Mitsubishi CM400DX-12A Igbt modules high power switching use Datasheet

MITSUBISHI IGBT MODULES
CM400DX-12A
HIGH POWER SWITCHING USE
CM400DX-12A
¡IC ................................................................... 400A
¡VCES ............................................................ 600V
¡Dual
¡Flatbase Type / Insulated Package /
Copper (non-plating) base plate
¡RoHS Directive compliant
APPLICATION
General purpose Inverters, Servo Amplifiers, Power supply, etc.
OUTLINE DRAWING & CIRCUIT DIAGRAM
Dimensions in mm
(20.5)
4-M6 NUTS
17
TERMINAL t = 0.8
7
φ4.3
48
23
1.5
24
1
2
3
4
5
6
7
8
φ2.5
φ2.1
12.5
39
50 ±0.5
57.5
62
*58.4
(14)
(14)
22
17
17
12
12
6
6
46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
47
(7.4)
1.2
(3.81)
(13.5)
0.8
(4.2)
(13.5)
1.15
0.65
152
137
121.7
110 ±0.5
99
94.5
9 10 11 12 13 14 15 16 17 18 19 20 21 22
SECTION A
A
LABEL
E2(39) G2(38)
Tr2
E1C2
(24)
E2(47)
C1(48)
E1C2
(23)
Di1
Tr1
Th
NTC
G1(15)
TH2(2)
13
C1(22)
E1(16)
*Pin positions
with tolerance
φ 0.5
Tolerance otherwise specified
Division of Dimension
Di2
TH1(1)
*95
(102.25)
*68.34
*72.14
4-φ5.5 MOUNTING HOLES
*41.66
*45.48
3.5
0
(7.75)
*15
*18.8
(21.14)
(3)
(5.4)
12.5
(SCREWING DEPTH)
17 +1
-0.5
6.5
Tolerance
3
±0.2
to
6
±0.3
to
30
±0.5
30
to
120
±0.8
over 120
to
400
±1.2
0.5
to
over
3
over
6
over
CIRCUIT DIAGRAM
Jan. 2009
MITSUBISHI IGBT MODULES
CM400DX-12A
HIGH POWER SWITCHING USE
ABSOLUTE MAXIMUM RATINGS
INVERTER PART
Symbol
VCES
VGES
IC
ICRM
PC
IE (Note.3)
IERM(Note.3)
Tj
Tstg
Viso
—
—
—
—
(Tj = 25°C, unless otherwise specified)
Parameter
Collector-emitter voltage
Gate-emitter voltage
Conditions
G-E Short
C-E Short
(Note. 1)
DC, TC = 60°C
Collector current
(Note. 4)
Pulse
(Note. 1, 5)
Maximum collector dissipation TC = 25°C
(Note. 1)
Emitter current
TC = 25°C
(Note. 4)
(Free wheeling diode forward current) Pulse
Junction temperature
Storage temperature
Isolation voltage
Terminals to base plate, f = 60Hz, AC 1 minute
(Note. 8)
Base plate flatness
On the centerilne X, Y
Torque strength
Main terminals
M6 screw
Torque strength
Mounting
M5 screw
Weight
(Typical)
Rating
600
±20
400
800
1340
400
800
–40 ~ +150
–40 ~ +125
2500
±0 ~ +100
3.5 ~ 4.5
2.5 ~ 3.5
330
Unit
V
A
W
A
°C
Vrms
μm
N·m
g
+:convex
–:concave
–
Y
+
Heat sink side
Note. 8: The base plate flatness measurement points are in the following figure.
X
–
+
Heat sink side
Jan. 2009
2
MITSUBISHI IGBT MODULES
CM400DX-12A
HIGH POWER SWITCHING USE
ELECTRICAL CHARACTERISTICS
INVERTER PART
Symbol
(Tj = 25°C, unless otherwise specified)
Parameter
Conditions
ICES
VGE(th)
IGES
VCE = VCES, VGE = 0V
Collector cutoff current
Gate-emitter threshold voltage IC = 40mA, VCE = 10V
Gate leakage current
±VGE = VGES, VCE = 0V
VCE(sat)
Collector-emitter saturation voltage
IC = 400A, VGE = 15V
(Note. 6)
IC = 400A, VGE = 15V
Cies
Coes
Cres
QG
td(on)
tr
td(off)
tf
trr (Note.3)
Qrr (Note.3)
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Reverse recovery time
Reverse recovery charge
VEC(Note.3) Emitter-collector voltage
Rlead
Rth(j-c)Q
Rth(j-c)R
Rth(c-f)
RGint
RG
VCE = 10V
VGE = 0V
Tj = 25°C
Tj = 125°C
Chip
(Note. 6)
VCC = 300V, IC = 400A, VGE = 15V
VCC = 300V, IC = 400A
VGE = ±15V, RG = 3.6Ω
Inductive load
(IE = 400A)
(Note. 6)
IE = 400A, VGE = 0V
IE = 400A, VGE = 0V
Module lead resistance
Main terminals-chip, per switch
Thermal resistance
per IGBT
(Note. 1) per free wheeling diode
(Junction to case)
Contact thermal resistance
Thermal grease applied
(Case to heat sink) (Note. 1) per 1 module
Internal gate resistance
TC = 25°C
External gate resistance
Tj = 25°C
Tj = 125°C
Chip
(Note. 2)
Min.
—
5
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Limits
Typ.
—
6
—
1.7
1.9
1.6
—
—
—
1100
—
—
—
—
—
2.0
1.95
1.9
1.1
—
—
Max.
1
7
0.5
2.1
—
—
50
5.3
1.6
—
200
200
400
600
200
—
2.8
—
—
—
0.093
0.16
—
0.015
—
—
1.6
0
—
—
16
Min.
4.85
–7.3
—
—
Limits
Typ.
5.00
—
3375
—
Max.
5.15
+7.8
—
10
Unit
mA
V
μA
V
nF
nC
ns
μC
V
mΩ
K/W
Ω
NTC THERMISTOR PART
Symbol
R
ΔR/R
B(25/50)
P25
Parameter
Zero power resistance
Deviation of resistance
B constant
Power dissipation
Conditions
TC = 25°C
TC = 100°C, R100 = 493Ω
Approximate by equation
TC = 25°C
(Note. 7)
Unit
kΩ
%
K
mW
Note.1:
2:
3:
4:
5:
6:
Case temperature (TC), heat sink temperature (Tf) measured point is just under the chips. (Refer to the figure of the chip location.)
Typical value is measured by using thermally conductive grease of λ = 0.9W/(m·K).
IE, IERM, VEC, trr and Qrr represent ratings and characteristics of the anti-parallel, emitter-collector free wheeling diode (FWDi).
Pulse width and repetition rate should be such that the device junction temperature (Tj) dose not exceed Tjmax rating.
Junction temperature (Tj) should not increase beyond 150°C.
Pulse width and repetition rate should be such as to cause negligible temperature rise.
(Refer to the figure of the test circuit for VCE(sat) and VEC)
1
7: B(25/50) = In( R25 )/( 1
)
T50
R50 T25
R25: resistance at absolute temperature T25 [K]; T25 = 25 [°C]+273.15 = 298.15 [K]
R50: resistance at absolute temperature T50 [K]; T50 = 50 [°C]+273.15 = 323.15 [K]
Jan. 2009
3
MITSUBISHI IGBT MODULES
CM400DX-12A
HIGH POWER SWITCHING USE
Dimensions in mm (tolerance: ±1mm)
Chip Location (Top view)
(152)
(121.7)
(110)
0
0
46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
47
(50)
Di 2
24
Tr2
Di 1
Th
32.0
48
Tr1
5
6
7
8
30.0
23
43.6
9 10 11 12 13 14 15 16 17 18 19 20 21 22
78.6
4
43.2
3
36.3
2
29.6
1
0
(62)
21.5
LABEL SIDE
Each mark points the center position of each chip. Tr*: IGBT, Di*: FWDi, Th: NTC thermistor
Jan. 2009
4
MITSUBISHI IGBT MODULES
CM400DX-12A
HIGH POWER SWITCHING USE
C1
C1
C1(C1s)
V
C1(C1s)
VGE = 15V
VGE = 0V
IC
G1
G1
E1(E1s)
E1(E1s)
E1C2
E1C2
VGE = 0V
VGE = 15V
G2
G2
E2(E2s)
IC
V
IE
V
E2
E2(E2s)
E2
Tr1
Tr2
VCE(sat) test circuit
C1
C1
C1(C1s)
V
C1(C1s)
VGE = 0V
VGE = 0V
IE
G1
G1
E1(E1s)
E1(E1s)
E1C2
E1C2
VGE = 0V
VGE = 0V
G2
G2
E2(E2s)
E2
E2(E2s)
E2
Di1
Di2
VEC test circuit
Arm
VGE
IE
IE
90%
0V
0%
trr
Load
–VGE
+
VCC
IC
0A
90%
+VGE
0V
RG
VGE
–VGE
t
VCE
Irr
IC
10%
0A
td(on)
tr
td(off)
Switching time test circuit and waveforms
1/2 ✕ Irr
Qrr = 1/2 ✕ Irr ✕ trr
tf
trr, Qrr test waveform
Jan. 2009
5
MITSUBISHI IGBT MODULES
CM400DX-12A
HIGH POWER SWITCHING USE
PERFORMANCE CURVES
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL) Inverter part
Tj = 25°C
12
13
600
500
11
400
300
200
10
100
9
8
0
COLLECTOR-EMITTER
SATURATION VOLTAGE VCE(sat) (V)
15
VGE =
700 20V
0
1
2
3
4
5
6
7
8
9 10
VGE = 15V
3
2.5
2
1.5
1
0.5
0
Tj = 25°C
Tj = 125°C
0
100 200 300 400 500 600 700 800
COLLECTOR CURRENT IC (A)
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL) Inverter part
FREE WHEELING DIODE
FORWARD CHARACTERISTICS
(TYPICAL) Inverter part
10
103
Tj = 25°C
8
6
4
IC = 400A
IC = 800A
2
7
5
3
2
102
7
5
3
2
IC = 160A
0
6
8
10
12
14
16
18
101
20
1.5
2
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL) Inverter part
104
Cies
Coes
100
7
5
3
2
1
CAPACITANCE CHARACTERISTICS
(TYPICAL) Inverter part
101
7
5
3
2
0.5
EMITTER-COLLECTOR VOLTAGE VEC (V)
SWITCHING TIME (ns)
7
5
3
2
0
Tj = 25°C
Tj = 125°C
2.5 3 3.5 4
GATE-EMITTER VOLTAGE VGE (V)
102
CAPACITANCE (nF)
3.5
COLLECTOR-EMITTER VOLTAGE VCE (V)
EMITTER CURRENT IE (A)
COLLECTOR CURRENT IC (A)
800
COLLECTOR-EMITTER
SATURATION VOLTAGE VCE(sat) (V)
OUTPUT CHARACTERISTICS
(TYPICAL) Inverter part
Cres
VGE = 0V
10–1 –1
10 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102
Conditions:
VCC = 300V
VGE = ±15V
RG = 3.6Ω
Tj = 125°C
Inductive load
7
5
3
2
tf
103
7
5
3
2
102
td(off)
td(on)
7
5
3
2
101 1
10
tr
2
3
5 7 102
2
3
5 7 103
COLLECTOR CURRENT IC (A)
COLLECTOR-EMITTER VOLTAGE VCE (V)
Jan. 2009
6
MITSUBISHI IGBT MODULES
CM400DX-12A
HIGH POWER SWITCHING USE
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL) Inverter part
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL) Inverter part
102
103
7
SWITCHING LOSS (mJ/pulse)
SWITCHING TIME (ns)
5
3
tf
2
td(on)
tr
102
7
Conditions:
VCC = 300V
VGE = ±15V
IC = 400A
Tj = 125°C
Inductive load
5
3
2
101 0
10
2
3
5 7 101
2
3
7
5
Err
3
2
lrr (A), trr (ns)
Eoff
2
101
7
5
Err
3
2
2
3
5 7 101
Conditions:
VCC = 300V
VGE = ±15V
IC, IE = 400A
Tj = 125°C
Inductive load
5 7 102
2
3
5 7 103
2
3
7
5
3
2
101 1
10
5 7 102
GATE RESISTANCE RG (Ω)
2
3
5 7 102
2
3
5 7 103
EMITTER CURRENT IE (A)
TRANSIENT THERMAL
IMPEDANCE CHARACTERISTICS
GATE CHARGE CHARACTERISTICS
(TYPICAL) Inverter part
100
IC = 400A
NORMALIZED TRANSIENT
THERMAL IMPEDANCE Zth(j–c)
GATE-EMITTER VOLTAGE VGE (V)
3
REVERSE RECOVERY CHARACTERISTICS
OF FREE WHEELING DIODE
(TYPICAL) Inverter part
103
7 Conditions:
VCC = 300V
5
VGE = ±15V
3 RG = 3.6Ω
Tj = 25°C
2
Irr
Inductive load
trr
102
Eon
VCC = 200V
15
VCC = 300V
10
5
0
2
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL) Inverter part
3
0
Eon
101
COLLECTOR CURRENT IC (A)
EMITTER CURRENT IE (A)
5
20
Eoff
GATE RESISTANCE RG (Ω)
7
SWITCHING LOSS (mJ/pulse)
5
100 1
10
5 7 102
102
100 0
10
Conditions:
VCC = 300V
VGE = ±15V
3 RG = 3.6Ω
Tj = 125°C
2
Inductive load
7
td(off)
7 Single pulse
5 TC = 25°C
3
2
10–1
7
5
3
2
10–2
7
5
3
2 Inverter IGBT part : Per unit base = Rth(j–c) = 0.093K/W
Inverter FWDi part : Per unit base = Rth(j–c) = 0.16K/W
10–3
10–52 3 5710–42 3 5710–32 3 5710–22 3 5710–12 3 57 100 2 3 57 101
200 400 600 800 1000 1200 1400 1600
GATE CHARGE QG (nC)
TIME (s)
Jan. 2009
7
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