NSC LMX4268 Radio transceiver for dect Datasheet

March 2004
LMX4268
Radio Transceiver for DECT
1.0 General description
2.0 Features
■
■
■
■
■
■
■
The LMX4268 integrates a complete transmitter, consisting
of a phase locked loop, VCO and PA driver. The receiver ■
contains LNA, quadrature downconverter, polyphase filter, ■
automatic gain control and demodulator.
■
The LMX4268 operates from a single 2.5V supply. The ■
LMX4268 is manufactured in National’s 0.25µm CMOS
■
technology, and is packaged in a 44 pin LLP package.
■
The LMX4268 is a radio transceiver integrated circuit optimized for the Digital Cordless Telecommunications (DCT)
system. The transceiver, when combined with a power
amplifier and a Tx/Rx switch, implements a complete
2.4GHz ISM band digital radio transceiver compliant with
the FCC rules part 15. The LMX4268 interfaces directly to
National Semiconductor’s SC144XX DCT family of baseband processors.
Fully integrated 2.4 GHz CMOS low-IF transceiver
Low power consumption
On-chip Voltage Controlled Oscillator (VCO)
On-chip low noise amplifier (LNA)
Open-loop modulation
On chip Modulation Gain Amplifier (MGA)
On-chip timing control
Four digital (5 mA) output ports
0 dBm PA driver output
dual bit rate 0.576 MHz (LRb) / 1.152 MHz (HRb)
sensitivity -96 dBm (LRb) / -93 dBm (HRb)
2.5V operation
Small 44 pin Leadless Leadframe Package
3.0 Applications
■ (DCT) Digital Cordless Telecommunications
4.0 System Diagram
AGC
RX DATA
DEMOD.
BALUN
LNA
RSSI
0°
90°
DATA
MICROWIRE
PA
BALUN
PADR
MGA
PORTS
TX DATA
© 2004 National Semiconductor Corporation
X2
CLOCK
LE
PLL
BIAS
R_REF
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LMX4268 Radio Transceiver for DECT
ADVANCED INFORMATION
LMX4268
5.0 Specifications
5.1 ABSOLUTE MAXIMUM RATINGS
Table 1. Absolute Maximum Ratings
Parameter
Vddmax
1,2
Description
Power Supply Voltage
Min
Typ
Max
Units
-0.3
-
3.0
V
(Vdd_shield, Vdd_ADC, Vdd_mix, Vdd_LNA, Vdd_ESD,
Vdd_PAdr, Vdd_presc, Vdd_PLL, Vdd_VCO, Vdd_bias, Vdd_dig,
Vdd_RSSI)
-
-
0.3
V
Vnmax
Absolute difference between power supplies
Voltage on any pin
-0.3
-
Vdd+0.3
V
Tstorage
Storage Temperature
-40
-
+150
°C
TLead
Lead Temp. (solder 4 sec)3
-
-
+260
°C
VHBM
ESD - human body model 4
-
-
2.0
kV
VMM
ESD - machine model 4
-
-
200
V
1.tbc = To be characterized
2.Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating
Ratings indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only to the test conditions listed.
3.MSL 2 (Moisture Sensitivity Level) is valid when the standard reflow process (235°C) is used. MSL 2
means 1 year shelf life after opening dry-pack. MSL 2(1 year shelf life) is also valid when the leadfree
reflow process (260°C) is used. Storage conditions are max. 30°C / 60% rel. humidity.
4.ESD STATEMENT
This device is a high performance RF integrated circuit and is ESD sensitive. Handling and assembly
of this device should be performed at ESD free workstations.
5.2 ELECTRICAL CHARACTERISTICS
Table 2. Recommended Operating Conditions
Parameter
Description
Min
Typ
Max
Units
Vdd
Power Supply Voltage
(Vdd_shield, Vdd_ADC, Vdd_mix, Vdd_LNA, Vdd_ESD, Vdd_PAdr,
Vdd_presc, Vdd_PLL, Vdd_VCO, Vdd_bias, Vdd_dig, Vdd_RSSI)
2.25
2.5
2.75
V
VTXout
PA driver output biasing voltage on pins TXoutZ, TXout
-
2.0
-
V
Ta
Operating ambient temperature
-20
-
+70
°C
R_ref
Reference resistor connected from pin 31 to Vss (see Table 1)
61
62
63
kΩ
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2
Datasheet Status
Product Status
Definition
Advance Information
Formative or in Design
This data sheet contains the design specifications for product
development. Specifications may change in any manner without
notice.
Preliminary
First Production
This data sheet contains preliminary data. Supplementary data
will be published at a later date. National Semiconductor
Corporation reserves the right to make changes at any time
without notice in order to improve design and supply the best
possible product.
No Identification Noted
Full production
This data sheet contains final specifications. National
Semiconductor Corporation reserves the right to make changes
at any time without notice in order to improve design and supply
the best possible product.
Obsolete
Not in Production
This data sheet contains specifications on a product that has
been discontinued by National Semiconductor Corporation. The
datasheet is printed for reference information only.
National Semiconductor reserves the right to make changes without notice to any products herein to improve reliability,
function or design. National does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights, nor the right of others.
3
LMX4268
6.0 Product Status Definitions
LMX4268 Radio Transceiver for DECT
7.0 Package Information inches (millimeters) unless otherwise noted
Figure 1. 44 pins Leadless Leadframe Package - NS Package Number LQA44
Note:
Refer to the application note AN-1187 for relevant soldering information.
This document can be downloaded from http://www.national.com/an/AN/AN-1187.pdf
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which,
(a) are intended for surgical implant into the body, or (b) support
or sustain life, and whose failure to perform, when properly used
in accordance with instructions for use provided in the labeling,
can be reasonably expected to result in a significant injury to the
user.
2. A critical component is any component of a life support device or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect
its safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no “Banned Substances” as defined in CSP-9-111S2.
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