MCP6231/1R/1U/2/4
20 µA, 300 kHz Rail-to-Rail Op Amp
Features
Description
•
•
•
•
•
•
The Microchip Technology Inc. MCP6231/1R/1U/2/4
operational amplifiers (op amps) provide wide
bandwidth for the quiescent current. The MCP6231/1R/
1U/2/4 family has a 300 kHz gain bandwidth product
and 65°C (typical) phase margin. This family operates
from a single supply voltage as low as 1.8V, while
drawing 20 µA (typical) quiescent current. In addition,
the MCP6231/1R/1U/2/4 family supports rail-to-rail
input and output swing, with a common mode input
voltage range of VDD + 300 mV to VSS – 300 mV.
These op amps are designed in one of Microchip’s
advanced CMOS processes.
Gain Bandwidth Product: 300 kHz (typical)
Supply Current: IQ = 20 µA (typical)
Supply Voltage: 1.8V to 6.0V
Rail-to-Rail Input/Output
Extended Temperature Range: -40°C to +125°C
Available in 5-Pin SC70 and SOT-23 packages
Applications
•
•
•
•
•
•
Automotive
Portable Equipment
Transimpedance amplifiers
Analog Filters
Notebooks and PDAs
Battery-Powered Systems
Package Types
MCP6231
5 VDD
VOUT 1
VSS 2
4 VIN–
RG2
–
7 VDD
VIN+ 3
+
6 VOUT
SOT-23-5
MSOP, PDIP, SOIC
5 VSS
VOUT 1
VDD 2
5 NC
MCP6232
MCP6231R
VOUTA 1
VINA_ 2
–
4 VIN–
MCP6231U
SC70-5, SOT-23-5
RG1
VINA+ 3
8 VDD
7 VOUTB
- +
6 VINB_
+ -
RF
VSS 2
VINA_ 2
4 VOUT VINA+ 3
VSS 4
VOUT
MCP6231
DFN *
+
RZ
NC 1
VIN– 2
VIN+ 3
Summing Amplifier Circuit
VSS 4
EP
9
8 VDD
VOUTA 1
–
VIN– 3
–
MCP6231
5 VDD
VIN+ 1
5 VINB+
MCP6232
2x3 TDFN *
+
VIN1
RX
8 NC
VSS 4
VIN2
VDD
NC 1
VIN– 2
VSS 4
VIN+ 3
Typical Application
RY
–
VIN+ 3
+
SPICE Macro Models
FilterLab® Software
Mindi™ Circuit Designer & Simulator
Microchip Advanced Part Selector (MAPS)
Analog Demonstration and Evaluation Boards
Application Notes
+
Design Aids
•
•
•
•
•
•
MCP6231
MSOP, PDIP, SOIC
SOT-23-5
EP
9
7 VOUTB
6 VINB_
5 VINB+
MCP6234
PDIP, SOIC, TSSOP
8 NC
VOUTA 1
7 VDD
VINA– 2
- + + - 13 VIND–
6 VOUT
VINA+ 3
VDD 4
12 VIND+
VINB+ 5
VINB– 6
10 VINC+
- + +- 9 V –
INC
VOUTB 7
8 VOUTC
5 NC
14 VOUTD
11 VSS
* Includes Exposed Thermal Pad (EP); see Table 3-1.
© 2009 Microchip Technology Inc.
DS21881E-page 1
MCP6231/1R/1U/2/4
NOTES:
DS21881E-page 2
© 2009 Microchip Technology Inc.
MCP6231/1R/1U/2/4
1.0
ELECTRICAL
CHARACTERISTICS
VDD – VSS ........................................................................7.0V
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification is not
implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.
Current at Analog Input Pins (VIN+, VIN–).....................±2 mA
†† See Section 4.1.2 “Input Voltage and Current Limits”.
Absolute Maximum Ratings †
Analog Inputs (VIN+, VIN–) †† ........ VSS – 1.0V to VDD + 1.0V
All Other Inputs and Outputs ......... VSS – 0.3V to VDD + 0.3V
Difference Input Voltage ...................................... |VDD – VSS|
Output Short Circuit Current ................................ Continuous
Current at Output and Supply Pins ............................±30 mA
Storage Temperature ................................... –65°C to +150°C
Maximum Junction Temperature (TJ)......................... .+150°C
ESD Protection On All Pins (HBM; MM) .............. ≥ 4 kV; 300V
DC ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2,
RL = 100 kΩ to VDD/2 and VOUT ≈ VDD/2.
Sym
Min
Typ
Max
Units
Conditions
Input Offset Voltage
VOS
-5.0
—
+5.0
mV
VCM = VSS
Extended Temperature
VOS
-7.0
—
+7.0
mV
TA = -40°C to +125°C,
VCM = VSS (Note 1)
ΔVOS/ΔTA
—
±3.0
—
µV/°C
TA= -40°C to +125°C,
VCM = VSS
PSRR
—
83
—
dB
Input Bias Current:
IB
—
±1.0
—
pA
At Temperature
IB
—
20
—
pA
TA = +85°C
At Temperature
IB
—
1100
—
pA
TA = +125°C
IOS
—
±1.0
—
pA
Parameters
Input Offset
Input Offset Drift with Temperature
Power Supply Rejection Ratio
VCM = VSS
Input Bias Current and Impedance
Input Offset Current
Common Mode Input Impedance
ZCM
—
1013||6
—
Ω||pF
Differential Input Impedance
ZDIFF
—
1013||3
—
Ω||pF
Common Mode Input Range
VCMR
VSS – 0.3
—
VDD + 0.3
V
Common Mode Rejection Ratio
CMRR
61
75
—
dB
VCM = -0.3V to 5.3V,
VDD = 5V
AOL
90
110
—
dB
VOUT = 0.3V to VDD – 0.3V,
VCM = VSS
VOL, VOH
VSS + 35
—
VDD – 35
mV
RL =10 kΩ, 0.5V Input
Overdrive
ISC
—
±6
—
mA
VDD = 1.8V
ISC
—
±23
—
mA
VDD = 5.5V
VDD
1.8
—
6.0
V
IQ
10
20
30
µA
Common Mode
Open-Loop Gain
DC Open-Loop Gain (large signal)
Output
Maximum Output Voltage Swing
Output Short-Circuit Current
Power Supply
Supply Voltage
Quiescent Current per Amplifier
Note 1:
2:
IO = 0, VCM = VDD – 0.5V
The SC70 package is only tested at +25°C.
All parts with date codes February 2007 and later have been screened to ensure operation at VDD = 6.0V. However, the
other minimum and maximum specifications are measured at 1.8V and 5.5V
© 2009 Microchip Technology Inc.
DS21881E-page 3
MCP6231/1R/1U/2/4
AC ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.8 to 5.5V, VSS = GND, VCM = VDD/2,
VOUT ≈ VDD/2, RL = 100 kΩ to VDD/2 and CL = 60 pF.
Parameters
Sym
Min
Typ
Max
Units
Conditions
GBWP
—
300
—
kHz
Phase Margin
PM
—
65
—
°
Slew Rate
SR
—
0.15
—
V/µs
Input Noise Voltage
Eni
—
6.0
—
µVP-P
Input Noise Voltage Density
eni
—
52
—
nV/√Hz
f = 1 kHz
Input Noise Current Density
ini
—
0.6
—
fA/√Hz
f = 1 kHz
AC Response
Gain Bandwidth Product
G = +1 V/V
Noise
f = 0.1 Hz to 10 Hz
TEMPERATURE CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VDD = +1.8V to +5.5V and VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Extended Temperature Range
TA
-40
—
+125
°C
Operating Temperature Range
TA
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 5L-SC70
θJA
—
331
—
°C/W
Thermal Resistance, 5L-SOT-23
θJA
—
256
—
°C/W
Thermal Resistance, 8L-DFN
θJA
—
84.5
—
°C/W
Thermal Resistance, 8L-MSOP
θJA
—
206
—
°C/W
Thermal Resistance, 8L-TDFN
θJA
—
41
—
°C/W
Thermal Resistance, 8L-PDIP
θJA
—
85
—
°C/W
Thermal Resistance, 8L-SOIC
θJA
—
163
—
°C/W
Thermal Resistance, 14L-PDIP
θJA
—
70
—
°C/W
Thermal Resistance, 14L-SOIC
θJA
—
120
—
°C/W
Thermal Resistance, 14L-TSSOP
θJA
—
100
—
°C/W
Note
Thermal Package Resistances
Note:
1.1
The internal Junction Temperature (TJ) must not exceed the Absolute Maximum specification of +150°C.
Test Circuits
The test circuits used for the DC and AC tests are
shown in Figure 1-1 and Figure 1-1. The bypass
capacitors are laid out according to the rules discussed
in Section 4.6 “PCB Surface Leakage”.
VDD
VDD/2
RN
0.1 µF 1 µF
VOUT
MCP623X
CL
VDD
VIN
0.1 µF 1 µF
VIN
RG
RL
RF
VL
RN
VOUT
MCP623X
CL
VDD/2 RG
RL
FIGURE 1-2:
AC and DC Test Circuit for
Most Inverting Gain Conditions.
RF
VL
FIGURE 1-1:
AC and DC Test Circuit for
Most Non-Inverting Gain Conditions.
DS21881E-page 4
© 2009 Microchip Technology Inc.
MCP6231/1R/1U/2/4
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
20%
18%
16%
14%
12%
10%
8%
6%
4%
2%
0%
90
CMRR, PSRR (dB)
630 Samples
VCM = VSS
85
PSRR (VCM = VSS)
80
75
CMRR (VCM = -0.3V to +5.3V,
VDD = 5.0V)
-25
0
25
50
75
Ambient Temperature (°C)
Input Offset Voltage (mV)
FIGURE 2-4:
Temperature.
100
120
30
1.E+02
10
1.E+03
100
1.E+04
1k
100k
Frequency (Hz)
PSRR, CMRR vs.
-180
30%
25%
20%
15%
10%
5%
0%
Input Bias Current (pA)
FIGURE 2-3:
Input Bias Current at +85°C.
© 2009 Microchip Technology Inc.
Open-Loop Gain, Phase vs.
632 Samples
VCM = VDD/2
TA = +125°C
0.0
Percentage of Occurrences
42
36
30
24
18
12
-150
0
FIGURE 2-5:
Frequency.
630 Samples
VCM = VDD/2
TA = +85°C
6
20%
18%
16%
14%
12%
10%
8%
6%
4%
2%
0%
0
Percentage of Occurrences
FIGURE 2-2:
Frequency.
20
-20
-210
0.1 1.E+
1 1.E+
10 1.E+
100 1.E+
1k 1.E+
10k 100k
1M 1.E+
10M
1.E1.E+ 1.E+
01 00 01 Frequency
02 03 (Hz)
04 05 06 07
1.E+05
10k
-120
0.6
20
1.E+01
-90
Phase
2.0
40
-60
40
0.4
50
60
-30
1.8
PSRR+
0
1.6
CMRR
60
Gain
80
0.2
70
100
1.0
80
RL = 10 kΩ
VCM = VDD/2
0.8
PSRR-
Open-Loop Gain (dB)
PSRR, CMRR (dB)
90
125
CMRR, PSRR vs. Ambient
1.4
Input Offset Voltage.
1.2
FIGURE 2-1:
100
Open-Loop Phase (°)
-50
5
4
3
2
1
0
-1
-2
-3
-4
70
-5
Percentage of Occurrences
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2,
RL = 100 kΩ to VDD/2 and CL = 60 pF.
Input Bias Current (nA)
FIGURE 2-6:
+125°C.
Input Bias Current at
DS21881E-page 5
MCP6231/1R/1U/2/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2,
RL = 100 kΩ to VDD/2 and CL = 60 pF.
FIGURE 2-7:
vs. Frequency.
VDD = 1.8V
TA = -40°C
TA = +25°C
TA = +85°C
TA = +125°C
450
350
250
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
150
FIGURE 2-10:
50
0
-50
-100
-150
Common Mode Input Voltage (V)
FIGURE 2-9:
Input Offset Voltage vs.
Common Mode Input Voltage at VDD = 5.5V.
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
-200
DS21881E-page 6
12
10
8
6
4
2
0
0
-50
-100
VDD = 5.5V
-150
-200
VDD = 1.8V
-250
-300
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Output Short-Circuit Current
(mA)
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
100
-2
VCM = VSS
50
FIGURE 2-11:
Output Voltage.
VDD = 5.5 V
150
Input Offset Voltage Drift.
Output Voltage (V)
FIGURE 2-8:
Input Offset Voltage vs.
Common Mode Input Voltage at VDD = 1.8V.
200
-4
Input Offset Voltage Drift (µV/°C)
Common Mode Input Voltage (V)
Input Offset Voltage (µV)
-6
-8
-10
628 Samples
VCM = VSS
TA = -40°C to +125°C
100
550
Input Offset Voltage (µV)
Input Noise Voltage Density
20%
18%
16%
14%
12%
10%
8%
6%
4%
2%
0%
-12
10
0.1 1.E+0
1
10
100 1.E+0
1k
10k 1.E+0
100k
1.E-01
1.E+0
1.E+0
1.E+0
0
1Frequency
2 (Hz)3
4
5
Percentage of Occurrences
100
Input Offset Voltage (µV)
Input Noise Voltage Density
(nV/√Hz)
1,000
30
25
20
15
10
5
0
-5
-10
-15
-20
-25
-30
Input Offset Voltage vs.
+ISC
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
-ISC
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Power Supply Voltage (V)
FIGURE 2-12:
Output Short-Circuit Current
vs. Ambient Temperature.
© 2009 Microchip Technology Inc.
MCP6231/1R/1U/2/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2,
RL = 100 kΩ to VDD/2 and CL = 60 pF.
VDD = 5.5V
0.25
Falling Edge
0.20
0.15
0.10
Rising Edge
VDD = 1.8V
0.05
-50
-25
0
25
50
75
100
Ambient Temperature (°C)
FIGURE 2-13:
Temperature.
125
Slew Rate vs. Ambient
Time (2 µs/div)
FIGURE 2-16:
Pulse Response.
1,000
VDD = 5.0V
G = +1 V/V
4.5
100
VDD – VOH
VOL – VSS
10
1
10µ
1.E-02
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
100µ
1m
1.E-01
1.E+00
Output Current Magnitude (A)
10m
1.E+01
0.0
Time (20 µs/div)
FIGURE 2-14:
Output Voltage Headroom
vs. Output Current Magnitude.
FIGURE 2-17:
Pulse Response.
30
10
VDD = 5.5V
1
Quiescent Current
per Amplifier (µA)
Max. Output Voltage Swing
(VP-P )
Small-Signal, Non-Inverting
5.0
Output Voltage (V)
Output Voltage Headroom
(mV)
G = +1 V/V
RL = 10 kΩ
Output Voltage (10 mV/div)
Slew Rate (V/µs)
0.30
VDD = 1.8V
0.1
1k
1.E+03
Large-Signal, Non-Inverting
VCM = 0.9VDD
25
20
15
10
5
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
0
10k
100k
1.E+04
1.E+05
Frequency (Hz)
1M
1.E+06
FIGURE 2-15:
Maximum Output Voltage
Swing vs. Frequency.
© 2009 Microchip Technology Inc.
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Power Supply Voltage (V)
FIGURE 2-18:
Quiescent Current vs.
Power Supply Voltage.
DS21881E-page 7
MCP6231/1R/1U/2/4
6.0
+125°C
+85°C
+25°C
-40°C
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0
Input Voltage (V)
FIGURE 2-19:
Measured Input Current vs.
Input Voltage (below VSS).
DS21881E-page 8
Input, Output Voltages (V)
Input Current Magnitude (A)
1.E-02
10m
1.E-03
1m
1.E-04
100µ
1.E-05
10µ
1.E-06
1µ
100n
1.E-07
10n
1.E-08
1n
1.E-09
100p
1.E-10
10p
1.E-11
1p
1.E-12
VOUT
5.0
4.0
VDD = 5.0V
G = +2 V/V
VIN
3.0
2.0
1.0
0.0
-1.0
Time (1 ms/div)
FIGURE 2-20:
The MCP6231/1R/1U/2/4
Show No Phase Reversal.
© 2009 Microchip Technology Inc.
MCP6231/1R/1U/2/4
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1 (single op amps) and Table 3-2 (dual and quad op amps).
TABLE 3-1:
PIN FUNCTION TABLE FOR SINGLE OP AMPS
MCP6231
MCP6231R
MCP6231U
DFN, MSOP,
PDIP, SOIC
SOT-23-5
SOT-23-5
SOT-23-5
SC70
6
1
1
4
Analog Output
4
4
3
VIN–
Inverting Input
3
3
1
VIN+
Non-inverting Input
7
5
2
5
VDD
Positive Power Supply
4
2
5
2
VSS
Negative Power Supply
1, 5, 8
—
—
—
NC
No Internal Connection
9
—
—
—
EP
Exposed Thermal Pad (EP); must be
connected to VSS.
PIN FUNCTION TABLE FOR DUAL AND QUAD OP AMPS
MCP6232
MCP6234
MSOP, PDIP,
SOIC, TDFN
PDIP, SOIC, TSSOP
1
1
VOUTA
Analog Output (op amp A)
2
2
VINA–
Inverting Input (op amp A)
3
3
VINA+
Non-inverting Input (op amp A)
8
4
VDD
5
5
VINB+
Non-inverting Input (op amp B)
6
6
VINB–
Inverting Input (op amp B)
Analog Output (op amp B)
Symbol
Description
Positive Power Supply
7
7
VOUTB
—
8
VOUTC
Analog Output (op amp C)
—
9
VINC–
Inverting Input (op amp C)
—
10
VINC+
4
11
VSS
—
12
VIND+
Non-inverting Input (op amp D)
—
13
VIND–
Inverting Input (op amp D)
—
14
VOUTD
9
—
—
Analog Outputs
Analog Inputs
The non-inverting and inverting inputs are
high-impedance CMOS inputs with low bias currents.
3.3
VOUT
2
The output pins are low-impedance voltage sources.
3.2
Description
3
TABLE 3-2:
3.1
Symbol
Power Supply (VSS and VDD)
The positive power supply (VDD) is 1.8V to 6.0V higher
than the negative power supply (VSS). For normal
operation, the other pins are between VSS and VDD.
© 2009 Microchip Technology Inc.
Non-inverting Input (op amp C)
Negative Power Supply
Analog Output (op amp D)
Exposed Thermal Pad (EP); must be connected to VSS.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need bypass capacitors.
3.4
Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the VSS pin; they must
be connected to the same potential on the Printed
Circuit Board (PCB).
DS21881E-page 9
MCP6231/1R/1U/2/4
NOTES:
DS21881E-page 10
© 2009 Microchip Technology Inc.
MCP6231/1R/1U/2/4
4.0
APPLICATION INFORMATION
The MCP6231/1R/1U/2/4 family of op amps is
manufactured using Microchip’s state-of-the-art CMOS
process and is specifically designed for low-cost,
low-power and general-purpose applications. The low
supply voltage, low quiescent current and wide
bandwidth makes the MCP6231/1R/1U/2/4 ideal for
battery-powered applications.
4.1
VIN+ Bond
Pad
Rail-to-Rail Inputs
4.1.1
PHASE REVERSAL
6.0
VOUT
5.0
4.0
Bond V –
IN
Pad
Input
Stage
VSS Bond
Pad
The MCP6231/1R/1U/2/4 op amp is designed to
prevent phase reversal when the input pins exceed the
supply voltages. Figure 4-1 shows the input voltage
exceeding the supply voltage without any phase
reversal.
Input, Output Voltages (V)
VDD Bond
Pad
VDD = 5.0V
G = +2 V/V
VIN
3.0
2.0
1.0
0.0
-1.0
FIGURE 4-2:
Structures.
Simplified Analog Input ESD
In order to prevent damage and/or improper operation
of these op amps, the circuit they are in must limit the
currents and voltages at the VIN+ and VIN– pins (see
Absolute Maximum Ratings † at the beginning of
Section 1.0 “Electrical Characteristics”). Figure 4-3
shows the recommended approach to protecting these
inputs. The internal ESD diodes prevent the input pins
(VIN+ and VIN–) from going too far below ground, and
the resistors R1 and R2 limit the possible current drawn
out of the input pins. Diodes D1 and D2 prevent the
input pins (VIN+ and VIN–) from going too far above
VDD, and dump any currents onto VDD. When
implemented as shown, resistors R1 and R2 also limit
the current through D1 and D2.
Time (1 ms/div)
VDD
FIGURE 4-1:
The MCP6231/1R/1U/2/4
Show No Phase Reversal.
D1
4.1.2
INPUT VOLTAGE AND CURRENT
LIMITS
The ESD protection on the inputs can be depicted as
shown in Figure 4-2. This structure was chosen to
protect the input transistors, and to minimize input bias
current (IB). The input ESD diodes clamp the inputs
when they try to go more than one diode drop below
VSS. They also clamp any voltages that go too far
above VDD; their breakdown voltage is high enough to
allow normal operation, and low enough to bypass
quick ESD events within the specified limits.
D2
V1
R1
MCP623X
V2
R2
R3
VSS – (minimum expected V1)
2 mA
VSS – (minimum expected V2)
R2 >
2 mA
R1 >
FIGURE 4-3:
Inputs.
Protecting the Analog
It is also possible to connect the diodes to the left of
resistors R1 and R2. In this case, current through the
diodes D1 and D2 needs to be limited by some other
mechanism. The resistors then serve as in-rush current
limiters; the DC current into the input pins (VIN+ and
VIN–) should be very small.
© 2009 Microchip Technology Inc.
DS21881E-page 11
MCP6231/1R/1U/2/4
4.1.3
1k
1,000
NORMAL OPERATION
The input stage of the MCP6231/1R/1U/2/4 op amps
use two differential CMOS input stages in parallel. One
operates at low common mode input voltage (VCM),
while the other operates at high VCM. WIth this
topology, the device operates with VCM up to 0.3V
above VDD and 0.3V below VSS.
4.2
Capacitive Loads
Driving large capacitive loads can cause stability
problems for voltage feedback op amps. As the load
capacitance increases, the feedback loop’s phase
margin decreases and the closed-loop bandwidth is
reduced. This produces gain peaking in the frequency
response, with overshoot and ringing in the step
response. A unity-gain buffer (G = +1) is the most
sensitive to capacitive loads, but all gains show the
same general behavior.
When driving large capacitive loads with these op
amps (e.g., > 60 pF when G = +1), a small series
resistor at the output (RISO in Figure 4-4) improves the
feedback loop’s phase margin (stability) by making the
output load resistive at higher frequencies. The
bandwidth will be generally lower than the bandwidth
with no capacitive load.
–
VIN
MCP623X
+
GN = 1 V/V
GN = 2 V/V
GN ≥ 4 V/V
100
100
10p
10
100p
1n
10n
100
1000
10000
Normalized Load Capacitance; CL/GN (F)
FIGURE 4-5:
Recommended RISO Values
for Capacitive Loads.
Rail-to-Rail Output
The output voltage range of the MCP6231/1R/1U/2/4
op amps is VDD – 35 mV (maximum) and VSS + 35 mV
(minimum) when RL = 10 kΩ is connected to VDD/2 and
VDD = 5.5V. Refer to Figure 2-14 for more information.
4.3
10,000
10k
Recommended RISO (Ω)
A significant amount of current can flow out of the
inputs when the common mode voltage (VCM) is below
ground (VSS); see Figure 2-19. Applications that are
high impedance may need to limit the usable voltage
range.
RISO
After selecting RISO for your circuit, double-check the
resulting frequency response peaking and step
response overshoot. Evaluation on the bench and
simulations with the MCP6231/1R/1U/2/4 SPICE
macro model are very helpful. Modify RISO’s value until
the response is reasonable.
4.4
Supply Bypass
With this op amp, the power supply pin (VDD for
single-supply) should have a local bypass capacitor
(i.e., 0.01 µF to 0.1 µF) within 2 mm for good
high-frequency performance. It can use a bulk
capacitor (i.e., 1 µF or larger) within 100 mm to
provide large, slow currents. This bulk capacitor can
be shared with other nearby analog parts.
4.5
Unused Op Amps
An unused op amp in a quad package (MCP6234)
should be configured as shown in Figure 4-6. Both
circuits prevent the output from toggling and causing
crosstalk. Circuit A can use any reference voltage
between the supplies, provides a buffered DC voltage
and minimizes the supply current draw of the unused
op amp. Circuit B minimizes the number of
components, but may draw a little more supply current
for the unused op amp.
VOUT
CL
¼ MCP6234 (A)
¼ MCP6234 (B)
VDD
FIGURE 4-4:
Output resistor, RISO
stabilizes large capacitive loads.
R1
Figure 4-5 gives recommended RISO values for
different capacitive loads and gains. The x-axis is the
normalized load capacitance (CL/GN), where GN is the
circuit’s noise gain. For non-inverting gains, GN and the
signal gain are equal. For inverting gains, GN is
1 + |Signal Gain| (e.g., –1 V/V gives GN = +2 V/V).
R2
VDD
VDD
R2
V REF = V DD ⋅ -------------------R1 + R2
FIGURE 4-6:
DS21881E-page 12
VREF
Unused Op Amps.
© 2009 Microchip Technology Inc.
MCP6231/1R/1U/2/4
4.6
PCB Surface Leakage
4.7
In applications where low input bias current is critical,
Printed Circuit Board (PCB) surface leakage effects
need to be considered. Surface leakage is caused by
humidity, dust or other contamination on the board.
Under low humidity conditions, a typical resistance
between nearby traces is 1012Ω. A 5V difference would
cause 5 pA of current to flow, which is greater than the
MCP6231/1R/1U/2/4 family’s bias current at +25°C
(1 pA, typical).
The easiest way to reduce surface leakage is to use a
guard ring around sensitive pins (or traces). The guard
ring is biased at the same voltage as the sensitive pin.
An example of this type of layout is shown in
Figure 4-7.
VIN–
VIN+
Application Circuits
4.7.1
MATCHING THE IMPEDANCE AT
THE INPUTS
To minimize the effect of input bias current in an amplifier circuit (this is important for very high sourceimpedance applications, such as pH meters and
transimpedance amplifiers), the impedances at the
inverting and non-inverting inputs need to be
matched. This is done by choosing the circuit resistor
values so that the total resistance at each input is the
same. Figure 4-8 shows a summing amplifier circuit.
RG2
VIN2
RG1
VIN1
VSS
RF
VDD
–
RX
MCP623X
VOUT
+
RY
Guard Ring
FIGURE 4-7:
for Inverting Gain.
1.
2.
Example Guard Ring Layout
Non-inverting Gain and Unity-Gain Buffer:
a. Connect the non-inverting pin (VIN+) to the
input with a wire that does not touch the
PCB surface.
b. Connect the guard ring to the inverting input
pin (VIN–). This biases the guard ring to the
common mode input voltage.
Inverting Gain and Transimpedance Amplifiers
(convert current to voltage, such as photo
detectors):
a. Connect the guard ring to the non-inverting
input pin (VIN+). This biases the guard ring
to the same reference voltage as the op
amp (e.g., VDD/2 or ground).
b. Connect the inverting pin (VIN–) to the input
with a wire that does not touch the PCB
surface.
RZ
FIGURE 4-8:
Summing Amplifier Circuit.
To match the inputs, set all voltage sources to ground
and calculate the total resistance at the input nodes. In
this summing amplifier circuit, the resistance at the
inverting input is calculated by setting VIN1, VIN2 and
VOUT to ground. In this case, RG1, RG2 and RF are in
parallel. The total resistance at the inverting input is:
EQUATION 4-1:
1
R VIN – = ---------------------------------------------1 + ----1-⎞
1 + --------⎛ --------⎝R
⎠
R
R
G1
G2
F
Where:
RVIN–
=
total resistance at the inverting
input
At the non-inverting input, VDD is the only voltage
source. When VDD is set to ground, both Rx and Ry are
in parallel. The total resistance at the non-inverting
input is:
EQUATION 4-2:
1
R VIN + = ------------------------- + RZ
1- + ----1-⎞
⎛ ----⎝R
R ⎠
X
Y
Where:
RVIN+
© 2009 Microchip Technology Inc.
=
total resistance at the inverting
input
DS21881E-page 13
MCP6231/1R/1U/2/4
To minimize output offset voltage and increase circuit
accuracy, the resistor values need to meet the
conditions:
EQUATION 4-3:
R VIN + = R VIN –
4.7.2
COMPENSATING FOR THE
PARASITIC CAPACITANCE
In analog circuit design, the PCB parasitic capacitance
can compromise the circuit behavior; Figure 4-9 shows
a typical scenario. If the input of an amplifier sees
parasitic capacitance of several picofarad (CPARA,
which includes the common mode capacitance of 6 pF,
typical), and large RF and RG, the frequency response
of the circuit will include a zero. This parasitic zero
introduces gain-peaking and can cause circuit
instability.
+
VAC
MCP623X
–
RG
VOUT
RF
VDC
CPARA
CF
RG
C F = C PARA • ------RF
FIGURE 4-9:
Effect of Parasitic
Capacitance at the Input.
One solution is to use smaller resistor values to push
the zero to a higher frequency. Another solution is to
compensate by introducing a pole at the point at which
the zero occurs. This can be done by adding CF in
parallel with the feedback resistor (RF). CF needs to be
selected so that the ratio CPARA:CF is equal to the ratio
of RF:RG.
DS21881E-page 14
© 2009 Microchip Technology Inc.
MCP6231/1R/1U/2/4
5.0
DESIGN AIDS
Microchip provides the basic design tools needed for
the MCP6231/1R/1U/2/4 family of op amps.
5.1
SPICE Macro Model
The latest SPICE macro model for the MCP6231/1R/
1U/2/4 op amps is available on the Microchip web site
at www.microchip.com. This model is intended to be an
initial design tool that works well in the op amp’s linear
region of operation over the temperature range. See
the model file for information on its capabilities.
Bench testing is a very important part of any design and
cannot be replaced with simulations. Also, simulation
results using this macro model need to be validated by
comparing them to the data sheet specifications and
characteristic curves.
5.2
FilterLab® Software
Microchip’s FilterLab® software is an innovative
software tool that simplifies analog active filter (using
op amps) design. Available at no cost from the
Microchip web site at www.microchip.com/filterlab, the
FilterLab design tool provides full schematic diagrams
of the filter circuit with component values. It also
outputs the filter circuit in SPICE format, which can be
used with the macro model to simulate actual filter
performance.
5.3
Mindi™ Circuit Designer &
Simulator
Microchip’s Mindi™ Circuit Designer & Simulator aids
in the design of various circuits useful for active filter,
amplifier and power-management applications. It is a
free online circuit designer & simulator available from
the Microchip web site at www.microchip.com/mindi.
This interactive circuit designer & simulator enables
designers to quickly generate circuit diagrams,
simulate circuits. Circuits developed using the Mindi
Circuit Designer & Simulator can be downloaded to a
personal computer or workstation.
5.4
5.5
Analog Demonstration and
Evaluation Boards
Microchip offers a broad spectrum of Analog
Demonstration and Evaluation Boards that are
designed to help you achieve faster time to market. For
a complete listing of these boards and their
corresponding user’s guides and technical information,
visit the Microchip web site at:
www.microchip.com/analogtools
Two of our boards that are especially useful are:
• P/N SOIC8EV: 8-Pin SOIC/MSOP/TSSOP/DIP
Evaluation Board
• P/N SOIC14EV: 14-Pin SOIC/TSSOP/DIP
Evaluation Board
5.6
Application Notes
The following Microchip Application Notes are
available on the Microchip web site at www.microchip.
com/appnotes and are recommended as supplemental
reference resources.
• ADN003: “Select the Right Operational Amplifier
for your Filtering Circuits”, DS21821
• AN722: “Operational Amplifier Topologies and DC
Specifications”, DS00722
• AN723: “Operational Amplifier AC Specifications
and Applications”, DS00723
• AN884: “Driving Capacitive Loads With Op
Amps”, DS00884
• AN990: “Analog Sensor Conditioning Circuits –
An Overview”, DS00990
These application notes and others are listed in the
design guide:
• “Signal Chain Design Guide”, DS21825
Microchip Advanced Part Selector
(MAPS)
MAPS is a software tool that helps semiconductor
professionals efficiently identify Microchip devices that
fit a particular design requirement. Available at no cost
from the Microchip web site at www.microchip.com/
maps, the MAPS is an overall selection tool for
Microchip’s product portfolio that includes Analog,
Memory, MCUs and DSCs. Using this tool you can
define a filter to sort features for a parametric search of
devices and export side-by-side technical comparison
reports. Helpful links are also provided for Data sheets,
Purchase, and Sampling of Microchip parts.
© 2009 Microchip Technology Inc.
DS21881E-page 15
MCP6231/1R/1U/2/4
NOTES:
DS21881E-page 16
© 2009 Microchip Technology Inc.
MCP6231/1R/1U/2/4
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
5-Lead SC70 (MCP6231U Only)
Example:
XXNN
AS25
Example:
5-Lead SOT-23
5
XXNN
1
Device
4
2
3
Code
MCP6231
BJNN
MCP6231R
BKNN
MCP6231U
BLNN
Note:
8-Lead DFN (2 x 3) (MCP6231)
XXX
YWW
NNN
Applies to 5-Lead SOT-23.
5
4
BJ25
1
2
3
Example:
AER
929
256
8-Lead TDFN (2 x 3) (MCP6232)
Example:
AAE
929
256
XXX
YWW
NNN
Example:
8-Lead MSOP
XXXXXX
6232E
YWWNNN
929256
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2009 Microchip Technology Inc.
DS21881E-page 17
MCP6231/1R/1U/2/4
Package Marking Information (Continued)
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (150 mil)
XXXXXXXX
XXXXYYWW
NNN
14-Lead PDIP (300 mil) (MCP6234)
Example:
MCP6232
E/P256
0929
MCP6232
E/P e3 256
0929
OR
Example:
MCP6232
E/SN0929
256
MCP6232E
SN e3 0929
256
OR
Example:
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
14-Lead SOIC (150 mil) (MCP6234)
MCP6234
e3
E/P^^
0929256
Example:
MCP6234
e3
E/SL^^
0929256
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
14-Lead TSSOP (MCP6234)
Example:
XXXXXXXX
YYWW
6234E
0929
NNN
256
DS21881E-page 18
© 2009 Microchip Technology Inc.
MCP6231/1R/1U/2/4
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© 2009 Microchip Technology Inc.
MCP6231/1R/1U/2/4
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
© 2009 Microchip Technology Inc.
DS21881E-page 27
MCP6231/1R/1U/2/4
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)*+) #&#,$
--# $## #&!A !
© 2009 Microchip Technology Inc.
- *()
DS21881E-page 31
MCP6231/1R/1U/2/4
12 )0%!+,-./
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DS21881E-page 32
- *9()
© 2009 Microchip Technology Inc.
MCP6231/1R/1U/2/4
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© 2009 Microchip Technology Inc.
DS21881E-page 33
MCP6231/1R/1U/2/4
12 3 3 & )2+2-. . # #$ # /! - 0 # 1/ %# #!#
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DS21881E-page 34
- *;)
© 2009 Microchip Technology Inc.
MCP6231/2/4
APPENDIX A:
REVISION HISTORY
Revision E (August 2009)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
Added the 2x3 TDFN package for MCP6232.
Updated the 2x3 DFN package information for
MCP6231.
Updated the “Temperature Characteristics”
table.
Updated Section 3.0 “Pin Descriptions”.
Updated the Package Outline Drawings in
Section 6.0 “Packaging Information”.
Updated the Product Identification Systems
section.
Revision C (March 2005)
The following is the list of modifications:
1.
2.
3.
4.
5.
Added the MCP6234 quad op amp.
Corrected plots in Section 2.0 “Typical
Performance Curves”.
Added Section 3.0 “Pin Descriptions”.
Added new SC-70 package markings. Added
PDIP-14, SOIC-14, and TSSOP-14 packages
and corrected package marking information
(Section 6.0 “Packaging Information”).
Added Appendix A: “Revision History”.
Revision B (August 2004)
• Undocumented changes.
Revision D (May 2008)
Revision A (March 2004)
The following is the list of modifications:
• Original Release of this Document.
1.
Changed Heading “Available Tools” to “Design
Aids”.
2. Design Aids: Name change for Mindi Simulator
Tool.
3. Package Types: Added DFN to MCP6231
Device.
4. Absolute Maximum Ratings: Numerous
changes in this section.
5. Updated notes to Section 1.0 “Electrical
Characteristics”.
6. Added Test Circuits to Section 1.0 “Electrical
Characteristics”.
7. Corrected Figure 2-7.
8. Added Figure 2-19.
9. Numerous changes to Section 3.0 “Pin
Descriptions”.
10. Added Section 4.1.1 “Phase Reversal”,
Section 4.1.2 “Input Voltage and Current
Limits”,
and
Section 4.1.3
“Normal
Operation”.
11. Replaced Section 5.0 “Design Aids” with
additional information.
12. Updated
Section 6.0
“Packaging
Information” with updated Package Outline
Drawings.
© 2009 Microchip Technology Inc.
DS21881E-page 35
MCP6231/2/4
NOTES:
DS21881E-page 36
© 2009 Microchip Technology Inc.
MCP6231/2/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
Device
Tape and Reel
and/or
Alternate Pinout
Device:
-X
/XX
Temperature Package
Range
MCP6231:
MCP6231T:
MCP6231RT:
MCP6231UT:
MCP6232:
MCP6232T:
MCP6234:
MCP6234T:
Single Op Amp (MSOP, PDIP, SOIC)
Single Op Amp (Tape and Reel)
(MSOP, SOIC, SOT-23)
Single Op Amp (Tape and Reel)
(SOT-23)
Single Op Amp (Tape and Reel)
(SC70, SOT-23, TDFN)
Dual Op Amp
Dual Op Amp (Tape and Reel)
(MSOP, SOIC)
Quad Op Amp
Quad Op Amp (Tape and Reel)
(TSSOP, SOIC)
Temperature Range:
E
= -40° C to +125° C
Package:
LT = Plastic Package (SC70), 5-lead (MCP6231U only)
MC = Plastic Dual Flat No-Lead (DFN) 2x3, 8-lead
(MCP6231 only)
MNY= Plastic Dual Flat No-Lead (TDFN) 2x3, 8-lead
(MCP6232 only)
MS = Plastic Micro Small Outline (MSOP), 8-lead
P
= Plastic DIP (300 mil Body), 8-lead, 14-lead
OT = Plastic Small Outline Transistor (SOT-23), 5-lead
(MCP6231, MCP6231R, MCP6231U)
SN = Plastic SOIC (150 mil Body), 8-lead
SL = Plastic SOIC (150 mil Body), 14-lead
ST = Plastic TSSOP (4.4 mil Body), 14-lead
Examples:
a) MCP6231-E/MC:
Extended Temperature
8LD DFN package.
b) MCP6231-E/MS:
Extended Temperature
8LD MSOP package.
c) MCP6231UT-E/LT: Tape and Reel,
Extended Temperature
5LD SC70 package.
d) MCP6231-E/P:
Extended Temperature
8LD PDIP package.
e) MCP6231RT-E/OT: Tape and Reel,
Extended Temperature
5LD SOT-23 package
f) MCP6231UT-E/OT: Tape and Reel,
Extended Temperature
5LD SOT-23.
g) MCP6231-E/SN:
Extended Temperature
8LD SOIC package.
a) MCP6232-E/SN:
b)
c)
d)
e)
Extended Temperature
8LD SOIC package.
MCP6232-E/MS:
Extended Temperature
8LD MSOP package.
MCP6232-E/P:
Extended Temperature
8LD PDIP package.
MCP6232T-E/SN: Tape and Reel,
Extended Temperature
8LD SOIC package.
MCP6232T-E/MNY: Tape and Reel,
Extended Temperature
8LD TDFN package.
a) MCP6234-E/P:
b) MCP6234-E/SL:
c) MCP6234-E/ST:
d) MCP6234T-E/SL:
e) MCP6234T-E/ST:
© 2009 Microchip Technology Inc.
Extended Temperature
14LD PDIP package.
Extended Temperature
14LD SOIC package.
Extended Temperature,
14LD TSSOP package
Tape and Reel,
Extended Temperature
14LD SOIC package.
Tape and Reel,
Extended Temperature
14LD TSSOP package.
DS21881E-page 37
MCP6231/2/4
NOTES:
DS21881E-page 38
© 2009 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
rfPIC and UNI/O are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2009 Microchip Technology Inc.
DS21881E-page 39
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
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Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
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Tel: 91-80-3090-4444
Fax: 91-80-3090-4080
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
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Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
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Tel: 91-20-2566-1512
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Tel: 886-7-536-4818
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Tel: 86-592-2388138
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Taiwan - Taipei
Tel: 886-2-2500-6610
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Thailand - Bangkok
Tel: 66-2-694-1351
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Italy - Milan
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Tel: 86-756-3210040
Fax: 86-756-3210049
03/26/09
DS21881E-page 40
© 2009 Microchip Technology Inc.