NL17SV00XV5T2 Single 2−Input NAND Gate The NL17SV00 is an ultra−high performance 2−Input NAND gate manufactured in 0.35 m technology, with excellent performance down to 0.9 V. This device is ideal for extremely high speed and high−drive applications. Additionally, limitations of board space are no longer a constraint. The very small SOT−553 makes this device fit most tight designs and spaces. http://onsemi.com Features • • • • • • • Extremely High Speed: 1.0 ns (Typ) @ VCC = 3.3 V Designed for 0.9 to 3.3 V Operation Overvoltage Tolerance (OVT)* Input Pins Permits Logic Translation Balanced 24 mA Output Drive @ VCC 3.3 V Near Zero Static Supply Current Ultra−Tiny SOT−553 5−Pin Package, only 1.6 x 1.6 x 0.6 mm All Devices in Package SOT−553 are Inherently Pb−Free** MARKING DIAGRAM 5 1 UH = Specific Device Code D = Date Code Typical Applications • • • • Cellular Digital Camera PDA Digital Video UH D SOT−553 CASE 463B PIN DIAGRAM Industry Leadership • Functionally Similar to NC7SV00 and SN74AUC1G00 IN A & IN B 1 IN A 2 GND 3 OUT Y Figure 1. Logic Symbol FUNCTION TABLE Output A B Y L L H H L H L H H H H L VCC 4 OUT Y PIN ASSIGNMENT IN B Inputs 5 PIN # FUNCTION 1 IN B 2 IN A 3 GND 4 OUT Y 5 VCC ORDERING INFORMATION *Overvoltage Tolerance (OVT) enables input pins to function outside (higher) of their operating voltages, with no damage to the devices or to signal integrity. Device Package Shipping† NL17SV00XV5T2 SOT−553 (Pb−Free) 4000 Tape & Reel (178 mm) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. **For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2005 January, 2005 − Rev. 2 1 Publication Order Number: NL17SV00XV5T2/D NL17SV00XV5T2 MAXIMUM RATINGS Symbol VCC Rating DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current IO Value Unit −0.5 to + 4.6 V −0.5 to + 4.6 V −0.5 to VCC +0.5 V VI < GND ±50 mA VO = GND VO = VCC −50 +50 mA DC Output Sink Current ±50 mA ICC DC Supply Current per Supply Pin ±50 mA IGND DC Ground Current per Ground Pin TSTG Storage Temperature Range ±50 mA − 65 to +150 °C °C TL Lead Temperature, 1.0 mm from Case for 10 seconds 260 TJ Junction Temperature Under Bias +150 °C JA Thermal Resistance (Note 1) 250 °C/W PD Power Dissipation in Still Air at 85°C 250 mW MSL Moisture Sensitivity FR Flammability Rating Level 1 Oxygen index: 28 to 34 UL 94 V−0 @ 0125 in Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Positive DC Supply Voltage VIN Digital Input Voltage Vout Output Voltage IOH/IOL Output Current tA Max Unit 0.9 3.6 V 0 3.6 V 0 VCC V ±24 ±18 ±6 ±4 ±2 ±0.1 mA −40 +85 °C 0 10 nS/V VCC = 3.0 V to 3.6 V VCC = 2.3 V to 2.7 V VCC = 1.65 V to 1.95 V VCC = 1.4 V to 1.6 V VCC = 1.1 V to 1.3 V VCC = 0.9 V Operating Temperature Range. All Package Types tr, tf Min VCC = 3.3V ± 0.3 V Input Rise or Fall Time DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature °C Time, Hours Time, Years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 http://onsemi.com 2 NL17SV00XV5T2 DC CHARACTERISTICS– Digital Section (Voltages Referenced to GND) TA = 25°C Symbol Parameter VCC Min VIH High Level Input Voltage 0.90 1.10 = VCC 1.30 1.40 VCC 1.60 1.65 VCC 1.95 2.30 VCC 2.70 2.70 VCC 3.60 0.65 x VCC 0.65 x VCC 0.65 x VCC 0.65 x VCC 1.6 2.0 VIL Low Level Input Voltage 0.90 1.10 VCC 1.30 1.40 VCC 1.60 1.65 VCC 1.95 2.30 VCC 2.70 2.70 VCC 3.60 VOH High Level Output Voltage VOL Low Level Output Voltage IIN Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current Condition TA = −40 to 85°C Max Min Max 0.65 x VCC 0.65 x VCC 0.65 x VCC 0.65 x VCC 1.6 2.0 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.7 0.8 Unit V 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.7 0.8 V IOH = −100 A 0.90 1.10 VCC 1.30 1.40 VCC 1.60 1.65 VCC 1.95 2.30 VCC 2.70 2.70 VCC 3.60 VCC − 0.1 VCC − 0.1 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.1 VCC − 0.1 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.2 IOH = −2.0 mA 1.10 VCC 1.30 0.75 x VCC 0.75 x VCC IOH = −4.0 mA 1.40 VCC 1.60 0.75 x VCC 0.75 x VCC IOH = −6.0 6 0 mA 1.65 65 VCC 1.95 95 2.30 VCC 2.70 1.25 5 2.0 1.25 5 2.0 IOH = −12 mA 2.30 VCC 2.70 2.70 VCC 3.60 1.8 2.2 1.8 2.2 IOH = −18 mA 2.30 VCC 2.70 2.70 VCC 3.60 1.7 2.4 1.7 2.4 IOH = −24 mA 2.70 VCC 3.60 2.2 2.2 IOL = 100 A 0.90 1.10 VCC 1.30 1.40 VCC 1.60 1.65 VCC 1.95 2.30 VCC 2.70 2.70 VCC 3.60 0.1 0.1 0.2 0.2 0.2 0.2 0.1 0.1 0.2 0.2 0.2 0.2 IOL = 2.0 mA 1.10 VCC 1.30 0.25 x VCC 0.25 x VCC IOL = 4.0 mA 1.40 VCC 1.60 0.25 x VCC 0.25 x VCC IOL = 6.0 mA 1.65 VCC 1.95 0.3 0.3 IOL = 12 mA 2.30 VCC 2.70 2.70 VCC 3.60 0.4 0.4 0.4 0.4 IOL = 18 mA 2.30 VCC 2.70 2.70 VCC 3.60 0.6 0.4 0.6 0.4 IOL = 24 mA 2.70 VCC 3.60 0.55 0.55 0 = VI = 3.6 V 0.90 to 3.60 ±0.1 ±0.9 A 0 1 5 A 0.90 to 3.60 0.9 5 A VI = VCC or GND http://onsemi.com 3 V V NL17SV00XV5T2 AC CHARACTERISTICS (Input tr = tf = 3.0 nS) −40°C 25°C Min Typ 85°C Symbol Parameter Condition VCC Max Min Max TPHL,, TPLH Propagation Delay CL = 15 pF, RL = 1.0 M 0.90 CL = 15 pF, RL = 2.0 k 1.10 VCC 1.30 1.40 VCC 1.60 3.0 1.0 6.0 3.2 9.9 6.0 1.0 1.0 14.6 7.2 nS CL = 30 pF, RL = 500 k 1.65 VCC 1.95 2.30 VCC 2.70 2.70 VCC 3.60 1.0 0.8 0.7 1.9 1.2 1.0 4.5 2.6 2.3 1.0 0.7 0.6 5.3 3.7 3.0 nS 13 Unit nS CIN Input Capacitance 0 2.0 pF COUT Output Capacitance 0 4.5 pF CPD Power Dissipation Capacitance 0.90 to 3.60 20 pF VI = 0 V or VCC F = 10 MHz http://onsemi.com 4 NL17SV00XV5T2 PACKAGE DIMENSIONS SOT−553 5−LEAD PACKAGE CASE 463B−01 ISSUE A A −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. C K 4 1 2 B −Y− 3 D G S DIM A B C D G J K S J 5 PL 0.08 (0.003) M X Y MILLIMETERS MIN MAX 1.50 1.70 1.10 1.30 0.50 0.60 0.17 0.27 0.50 BSC 0.08 0.18 0.10 0.30 1.50 1.70 SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 INCHES MIN MAX 0.059 0.067 0.043 0.051 0.020 0.024 0.007 0.011 0.020 BSC 0.003 0.007 0.004 0.012 0.059 0.067 NL17SV00XV5T2 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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