2.2x1.4mm SURFACE MOUNT LED LAMP Part Number: AA2214ZGSK Green ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Descriptions Features The Green source color devices are made with InGaN 2.2mm x 1.4mm, 1.3mm high. on Sapphire Light Emitting Diode. Electrostatic discharge and power surge could damage Low power consumption. the LEDs. Available on tape and reel. It is recommended to use a wrist band or anti- Package : 2000pcs / reel. Moisture sensitivity level : level 3. electrostatic glove when handling the LEDs. All devices, equipments and machineries must be RoHS compliant. electrically grounded. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAO0994 REV NO: V.1B DATE: JAN/06/2015 PAGE: 1 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: P.Cheng ERP: 1201008993 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. SPEC NO: DSAO0994 REV NO: V.1B DATE: JAN/06/2015 PAGE: 2 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: P.Cheng ERP: 1201008993 Selection Guide Part No. Dice AA2214ZGSK Green (InGaN) Viewing Angle [1] Iv (mcd) [2] @ 20mA Lens Type Min. Typ. 2θ1/2 400 650 120° Water Clear Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity/ luminous Flux: +/-15%. 3. Luminous intensity value is traceable to the CIE127-2007 compliant national standards. Electrical / Optical Characteristics at TA=25°C Symbol Parameter Device Typ. λpeak Peak Wavelength Green λD [1] Dominant Wavelength Δλ1/2 Max. Units Test Conditions 515 nm IF=20mA Green 525 nm IF=20mA Spectral Line Half-width Green 35 nm IF=20mA C Capacitance Green 45 pF VF=0V;f=1MHz VF [2] Forward Voltage Green 3.3 4.1 V IF=20mA IR Reverse Current Green 50 uA VR=5V Notes: 1. Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V. 3. Wavelength value is traceable to the CIE127-2007 compliant national standards. 4. Excess driving current and/or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. Absolute Maximum Ratings at TA=25°C Parameter Green Units Power dissipation 102.5 mW DC Forward Current 25 mA Peak Forward Current [1] 150 mA 5 V Reverse Voltage Operating Temperature -40°C To +85°C Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAO0994 REV NO: V.1B DATE: JAN/06/2015 PAGE: 3 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: P.Cheng ERP: 1201008993 Green AA2214ZGSK SPEC NO: DSAO0994 REV NO: V.1B DATE: JAN/06/2015 PAGE: 4 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: P.Cheng ERP: 1201008993 AA2214ZGSK Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Reel Dimension Tape Dimensions (Units : mm) SPEC NO: DSAO0994 REV NO: V.1B DATE: JAN/06/2015 PAGE: 5 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: P.Cheng ERP: 1201008993 PACKING & LABEL SPECIFICATIONS AA2214ZGSK Terms and conditions for the usage of this document 1.The information included in this document reflects representative usage scenarios and is intended for technical reference only. 2.The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3.When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4.The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5.The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6.All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes SPEC NO: DSAO0994 REV NO: V.1B DATE: JAN/06/2015 PAGE: 6 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: P.Cheng ERP: 1201008993