.9 1.9 W ± 0.3 F ± 0.05 P ± 0.1 D +0.2/-0 0.25 8.0 3.5 4.0 1.0 2.0 +/- 0.5 REEL 13 .0 t ± 0.05 4.0 ±0.1 P1 1.5 +0.1 -0 +/ − 0. 5 1.75 ±0.1 t 2.0 +/− 0.5 F D1 D3 W B Do D2 t A P ® C W NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com 69