WJ AH212 1 watt high linearity, high gain ingap hbt amplifier Datasheet

AH212
The Communications Edge TM
1 Watt High Linearity, High Gain InGaP HBT Amplifier
Product Features
Product Information
Product Description
Functional Diagram
The AH212 is a high dynamic range two-stage driver
amplifier in a low-cost surface mount package. The
InGaP/GaAs HBT is able to achieve superior performance
for various narrowband-tuned application circuits with up
to +46 dBm OIP3 and +30 dBm of compressed 1-dB
power. The amplifier is available in an industry-standard
SMT lead-free/green/RoHS-compliant SOIC-8 or 4x5mm
DFN package. All devices are 100% RF and DC tested.
 1800 – 2400 MHz
 26 dB Gain
 +30 dBm P1dB
 +46 dBm Output IP3
 +5V Single Positive Supply
 Internal Active Bias
Vcc1 1
Vbias1 2
7 Vcc2 / RF Out
RF In 3
6 Vcc2 / RF Out
AH212-S8G
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Noise Figure
W-CDMA Channel Power
@ -45 dBc ACLR
Operating Current Range , Icc
Stage 1 Amp Current, Icc1
Stage 2 Amp Current, Icc2
Device Voltage, Vcc
12 Vcc1
N/C 2
11 N/C
RF In 3
10 Vcc2 / RF Out
N/C 4
9 Vcc2 / RF Out
N/C 5
8 N/C
Vbias2 6
7 N/C
AH212-EG
Specifications (1)
Parameters
Vbias1 1
such as GPRS, GSM, CDMA, W-CDMA, TD-SCDMA,
and WiBro, where high linearity and high power is
required. The internal active bias allows the AH212 to
maintain high linearity over temperature and operate
directly off a +5 V supply.
 Mobile Infrastructure
 WiBro Infrastructure
 TD-SCDMA
5 N/C
Vbias2 4
 Lead-free/green/RoHS-compliant The product is targeted for use as linear driver amplifier for
SOIC-8 & 4x5mm DFN Package various current and next generation wireless technologies
Applications
8 N/C
Typical Performance (1)
Units Min
MHz
MHz
dB
dB
dB
dBm
dBm
dB
22.2
+29
+43.5
dBm
mA
mA
mA
V
Typ
1800
Max
Parameters
2400
Frequency
Gain (3)
Input Return Loss
Output Return Loss
Output P1dB (3)
Output IP3
IS-95A Channel Power
2140
25
25
9
+29.5
+46
6.0
@ -45 dBc ACPR
W-CDMA Channel Power
@ -45 dBc ACLR
+21
340
400
85
315
5
Units
500
Noise Figure
Supply Bias
Typical
MHz
dB
dB
dB
dBm
dBm
1960
25.8
15
11
+30
+48.5
dBm
+23.5
dBm
dB
2140
25
25
9
+29.5
+46
+21
5.5
6.0
+5 V @ 400 mA
3. The performance is shown for the AH212-S8G (SOIC-8 package) at 25ºC. The AH212-EG in a 4x5
mm DFN package offers approximately 0.5dB more gain and 0.5 dB higher P1dB.
1. Test conditions unless otherwise noted: 25 ºC, +5V, in tuned application circuit.
2. 3OIP measured with two tones at an output power of +15 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Ordering Information
Parameter
Rating
Part No.
Description
Operating Case Temperature
Storage Temperature
RF Input Power (continuous)
Device Voltage
Device Current
Device Power
Junction Temperature
-40 to +85 C
-65 to +150 C
+26 dBm
+7 V
900 mA
5W
+250 ºC
AH212-S8G
1 Watt, High Gain InGaP HBT Amplifier
AH212-EG
1 Watt, High Gain InGaP HBT Amplifier
AH212-S8PCB1960
AH212-S8PCB2140
AH212-EPCB1960
AH212-EPCB2140
1960 MHz Evaluation Board
2140 MHz Evaluation Board
1960 MHz Evaluation Board
2140 MHz Evaluation Board
(lead-free/green/RoHS-compliant SOIC-8 package)
(lead-free/green/RoHS-compliant 12-pin 4x5mm DFN package)
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice.
WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: 408-577-6621  e-mail: [email protected]  Web site: www.wj.com
Page 1 of 12 August 2006
AH212
The Communications Edge TM
1 Watt High Linearity, High Gain InGaP HBT Amplifier
Product Information
Typical Device Data (SOIC-8)
S-Parameters (VCC = +5 V, ICC = 400 mA, T = 25 C, calibrated to device leads)
0.
4
3.
1.0
0.8
0
2.
0
2.
0
4
30
Swp Max
3GHz
6
0.
0.8
6
0.
Swp Max
3GHz
0.
DB(|S(2,1)|)
AH212
S22
1.0
S11
Gain
35
3.
0
0
4.
0.2
0
5.
10.0
5.0
4.0
3.0
2.0
1.0
0.8
0.6
0.4
10.0
0
10.0
5.0
4.0
3.0
2.0
1.0
0.8
0.6
0.4
0.2
20
0.2
10.0
0
Gain (dB)
0
4.
0
5.
0 .2
25
15
-10.0
-4
.0
-5
.0
-
-0
.6
-
S(2,2)
AH212
0
2.
.4
0
2.
Swp Min
0.01GHz
-1.0
S(1,1)
AH212
-0
Swp Min
0.01GHz
-1.0
.4
3
-0.8
2.5
-0
.6
2
-0.8
0
1.5
Frequency (GHz)
-3
.
1
0
0.5
-3
.
-0
0
2
-0.
-4
.0
-5
.0
5
-10.0
2
-0.
10
Notes:
The gain for the unmatched device in 50 ohm system is shown as the trace in blue color. For a band specific tuned circuit, it is expected that actual gain
will be higher. The impedance plots are shown from 50 – 3000 MHz, with markers placed at 0.5 – 3.0 GHz in 0.5 GHz increment.
S-Parameters for AH212-S8G (VCC = +5 V, ICC = 400 mA, T = 25 C, unmatched 50 ohm system, calibrated to device leads)
Freq (MHz)
50
100
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
2600
2800
3000
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
-9.19
-4.58
-0.92
-2.81
-4.10
-10.08
-14.20
-7.51
-6.58
-6.67
-7.87
-11.42
-18.51
-8.70
-4.43
-2.78
-2.44
-130.35
-125.96
-169.81
160.59
134.99
97.76
-174.16
146.36
101.88
65.24
37.31
19.84
69.85
105.38
93.47
84.89
81.11
17.61
21.86
27.39
26.96
26.35
30.19
31.30
29.49
27.14
25.02
23.35
22.01
20.56
18.40
15.61
12.91
10.51
65.80
69.36
14.98
-55.64
-69.83
-108.08
-167.40
141.86
99.61
63.05
28.87
-5.81
-44.21
-84.80
-122.39
-156.41
167.98
-64.44
-58.42
-55.39
-50.75
-49.90
-46.20
-49.63
-44.88
-45.19
-46.75
-47.96
-44.88
-40.54
-38.49
-38.94
-39.25
-38.27
122.93
-135.96
49.47
78.75
59.30
44.46
25.99
48.15
29.86
33.97
24.08
70.88
52.01
31.21
23.84
-2.01
0.70
-2.71
-2.92
-3.04
-1.13
-0.86
-0.93
-1.05
-1.97
-2.76
-2.82
-2.53
-2.08
-1.45
-1.02
-0.89
-1.16
-1.34
-145.39
-160.72
-166.12
-169.23
-179.36
172.84
164.98
159.52
156.95
154.08
150.05
143.86
134.91
123.57
113.66
106.71
101.38
Device S-parameters are available for download off of the website at: http://www.wj.com
Application Circuit PC Board Layout
Circuit Board Material: .014” FR4, four layer, 1 oz copper, Microstrip line details: width = .026”, spacing = .026”
The silk screen markers ‘A’, ‘B’, ‘C’, etc. and ‘1’, ‘2’, ‘3’, etc. are used as placemarkers for the input and output tuning
shunt capacitor – C7. The markers and vias are spaced in 0.050” increments.
Specifications and information are subject to change without notice.
WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: 408-577-6621  e-mail: [email protected]  Web site: www.wj.com
Page 2 of 12 August 2006
AH212
The Communications Edge TM
1 Watt High Linearity, High Gain InGaP HBT Amplifier
Product Information
AH212-S8 1850 MHz Reference Design
Typical RF Performance at 25 C
Frequency (MHz)
Gain (dB)
Input Return Loss (dB)
Output Return Loss (dB)
Output P1dB (dBm)
Output IP3 (dBm)
(+15 dBm / tone, 1 MHz spacing)
Vcc = +5 V
1800
26.4
10.5
15.5
+30.5
1850
26.2
12
15
+30.5
1900
26.2
12.5
13
+30
+47.5
+47.5
+48.5
Noise Figure (dB)
Device / Supply Voltage
Quiescent Current
5.8
5.8
+5 V
400 mA
CAP
ID=C9
C=47 pF
IND
ID=L1
L=18 nH
RES
ID=R2
R=0 Ohm
CAP
ID=C1
C=47 pF
PORT
P=1
Z=50 Ohm
5.9
CAP
ID=C10
C=1000 pF
CAP
ID=C6
C=1000 pF
CAP
ID=C5
C=1000 pF
CAP
ID=C11
C=4.7E6 pF
SIZE 1210
CAP
ID=C2
C=47 pF
IND
ID=L2
L=18 nH
Size 0805
CAP
ID=C8
C=47 pF
8
1
5
2 NET="AH212" 7 6
3
67
4
58
TLINP
ID=TL1
Z0=50 Ohm
L=125 mil
Eeff=4.6
Loss=0
F0=0 MHz
RES
ID=R1
R=10 Ohm
RES
ID=R3
R=75 Ohm
All passive components are of size 0603
unless otherwise noted.
CAP
ID=C4
C=1000 pF
PORT
P=2
Z=50 Ohm
CAP
ID=C7
C=2.7 pF
C7 is placed between silkscreen marker "2" and "3" on WJ's eval
Board or @ 10 degrees at 1.85GHz away from pins 6 and 7.
VBC = +5 V
S21 vs. Frequency
S11 vs. Frequency
28
0
27
-5
S11 (dB)
S21 (dB)
+25°C
26
25
24
+85°C
-10
-15
-20
+25°C
23
1800
-40°C
1820
-40°C
1840
+85°C
1860
1880
-25
1800
1900
1820
1840
1860
Frequency (MHz)
Frequency (MHz)
S22 vs. Frequency
OIP3 vs. Frequency
0
1880
1900
1880
1900
+25° C, +15 dBm/tone
55
OIP3 (dBm)
S22 (dB)
-5
-10
-15
45
40
-20
+25°C
-25
1800
50
1820
1840
-40°C
1860
Frequency (MHz)
+85°C
1880
1900
35
1800
1820
1840
1860
Frequency (MHz)
Specifications and information are subject to change without notice.
WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: 408-577-6621  e-mail: [email protected]  Web site: www.wj.com
Page 3 of 12 August 2006
AH212
The Communications Edge TM
1 Watt High Linearity, High Gain InGaP HBT Amplifier
Product Information
1960 MHz Application Circuit (AH212-S8PCB1960)
Typical RF Performance at 25 C
Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
Vcc = +5 V
1960 MHz
25.8 dB
15 dB
11 dB
+30 dBm
Channel Power
+23.5 dBm
(@-45 dBc ACPR, IS-95, 9 channels fwd)
Noise Figure
Device / Supply Voltage
Quiescent Current
CAP
ID=C9
C=47 pF
IND
ID=L1
L=18 nH
RES
ID=R2
R=0 Ohm
PORT
P=1
Z=50 Ohm
CAP
ID=C2
C=47 pF
CAP
ID=C1
C=47 pF
IND
ID=L2
L=18 nH
Size 0805
CAP
ID=C8
C=47 pF
85
1
2
5.5 dB
+5 V
400 mA
CAP
ID=C10
C=1000 pF
CAP
ID=C6
C=1000 pF
CAP
ID=C5
C=1000 pF
+48.5 dBm
(+15 dBm / tone, 1 MHz spacing)
CAP
ID=C11
C=4.7E6 pF
SIZE 1210
NET="AH212"
76
3
67
4
58
RES
ID=R3
R=75 Ohm
All passive components are of size 0603
unless otherwise noted.
CAP
ID=C4
C=1000 pF
PORT
P=2
Z=50 Ohm
TLINP
ID=TL1
Z0=50 Ohm
L=125 mil
Eeff=4.6
Loss=0
F0=0 MHz
RES
ID=R1
R=10 Ohm
CAP
ID=C 7
C=2.7 pF
C7 is placed between silkscreen marker "2" and "3" on WJ's eval
Board or @ 14 degrees at 1.96GHz away from pins 6 and 7.
VBC = +5 V
S21 vs. Frequency
S11 vs. Frequency
28
0
27
-5
25
24
+25°C
23
1930
1940
-40°C
1950
-10
-15
1960
1970
1980
1990
-20
-20
-25
1930
-25
1930
1940
1990
45
35
-15
28
1940
1950
+25°C
1960
1970
Frequency(MHz)
10
35
Temperature (°C)
60
85
12
13
1980
-40
6
-45
5
4
3
+85°C
-40°C
1990
2
1930
+25°C
14
15
16
Output Power (dBm)
17
18
ACPR vs. Channel Power
7
ACPR (dBc)
NF (dB)
P1dB (dBm)
29
-40°C
45
Noise Figure vs. Frequency
30
27
50
40
P1dBvs. Frequency
Circuit boardsareoptimizedat 1960MHz
1950 1960 1970 1980 1990
freq. = 1960 MHz, 1961 MHz, +25° C
55
50
35
-40
+85°C
OIP3 vs. Output Power
freq. = 1960 MHz, 1961 MHz, +15 dBm/tone
40
1980
-40°C
Frequency (MHz)
OIP3 (dBm)
OIP3 (dBm)
OIP3 (dBm)
40
1950 1960 1970
Frequency (MHz)
1940
OIP3 vs. Temperature
55
45
26
1930
1950 1960 1970 1980 1990
Frequency (MHz)
50
31
-15
+25°C
+25° C, +15 dBm/tone
1940
-10
+85°C
OIP3 vs. Frequency
35
1930
+85°C
-5
Frequency (MHz)
55
-40°C
S22 (dB)
S11 (dB)
S21 (dB)
+25°C
26
S22 vs. Frequency
0
IS-95, 9 Ch. Fwd, ±885 kHz offset, 30 kHz Meas BW, 1960 MHz
-50
-55
-60
-65
+85°C
-40 C
+25 C
+85 C
-70
1940
1950
1960
1970
1980
18
1990
19
20
21
22
23
24
25
Output Channel Power (dBm)
Frequency (MHz)
Specifications and information are subject to change without notice.
WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: 408-577-6621  e-mail: [email protected]  Web site: www.wj.com
Page 4 of 12 August 2006
AH212
The Communications Edge TM
1 Watt High Linearity, High Gain InGaP HBT Amplifier
Product Information
AH212-S8 2015 MHz Reference Design for TD-SCDMA Applications
Vcc = +5 V
Typical RF Performance at 25 C
Frequency (MHz)
Gain (dB)
Input Return Loss (dB)
Output Return Loss (dB)
Output P1dB (dBm)
Output IP3 (dBm)
(+15 dBm / tone, 1 MHz spacing)
Channel Power (dBm)
(@-45 dBc ACPR, IS-95, 9 channels fwd)
Noise Figure (dB)
Device / Supply Voltage
Quiescent Current
2010
25.5
17
10.5
+30
2025
25.2
19
10
+30
+48
+47.5
+23.5
+23.5
6
CAP
ID=C9
C=47 pF
IND
ID=L1
L=18 nH
RES
ID=R2
R=0 Ohm
CAP
ID=C2
C=47 pF
CAP
ID=C1
C=47 pF
PORT
P=1
Z=50 Ohm
CAP
ID=C10
C=1000 pF
CAP
ID=C6
C=1000 pF
CAP
ID=C5
C=1000 pF
IND
ID=L2
L=18 nH
Size 0805
1
8
5
2 NET="AH212"
7
6
3
6
7
4
5
8
RES
ID=R1
R=10 Ohm
6
RES
ID=R3
R=75 Ohm
+5 V
400 mA
CAP
ID=C11
C=4.7E6 pF
SIZE 1210
All passive components are of size 0603
unless otherwise noted.
CAP
ID=C4
C=1000 pF
CAP
ID=C8
C=47 pF
TLINP
ID=TL1
Z0=50 Ohm
L=125 mil
Eeff=4.6
Loss=0
F0=0 MHz
PORT
P=2
Z=50 Ohm
CAP
ID=C7
C=2.7 pF
C7 is placed between silkscreen marker "2" and "3" on WJ's eval
Board or @ 17 degrees at 2.01GHz away from pins 6 and 7.
VBC = +5 V
S21 vs. Frequency
S11 vs. Frequency
28
0
27
-5
25
24
+25°C
23
2000
2005
-40°C
-40°C
+85°C
-5
S22 (dB)
S11 (dB)
S21 (dB)
+25°C
26
S22 vs. Frequency
0
-10
-15
-10
-15
-20
-20
-25
2000
-25
2000
+25°C
+85°C
2010
2015
2020
2025
Frequency (MHz)
55
2005
2010
2015
2020
2025
2005
Frequency (MHz)
2010
-40°C
2015
+85°C
2020
2025
Frequency (MHz)
OIP3 vs. Frequency
ACPR vs. Channel Power
+25° C, +15 dBm/tone
IS-95, 9 Ch. Fwd, ±885 kHz offset, 30 kHz Meas BW, 2010 MHz
50
ACPR (dBc)
OIP3 (dBm)
-35
45
-55
-65
40
35
2010
-45
-75
2015
2020
Frequency (MHz)
2025
19
20
21
22
23
24
Output Channel Power (dBm)
Specifications and information are subject to change without notice.
WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: 408-577-6621  e-mail: [email protected]  Web site: www.wj.com
Page 5 of 12 August 2006
AH212
The Communications Edge TM
1 Watt High Linearity, High Gain InGaP HBT Amplifier
Product Information
2140 MHz Application Circuit (AH212-S8PCB2140)
Typical RF Performance at 25 C
Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
Vcc = +5 V
2140 MHz
25 dB
25 dB
9 dB
+29.5 dBm
(+15 dBm / tone, 1 MHz spacing)
Channel Power
(@-45 dBc ACLR, W-CDMA, Test model
1 +64 DPCH, ± 5MHz offset)
Noise Figure
Device / Supply Voltage
Quiescent Current
CAP
ID=C9
C=47 pF
IN D
ID =L1
L=18 nH
RES
ID=R2
R=0 Ohm
PORT
P=1
Z=50 Ohm
+21 dBm
C AP
ID =C 2
C =47 pF
CAP
ID=C1
C=47 pF
6 dB
+5 V
400 mA
CAP
ID =C 10
C=1000 pF
CAP
ID=C6
C=1000 pF
CAP
ID=C5
C=1000 pF
+46 dBm
CAP
ID=C11
C=4.7E6 pF
SIZ E 1210
IND
ID=L2
L=18 nH
Size 0805
1
58
2 NET="AH 212"
67
3
6
7
4
85
All passive components are of size 0603
unless otherwise noted.
CAP
ID=C4
C=1000 pF
PORT
P=2
Z=50 Ohm
TLINP
ID=TL1
Z0=50 Ohm
L=110 mil
Eeff=4.6
Loss=0
F0=0 MH z
RES
ID=R1
R=10 Ohm
RES
ID=R3
R=75 Ohm
CAP
ID =C8
C=47 pF
C AP
ID=C 7
C =2.4 pF
C7 is placed at silkscreen marker "2" on WJ's eval board
or @ 12.2 deg at 2.14GHZ away from pins 6 and 7.
VBC = +5 V
S21 vs. Frequency
S11 vs. Frequency
27
S22 vs. Frequency
0
0
+25°C
-5
26
-40°C
+85°C
-5
25
24
S22 (dB)
S11 (dB)
S21 (dB)
-10
-15
-20
-10
-15
-25
23
+25°C
22
2110
2120
-40°C
2130
2140
2150
-20
-30
+85°C
2160
-35
2110
2170
+25°C
2120
Frequency (MHz)
40
2160
2170
45
45
40
-15
35
12
85
27
2120
2130
+25°C
2140
2150
Frequency (MHz)
2160
6
5
-40°C
2170
3
2110
17
18
ACLR vs. Channel Power
4
+85°C
14
15
16
Output Power (dBm)
3GPP W-CDMA, Test Model 1+64 DPCH, ±5 MHz offset, 2140 MHz
ACLR (dBc)
28
-40°C
13
-40
7
NF (dB)
P1dB (dBm)
60
8
29
25
2110
10
35
Temperature (°C)
Noise Figure vs. Frequency
Circuit boards are optimized at 2140 MHz
26
freq. =2140MHz, 2141MHz, +25° C
55
50
P1dB vs. Frequency
30
2130 2140 2150 2160 2170
OIP3vs. Output Power
freq. = 2140 MHz, 2141 MHz, +15 dBm/tone
50
35
-40
+85°C
Frequency (MHz)
40
2130 2140 2150
Frequency (MHz)
-40°C
OIP3 (dBm)
OIP3 (dBm)
OIP3 (dBm)
55
45
2120
2120
OIP3 vs. Temperature
+25° C, +15 dBm/tone
50
35
2110
2130 2140 2150 2160 2170
Frequency (MHz)
OIP3 vs. Frequency
55
-25
2110
+25°C
-45
-50
-55
+85°C
-40 C
+25 C
+85 C
-60
2120
2130
2140
2150
2160
18
2170
19
20
21
22
Output Channel Power (dBm)
Frequency (MHz)
Specifications and information are subject to change without notice.
WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: 408-577-6621  e-mail: [email protected]  Web site: www.wj.com
Page 6 of 12 August 2006
AH212
The Communications Edge TM
1 Watt High Linearity, High Gain InGaP HBT Amplifier
Product Information
AH212-S8 2350 MHz Reference Design for WiBro Applications
Typical RF Performance at 25 C
Frequency (MHz)
Gain (dB)
Input Return Loss (dB)
Output Return Loss (dB)
Output P1dB (dBm)
Output IP3 (dBm)
Vcc = +5 V
2300
24.5
10
7.5
+30.4
2350
24.4
10
7
+30
2400
24.3
10
6.5
+29.6
+45
+44.3
+43.7
(+15 dBm / tone, 1 MHz spacing)
Device / Supply Voltage
Quiescent Current
CAP
ID=C9
C=22 pF
IND
ID=L1
L=12 nH
RES
ID=R2
R=0 Ohm
CAP
ID=C2
C=6.8 pF
CAP
ID=C1
C=22 pF
8
5
1
RES
ID=R1
R=20 Ohm
2 NET="AH212"
7
6
3
67
4
5
8
RES
ID=R3
R=75 Ohm
VBC = +5 V
C7 is placed at silkscreen marker "1" on WJ's eval
Board or @ 4.2 degrees at 2.35 GHz away from pin 6 and 7.
S22 vs. Frequency
25
-5
-5
22
21
2300
S22 (dB)
0
S11 (dB)
S21 (dB)
S11 vs. Frequency
0
23
-10
-15
-20
2320
2340
2360
2380
2400
-25
2300
2320
2340
2360
2380
-25
2300
2400
2320
2340
2360
2380
2400
Frequency (MHz)
P1dB vs. Frequency
+25° C, +15 dBm/tone
31
30
50
P1dB (dBm)
OIP3 (dBm)
-15
Frequency (MHz)
OIP3 vs. Frequency
45
40
35
2300
-10
-20
Frequency (MHz)
55
PORT
P=2
Z=50 Ohm
CAP
ID=C4
C=1000 pF
26
24
IND
ID=L2
L=15 nH
Size 0805
CAP
ID=C8
C=22 pF
CAP
ID=C7
C=2.2 pF
CAP
ID=C12
C=1.5 pF
C12 is placed at silkscreen marker "A" on WJ's eval
Board or @ 4.2 degrees at 2.35 GHz away from pin 3.
S21 vs. Frequency
CAP
ID=C10
C=1000 pF
CAP
ID=C6
C=1000 pF
CAP
ID=C5
C=1000 pF
PORT
P=1
Z=50 Ohm
+5 V
400 mA
CAP
ID=C11
C=4.7E6 pF
SIZE 1210
All passive components are of size 0603
unless otherwise noted.
29
28
27
2320
2340
2360
Frequency (MHz)
2380
2400
26
2300
2320
2340
2360
2380
2400
Frequency (MHz)
Specifications and information are subject to change without notice.
WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: 408-577-6621  e-mail: [email protected]  Web site: www.wj.com
Page 7 of 12 August 2006
AH212
The Communications Edge TM
1 Watt High Linearity, High Gain InGaP HBT Amplifier
Product Information
Typical Device Data (DFN 4x5 mm)
S-Parameters (VCC = +5 V, ICC = 400 mA, T = 25 C, calibrated to device leads)
1.0
0.8
2.
0
2.
0
0.
4
3.
Swp Max
3GHz
6
0.
0.8
6
0.
Swp Max
3GHz
0.
4
DB(|S(2,1)|)
AH212
30
S22
1.0
S11
Gain
35
0
3.
0
0
4.
0.2
0
5.
10.0
5.0
4.0
3.0
2.0
1.0
0.8
0.6
0.4
10.0
0
10.0
5.0
4.0
3.0
2.0
1.0
0.8
0.6
0.4
0.2
20
0.2
10.0
0
Gain (dB)
0
4.
0
5.
0.2
25
15
-10.0
-4
.0
-5
.0
S(2,2)
AH212
-
Swp Min
0.01GHz
-1.0
-
Swp Min
0.01GHz
0
2.
.4
0
2.
-0
-0
.6
S(1,1)
AH212
.4
-1.0
3
-0.8
2.5
-0
.6
2
-0.8
0
1.5
Frequency (GHz)
-3
.
1
0
0.5
-3
.
-0
0
2
-0.
-4
.0
-5
.0
5
-10.0
2
-0.
10
Notes:
The gain for the unmatched device in 50 ohm system is shown as the trace in blue color. For a band specific tuned circuit, it is expected that actual gain
will be higher. The impedance plots are shown from 50 – 3000 MHz, with markers placed at 0.5 – 3.0 GHz in 0.5 GHz increment.
S-Parameters for AH212-EG (VCC = +5 V, ICC = 400 mA, T = 25 C, unmatched 50 ohm system, calibrated to device leads)
Freq (MHz)
50
100
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
2600
2800
3000
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
-10.92
-3.48
-0.12
-2.58
-3.56
-8.55
-12.30
-5.21
-4.42
-5.81
-9.68
-22.03
-13.88
-7.86
-5.27
-4.10
-3.60
-112.71
-121.92
-168.99
163.93
147.73
125.39
-155.14
-171.47
164.06
140.51
118.60
121.72
-133.74
-148.71
-164.02
-176.86
174.71
14.75
22.90
27.45
26.41
25.52
28.69
29.61
28.43
26.63
25.16
23.77
22.15
20.27
18.12
16.09
14.35
12.79
95.57
70.25
14.93
-53.73
-62.82
-95.79
-147.37
167.21
132.05
99.97
67.69
34.69
2.51
-28.03
-56.46
-85.23
-117.50
-73.98
-70.46
-67.96
-60.92
-59.17
-54.90
-55.92
-55.39
-56.48
-57.72
-60.00
-60.00
-55.39
-50.75
-48.64
-47.96
-47.13
47.38
9.54
94.09
47.82
67.34
49.69
32.50
23.93
3.83
-6.10
-86.34
-166.62
157.88
130.86
115.31
96.72
90.37
-2.62
-2.87
-2.87
-1.39
-1.19
-1.51
-1.54
-1.50
-1.61
-1.61
-1.58
-1.43
-1.39
-1.27
-1.27
-1.27
-1.24
-143.22
-160.44
-166.36
-168.43
-177.07
179.99
179.91
177.74
175.61
173.57
171.97
169.44
166.52
162.89
159.59
156.84
154.34
Device S-parameters are available for download off of the website at: http://www.wj.com
Application Circuit PC Board Layout
Circuit Board Material: .014” FR4, four layer, 1 oz copper, Microstrip line details: width = .026”, spacing = .026”
The silk screen markers ‘A’, ‘B’, ‘C’, etc. and ‘1’, ‘2’, ‘3’, etc. are used as placemarkers for the input and output tuning
shunt capacitor – C7. The markers and vias are spaced in 0.050” increments.
Specifications and information are subject to change without notice.
WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: 408-577-6621  e-mail: [email protected]  Web site: www.wj.com
Page 8 of 12 August 2006
AH212
The Communications Edge TM
1 Watt High Linearity, High Gain InGaP HBT Amplifier
Product Information
1960 MHz Application Circuit (AH212-EPCB1960)
Typical RF Performance at 25 C
Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
1960 MHz
27 dB
16 dB
10 dB
+30.5 dBm
+46.5 dBm
(+15 dBm / tone, 1 MHz spacing)
Channel Power
+24.5 dBm
(@-45 dBc ACPR, IS-95, 9 channels fwd)
Noise Figure
Device / Supply Voltage
Quiescent Current
5.5 dB
+5 V
400 mA
S21 vs. Frequency
S11 vs. Frequency
30
+25°C
-40°C
0
+85°C
+25°C
-40°C
+85°C
28
27
-5
S22 (dB)
-5
S11 (dB)
29
S21 (dB)
S22 vs. Frequency
0
-10
-15
-10
-15
26
-20
-20
25
1930
-25
1930
-25
1930
+25°C
1940
1950
1960
1970
1980
1990
1940
Frequency (MHz)
1960
1970
1980
1990
Supply Bias vs. Temperature
OIP3 vs. Output Power
410
390
350
50
45
60
85
50
45
13
14
15
16
Output Power (dBm)
17
18
-40
-15
Noise Figure vs. Frequency
Circuit boards are optimized at 1960 MHz
1990
35
12
P1dB vs. Frequency
31
1980
40
35
10
35
Temperature (°C)
1970
OIP3 vs. Temperature
40
370
1960
freq. = 1960 MHz, 1961 MHz, +15 dBm/tone
55
OIP3 (dBm)
OIP3 (dBm)
430
-15
1950
+85°C
Frequency (MHz)
freq. = 1960 MHz, 1961 MHz, +25° C
55
-40
1940
Frequency (MHz)
450
OIP3 (dBm)
1950
-40°C
10
35
Temperature (°C)
60
85
ACPR vs. Channel Power
IS-95, 9 Ch. Fwd, ±885 kHz offset, 30 kHz Meas BW, 1960 MHz
7
-35
NF (dB)
P1dB (dBm)
29
28
27
26
1930
-40°C
1940
1950
+25°C
1960
1970
Frequency (MHz)
5
4
-40°C
1990
2
1900
-45
-55
-65
3
+85°C
1980
ACPR (dBc)
6
30
+25°C
+85°C
-40 C
+25 C
+85 C
-75
1920
1940
1960
1980
18
2000
19
20
21
22
23
24
25
26
Output Channel Power (dBm)
Frequency (MHz)
Specifications and information are subject to change without notice.
WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: 408-577-6621  e-mail: [email protected]  Web site: www.wj.com
Page 9 of 12 August 2006
AH212
The Communications Edge TM
1 Watt High Linearity, High Gain InGaP HBT Amplifier
Product Information
2140 MHz Application Circuit (AH212-EPCB2140)
Typical RF Performance at 25 C
FreFrequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
2140 MHz
25.5 dB
24 dB
9 dB
+30.5 dBm
+46 dBm
(+15 dBm / tone, 1 MHz spacing)
Channel Power
+22 dBm
(@-45 dBc ACPR, IS-95, 9 channels fwd)
Noise Figure
Device / Supply Voltage
Quiescent Current
6 dB
+5 V
400 mA
S21 vs. Frequency
S11 vs. Frequency
28
0
27
-5
25
24
+25°C
23
2110
-40°C
2120
2130
-5
-15
-20
-20
-30
2110
-25
2110
+25°C
2140
2150
2160
2170
2120
2130
2140
2150
2160
2170
390
350
50
45
85
13
17
18
2120
2130
+25°C
2140
2150
Frequency (MHz)
-15
2160
5
-40°C
2170
85
ACLR vs. Channel Power
6
3
2110
60
3GPP W-CDMA, Test Model 1+64 DPCH, ±5 MHz offset, 2140 MHz
4
+85°C
10
35
Temperature (°C)
-40
ACLR (dBc)
NF (dB)
28
-40°C
45
-40
7
29
26
2110
14
15
16
Output Power (dBm)
8
30
27
50
Noise Figure vs. Frequency
Circuit boards are optimized at 2140 MHz
2170
35
12
P1dB vs. Frequency
31
2160
40
35
60
2150
freq. = 2140 MHz, 2141 MHz, +15 dBm/tone
55
40
370
2140
+85°C
OIP3 vs. Temperature
freq. = 2140 MHz, 2141 MHz, +25° C
OIP3 (dBm)
OIP3 (dBm)
410
2130
-40°C
Frequency (MHz)
OIP3 vs. Output Power
430
10
35
Temperature (°C)
2120
Frequency (MHz)
55
-15
-15
-25
Supply Bias vs. Temperature
-40
-10
+85°C
450
OIP3 (dBm)
+85°C
-10
Frequency (MHz)
P1dB (dBm)
-40°C
S22 (dB)
S11 (dB)
S21 (dB)
+25°C
26
S22 vs. Frequency
0
+25°C
-45
-50
-55
+85°C
-40 C
+25 C
+85 C
-60
2120
2130
2140
2150
2160
18
2170
19
20
21
22
23
24
Output Channel Power (dBm)
Frequency (MHz)
Specifications and information are subject to change without notice.
WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: 408-577-6621  e-mail: [email protected]  Web site: www.wj.com
Page 10 of 12 August 2006
AH212
The Communications Edge TM
1 Watt High Linearity, High Gain InGaP HBT Amplifier
Product Information
AH212-S8G (Lead-Free SOIC-8 Package) Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260 C reflow temperature) and lead (maximum 245 C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an
“AH212G” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating:
Value:
Test:
Standard:
Class IV
Passes ≥ 2000V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 2 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted device
is recommended for proper thermal operation. Damage to the
device can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
3. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
5. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8. All dimensions are in millimeters
Mounting Configuration / Land Pattern
Functional Pin Layout
Vcc1 1
Thermal Specifications
Parameter
Rating
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tj (2)
-40 to +85C
33 C / W
156 C
Vbias1 2
7 Vcc2 / RF Out
RF In 3
6 Vcc2 / RF Out
Vbias2 4
Notes:
1. The thermal resistance is referenced from the junction-to-case at a case
temperature of 85 C. Tj is a function of the voltage and the current applied. It
can be calculated by:
Tj = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V, 400 mA at an 85 C
case temperature.
8 N/C
5 N/C
Function
Pin No.
Vcc1
Input
Output/ Vcc2
Vbias1
Vbias2
GND
N/C or GND
1
3
6, 7
2
4
Backside Paddle
5, 8
Specifications and information are subject to change without notice.
WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: 408-577-6621  e-mail: [email protected]  Web site: www.wj.com
Page 11 of 12 August 2006
AH212
The Communications Edge TM
1 Watt High Linearity, High Gain InGaP HBT Amplifier
Product Information
AH212-EG (Lead-Free DFN 4x5 mm Package) Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is Matte Tin. It is compatible with both lead-free
(maximum 260 C reflow temperature) and lead (maximum 245 C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an
“AH212-EG” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
AH212-EG
ESD / MSL Information
Mounting Configuration / Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating:
Value:
Test:
Standard:
Class IV
Passes ≥ 2000V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 2 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted device
is recommended for proper thermal operation. Damage to the
device can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
3. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
5. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8. All dimensions are in millimeters
Thermal Specifications
Parameter
Rating
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tj (2)
-40 to +85 C
33 C / W
156 C
Notes:
1. The thermal resistance is referenced from the junction-to-case at a case.
temperature of 85 C. Tj is a function of the voltage and the current applied. It can
be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V, 400 mA at an 85 C
case temperature.
Functional Pin Layout
Vbias1 1
N/C 2
12 Vcc1
11 N/C
RF In 3
10 Vcc2 / RF Out
N/C 4
9 Vcc2 / RF Out
N/C 5
8 N/C
Vbias2 6
7 N/C
Function
Pin No.
Vcc1
Input
Output /Vcc2
Vbias1
Vbias2
GND
N/C or GND
12
3
9, 10
1
6
Backside Paddle
2, 4, 5, 7, 8, 11
Specifications and information are subject to change without notice.
WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: 408-577-6621  e-mail: [email protected]  Web site: www.wj.com
Page 12 of 12 August 2006
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