TDK MPZ1005 Chip beads for power line mpz sery Datasheet

Chip Beads
For power line
MPZ series
Type:
MPZ0603
MPZ1005
MPZ1608
MPZ2012
MPZ1005-E
0603[0201 inch]*
1005[0402 inch]
1608[0603 inch]
2012[0805 inch]
1005[0402 inch]
* Dimensions Code JIS[EIA]
Issue date:
September 2012
• All specifications are subject to change without notice.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
(1/12)
Chip Beads
For Power Line
Conformity to RoHS Directive
MPZ Series MPZ0603
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
0.30
0.3±0.03
0.6±0.03
0.25
0.1min.
0.30
0.25
0.3±0.03
FEATURES
• This chip bead implements a 0603 shape in its capacity as an
EMC countermeasure component, and it supports compact
devices that need smaller spaces.
• This product can cope with a high current due to its low DC
resistance. It is also most suitable for lower power consumption.
• Because of its low DC resistance, it is useful for audio lines.
• No cross talk with closed magnetic circuit structural design.
• It is a product conforming to RoHS directive.
Weight: 0.3mg
Dimensions in mm
APPLICATIONS
Removal of power line noises of cellular phones, PCs, note PCs,
TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, etc.
SPECIFICATIONS
PRODUCT IDENTIFICATION
PACKAGING STYLE AND QUANTITIES
MPZ 0603 S 220 C T
(1)
(2) (3) (4) (5) (6)
(7)
(1) Series name
(2) Dimensions LW
(3) Type name
(4) Impedance
220: 22 at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping(reel)
(7) TDK internal code
Operating temperature range
Storage temperature range
Packaging style
Taping
–55 to +125°C
–55 to +125°C(After mount)
Quantity
15000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
Natural
cooling
230˚C
180˚C
150˚C
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
ELECTRICAL CHARACTERISTICS
Part No.
MPZ0603S220C
MPZ0603S330C
MPZ0603S470C

Impedance
( )[100MHz]
22±25%
33±25%
47±25%
DC resistance
( )max.
0.065
0.090
0.120
Rated current
(mA)max.
1000
750
500
Test equipment: E4991A or equivalent
Test tool: 16197 or equivalent
Test temperature: 25±10°C
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-08 / 20120925 / e9413_mpz
(2/12)
TYPICAL ELECTRICAL CHARACTERISTICS
Z FREQUENCY CHARACTERISTICS
MPZ0603S SERIES
MPZ0603S470C
Impedance (Ω)
MPZ0603S330C
MPZ0603S220C
10
100
1000
Frequency (MHz)
10000
Z, X, R vs. FREQUENCY CHARACTERISTICS
MPZ0603S220C
MPZ0603S330C
45
70
40
60
25
R
20
15
10
X
5
0
1
10
100
1000
Frequency (MHz)
100
80
50
Impedance(Ω)
Z
30
Impedance(Ω)
Impedance(Ω)
35
MPZ0603S470C
Z
40
R
30
20
10
0
10000
10
100
1000
Frequency (MHz)
PACKAGING STYLES
REEL DIMENSIONS
R
40
20
X
1
Z
60
0
10000
X
1
10
100
1000
Frequency (MHz)
10000
TAPE DIMENSIONS
Sprocket hole
1.5 +0.1
–0.0
Cavity
0.5max.
0.38±0.05
4.0±0.1
2.0±0.05
2.0±0.5
8.4 +2.0
–0.0
ø13±0.2
14.4max.
160min.
Taping
2.0±0.05
0.68±0.05
ø60min.
8.0±0.3
1.0
3.5±0.05
1
1.75±0.1
100
90
80
70
60
50
40
30
20
10
0
200min.
ø21±0.8
ø180±2.0
Dimensions in mm
Drawing direction
300min.
Dimensions in mm
• All specifications are subject to change without notice.
001-08 / 20120925 / e9413_mpz
(3/12)
Chip Beads
For Power Line
Conformity to RoHS Directive
MPZ Series MPZ1005
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
1±0.05
0.5
0.5±0.05
FEATURES
• TDK has manufactured MPZ1005 type as EMI countermeasure
product for power line.
• This type is the best for energy-saving in the low DC resistance.
• No cross talk with closed magnetic circuit structural design.
• It is a product conforming to RoHS directive.
0.5
0.4
0.5
0.5±0.05
0.1min.
APPLICATIONS
Removal of power line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
Weight: 1mg
Dimensions in mm
SPECIFICATIONS
PRODUCT IDENTIFICATION
MPZ 1005 S 121 C T
(1)
(2) (3) (4) (5) (6)
Operating temperature range
Storage temperature range
–40 to +85°C
–40 to +85°C(After mount)
(7)
PACKAGING STYLE AND QUANTITIES
(1) Series name
(2) Dimensions LW
(3) Type name
(4) Impedance
121: 120 at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping(reel)
(7) TDK internal code
Packaging style
Taping
Quantity
10000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
Natural
cooling
230˚C
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
180˚C
150˚C
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
ELECTRICAL CHARACTERISTICS
Part No.
MPZ1005S100C
MPZ1005S300C
MPZ1005S600C
MPZ1005S121C
MPZ1005Y900C

Impedance
( )[100MHz]
10±5
30±10
60±25%
120±25%
90±25%
DC resistance
( )max.
0.025
0.035
0.060
0.090
0.100
Rated current
(A)max.
2.0
1.7
1.5
1.2
1.2
Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
Test temperature: 25±10°C
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-08 / 20120925 / e9413_mpz
(4/12)
TYPICAL ELECTRICAL CHARACTERISTICS
Z FREQUENCY CHARACTERISTICS
MPZ1005S/MPZ1005Y SERIES
250
MPZ1005Y900C
MPZ1005S121C
Impedance (Ω)
200
MPZ1005S600C
150
MPZ1005S300C
MPZ1005S100C
100
50
0
1
10
100
1000
Frequency (MHz)
10000
Z, X, R vs. FREQUENCY CHARACTERISTICS
MPZ1005S100C
MPZ1005S300C
MPZ1005S600C
50
18
100
16
40
12
10
R
8
6
4
0
1
10
100
1000
Frequency (MHz)
30
R
20
0
10000
MPZ1005S121C
1
10
60
R
Z
40
20
100
1000
Frequency (MHz)
0
10000
X
1
10
100
1000
Frequency (MHz)
10000
MPZ1005Y900C
250
200
200
150
Impedance (Ω)
Impedance (Ω)
X
10
X
2
80
Z
Impedance (Ω)
Z
Impedance (Ω)
Impedance (Ω)
14
Z
R
100
X
50
Z
150
R
100
50
X
10
100
1000
Frequency (MHz)
10000
1
10
100
1000
Frequency (MHz)
PACKAGING STYLES
REEL DIMENSIONS
10000
TAPE DIMENSIONS
Sprocket hole
1.5 +0.1
–0.0
Cavity
0.8max.
0.65±0.1
4.0±0.1
2.0±0.05
2.0±0.5
8.4 +2.0
–0.0
ø13±0.2
14.4max.
160min.
Taping
2.0±0.05
1.15±0.1
ø60min.
8.0±0.3
1.0
3.5±0.05
1
0
1.75±0.1
0
200min.
ø21±0.8
ø180±2.0
Dimensions in mm
Drawing direction
300min.
Dimensions in mm
• All specifications are subject to change without notice.
001-08 / 20120925 / e9413_mpz
(5/12)
Chip Beads
For Power Line
Conformity to RoHS Directive
MPZ Series MPZ1608
APPLICATIONS
Removal of power line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
PRODUCT IDENTIFICATION
MPZ 1608 S 221 A T
(1)
(2) (3) (4) (5) (6)
(7)
(1) Series name
(2) Dimensions LW
(3) Type name
(4) Impedance
221: 220 at 100MHz
(5) Characteristic type
(6) Packaging style
T: Taping
(7) TDK internal code
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
MATERIAL CHARACTERISTICS
B material: This type is perfectly suited for fast digital signals. By
equalizing R components and X components that
beads possess at a frequency of 5MHz, it is able to
suppress overshooting, undershooting and ringing of
fast digital signals.
R material: For wide frequency applications calling for broad
impedance characteristics.
For digital signal line applications calling requiring
good waveform integrity. Impedance values selected
for effectiveness at 10 to 200MHz.
S material: Standard type that features impedance characteristics
similar to those of a typical ferrite core.
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for
effectiveness at 40 to 300MHz.
Y material: High frequency range type intended for the 100MHz
region and above.
For signal line applications in which the signal
frequency is far from the cutoff frequency. Impedance
values selected for effectiveness at 80 to 400MHz.
D material: For applications calling for low insertion loss at low
frequencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high
frequencies (300MHz to 1GHz) for signal line
applications.
TYPICAL MATERIAL CHARACTERISTICS
2500
D
2000
Y
Impedance(Ω)
FEATURES
• This type is the best for energy-saving in the low DC resistance.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
1500
1000
R
S
500
B
0
10
100
Frequency(MHz)
1000
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-08 / 20120925 / e9413_mpz
(6/12)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
1.6±0.15
0.8
0.6
0.8
0.8±0.15
0.6
0.3±0.2
T
0.3±0.2
Dimensions in mm
Thickness(T)
0.6±0.15mm
0.8±0.15mm
Weight
3mg
4mg
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
–55 to +125°C(After mount)
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
4000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
ELECTRICAL CHARACTERISTICS
Part No.
MPZ1608B471A
MPZ1608S300A
MPZ1608S600A
MPZ1608S101A
MPZ1608S121A
MPZ1608S181A
MPZ1608S221A
MPZ1608S331A
MPZ1608R391A
MPZ1608S471A
MPZ1608S601A
MPZ1608S102A
MPZ1608Y600B
MPZ1608Y101B
MPZ1608Y151B
MPZ1608Y221B
MPZ1608D300B
MPZ1608D600B
MPZ1608D101B
Impedance
()[100MHz]1
470±25%
30±10
60±25%
100±25%
120±25%
180±25%
220±25%
330±25%
390±25%
470±25%
600±25%
1000±25%
60±25%
100±25%
150±25%
220±25%
30±10
60±25%
100±25%
DC resistance
( )max.
0.150
0.010
0.020
0.030
0.045
0.050
0.050
0.080
0.120
0.150
0.150
0.300
0.030
0.040
0.050
0.100
0.060
0.100
0.150
Rated current2
(A)max.
1.0
5.0
3.5
3.0
2.0
2.0
2.2
1.7
1.2
1.0
1.0
0.8
2.3
2.0
1.8
1.5
1.8
1.2
1.0
Thickness
T(mm)
0.8
0.6
0.6
0.6
0.6
0.6
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
1
Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
Test temperature: 25±10°C
2 Please refer to the graph of RATED CURRENT vs. TEMPERATURE
CHARACTERISTICS(DERATING) about the rating current at 85°C or
more in temperature of the product.
RATED CURRENT vs. TEMPERATURE CHARACTERISTICS
(DERATING)
10s max.
250 to 260˚C
6
Natural
cooling
230˚C
180˚C
150˚C
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
Rated current(A)
5
4
3
2
1
0
–55 –35
–15
5
25
45
65
Temperature(˚C)
85
105
125
S300A
S600A
S101A
Y600B
S221A
S121A,S181A,Y101B
Y151B,D300B
S331A
Y221B
R391A,D600B
B471A,S471A,S601A,D101B
S102A
• All specifications are subject to change without notice.
001-08 / 20120925 / e9413_mpz
(7/12)
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MPZ1608B471A
MPZ1608S300A
MPZ1608S600A
100
40
500
35
Z
300
R
200
25
R
20
Z
15
10
X
100
80
30
Impedance(Ω)
Impedance(Ω)
Impedance(Ω)
400
X
60
Z
R
40
X
20
5
0
1
10
100
1000
Frequency (MHz)
0
10000
MPZ1608S101A
1
10
100
1000
Frequency (MHz)
0
10000
MPZ1608S121A
Z
80
R
60
40
R
100
1
10
100
1000
Frequency (MHz)
0
10000
MPZ1608S221A
1
10
100
1000
Frequency (MHz)
10
100
1000
Frequency (MHz)
10000
400
400
200
Z
150
R
100
X
300
Z
250
Impedance(Ω)
Impedance(Ω)
R
200
150
X
100
50
Z
300
R
200
X
100
50
1
10
100
1000
Frequency (MHz)
0
10000
MPZ1608S471A
1
100
1000
Frequency (MHz)
800
600
700
Impedance(Ω)
500
Z
R
300
200
100
10
100
1000
Frequency (MHz)
10
100
1000
Frequency (MHz)
10000
MPZ1608S102A
1000
600
500
Z
R
400
300
X
10000
0
800
Z
600
1
10
100
1000
Frequency (MHz)
10000
R
400
X
200
100
1
1
1200
200
X
0
10000
MPZ1608S601A
700
400
10
Impedance(Ω)
Impedance(Ω)
1
500
350
Impedance(Ω)
X
MPZ1608R391A
450
250
0
100
0
10000
MPZ1608S331A
300
0
R
150
50
X
20
0
Z
200
50
X
10000
250
Z
150
Impedance(Ω)
Impedance(Ω)
Impedance(Ω)
100
100
1000
Frequency (MHz)
300
140
120
10
MPZ1608S181A
200
160
1
0
1
10
100
1000
Frequency (MHz)
10000
• All specifications are subject to change without notice.
001-08 / 20120925 / e9413_mpz
(8/12)
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MPZ1608Y600B
MPZ1608Y101B
MPZ1608Y151B
300
200
140
250
Z
80
R
60
40
Z
100
1
10
R
X
50
X
20
0
150
Impedance(Ω)
100
Impedance(Ω)
Impedance(Ω)
120
200
Z
150
R
100
X
50
100
1000
Frequency (MHz)
0
10000
1
10
100
1000
Frequency (MHz)
0
10000
1
10
100
1000
Frequency (MHz)
10000
MPZ1608Y221B
350
250
Z
200
R
150
100
X
0
1
10
100
1000
Frequency (MHz)
10000
MPZ1608D300B
MPZ1608D600B
MPZ1608D101B
350
250
600
300
500
Z
R
100
150
100
0
10
100
1000
Frequency (MHz)
X
10000
1
10
PACKAGING STYLES
REEL DIMENSIONS
100
1000
Frequency (MHz)
400
Z
300
R
200
X
100
50
X
1
R
200
50
0
Z
250
Impedance(Ω)
150
Impedance(Ω)
Impedance(Ω)
200
0
10000
1
10
100
1000
Frequency (MHz)
10000
TAPE DIMENSIONS
Sprocket hole
1.5 +0.1
–0.0
Cavity
1.1max.
1.1±0.2
4.0±0.1
4.0±0.1
2.0±0.05
2.0±0.5
8.4 +2.0
–0.0
ø13±0.2
14.4max.
160min.
Taping
1.9±0.2
ø60min.
8.0±0.3
1.0
3.5±0.05
50
1.75±0.1
Impedance(Ω)
300
200min.
ø21±0.8
ø180±2.0
Dimensions in mm
Drawing direction
300min.
Dimensions in mm
• All specifications are subject to change without notice.
001-08 / 20120925 / e9413_mpz
(9/12)
Chip Beads
For Power Line
Conformity to RoHS Directive
MPZ Series MPZ2012
APPLICATIONS
Removal of power line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
1.2
1.25±0.2
2.0±0.2
0.8
0.5±0.3
1
0.8
0.85±0.2
FEATURES
• The MPZ series are multilayer chip impeders for power supply
line applications.
• High miniaturized, these parts nonetheless exhibit low DC
resistance and high current handling capability.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
Weight: 8mg
Dimensions in mm
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
–55 to +125°C(After mount)
PRODUCT IDENTIFICATION
MPZ 2012 S 331 A T
(1)
(2) (3) (4) (5) (6)
PACKAGING STYLE AND QUANTITIES
(7)
(1)Series name
(2)Dimensions LW
(3)Type name
(4)Impedance
331: 330 at 100MHz
(5)Characteristic type
(6)Packaging style
T: Taping
(7) TDK internal code
Packaging style
Taping
Quantity
4000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
Natural
cooling
230˚C
180˚C
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
150˚C
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-08 / 20120925 / e9413_mpz
(10/12)
ELECTRICAL CHARACTERISTICS
7
S300A
6
1
Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
Test temperature: 25±10°C
2 Please refer to the graph of RATED CURRENT vs. TEMPERATURE
CHARACTERISTICS(DERATING) about the rating current at 85°C or
more in temperature of the product.
5
S101A
4
S221A
S331A
S601A
S102A
3
2
1
0
–55 –35
–15
5
25
45
65
Temperature(˚C)
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MPZ2012S300A
MPZ2012S101A
30
Impedance(Ω)
Impedance(Ω)
40
Z
R
20
X
10
140
300
120
250
100
Z
80
R
60
40
1
10
100
1000
Frequency (MHz)
0
10000
10
200
Z
R
150
100
50
100
1000
Frequency (MHz)
0
10000
MPZ2012S601A
1
700
1200
350
600
1000
250
Z
R
200
150
X
100
Z
400
R
300
200
400
X
200
0
0
0
100
1000
Frequency (MHz)
10000
R
600
100
10
10000
800
50
1
100
1000
Frequency (MHz)
Z
500
Impedance(Ω)
300
10
MPZ2012S102A
400
Impedance(Ω)
Impedance(Ω)
MPZ2012S331A
1
125
X
X
20
0
105
MPZ2012S221A
Impedance(Ω)
50
85
1
10
100
1000
Frequency (MHz)
PACKAGING STYLES
REEL DIMENSIONS
10000
X
1
10
100
1000
Frequency (MHz)
10000
TAPE DIMENSIONS
Sprocket hole
1.5 +0.1
–0.0
Cavity
1.1max.
1.5±0.2
4.0±0.1
4.0±0.1
2.0±0.05
2.0±0.5
8.4 +2.0
–0.0
ø13±0.2
14.4max.
160min.
Taping
2.3±0.2
ø60min.
8.0±0.3
1.0
3.5±0.05
MPZ2012S300A
MPZ2012S101A
MPZ2012S221A
MPZ2012S331A
MPZ2012S601A
MPZ2012S102A
1.75±0.1
Part No.
RATED CURRENT vs. TEMPERATURE CHARACTERISTICS
(DERATING)
Rated current2
(A)max.
6
4
3
2.5
2
1.5
DC resistance
( )max.
0.010
0.020
0.040
0.050
0.100
0.150
Rated current(A)
Impedance
( )[100MHz]1
30±10
100±25%
220±25%
330±25%
600±25%
1000±25%
200min.
ø21±0.8
ø180±2.0
Dimensions in mm
Drawing direction
300min.
Dimensions in mm
• All specifications are subject to change without notice.
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Chip Beads
For Power Line
Conformity to RoHS Directive
MPZ Series MPZ1005-E
APPLICATIONS
Removal of power line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, PNDs, etc.
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
0.5
0.5±0.05
1±0.05
0.5
0.1min.
0.4
0.5
0.5±0.05
FEATURES
• TDK has manufactured MPZ1005 type as EMI countermeasure
product for power line.
• Compared with the existing MPZ1005 type, this new product has
broad-band impedance values for higher frequency ranges.
• This type is the best for energy-saving in the low DC resistance.
• No cross talk with closed magnetic circuit structural design.
• It is a product conforming to RoHS directive.
Weight: 1mg
Dimensions in mm
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
–55 to +125°C(After mount)
PRODUCT IDENTIFICATION
MPZ 1005 S 221 E T
(1)
(2) (3) (4) (5) (6)
PACKAGING STYLE AND QUANTITIES
(7)
(1) Series name
(2) Dimensions LW
(3) Type name
(4) Impedance
221:220 at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping(reel)
(7) TDK internal code
Packaging style
Taping
Quantity
10000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
Natural
cooling
230˚C
180˚C
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
150˚C
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-08 / 20120925 / e9413_mpz
(12/12)
ELECTRICAL CHARACTERISTICS
Impedance( )1
[100MHz] [1GHz]
220±25% 350±40%
330±25% 550±40%
Part No.
MPZ1005S221E
MPZ1005S331E
DC resistance
( )max.
0.22
0.28
Rated current
(A)max.2
0.9
0.7
RATED CURRENT vs. TEMPERATURE CHARACTERISTICS
(DERATING)
1.0
0.9
S221E
0.8
1
Rated current(A)
Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
Test temperature: 25±10°C
2 Please refer to the graph of RATED CURRENT vs. TEMPERATURE
CHARACTERISTICS(DERATING) about the rating current at 85°C or
more in temperature of the product.
0.7
S331E
0.6
0.5
0.4
0.3
0.2
0.1
0.0
–55 –35
–15
5
25
45
65
Temperature(˚C)
85
105
125
TYPICAL ELECTRICAL CHARACTERISTICS
Z FREQUENCY CHARACTERISTICS
MPZ1005S-E SERIES
600
MPZ1005S331E
500
Impedance (Ω)
MPZ1005S221E
400
300
200
100
0
1
10
100
1000
Frequency (MHz)
10000
Z, X, R vs. FREQUENCY CHARACTERISTICS
MPZ1005S221E
MPZ1005S331E
600
400
500
Z
250
R
150
100
X
1
10
100
1000
Frequency (MHz)
200
X
100
50
0
R
300
0
10000
1
10
100
1000
Frequency (MHz)
PACKAGING STYLES
REEL DIMENSIONS
10000
TAPE DIMENSIONS
Sprocket hole
1.5 +0.1
–0.0
Cavity
0.8max.
0.65±0.1
4.0±0.1
2.0±0.05
2.0±0.5
8.4 +2.0
–0.0
ø13±0.2
14.4max.
160min.
Taping
2.0±0.05
1.15±0.1
ø60min.
8.0±0.3
1.0
3.5±0.05
200
Z
400
1.75±0.1
300
Impedance (Ω)
Impedance (Ω)
350
200min.
ø21±0.8
ø180±2.0
Dimensions in mm
Drawing direction
300min.
Dimensions in mm
• All specifications are subject to change without notice.
001-08 / 20120925 / e9413_mpz