HP HSMP-3893-TR1 Surface mount pin diode Datasheet

Surface Mount PIN Diodes
Technical Data
HSMP-38XX and
HSMP-48XX Series
Features
• Diodes Optimized for:
Low Current Switching
Low Distortion Attenuating
Ultra-Low Distortion
Switching
Microwave Frequency
Operation
• Surface Mount SOT-23 and
SOT-143 Packages
Single and Dual Versions
Tape and Reel Options
Available
• Low Failure in Time (FIT)
Rate[1]
Note:
1. For more information see the
Surface Mount PIN Reliability Data
Sheet.
Description/Applications
The HSMP-380X and HSMP-381X
series are specifically designed for
low distortion attenuator applications. The HSMP-382X series is
optimized for switching applications where ultra-low resistance is
required. The HSMP-3880 switching diode is an ultra low distortion
device optimized for higher power
applications from 50 MHz to
1.5 GHz. The HSMP-389X series is
optimized for switching applications where low resistance at low
current and low capacitance are
required. The HSMP-48XX series
are special products featuring
ultra low parasitic inductance in
the SOT-23 package, specifically
designed for use at frequencies
which are much higher than the
upper limit for conventional
SOT-23 PIN diodes. The
HSMP-4810 diode is a low distortion attenuating PIN designed for
operation to 3 GHz. The
HSMP-4820 diode is ideal for
limiting and low inductance
switching applications up to
1.5 GHz. The HSMP-4890 is
optimized for low current switching applications up to 3 GHz.
The HSMP-386X series of general
purpose PIN diodes are designed
for two classes of applications.
The first is attenuators where
current consumption is the most
important design consideration.
The second application for this
series of diodes is in switches
where low cost is the driving
issue for the designer.
The HSMP-386X series Total
Capacitance (CT) and Total
Resistance (RT) are typical
specifications. For applications
that require guaranteed performance, the general purpose
HSMP-383X series is recommended. For low distortion
Package Lead Code
Identification
SINGLE
#0
SERIES
COMMON
ANODE
#2
COMMON
CATHODE
UNCONNECTED
PAIR
#4
DUAL ANODE
DUAL CATHODE
#A
#B
#3
#5
attenuators, the HSMP-380X or
-381X series are recommended.
For high performance switching
applications, the HSMP-389X
series is recommended.
A SPICE model is not available
for PIN diodes as SPICE does not
provide for a key PIN diode
characteristic, carrier lifetime.
2
Absolute Maximum Ratings[1] TA = 25°C
Symbol
If
Pt
Piv
Tj
TSTG
Parameter
Forward Current (1 ms Pulse)
Total Device Dissipation
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Units Absolute Maximum
Amp
mW [2]
—
°C
°C
1
250
Same as VBR
150
-65 to 150
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to
this device.
2. CW Power Dissipation at TLEAD = 25°C. Derate to zero at maximum rated temperature.
PIN Attenuator Diodes
Electrical Specifications TA = 25°C (Each Diode)
Nearest
Equivalent Minimum
Maximum
Maximum
Minimum Maximum
Axial Lead Breakdown
Series
Total
High
Low
Part No.
Voltage
Resistance Capacitance Resistance Resistance
5082VBR (V)
RS (Ω)
CT (pF)
RH (Ω)
RL (Ω)
Part
Number
HSMP-
Package
Marking
Code[1]
3800
3802
3804
D0
D2
D4
0
2
4
Single
Series
Common Cathode
3080
100
2.0
0.37
1000
8
3810
3812
3813
3814
E0
E2
E3
E4
0
2
3
4
Single
Series
Common Anode
Common Cathode
3081
100
3.0
0.35
1500
10
VR = VBR
Measure
IR ≤ 10 µA
IF = 100 mA
f = 100 MHz
VR = 50 V
f = 1 MHz
Lead
Code Configuration
Test Conditions
IF = 0.01 mA IF = 20 mA
f = 100 MHz f= 100 MHz
PIN Switching Diodes
Electrical Specifications TA = 25°C
Part
Number
HSMP-
Package
Marking
Code[1]
3820
3822
3823
3824
F0
F2
F3
F4
Lead
Code Configuration
0
2
3
4
Single
Series
Common Anode
Common Cathode
Nearest
Equivalent
Axial Lead
Part No.
5082-
Minimum
Breakdown
Voltage
VBR (V)
Maximum
Series
Resistance
RS (Ω)
Maximum
Total
Capacitance
CT (pF)
Maximum
Shunt Mode
Harmonic
Distortion
Hmd (dBc)
3188
50
0.6*
0.8*
—
3880
S0
0
Single
—
100
6.5
0.40
–55
3890
3892
3893
3894
3895
G0
G2
G3
G4
G5
0
2
3
4
5
Single
Series
Common Anode
Common Cathode
Unconnected Pair
—
100
2.5
0.30**
—
VR = VBR
Measure
IR ≤ 10 µA
IF = 5 mA
f = 100 MHz
IF = 10 mA*
VR = 50 V
f = 1 MHz
VR = 20 V*
VR = 5 V**
2 fo, Zo = 50 W
f o = 400 MHz
Pin = +30 dBm
0 V bias
Test Conditions
Note:
1. Package marking code is white.
3
PIN General Purpose Diodes, Electrical Specifications TA = 25°C
Part
Number
HSMP-
Package
Marking
Code[1]
Lead
Code
Configuration
3830
3832
3833
3834
K0
K2
K3
K4
0
2
3
4
Single
Series
Common Anode
Common Cathode
Nearest
Equivalent
Axial Lead
Part No.
5082-
Minimum
Breakdown
Voltage
VBR (V)
Maximum
Series
Resistance
RS (Ω)
Maximum
Total
Capacitance
CT (pF)
3077
200
1.5
0.3
VR = VBR
Measure
IR ≤ 10 mA
IF = 100 mA
f = 100 MHz
VR = 50 V
f = 1 MHz
Test Conditions
High Frequency (Low Inductance, 500 MHz – 3 GHz) PIN Diodes, Electrical Specifications TA = 25°C
Part
Number
HSMP-
Package
Marking
Code
Lead
Code
4810
EB
B
Configuration
Dual
Cathode
Minimum
Breakdown
Voltage
VBR (V)
Maximum
Series
Resistance
RS (Ω)
Typical
Total
Capacitance
CT (pF)
Maximum
Total
Capacitance
CT (pF)
Typical
Total
Inductance
LT (nH)
100
3.0
0.35
0.4
1.0
Attenuator
Application
4820
FA
A
Dual Anode
50
0.6*
0.75*
1.0
1.0*
Limiter
4890
GA
A
Dual Anode
100
2.5**
0.33
0.375
1.0
Switch
VR = VBR
Measure
IR ≤ 10 µA
IF = 100 mA
IF = 10 mA*
IF = 5 mA**
VR = 50 V
f = 1 MHz
VR = 20 V*
VR = 50 V
f = 1 MHz
VR = 0 V
f = 500 MHz –
3 GHz
VR = 20 V*
PIN General Purpose Diodes, Typical Specifications TA = 25°C
Part Number
HSMP-
Code
Marking
Code[1]
Lead
Code
Configuration
3860
3862
3863
3864
L0
L2
L3
L4
0
2
3
4
Single
Series
Common Anode
Common Cathode
Test Conditions
Minimum
Breakdown
Voltage VBR (V)
Typical Series
Resistance
RS (Ω)
Typical Total
Capacitance
CT (pF)
50
3.0/1.5*
0.20
VR = VBR
Measure
IR ≤ 10 µA
IF = 10 mA
f = 100 MHz
VR = 50 V
f = 1 MHz
*IF = 100 mA
Typical Parameters at TA = 25°C
Part Number
HSMP-
Series Resistance
RS (Ω)
Carrier Lifetime
τ (ns)
Reverse Recovery Time
Trr (ns)
Total Capacitance
CT (pF)
380X
381X
382X
383X
388X
389X
55
75
1.5
20
3.8
3.8
1800
1500
70*
500
2500
200*
500
300
7
80
550
–
0.32 @ 50 V
0.27 @ 50 V
0.60 @ 20 V
0.20 @ 50 V
0.30 @ 50 V
0.20 @ 5 V
IF = 1 mA
f = 100 MHz
IF = 10 mA*
IF = 50 mA
IR = 250 mA
IF = 10 mA*
IR = 6 mA*
VR = 10 V
IF = 20 mA
90% Recovery
Test Conditions
Note:
1. Package marking code is white.
4
Typical Parameters at TA = 25°C (unless otherwise noted), Single Diode
0.35
0.40
0.35
1 MHz
0.30
0.25
30 MHz
0.20
frequency>100 MHz
0
2
4
6
8
HSMP-381x, /HSMP-4810
0.30
1 MHz
0.25
100 MHz
0.20
0.15
10 12 14 16 18 20
1 GHz
0
2
REVERSE VOLTAGE (V)
6
8
1000
RF RESISTANCE (OHMS)
TA = +85°C
TA = +25°C
TA = –55°C
100
10
10
1
HSMP-382x, -4820
Figure 3. Resistance at 25°C vs.
Forward Bias Current.
Figure 2. RF Capacitance vs. Reverse
Bias, HSMP-3830 Series.
1.4
10000
3000
HSMP-383x, -386x
100
0.1
0.01
0.1
1
10
100
IF – FORWARD BIAS CURRENT (mA)
10 12 14 16 18 20
REVERSE VOLTAGE (V)
Figure 1. RF Capacitance vs. Reverse
Bias, HSMP-3810 Series.
RF RESISTANCE (OHMS)
4
1000
TA = +85°C
TA = +25°C
TA = –55°C
1000
1.2
CAPACITANCE (pF)
0.15
10000
RESISTANCE (OHMS)
TOTAL CAPACITANCE (pF)
TOTAL CAPACITANCE (pF)
0.45
100
10
1
HSMP-382X
0.8
0.6
HSMP-3880
HSMP-3800
HSMP-381X
0.4
0.2
HSMP-3830
0.1
1
10
1
0.01
0.1
1
10
100
IF – FORWARD BIAS CURRENT (mA)
100
IF – FORWARD BIAS CURRENT (mA)
120
90
HSMP-3830
80
70
HSMP-3810
60
HSMP-3830
50
40
1000
INPUT INTERCEPT POINT (dBm)
INPUT INTERCEPT POINT (dBm)
120
Diode Mounted as a
Series Attenuator in a
115
50 Ohm Microstrip and
Tested at 123 MHz
110
105
HSMP-3880
100
HSMP-3820
95
HSMP-3830
90
HSMP-3890
85
100
10
DIODE RF RESISTANCE (OHMS)
Figure 7. 2nd Harmonic Input
Intercept Point vs. Diode RF
Resistance for Attenuator Diodes.
1
10
30
IF – FORWARD BIAS CURRENT (mA)
Figure 8. 2nd Harmonic Input
Intercept Point vs. Forward Bias
Current for Switch Diodes.
0
10
HSMP-3890
20
30
40
50
VR – REVERSE VOLTAGE (V)
Figure 5. RF Resistance vs. Forward
Bias Current for HSMP-3810/
HSMP-4810.
Figure 4. RF Resistance vs. Forward
Bias Current for HSMP-3800.
Diode Mounted as a
110 Series Attenuator
in a 50 Ohm Microstrip
100 and Tested at 123 MHz
0
Figure 6. Capacitance vs. Reverse
Voltage.
Trr – REVERSE RECOVERY TIME (ns)
1
0.01
100
HSMP-382X
VR = 2V
VR = 5V
10
VR = 10V
1
10
20
30
FORWARD CURRENT (mA)
Figure 9. Reverse Recovery Time vs.
Forward Current for Various Reverse
Voltages. HSMP-3820 Series.
5
HSMP-3830
VR = 5V
VR = 10V
100
VR = 20V
10
10
20
1000
900
800
700
600
500
VR = 5V
VR = 10V
400
300
VR = 20V
200
100
10
30
Figure 10. Reverse Recovery Time vs.
Forward Current for Various Reverse
Voltage. HSMP-3830 Series.
25
30
1
0.1
125°C
0.2
0.4
25°C –50°C
0.6
0.8
1.0
10
1
0.1
125°C 25°C –50°C
0.01
1.2
0
0.2
0.4
0.6
0.8
1.0
1
0.1
125°C 25°C –50°C
0.01
1.0
0
10
1.2
VF – FORWARD VOLTAGE (mA)
Figure 16. Forward Current vs.
Forward Voltage. HSMP-3830 Series.
20
25
30
HSMP-382X
HSMP-482X
10
1
0.1
125°C 25°C –50°C
0
0.2
0.4
0.6
0.8
1.0
1.2
100
10
1
0.1
125°C
0.01
15
Figure 15. Forward Current vs.
Forward Voltage. HSMP-3820 and
HSMP-4820 Series.
IF – FORWARD CURRENT (mA)
IF – FORWARD CURRENT (mA)
10
0.8
VR = –10V
VF – FORWARD VOLTAGE (mA)
100
HSMP-3830
0.6
VR = –5V
40
0.01
1.2
Figure 14. Forward Current vs.
Forward Voltage. HSMP-3810 and
HSMP-4810 Series.
100
0.4
80
VF – FORWARD VOLTAGE (mA)
Figure 13. Forward Current vs.
Forward Voltage. HSMP-3800 Series.
0.2
120
100
HSMP-3810
HSMP-4810
VF – FORWARD VOLTAGE (mA)
0
VR = –2V
Figure 12. Typical Reverse Recovery
Time vs. Reverse Voltage. HSMP-3890
Series.
IF – FORWARD CURRENT (mA)
10
0
160
FORWARD CURRENT (mA)
100
HSMP-3800
IF – FORWARD CURRENT (mA)
IF – FORWARD CURRENT (mA)
20
Figure 11. Typical Reverse Recovery
Time vs. Reverse Voltage. HSMP-3880
Series.
100
IF – FORWARD CURRENT (mA)
15
200
FORWARD CURRENT (mA)
FORWARD CURRENT (mA)
0.01
TRR - REVERSE RECOVERY TIME (nS)
1000
REVERSE RECOVERY TIME (nS)
Trr - REVERSE RECOVERY TIME (nS)
Typical Parameters (continued)
0
0.2
0.4
25°C –55°C
0.6
0.8
1.0
1.2
VF – FORWARD CURRENT (mA)
Figure 17. Forward Current vs.
Forward Voltage. HSMP-3880 Series.
10
1
0.1
0.01
–55°C
125°C 25°C
0
0.2
0.4
0.6
0.8
1.0
VF – FORWARD VOLTAGE (mA)
Figure 18. Forward Current vs.
Forward Voltage. HSMP-3890 and
HSMP-4890 Series.
1.2
6
Typical Parameters (continued)
0.5
100
100
10
1
0.01
TA = +125°C
TA = +25°C
TA = –50°C
10
CT – CAPACITANCE (pF)
TA = +85°C
TA = +25°C
TA = –55°C
IF – FORWARD CURRENT (mA)
RESISTANCE (OHMS)
1000
1
0.1
1
10
100
0
BIAS CURRENT (mA)
Cp
0.08 pF
Lp
Rs
2.0 nH
1.5 Ω
0.4
0.6
0.8
1.0
Figure 20. Forward Current vs.
Forward Voltage for HSMP-3860.
Equivalent Circuit Model
HSMS-3860
0.2
VF – FORWARD VOLTAGE (V)
Figure 19. Typical RF Resistance vs.
Forward Bias Current for HSMP-3860.
Rj
Cj
RT = 1.5 + R j
0.12 pF*
CT = CP + Cj
* Measured at -20 V
12
R j = 0.9 Ω
I
I = Forward Bias Current in mA
0.3
0.2
0.1
0
0.01
0.1
0.4
1.2
0
5
10
15
20
VR – REVERSE VOLTAGE (V)
Figure 21. Typical Capacitance vs.
Reverse Bias for HSMP-3860.
7
Typical Applications for Multiple Diode Products
RF COMMON
RF COMMON
RF 2
RF 1
RF 2
RF 1
BIAS 2
BIAS 1
BIAS
BIAS
Figure 23. High Isolation SPDT Switch, Dual Bias.
Figure 22. Simple SPDT Switch, Using Only Positive Current.
RF COMMON
RF COMMON
BIAS
RF 1
RF 2
RF 2
RF 1
BIAS
Figure 24. Switch Using Both Positive and Negative Bias
Current.
Figure 25. Very High Isolation SPDT Switch, Dual Bias.
8
Typical Applications for Multiple Diode Products (continued)
VARIABLE BIAS
RF IN/OUT
INPUT
FIXED
BIAS
VOLTAGE
Figure 26. Four Diode π Attenuator.
BIAS
Figure 27. High Isolation SPST Switch
(Repeat Cells as Required).
Figure 28. Power Limiter Using HSMP-3822
Diode Pair.
9
Typical Applications for HSMP-48XX Low Inductance Series
3
0.5nH
0.3 pF*
3
3
0.5 nH
1
2
HSMP-4810
1
2
HSMP-4820 & HSMP-4890
Figure 29. Internal Connections.
0.5 nH
1
2
*0.8pF TYPICAL FOR HSMP-3820
Figure 30. Equivalent Circuit.
0.25 nH
0.3 pF*
0.5 nH
*0.8 pF TYPICAL FOR HSMP-3820
Figure 31. Circuit Layout.
Microstrip Series
Connection for HSMP-48XX Series
In order to take full advantage
of the low inductance of the
HSMP-48XX series when using
them in series application,
both lead 1 and lead 2 should be
connected together, as shown above.
Figure 32. Equivalent Circuit.
10
1.5 nH
1.5 nH
50 OHM MICROSTRIP LINES
0.3 pF*
0.3 nH
0.3 nH
PAD CONNECTED TO
GROUND BY TWO
VIA HOLES
*0.8 pF TYPICAL FOR HSMP-4820
Figure 33. Circuit Layout.
Figure 34. Equivalent Circuit.
Microstrip Shunt
Connections for
HSMP-48XX Series
HSMP-38XX series diode are
placed across the resulting gap.
This forces the 0.5 nH lead
inductance of leads 1 and 2 to
appear as part of a low pass
filter, reducing the shunt
parasitic inductance and
In the diagram above, the
center conductor of the
microstrip line is interrupted
and leads 1 and 2 of the
increasing the maximum
available attenuation. The 0.3 nH
of shunt inductance external
to the diode is created by the via
holes, and is a good estimate for
0.032" thick material.
Co-Planar Waveguide
Groundplane
Center Conductor
0.3 pF*
Groundplane
0.75 nH
*0.8 pF TYPICAL FOR HSMP-4820
Figure 35. Circuit Layout.
Co-Planar Waveguide
Shunt Connection for
HSMP-48XX Series
Co-Planar waveguide, with
ground on the top side of the
printed circuit board, is shown
Figure 36. Equivalent Circuit.
in the diagram above. Since it
eliminates the need for via holes
to ground, it offers lower shunt
parasitic inductance and higher
maximum attenuation when
compared to a microstrip circuit.
11
Package Dimensions
PC Board Footprints
Outline 23 (SOT-23)
SOT-23
1.02 (0.040)
0.89 (0.035)
0.54 (0.021)
0.37 (0.015)
PACKAGE
MARKING
CODE (XX)
0.037
0.95
3
1.40 (0.055)
1.20 (0.047)
XXX
2.65 (0.104)
2.10 (0.083)
2
1
0.50 (0.024)
0.45 (0.018)
0.037
0.95
DATE CODE (X)
0.079
2.0
2.04 (0.080)
1.78 (0.070)
TOP VIEW
0.035
0.9
0.152 (0.006)
0.066 (0.003)
3.06 (0.120)
2.80 (0.110)
0.031
0.8
1.02 (0.041)
0.85 (0.033)
DIMENSIONS IN
inches
mm
0.69 (0.027)
0.45 (0.018)
0.10 (0.004)
0.013 (0.0005)
SIDE VIEW
END VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
SOT-143
Outline 143 (SOT-143)
0.92 (0.036)
0.78 (0.031)
DATE CODE (X)
E
PACKAGE
MARKING
CODE (XX)
1.40 (0.055)
1.20 (0.047)
XXX
B
0.112
2.85
C
0.079
2
2.65 (0.104)
2.10 (0.083)
0.033
0.85
E
0.60 (0.024)
0.45 (0.018)
2.04 (0.080)
1.78 (0.070)
0.075
1.9
0.54 (0.021)
0.37 (0.015)
3.06 (0.120)
2.80 (0.110)
0.071
1.8
0.108
2.75
0.033
0.85
0.15 (0.006)
0.09 (0.003)
0.047
1.2
1.04 (0.041)
0.85 (0.033)
0.10 (0.004)
0.013 (0.0005)
0.041
1.05
0.69 (0.027)
0.45 (0.018)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Package Characteristics
Lead Material ...................................................................................... Alloy 42
Lead Finish ............................................................................ Tin-Lead 85-15%
Maximum Soldering Temperature .............................. 260°C for 5 seconds
Minimum Lead Strength .......................................................... 2 pounds pull
Typical Package Inductance .................................................................. 2 nH
Typical Package Capacitance .............................. 0.08 pF (opposite leads)
0.031 0.033
0.8
0.85
DIMENSIONS IN
inches
mm
Profile Option Descriptions
-BLK = Bulk
-TR1 = 3K pc. Tape and Reel, Device Orientation; See Figures 37 and 38
-TR2 = 10K pc. Tape and Reel, Device Orientation; See Figures 37 and 38
Tape and Reeling conforms to Electronic Industries RS-481, “Taping of
Surface Mounted Components for Automated Placement.”
Ordering Information
Specify part number followed by option under. For example:
H
SMP - 38XX - XXX
Bulk or Tape and Reel Option
Part Number
Surface Mount PIN Diode
Hewlett-Packard
REEL
CARRIER
TAPE
USER
FEED
DIRECTION
COVER TAPE
TOP VIEW
END VIEW
4 mm
8 mm
www.hp.com/go/rf
Figure 37. Options -TR1, -TR2 for SOT-23 Packages.
TOP VIEW
END VIEW
For technical assistance or the location of
your nearest Hewlett-Packard sales
office, distributor or representative call:
Americas/Canada: 1-800-235-0312 or
408-654-8675
4 mm
Far East/Australasia: Call your local HP
sales office.
Japan: (81 3) 3335-8152
8 mm
Europe: Call your local HP sales office.
Data subject to change.
Copyright © 1999 Hewlett-Packard Co.
Figure 38. Options -TR1, -TR2 for SOT-143 Packages.
Obsoletes 5968-3435E
5968-5439E (6/99)