NCP630 3.0 A Fast Linear Voltage Regulators The NCP630 is a low dropout positive voltage regulator that is capable of providing a guaranteed output current of 3.0 A with a maximum dropout voltage of 1.25 V at 3.0 A over temperature. The fast turn on time allows step changes in loads commonly found in low voltage microprocessor applications. The NCP630 is currently offered as an adjustable output version that can be programmed down to 1.2 V with two external resistors and as a fixed output version at 3.47 V. On chip trimming adjusts the reference/output voltage to within "1.5% accuracy. Internal protection features consist of output current limiting and thermal shutdown. NCP630 is available in D2PAK package. http://onsemi.com MARKING DIAGRAM Features • • • • • • • • 1 NC P630xD2T AWLYWWG 5 Output Current of 3.0 A 1.25 V Maximum Dropout Voltage at 3.0 A Over Temperature Voltage on Shutdown Pin is TTL Compatible Reference/Output Voltage Trimmed to "1.5% Current Limit Protection Thermal Shutdown Protection −40°C to 125°C Junction Temperature Range Pb−Free Packages are Available NCP630A NCP630G Tab = Ground Pin 1. Shutdown 2. Vin 3. Ground 4. Vout 5. Adj x A WL Y WW G Applications • • • • D2PAK D2T SUFFIX CASE 936A Microprocessor Power Supplies DSP Power Supplies SMPS Post Regulation Battery Chargers Tab = Ground Pin 1. Shutdown 2. Vin 3. Ground 4. Vout 5. Sense = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. Vin INPUT Vout + Cin 68 mF − Shutdown NCP630A ADJ GND R2 + R1 R2 + Vout @3A Vin INPUT Vout + Cin 68 mF − Co 33 mF R1 10 kW + Shutdown NCP630G SENSE GND Vout @3A Co 33 mF Vout ǒ1.216 * 1Ǔ Figure 1. Typical Application Circuit for NCP630A © Semiconductor Components Industries, LLC, 2005 June, 2005 − Rev. 5 Figure 2. Typical Application Circuit for NCP630G 1 Publication Order Number: NCP630/D NCP630 MAXIMUM RATINGS Rating Symbol Value Unit Vin 12 V Shutdown −0.3 to Vin + 0.3 V Vout −0.3 to Vin + 0.3 V − Infinite − PD RqJA RqJC Internally Limited 45 5.0 W °C/W °C/W Operating Junction Temperature Range TJ −40 to 125 °C Storage Temperature Range Tstg −55 to 150 °C Tsolder 10 sec Input Voltage (Note 1) Shutdown Voltage Output Voltage Output Short Circuit Duration (Note 2) Power Dissipation and Thermal Characteristics Case 936F (D2PAK) Power Dissipation (Note 2) Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Lead Soldering Temperature @ 260°C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model JESD 22−A114−B Machine Model JESD 22−A115−A 2. The maximum package power dissipation is: *T T J(max) A P + D R qJA PIN FUNCTION DESCRIPTION Pin No. NCP630A NCP630G Description 1 Shutdown Shutdown This input is used to place the NCP630 into shutdown mode. The NCP630 is active when a voltage greater than 2.0 V is applied. The NCP630 will be placed into a shutdown mode when a voltage less than 0.8 V is applied. If left unused then connect the pin high. 2 Vin Vin 3, Tab Ground Ground 4 Vout Vout 5 Adj − 5 − Sense Positive power supply input voltage Power supply ground Regulated output voltage This pin is to be Connected to the Rsense resistors on the output. It maintains 1.216 V between itself and ground. Refer to Figure 1 for equation. This pin is to be connected near the load for better regulation. http://onsemi.com 2 NCP630 ELECTRICAL CHARACTERISTICS (Cin = 68 mF, Cout = 33 mF, Vin = Vout + 1.5 V, Iout = 10 mA, for typical value TJ = 25°C, for min and max values TJ = −40°C to 125°C unless otherwise noted.) Characteristic Symbol Reference Voltage (Vin = Vout + 1.5 V to 7.0 V, Iout = 10 mA to 3.0 A, TJ = 25°C) (Vin = Vout + 1.5 V to 7.0 V, Iout = 10 mA to 3.0 A, TJ = −40°C to 125°C) Vadj Min Typ Max 1.198 1.180 1.216 − 1.234 1.253 − − 0.02 0.06 − − − − 0.01 0.06 − − − − 0.75 1.0 1.0 1.25 − − 0.4 1.0 1.0 2.0 − 15 50 Unit NCP630A Line Regulation (Notes 3 and 4) (Vin = Vout + 1.5 V to 7.0 V, TJ = 25°C) (Vin = Vout + 1.5 V to 7.0 V, TJ = −40°C to 125°C) Regline Load Regulation (Notes 3 and 4) (Iout = 10 mA to 3.0 A, TJ = 25°C) (Iout = 10 mA to 3.0 A, TJ = −40°C to 125°C) Regload Dropout Voltage (Measured at Vout – 2%) (Iout = 300 mA) (Iout = 3.0 A) Vin−Vout V % % V Ground Pin Current in Normal Mode (Iout = 300 mA) (Iout = 3.0 A) IGnd Ground Pin Current in Shutdown Mode (Vshutdown = 0.8 V) IGnd Peak Output Limit Iout 3.0 6.0 − A Short Current Limit (Note 5) ISC − 6.5 − A − − 165 − °C 2.0 − − − − 0.8 Thermal Shutdown Shutdown Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) mA mA Vtth(shutdown) V Turn−off Delay, Iout = 3.0 A TD(off) − 20 − ms Turn−on Delay, Iout = 3.0 A TD(on) − 25 − ms Shutdown Input Low Current (VShutdown = 0.8 V), (Negative current flows out of pin) IIL −10 −5.0 −1.0 mA Shutdown Input High Current (VShutdown = 2.0 V), (Negative current flows out of pin) IIH −10 −4.5 −1.0 mA Ripple Rejection (Cout = 100 mF, f = 1.0 kHz) RR − 85 − − 0.6 − − 210 − Output Noise Density (f = 120 Hz) − Output Noise Voltage (f = 20 Hz – 100 kHz) dB Vn mVń ǸHz mVrms 3. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 4. Line regulation is defined as the change in output voltage for a change in input voltage. Load regulation is defined as the change in output voltage for a change in output load current at a constant temperature. The limits for line and load regulation are contained within the reference voltage specification, Vadj. Typical numbers are included in the specification for line and load regulation. 5. The short circuit limit is for device protection. Maximum output current is guaranteed to be greater or equal to 3.0 A with a 6.0 A typical as listed in the peak output limit specification. http://onsemi.com 3 NCP630 ELECTRICAL CHARACTERISTICS (Cin = 68 mF, Cout = 33 mF, Vin = Vout + 1.5 V, Iout = 10 mA, for typical value TJ = 25°C, for min and max values TJ = 0°C to 125°C unless otherwise noted.) Characteristic Symbol Min Typ Max 3.418 3.383 3.470 − 3.522 3.557 − − 0.02 0.06 − − − − 0.01 0.06 − − − − 0.75 1.0 1.0 1.25 − − 0.4 1.0 1.0 2.0 − 26 50 Unit NCP630G Output Voltage (Vin = 5.0 V to 7.0 V, Iout = 10 mA to 3.0 A, TJ = 25°C) (Vin = 5.0 V to 7.0 V, Iout = 10 mA to 3.0 A, TJ = 0°C to 125°C) Vout Line Regulation (Notes 6 and 7) (Vin = 5.0 V to 7.0 V, TJ = 25°C) (Vin = 5.0 V to 7.0 V, TJ = 0°C to 125°C) Regline Load Regulation (Notes 6 and 7) (Iout = 10 mA to 3.0 A, TJ = 25°C) (Iout = 10 mA to 3.0 A, TJ = 0°C to 125°C) Regload Dropout Voltage (Measured at Vout – 2%) (Iout = 300 mA) (Iout = 3.0 A) Vin−Vout V % % V Ground Pin Current in Normal Mode (Iout = 300 mA) (Iout = 3.0 A) IGnd Ground Pin Current in Shutdown Mode (Vshutdown = 0.8 V) IGnd Peak Output Limit Iout 3.0 5.0 − A Short Current Limit (Note 8) ISC − 5.0 − A − − 165 − °C 2.0 − − − − 0.8 Thermal Shutdown Shutdown Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) mA mA Vtth(shutdown) V Turn−off Delay, Iout = 3.0 A TD(off) − 20 − ms Turn−on Delay, Iout = 3.0 A TD(on) − 25 − ms Shutdown Input Low Current (Vin = 0.8 V), (Negative current flows out of pin) IIL −10 −5.0 −1.0 mA Shutdown Input High Current (Vin = 2.0 V), (Negative current flows out of pin) IIH −10 −4.5 −1.0 mA Ripple Rejection (Cout = 100 mF, f = 1.0 kHz) RR − 85 − − 0.6 − − 210 − Output Noise Density (f = 120 Hz) − Output Noise Voltage (f = 10 Hz – 100 kHz) dB Vn mVń ǸHz mVrms 6. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 7. Line regulation is defined as the change in output voltage for a change in input voltage. Load regulation is defined as the change in output voltage for a change in output load current at a constant temperature. The limits for line and load regulation are contained within the output voltage specification, Vout. Typical numbers are included in the specification for line and load regulation. 8. The short circuit limit is for device protection. Maximum output current is guaranteed to be greater or equal to 3.0 A with a 5.0 A typical as listed in the peak output limit specification. http://onsemi.com 4 NCP630 3.475 3.470 3.465 3.460 3.455 VIN − VOUT, DROPOUT VOLTAGE (V) 3.450 −40 −20 0 20 40 60 80 100 120 9 8 7 6 5 4 3 2 1 0 −40 0 20 40 60 100 120 80 TA, AMBIENT TEMPERATURE (°C) Figure 3. Output Voltage versus Temperature Figure 4. Short Circuit Current Limit versus Temperature 1.2 1.8 IOUT = 3.0 A 1 0.8 IOUT = 300 mA 0.6 0.4 0.2 0 −40 −20 0 20 40 60 80 100 VIN = VOUT + 1.5 V VSD = VIN 1.6 1.4 1.2 IOUT = 3.0 A 1 0.8 0.6 IOUT = 300 mA 0.4 0.2 0 −40 120 TA, TEMPERATURE (°C) −20 0 20 40 60 80 100 120 TA, AMBIENT TEMPERATURE (°C) Figure 5. Dropout Voltage versus Temperature Figure 6. Ground Current versus Temperature 30 25 VOUT, OUTPUT VOLTAGE (V) 35 4 SHUTDOWN VOLTAGE (V) 40 IGND, GROUND CURRENT (mA) −20 TA, AMBIENT TEMPERATURE (°C) IGND, GROUND CURRENT (mA) VOUT, OUTPUT VOLTAGE (V) 3.480 ISC, SHORT CIRCUIT CURRENT LIMIT (A) TYPICAL CHARACTERISTICS 3 COUT = 100 mF RL = 3.5 W 3 2 1 0 20 15 10 VIN = VOUT + 1.5 V VSD = 0 V 5 0 −60 −40 −20 0 20 40 60 80 100 120 140 2 1 0 0 20 40 60 80 TIME (ms) TA, AMBIENT TEMPERATURE (°C) Figure 7. Ground Pin Current in Shutdown Mode versus Temperature Figure 8. Start−up Transient http://onsemi.com 5 100 120 NCP630 TYPICAL CHARACTERISTICS 120 VIN = VOUT + 1.0 V COUT − 33 mF Tantalum CIN = 100 mF IOUT = 10 mA 1 0.8 RIPPLE REJECTION (dB) VN, NOISE VOLTAGE (mV/ Hz) 1.2 0.6 0.4 0.2 0 100 80 60 VOUT = 3.47 V VIN = 5.0 V + 0.5 VPP COUT = 100 mF Electrolytic IOUT = 10 mA 40 20 0 0.01 0.1 1 10 100 0.01 0.1 1 10 f, FREQUENCY (kHz) f, FREQUENCY (kHz) Figure 9. Output Noise Density Figure 10. Ripple Rejection http://onsemi.com 6 100 NCP630 APPLICATION INFORMATION Input Capacitor Reverse Current The minimum capacitance required for stability is a 68 mF aluminum electrolytic or tantalum capacitor. The maximum ESR allowed for stability is 5.0 W. The capacitor should be place as close as possible to the input of the device. The placement of a ceramic capacitor in parallel is not recommend due to possible instabilities. Some situations might occur were the output pin is raised to a voltage while the input pin is at zero volts. This situation will not damage the device. If the output voltage is raised to a higher voltage than the input voltage a diode is recommended from output to input with the anode connect to the output pin. Output Capacitor Thermal Considerations A minimum output capacitor value of 33 mF is required for stability. The type of capacitor can be aluminum electrolytic or tantalum capacitor. ESR can vary up to a maximum of 2.0 ohms for stability. The capacitor should be placed as close as possible to the output of the device. The placement of a ceramic capacitor in parallel is not recommend due to possible instabilities. This series contains an internal thermal limiting circuit that is designed to protect the regulator in the event that the maximum junction temperature is exceeded. When activated, typically at 165°C, the regulator output switches off and then back on as the die cools. As a result, if the device is continuously operated in an overheated condition, the output will appear to be oscillating. This feature provides protection from a catastrophic device failure due to accidental overheating. It is not intended to be used as a substitute for proper heatsinking. The maximum device power dissipation can be calculated by: Sense Pin The sense pin of the NCP630G will need to be connected near the output voltage. This provides great advantages when the linear regulator can’t be near the load. The sense pin will monitor the load and allow the linear regulator to adjust for losses in the line between itself and the load. Thus it will provide good accuracy for a remote load. PD + The typical application circuits for the fixed and adjustable output regulators are shown in Figures 1 and 2. The adjustable devices develop and maintain the nominal 1.216 V reference voltage between the adjust and ground pins. The adjust pin current, Iadj, is typically 40 nA and normally lower than the current flowing through R1 and R2, thus it generates a small output voltage error that can usually be ignored. For the fixed output devices R1 and R2 are included within the device. 80 JUNCTION−TO−AIR (° C/W) 3.5 PD(max) for TA = 50°C 70 3.0 Free Air Mounted Vertically 60 ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ 2.0 oz. Copper L Minimum Size Pad 50 2.0 L 40 1.5 RqJA 30 2.5 0 5.0 10 15 20 25 L, LENGTH OF COPPER (mm) Figure 11. 3−Pin and 5−Pin D2PAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length http://onsemi.com 7 30 1.0 PD, MAXIMUM POWER DISSIPATION (W) The devices are available in surface mount D2PAK package. The package has an exposed metal tab that is specifically designed to reduce the junction to air thermal resistance, RqJA, by utilizing the printed circuit board copper as a heat dissipater. Figure 11 shows typical RqJA values that can be obtained from a square pattern using economical single sided 2.0 ounce copper board material. The final product thermal limits should be tested and quantified in order to insure acceptable performance and reliability. The actual RqJA can vary considerably from the graphs shown. This will be due to any changes made in the copper aspect ratio of the final layout, adjacent heat sources, and air flow. ADJ Pin R θ JA, THERMAL RESISTANCE TJ(max) * TA RqJA NCP630 TAPE AND REEL SPECIFICATION SOP Description Leads Package Length Package Width Package Thickness Reel Quantity Tape Pitch Tape Width Vendor P/N 5 9.2 mm 10 mm 4.4 mm 800 16 mm 24 mm DDPAK−B D2PAK ∅ 1.55 ±0.05 2.0 ±0.1 0.30 $ 0.05 4.0 ±0.1 See Note #2 R 0.3 MAX 1.75 ±0.1 ∅ 1.50 MIN B 0.70 Max 11.5 ±0.1 20° Max 2.40 Max B0 9.00 11.15 A B 16.00 4.70 K0 24.0 ±0.3 A A0 = 10.60 ±0.15 B0 = 16.50 ±0.15 K0 = 4.90 ±0.15 SECTION B−B A0 ALL DIMENSIONS IN MILLIMETERS 0.30 $ 0.05 SECTION A−A 1.00 NOTES: 1. A0 & B0 MEASURED AT 0.3 mm ABOVE BASE OF POCKET 2. 10 PITCHES CUMULATIVE TOTAL ±0.2 mm Figure 12. Package Carrier Dimensions Figure 13. Reel Dimensions http://onsemi.com 8 Nominal Hub Depth W1 +3 4 mm 4.4 7.1 8 mm 8.4 11.1 16 mm 16.4 19.1 28 mm 28.4 31.1 W2MAX −2 NCP630 ORDERING INFORMATION Device NCP630AD2T Nominal Output Voltage Package Shipping Adj D2PAK 50 Units/Rail NCP630AD2TG Adj NCP630AD2TR4 Adj D2PAK (Pb−Free) D2PAK D2PAK 50 Units/Rail 800/Tape & Reel NCP630AD2TR4G Adj NCP630GD2T 3.47 D2PAK 50 Units/Rail NCP630GD2TG 3.47 D2PAK (Pb−Free) 50 Units/Rail NCP630GD2TR4 3.47 D2PAK 800/Tape & Reel NCP630GD2TR4G (Pb−Free) D2PAK 3.47 (Pb−Free) http://onsemi.com 9 800/Tape & Reel 800/Tape & Reel NCP630 PACKAGE DIMENSIONS D2PAK D2T SUFFIX CASE 936A−02 ISSUE C TERMINAL 6 −T− OPTIONAL CHAMFER U E A V S K B H 1 2 3 4 5 M L T INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.067 BSC 0.539 0.579 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN DIM A B C D E G H K L M N P R S U V P N D 0.010 (0.254) M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 6. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. R G C MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.702 BSC 13.691 14.707 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN SOLDERING FOOTPRINT* 8.38 0.33 1.702 0.067 10.66 0.42 16.02 0.63 3.05 0.12 SCALE 3:1 1.016 0.04 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: [email protected] http://onsemi.com 10 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NCP630/D