NXP LPC1830 Fastest cortex-m3 mcu, largest sram, high speed usb Datasheet

NXP 150 MHz, 32-bit
Cortex-M3™ microcontrollers
LPC1800
Fastest Cortex-M3 MCU, Largest SRAM,
High Speed USB
The LPC1800 series of low power, high-performance Cortex-M3 MCUs features frequencies up to
150 MHz and flexible Dual-Bank Flash for the highest reliability in-application re-programming.
Key features
4 150 MHz, 32-bit ARM Cortex-M3
4 Up to 1 MB dual-bank Flash
4 Up to 200 KB SRAM
4 Up to 4 KB EEPROM
4 Memory Protection Unit (MPU)
4 Two high-speed USB 2.0 interfaces, on-chip high-speed PHY
4 10/100T Ethernet MAC with MII and RMII interfaces
4 LCD controller with 1024 x 768 pixel display resolution
4 Innovative Quad SPI Flash Interface (SPIFI)
4 State Configurable Timer (SCT) Subsystem
4 Two CAN 2.0B
4 AES Decryption with 128-bit secure OTP key storage
4 Up to 164 GPIO
4 Pin-compatible with the LPC4300 series
Lower power and high performance
The LPC1800 - designed using NXP’s ultra low-leakage 90 nm
process technology - is optimized for low power operation at
very low frequencies all the way through to 150 MHz maximum
performance from either Flash or RAM. This performance
provides maximum connectivity and bandwidth options for
a wide range of demanding applications including power
conversion, lighting, motor control and audio applications.
Additional features
4 8-channel GPDMA controller
4 Two 8-channel, 10-bit ADCs and one 10-bit DAC
(400 K samples per second)
4 Motor Control PWM and Quadrature Encoder Interface
4 Four UARTs, smart card interface
4 Two Fast-mode I2C, two I2S, two SSP/SPI
Extensive peripheral set
The LPC1800 also features two new innovative peripherals:
a flexible quad-SPI interface and a State Configurable Timer
subsystem. The LPC1800 is the first microcontroller to provide
a seamless high-speed interface that will connect with virtually
all SPI and quad-SPI manufacturers. The LPC1800’s State
Configurable Timer Subsystem comprises of a timer array
with a state machine enabling complex functionality including
4 Temperature range: –40 to +85 ºC
Large internal memory
The LPC1800 offers the industry’s largest on-chip SRAM for
a Cortex-M3 with up to 200 KB provided in multiple banks.
A flexible dual-bank Flash architecture offers the highest
reliability in-application re-programming, and allows for
non-stop Flash operation.
event controlled PWM waveform generation, ADC
synchronization and dead time control. This timer
subsystem gives embedded designers increased
flexibility to create user-defined wave-forms and
control signals.
LPC1800 block diagram
LPC18xx
MPU
GPDMA
Audio PLL
NVIC
Brownout
Detector
USB PLL
WIC
Power-on
Reset
CPU PLL
Debug
Trace
Watchdog
Timer
IRC
ARM CORTEX-M3
Up to 150 MHz
Additional peripherals available on the LPC1800
include two HS USB controllers, an on-chip HS PHY,
a 10/100T Ethernet controller with hardware enabled
TCP/IP checksum calculation, a high-resolution
color LCD controller, and AES decryption including
two 128-bit secure OTP memories for key storage.
Versions with AES encryption are available on
request.
CORE
Flash
Up to 1 MB
Dual Bank
SRAM
Up to 200 KB
ROM
ROM / OTP
MEMORY
SYSTEM
Bus System
2 x CAN 2.0B
SPI Flash
Interface
4 x UART
Motor Ctrl
PWM
2 x HS
USB 2.0
External
Mem Ctrl
2 x SSP/SPI
4 x 32-bit
Timers
State Config
Timer
CONFIGURABLE INTERFACES
AES
Decryption
OTP Key
Storage
For more information, please visit
www.nxp.com/microcontrollers
Ethernet
MAC
SDIO
2 x I 2C
RTC
LCD
Controller
Quad Enc
Interface
2 x I2S
Alarm
Timer
INTERFACES
TIMERS
SECURITY
2 x 8 Ch
10-bit ADC
10-bit
DAC
ANALOG
Selection guide
Type
Memory
FLASH
LPC1810
LCD Ethernet
RAM
USB SPI Flash
Interface
State
Config
Timer
Subsys
ADC
I/O
pins
Ext bus
interface
Temp. range Package
options
136
•
•
2x 4-6ch 10b
50-64
8-16
-40 to +85 °C LQFP144, TBGA100
LPC1812
512 (1x512)
104
•
•
2x 4-6ch 10b
50-64
8-16
-40 to +85 °C LQFP144, TBGA100
LPC1813
512 (2x256)
104
•
•
2x 4-6ch 10b
50-64
8-16
-40 to +85 °C LQFP144, TBGA100
LPC1815
768 (2x384)
136
•
•
2x 4-6ch 10b
50-64
8-16
-40 to +85 °C LQFP144, TBGA100
LPC1817
1024 (2x512)
136
•
•
2x 4-6ch 10b
50-64
8-16
-40 to +85 °C LQFP144, TBGA100
LPC1820
168
1
•
•
2x 4-6ch 10b
50-64
8-16
-40 to +85 °C LQFP144, TBGA100, LQFP100
LPC1822
512 (1x512)
104
1
•
•
2x 4-6ch 10b
50-64
8-16
-40 to +85 °C LQFP144, TBGA100
LPC1823
512 (2x256)
104
1
•
•
2x 4-6ch 10b
50-64
8-16
-40 to +85 °C LQFP144, TBGA100
LPC1825
768 (2x384)
136
1
•
•
2x 4-6ch 10b
50-64
8-16
-40 to +85 °C LQFP144, TBGA100
LPC1827
1024 (2x512)
136
1
•
•
2x 4-6ch 10b
50-64
8-16
-40 to +85 °C LQFP144, TBGA100, LQFP100
200
•
2
•
•
2x 8ch 10b
80
16-32
-40 to +85 °C BGA256, BGA180, BGA100, LQFP144
LPC1833
LPC1830
512 (2x256)
136
•
2
•
•
2x 8ch 10b
80
16-32
-40 to +85 °C BGA256, BGA180, BGA100, LQFP144
LPC1837
1024 (2x512)
136
LPC1850
•
2
•
•
2x 8ch 10b
80
16-32
-40 to +85 °C BGA256, BGA180, BGA100, LQFP144
200
•
•
2
•
•
2x 8ch 10b
80
16-32
-40 to +85 °C LQFP208, BGA256, BGA180
LPC1853
512 (2x256)
136
•
•
2
•
•
2x 8ch 10b
80
16-32
-40 to +85 °C LQFP208, BGA256, BGA180
LPC1857
1024 (2x512)
136
•
•
2
•
•
2x 8ch 10b
80
16-32
-40 to +85 °C LQFP208, BGA256, BGA180
www.nxp.com
© 2011 NXP Semiconductors N.V.
All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The
Date of release: June 2011
information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and
Document order number: 9397 750 17140
may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof
Printed in the Netherlands
does not convey nor imply any license under patent- or other industrial or intellectual property rights.
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