FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products tm Features General Description 1.2 to 5.5V Input Voltage Range The FPF1003 & FPF1004 are low RDS P-Channel MOSFET load switches with controlled turn-on. The input voltage range operates from 1.2V to 5.5V to fulfill today's Ultra Portable Device's supply requirement. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signal. In FPF1004, 120Ω on-chip load resistor is added for output quick discharge when switch is turned off. RDS(ON) = 30 mΩ @ VIN = 5.5V RDS(ON) = 35 mΩ @ VIN = 3.3V ESD Protected, above 2000V HBM Applications PDAs Both FPF1003 & FPF1004 are available in a space-saving 1.0x1.5 mm2 chip scale package, 1.0X1.5CSP-6. Cell Phones GPS Devices MP3 Players Digital Cameras Peripheral Ports Hot Swap Supplies RoHS Compliant Pin 1 VIN VOUT VIN VOUT ON GND TOP BOTTOM Typical Application Circuit TO LOAD VOUT VIN FPF1003/4 - OFF ON ON GND Ordering Information Part Switch Input buffer FPF1003 30mΩ, PMOS FPF1004 30mΩ, PMOS ©2006 Fairchild Semiconductor Corporation FPF1003-FPF1004 Rev. G Output Discharge ON Pin Activity Top Mark Schmitt NA Active HI 3 Schmitt 120Ω Active HI 4 1 www.fairchildsemi.com FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products December 2006 FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products Functional Block Diagram VIN Turn-On Slew Rate Controlled Driver CONTROL LOGIC ON ESD protection VOUT FPF1003/4 Output Discharge (Optional) GND Pin Configuration A2 A1 B2 B1 C2 C1 1.0 x 1.5 CSP Bottom View Pin Description Pin Name A2, B2 VIN Supply Input: Input to the power switch and the supply voltage for the IC Function ON Control Input C2 ON A1, B1 VOUT Switch Output: Output of the power switch C1 GND Ground FPF1003-FPF1004 Rev. G 2 www.fairchildsemi.com Parameter Min VIN, VOUT, ON to GND -0.3 Max Power Dissipation @ TA = 25°C (Note 1) Unit 6 V 1.2 W 2.0 A Operating Temperature Range -40 125 °C Storage Temperature -65 150 °C 85 °C/W Maximum Continuous Switch Current Thermal Resistance, Junction to Ambient Electrostatic Discharge Protection HBM 2000 V MM 200 V Recommended Operating Range Parameter Min Max Unit VIN 1.2 5.5 V Ambient Operating Temperature, TA -40 85 °C Electrical Characteristics VIN = 1.2 to 5.5V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25°C. Parameter Symbol Conditions Min Typ Max Units Basic Operation Operating Voltage VIN Quiescent Current IQ 5.5 V IOUT = 0mA, VIN = Von 1.2 1 µA Off Supply Current IQ(off) Von = GND, OUT = open 1 µA Off Switch Current ISD(off) Von = GND, VOUT= 0 1 µA On-Resistance Output Pull Down Resistance RON RPD ON Input Logic High Voltage VIH ON Input Logic Low Voltage VIL ON Input Leakage VIN = 5.5V, TA = 25°C 20 30 VIN = 3.3V, TA = 25°C 25 35 VIN = 1.5V, TA = 25°C 50 75 VIN = 1.2V, TA = 25°C 95 150 75 120 VIN = 3.3V, VON = 0V, TA = 25°C, FPF1004 2 VIN = 2.7V to 5.5V Ω V 0.8 VIN = 1.2V mΩ VIN = 2.7V to 5.5V 0.8 VIN = 1.2V 0.35 1 VON = VIN or GND V µA Dynamic Turn on delay Turn off delay VOUT Rise Time VOUT Fall Time tON tOFF tR tF VIN = 3.3V, RL=500Ω, CL=0.1uF, TA = 25°C 13 µs VIN = 3.3V, RL=500Ω, CL=0.1uF, TA = 25°C, FPF1003 45 µs VIN = 3.3V, RL=500Ω, CL=0.1uF, RL_CHIP=120Ω, TA = 25°C, FPF1004 15 µs VIN = 3.3V, RL=500Ω, CL=0.1uF, TA = 25°C 13 µs VIN = 3.3V, RL=500Ω, CL=0.1uF, TA = 25°C, FPF1003 113 µs VIN = 3.3V, RL=500Ω, CL=0.1uF, RL_CHIP=120Ω, TA = 25°C, FPF1004 10 µs Note 1: Package power dissipation on 1square inch pad, 2 oz. copper board. FPF1003-FPF1004 Rev. G 3 www.fairchildsemi.com FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products Absolute Maximum Ratings 2.5 8 2.0 ON THRESHOLD (V) SUPPLY CURRENT (nA) 10 6 VON = VIN 4 MAX LIMIT 1.5 TYPICAL 1.0 0.5 2 VON = 0V 0.0 0 1 2 3 4 5 6 7 SUPPLY VOLTAGE (V) 8 9 1 10 Figure 1. Quiescent Current vs.VIN 2 3 4 SUPPLY VOLTAGE (V) 6 5 Figure 2. ON Threshold vs. VIN 16 10 12 SUPPLY CURRENT (nA) SUPPLY CURRENT (nA) 14 10 8 VIN = 5.5V 6 4 2 -15 10 35 60 TJ, JUNCTION TEMPERATURE (oC) 6 VIN = 5.5V 4 2 VIN = 3.3V VIN = 3.3V 0 -40 8 0 -40 85 Figure 3. Quiescent Current vs. Temperature 85 160 1400 140 VIN = 5.5V 1200 SUPPLY CURRENT (nA) SUPPLY CURRENT (nA) 10 35 60 o TJ, JUNCTION TEMPERATURE ( C) Figure 4. Quiescent Current (off) vs. Temperature 1600 1000 800 VIN = 3.3V 600 400 200 0 -50 -15 120 100 80 60 40 20 0 -25 0 25 50 o TJ, JUNCTION TEMPERATURE ( C) 75 100 Figure 5. ISWITCH-OFF Current vs. Temperature FPF1003-FPF1004 Rev. G 1 2 3 4 SUPPLY VOLTAGE (V) 5 6 Figure 6. ISWITCH-OFF Current vs. VIN 4 www.fairchildsemi.com FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products Typical Characteristics 1.5 250 VIN = 3.3V IOUT = 1A 1.3 200 RON NORMALIZED, (mOhms) ON RESISTANCE (mOhms) IOUT = 1A 150 100 1.1 0.9 0.7 50 0.5 -50 0 0 1 2 3 4 SUPPLY VOLTAGE (V) 5 7 6 -25 Figure 7. RON vs. VIN 100 0 25 50 TJ, JUNCTION TEMPERATURE (oC) 100 Figure 8. RON vs. Temperature 1000 VIN = 3.3V VIN = 3.3V RL = 500Ω RL = 500Ω RL_CHIP = 120Ω, FPF1004 TURN ON/OFF TIME (uS) 75 RL_CHIP = 120Ω, FPF1004 RISE / FALL TIME (uS) CL = 0.1uF FPF1003 TOFF FPF1004 TOFF CL = 0.1uF 100 FPF1003 TFALL TRISE 10 FPF1004 TFALL TON 10 1 -50 -25 0 25 50 75 TJ, JUNCTION TEMPERATURE (oC) 100 -50 Figure 9. TON/TOff vs. Temperature VON 2V/DIV 100 VIN=3.3V CIN=1uF COUT=0.1uF RL=500Ω IOUT 10mA/DIV IOUT 10mA/DIV VOUT 2V/DIV VOUT 2V/DIV FPF1003-FPF1004 Rev. G 0 25 50 75 TJ, JUNCTION TEMPERATURE (oC) Figure 10. TRISE/TFALL vs. Temperature VIN=3.3V CIN=1uF COUT=0.1uF RL=500Ω VON 2V/DIV -25 50us/DIV 50us/DIV Figure 11. FPF1003 TON Response Figure 12. FPF1003 TOFF Response 5 www.fairchildsemi.com FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products Typical Characteristics VIN=3.3V CIN=1uF COUT=0.1uF RL=10Ω VON 2V/DIV VON 2V/DIV IOUT 200mA/DIV IOUT 200mA/DIV VOUT 2V/DIV VOUT 2V/DIV 50us/DIV 2us/DIV Figure 13. FPF1003 TON Response Figure 14. FPF1003 TOFF Response VON 2V/DIV VIN=3.3V CIN=1uF COUT=0.1uF RL=500Ω VON 2V/DIV IOUT 10mA/DIV VOUT 2V/DIV 50us/DIV 50us/DIV Figure 15. FPF1004 TON Response Figure 16. FPF1004 TOFF Response VON 2V/DIV VON 2V/DIV VOUT 2V/DIV FPF1003-FPF1004 Rev. G VIN=3.3V CIN=1uF COUT=0.1uF RL=500Ω IOUT 10mA/DIV VOUT 2V/DIV IOUT 200mA/DIV VIN=3.3V CIN=1uF COUT=0.1uF RL=10Ω IOUT 200mA/DIV VIN=3.3V CIN=1uF COUT=0.1uF RL=10Ω VIN=3.3V CIN=1uF COUT=0.1uF RL=10Ω VOUT 2V/DIV 50us/DIV 2us/DIV Figure 17. FPF1004 TON Response Figure 18. FPF1004 TOFF Response 6 www.fairchildsemi.com FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products Typical Characteristics The FPF1003 & FPF1004 are low RDS(ON) P-Channel load switches with controlled turn-on. The core of each device is a 30mΩ P-Channel MOSFET and a controller capable of functioning over a wide input operating range of 1.2-5.5V. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signal. In FPF1004, 120Ω on-chip load resistor is added for output quick discharge when switch is turned off. Application Information Typical Application TO LOAD VOUT VIN FPF1003/4 Battery 1.2V-5.5V - OFF ON R1 = 499Ω ON GND C1 = 1µF C2 = 0.1µF Input Capacitor Board Layout To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on into a discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1µF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop. For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for VIN, VOUT and GND will help minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance. Output Capacitor A 0.1µF capacitor, COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductance from forcing VOUT below GND when the switch turns-off. Due to the integral body diode in the PMOS switch, a CIN greater than COUT is highly recommended. A COUT greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN. FPF1003-FPF1004 Rev. G 7 www.fairchildsemi.com FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products Description of Operation 1 .0 ± 0 .1 0 OUT IN D E X SLO T IN 2 1 A 0 .5 0 1 .5 0 ± 0 .1 0 B 1 .0 0 Ø 0 .2 5 C ON GND 0 .5 0 RECOMMENDED LAND PATTERN T O P V IE W 0 .6 5 M A X 2 Ø 0 .3 0 1 IN D E X SLO T A 0 .5 0 0 .2 8 0 .2 2 B SO LDER BALL 1 .0 0 C S ID E V IE W 0 .5 0 B O T T O M V IE W NOTES: A ) A L L D IM E N S IO N S A R E IN M IL L IM E T E R S . FPF1003-FPF1004 Rev. G 8 www.fairchildsemi.com FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products Dimensional Outline and Pad Layout The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FACT Quiet Series™ GlobalOptoisolator™ GTO™ HiSeC™ I2C™ i-Lo™ ImpliedDisconnect™ IntelliMAX™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ Across the board. Around the world.™ The Power Franchise® Programmable Active Droop™ ACEx™ ActiveArray™ Bottomless™ Build it Now™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™ E2CMOS™ EnSigna™ FACT® FAST® FASTr™ FPS™ FRFET™ OCX™ OCXPro™ OPTOLOGIC® OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ PowerSaver™ PowerTrench® QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ ScalarPump™ SILENT SWITCHER® SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TCM™ TinyBoost™ TinyBuck™ TinyPWM™ TinyPower™ TinyLogic® TINYOPTO™ TruTranslation™ UHC® UniFET™ VCX™ Wire™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I22 FPF1003-FPF1004 Rev. G 9 www.fairchildsemi.com FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products TRADEMARKS