ON LV5684PVD Multi-power supply ic for car audio system Datasheet

Ordering number : ENA2141
LV5684PVD
Bi-CMOS LSI
Multi-Power Supply IC
for Car Audio Systems
http://onsemi.com
Overview
The LV5684PVD is a power supply IC suitable for USB/CD receiver system for car audio system.
This IC integrates 5 systems of regulator output, 2 systems of high side power switch, overcurrent protector,
overvoltage protector and overheat protector
Supply for VDD and SW33V outputs is low voltage specification, which enables drastic reduction of power dissipation
compared to the existing model. (the package is HZIP15).
Features
• Low consumption current: 50μA (typ, only VDD output is in operation)
• 5 systems of regulator output
VDD for microcontroller: output voltage: 3.3V, maximum output current: 350mA reverse current protection
implemented.
For system: output voltage: 3.3V, maximum output current: 450mA
For audio: output voltage: 5 to 9V (set by external resistors), maximum output current: 250mA
For illumination: output voltage: 5 to 12V (set by external resistors), maximum output current: 300mA
For CD: output voltage: 5V/8V, maximum output current: 1300mA
• 2 lines of high side switch with interlock VCC
EXT: Maximum output current: 350mA, voltage difference between input and output: 0.5V
ANT: Maximum output current: 300mA, voltage difference between input and output: 0.5V
• Supply input
V6IN: 6V for VDD, system (SW33V)
VCC1: For internal reference voltage, control circuits
In case of voltage drop of V6IN, VCC1 supplies to VDD output.
VCC2: For AUDIO, illumination, CD, EXT/ANT
• Overcurrent protector
• Overvoltage protector(OVP): VCC1,VCC2 Typ 23V (All outputs except VDD are turned off)
Overvoltage shutdown(OVS): V6IN Typ 23V (All outputs except VDD are turned off)
• Overheat protector: Typ 175°C
• PchLDMOS is used in power output block
(Warning) The protector functions only improve the IC’s tolerance and they do not guarantee the safety of the IC if used under the
conditions out of safety range or ratings. Use of the IC such as use under overcurrent protection range, thermal shutdown state or V6IN
OVS condition may degrade the IC’s reliability and eventually damage the IC.
Semiconductor Components Industries, LLC, 2013
August, 2013
O1712NK 20120920-S00003 No.A2141-1/12
LV5684PVD
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Conditions
Supply voltage
Conditions
VCC max
VCC1, VCC2
V6IN max
V6IN (*)
Input voltage
VIN max
CTRL1, CTRL2
Allowable power dissipation
Pd max
Independent IC
Ratings
Unit
36
V
7
V
7
V
1.3
W
Al heat sink *
5.3
W
With an infinity heat sink
26
W
See below for the waveform applied.
50
V
Ta ≤ 25°C
Peak supply voltage
VCC peak
Operating ambient temperature
Topr
-40 to +85
°C
Storage temperature
Tstg
-55 to +150
°C
Junction temperature
Tj max
150
°C
* : When the Aluminum heat sink (50mm × 50mm × 1.5mm) is used
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Waveform of surge test (VCC1, VCC2)
*V6IN is designed to tolerant toward short period of
over-voltage (max 20V) which is assumed in condition of short
circuit between VCC1/VCC2 and V6IN.
However, applying over-voltage higher than maximum rating
(7V) to V6IN may degrade the device reliability
50V
90%
10%
16V
5msec
100msec
Recommended Operating range at Ta = 25°C
VCC1
Parameter
Operating supply voltage 1
Conditions
Ratings
VDD output
Unit
7 to 16
V
VCC2
Parameter
Operating supply voltage 2
Conditions
Unit
12 to 16
V
ILM output (8V)
10 to 16
V
Operating supply voltage 3
AUDIO output (9V)
Operating supply voltage 4
CD output (IO = 1.3A)
Operating supply voltage 5
Ratings
ILM output (10V)
10 to 16
V
10.5 to 16
V
CD output (IO ≤ 1A)
10 to 16
V
EXT output, ANT output
10 to 16
V
V6IN
Parameter
Operating supply voltage 6
Conditions
VDD output, SW33V output
Ratings
Unit
5.7 to 6.5
V
No.A2141-2/12
LV5684PVD
Electrical Characteristics at VCC1 = VCC2 = 14.4V, V6IN = 6V at Ta = 25°C (*1)
Parameter
Symbol
Ratings
Conditions
min
Quiescent current
ICC
typ
VDD w/out load, CTRL1/2 = “L/L”
Unit
max
50
100
μA
CTRL1 input (ANT/EXT/ILM)
Low input voltage
VIL1
0.5
V
M1 input voltage
VIM11
0.8
0
1.1
1.4
V
M2 input voltage
VIM21
1.9
2.2
2.5
V
High input voltage
VIH1
Input impedance
RIH1
input voltage ≤ 3.3V
2.9
3.3
5.5
V
280
400
480
kΩ
0.5
V
1.4
V
CTRL2 input (CD/AUDIO/SW33V)
Low input voltage
VIL2
M1 input voltage
VIM12
0.8
0
1.1
M2 input voltage
VIM22
1.9
2.2
2.5
V
High input voltage
VIH2
2.9
3.3
5.5
V
Input impedance
RIH2
280
400
480
kΩ
3.3
3.47
V
30
90
mV
input voltage ≤ 3.3V
VDD output (3.3V) (reverse current prevention diode implemented)
Output voltage
VO1
IO1 = 200mA
3.13
Output current
IO1
VO1 ≥ 3.1V
350
Line regulation
ΔVOLN1
5.7V < V6IN < 6.5V, IO1 = 200mA or
Load regulation
ΔVOLD1
V6IN = 0V, 7.5V < VCC1 < 16V, IO1 = 200mA
1mA < IO1 < 200mA
70
150
mV
Dropout voltage
VDROP1
IO1 = 200mA, V6IN = 0V
2.8
3.5
V
mA
(applicable to VCC1)
Ripple rejection (*2)
RREJ1
f = 120Hz, V6IN or VCC1 = 0.5Vpp
40
50
dB
IO1 = 200mA
Reverse current
Irev
VO1 = 3.3V, VCC1 = V6IN = 0V
1
50
3.3
3.47
μA
SW33V output (3.3V) ; CTRL2 = “M1 or M2 or H”
Output voltage
VO2
IO2 = 200mA
3.13
Output current
IO2
VO2 ≥ 3.1V
450
Line regulation
ΔVOLN2
5.7V < V6IN < 6.5V, IO2 = 200mA
Load regulation
ΔVOLD2
1mA < IO2 < 200mA
Dropout voltage
VDROP2
IO2 = 200mA
Ripple rejection (*2)
RREJ2
f = 120Hz, V6IN or VCC1 = 0.5Vpp
V
mA
30
90
mV
70
150
mV
0.25
0.5
V
40
50
dB
1.212
1.25
1.288
V
IO2 = 200mA
AUDIO (5-9V)output ; CTRL2 = “M1 or M2 or H”
AUDIO_F voltage
VI 3
AUDIO_F input current
IIN3
1
μA
AUDIO output voltage 1
VO3
IO3 = 150mA, R3 = 30kΩ, R4 = 5.6kΩ (*3)
7.65
8.0
8.35
V
AUDIO output voltage 2
VO3’
IO3 = 150mA, R3 = 27kΩ, R4 = 4.7kΩ (*3)
8.13
8.5
8.87
V
AUDIO output voltage 3
VO3’’
IO3 = 150mA, R3 = 24kΩ, R4 = 3.9kΩ (*3)
8.6
9.0
9.4
V
AUDIO output voltage 4
VO3’’’
IO3 = 150mA, R3 = 30kΩ, R4 = 10kΩ (*3)
4.75
5.0
5.25
AUDIO output current
IO3
Line regulation
ΔVOLN3
10V < VCC2 < 16V, IO3 = 150mA
30
90
mV
Load regulation
ΔVOLD3
1mA < IO3 < 150mA
70
150
mV
Dropout voltage 1
VDROP3
IO3 = 150mA
0.3
0.45
Ripple rejection (*2)
RREJ3
f = 120Hz, IO3 = 150mA
-1
250
V
mA
40
50
1.212
1.25
V
dB
ILM (5-12V) output ; CTRL1 = “M1 or M2 or H”
ILM_F voltage
VI4
ILM_F input current
IIN4
ILM output voltage 1
VO4
IO4 = 200mA, R1 = 43kΩ, R2 = 5.1kΩ (*3)
11.21
11.8
12.39
V
ILM output voltage 2
VO4’
IO4 = 200mA, R1 = 56kΩ, R2 = 7.5kΩ (*3)
9.97
10.5
11.03
V
-1
1.288
V
1
μA
*1 : All the specification is defined based on the tests performed under the conditions where Tj and Ta (= 25°C) are almost equal. These tests were performed
with pulse load to minimize the increase of junction temperature (Tj).
*2 : guaranteed by design
*3 : Using resistors of tolerance within 1%.
Continued on next page.
No.A2141-3/12
LV5684PVD
Continued from preceding page.
Parameter
Symbol
Ratings
Conditions
min
Unit
typ
max
ILM output voltage 3
VO4’’
IO4 = 200mA, R1 = 30kΩ, R2 = 5.6kΩ (*3)
7.6
8.0
8.4
V
ILM output voltage 4
VO4’’’
IO4 = 200mA, R1 = 30kΩ, R2 = 10kΩ (*3)
4.75
5.0
5.25
V
ILM output current
IO4
Line regulation
ΔVOLN4
10V < VCC2 < 16V, IO4 = 200mA
30
90
mV
Load regulation
ΔVOLD4
1mA < IO4 < 200mA
70
150
mV
Dropout voltage 1
VDROP4
IO4 = 200mA
0.7
1.05
V
Dropout voltage 2
VDROP4’
IO4 = 100mA
0.35
0.53
V
Ripple rejection (*2)
RREJ4
f = 120Hz, IO4 = 200mA
300
mA
R1 = 30kΩ, R2 = 5.6kΩ
40
50
dB
CD (5V/8V output) ; CTRL2 = “H” : 8V, CTRL2 = “M2” : 5V
Output voltage
VO51
IO5 = 1000mA
4.75
5.0
5.25
V
VO52
IO5 = 1000mA
7.6
8.0
8.4
V
Output current
IO5
VO51 ≥ 4.7V, VO52 ≥ 7.6V
Line regulation
ΔVOLN5
10.5V < VCC2 < 16V, IO5 = 1000mA
50
100
mV
Load regulation
ΔVOLD5
10mA < IO5 < 1000mA
100
200
mV
Dropout voltage 1
VDROP5
IO5 = 1000mA
1.0
1.5
V
Dropout voltage 2
VDROP5’
IO5 = 500mA
0.5
0.75
Ripple rejection (*2)
RREJ5
f = 120Hz, IO5 = 1000mA
Output voltage
VO6
IO6 = 350mA
Output current
IO6
VO6 ≥ VCC2-1.0
Output voltage
VO7
IO7 = 300mA
Output current
IO7
VO7 ≥ VCC2-1.0
1300
mA
40
50
VCC2-1.0
VCC2-0.5
V
dB
EXT_HS-SW ; CTRL1 = “M2 or H”
V
350
mA
ANT_HS-SW ; CTRL1 = “H”
VCC2-1.0
VCC2-0.5
V
300
mA
*2 : guaranteed by design
*3 : Using resistors of tolerance within 1%.
CTRL logic truth table
CTRL1
ANT
EXT
ILM
H
ON
ON
ON
M2
OFF
ON
ON
CTRL2
CD
AUDIO
SW33V
H
ON (8V)
ON
ON
M2
ON (5V)
ON
ON
M1
OFF
OFF
ON
M1
OFF
ON
ON
L
OFF
OFF
OFF
L
OFF
OFF
OFF
CTRL1/2 voltage range and threshold
5.5V
H
2.9V
2.65V (typ)
2.5V
1.9V
M2
1.65V (typ)
1.4V
0.8V
0.5V
0V
M1
0.65V (typ)
L
No.A2141-4/12
LV5684PVD
Package Dimensions
unit : mm (typ)
3336
• Allowable power dissipation derating curve
21.6
Allowable power dissipation, Pd max -- W
HEAT SPREADER
(20.0)
3.0
(11.0)
(11.0)
3.35
12.4
(9.05)
(14.55)
17.9
(8.6)
(R1.75)
1
(1.91)
0.4
15
1.27
Pd max -- Ta
8
2.54 2.54
0.7
Aluminum heat sink mounting conditions
tightening torque : 39N×cm, using silicone grease
7
6
Aluminum heat sink (50 × 50 × 1.5mm3) when using
5.3
5
4
3
2
Independent IC (HZIP15)
1.3
1
0
--40
SANYO : HZIP15
0
--20
20
40
60
80
100
120
140150160
Ambient temperature, Ta -- °C
R1
R3
C2
C4
R2
C1
CD
13
CTRL2
CTRL1
C5
AUDIO
C12 C11
+
VCC2
C13
ANT
14
C15
+
C14
+
C9 C10
EXT
12
11
SW33V
VDD
V6IN
10
9
C7 C8
ILM
GND
CTRL2
CTRL1
8
7
+
R4
C3
6
5
VCC1
4
3
VCC2
2
1
LV5684PVD
AUDIO
CD
ILM
ILM_F
AUDIO_F
Application Circuit Example
15
C16
+
D2
D4
D1
D3
V6IN VDD SW33V
VCC1
ANT
EXT
Peripheral parts
Part name
Description
Recommended value
C1, C3, C5, C13, C14
output stabilization capacitor
greater than10μF (*1)
C2, C4
output stabilization capacitor
0pF
C8, C10, C12
Capacitor for bypass power supply
C8: greater than 100μF
C10,C12: greater than 47μF
C7, C9, C11
C15, C16
Capacitor for oscillation protector
greater than 0.22μF
Capacitor for EXT/ANT output stabilization
greater than 2.2μF
R1/R2
Note
Ceramic capacitor
Make sure to implement close to
VCC and GND.
Use resistors of tolerance within 1%
43kΩ/5.1kΩ : VO = 12V
R1, R2
ILM voltage setting
56kΩ/7.5kΩ : VO = 10.5V
30kΩ/5.6kΩ : VO = 8V
30kΩ/10kΩ : VO = 5V
R3/R4
Use resistors of tolerance within 1%
30kΩ/10kΩ : VO = 5V
R3, R4
AUDIO voltage setting
30kΩ/5.6kΩ : VO = 8.0V
27kΩ/4.7kΩ : VO = 8.5V
24kΩ/3.9kΩ : VO = 9V
D1, D2, D3, D4
Internal device protector diode
SB1003M3
(*1) Make sure that output capacitors are greater than 10uF and meets the condition of ESR = 0.001 to 10Ω , in which voltage/ temperature dependence and
unit differences are taken into consideration. Moreover, in case of electrolytic capacitor, high-frequency characteristics should be sufficiently good.
No.A2141-5/12
LV5684PVD
Block Diagram
6V input
11
+
V6IN
VREF
OVS
9
+
VREG
12
VDD
3.3V, 0.35A
13
SW33V
3.3V, 0.45A
VCC1
6.5V
OVP
VREF
VREG
5.8V
VREF
1.25V
TSD
AUDIO
5 to 9V, 0.25A
5
VREF
AUDIO_F
CTRL1 8
CTL
CTRL2 6
OVP
VREF
ILM_F
OVP→all outputs except VDD: OFF
TSD→all outputs: OFF
7
ILM
5 to 12V, 0.3A
1
TSD
+
4
VCC2
2
CD
5V/8V, 1.3A
3
VREF
OVP
10 GND
15
EXT
out
14
ANT
out
+
EXT
VCC2-0.5V, 0.35A
+
ANT
VCC2-0.5V, 0.3A
Pin Function
Pin No.
1
Pin name
ILM
Description
ILM output
When CTRL1 = M1, M2, H,
Equivalent Circuit
VCC2
7
ILM is ON
1
2
ILM_F
ILM voltage adjust
2
10
1kΩ
GND
Continued on next page.
No.A2141-6/12
LV5684PVD
Continued from preceding page.
Pin No.
3
Pin name
CD
Description
Equivalent Circuit
CD output
VCC2
7
When CTRL2 = M2, H,
CD is ON
5V or 8V/1.3A
3
135kΩ
108kΩ
45kΩ
1kΩ
10
4
AUDIO_F
AUDIO voltage adjust
GND
VCC2
7
5
5
AUDIO
AUDIO output
4
When CTRL2 = M1, M2, H,
1kΩ
AUDIO is ON
10
6
CTRL2
CTRL2 input
4-value input
GND
9
VCC1
10kΩ
6
85kΩ
185kΩ
0.5V
45kΩ
75kΩ
10
7
VCC2
8
CTRL1
GND
Power supply
CTRL1 input
4-value input
9
VCC1
10kΩ
6
85kΩ
185kΩ
0.5V
45kΩ
75kΩ
10
9
VCC1
Power supply
10
GND
GND
11
V6IN
Power supply
GND
VCC2
VCC1
V6IN
7
9
11
10
GND
Continued on next page.
No.A2141-7/12
LV5684PVD
Continued from preceding page.
Pin No.
12
Pin name
VDD
Description
VDD output
3.3V/0.35A
Equivalent Circuit
VCC1
11
12
230kΩ
2kΩ
140kΩ
10
13
SW33V
SW33V output
When CTRL2 = M1, M2, H,
GND
V6IN
11
SW33V is ON
3.3V/0.45A
13
230kΩ
140kΩ
1kΩ
10
14
ANT
ANT output
When CTRL1 = H,
GND
VCC2
7
100kΩ
ANT is ON
VCC-0.5V/300mA
14
15
EXT
EXT output
When CTRL1 = M2, H,
5kΩ
10
GND
7
VCC2
100kΩ
EXT is ON
VCC-0.5V/350mA
15
10
5kΩ
GND
No.A2141-8/12
LV5684PVD
Timing Chart
23V
VCC1
(9PIN)
VCC2
(7PIN)
V6IN
(11PIN)
VDD output
(12PIN)
H
CTRL1 input
(8PIN)
M2
M1
L
H
M2
CTRL2 input
(6PIN)
M1
L
ILM output
(1PIN)
CD output
(3PIN)
AUDIO output
(5PIN)
ANT output
(14PIN)
EXT output
(15PIN)
SW33V output
(13PIN)
Caution: The above values are obtained when typ.
No.A2141-9/12
LV5684PVD
• How to set AUDIO output voltage
AUDIO output voltage expression
AUDIO = (
5
R1 AUDIO
=
−1
R2
1.25
AUDIO
R1
1.25V
4
R1
+ 1) × 1.25[V ]
R2
AUDIO_F
Set the ratio of R1 and R2 to satisfy above expression.
(ex) AUDIO = 9V setting
R2
AUDIO_F is determined by internal band-gap
reference voltage (typ = 1.25V).
R1
9
=
− 1 = 6.2
R2 1.25
R1
24kΩ
=
≅ 6.15
R2 3.9kΩ
AUDIO = (6.15 + 1) × 1.25V ≅ 8.94V
• ILM output voltage is similarly calculated as AUDIO output.
(ex) ILM = 10.5V setting
R1 10.5
=
− 1 = 7.4
R2 1.25
R1
56kΩ
=
≅ 7.46
R2 7.5kΩ
ILM = (7.46 + 1) × 1.25V ≅ 10.575V
Note : The above values are typical values. These values have variation among the range of their tolerances.
No.A2141-10/12
LV5684PVD
HZIP15 Heat sink attachment
Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to
the outer environment and dissipating that heat.
a.
Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be
applied to the heat sink or tabs.
b.
Heat sink attachment
• Use flat-head screws to attach heat sinks.
• Use also washer to protect the package.
• Use tightening torques in the ranges 39-59Ncm (4-6kgcm) .
• If tapping screws are used, do not use screws with a diameter larger
than the holes in the semiconductor device itself.
• Do not make gap, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
• Take care a position of via hole .
• Do not allow dirt, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
• Verify that there are no press burrs or screw-hole burrs on the heat sink.
• Warping in heat sinks and printed circuit boards must be no more than
0.05 mm between screw holes, for either concave or convex warping.
• Twisting must be limited to under 0.05 mm.
• Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
• The speed of these torque wrenches should never exceed 700 rpm,
and should typically be about 400 rpm.
Binding head
machine screw
Countersunk head
mashine screw
Heat sink
gap
Via hole
c.
Silicone grease
• Spread the silicone grease evenly when mounting heat sinks.
• Our company recommends YG-6260 (Momentive Performance Materials Japan LLC)
d.
Mount
• First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board.
• When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening
up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin
doesn't hang.
e.
When mounting the semiconductor device to the heat sink using jigs, etc.,
• Take care not to allow the device to ride onto the jig or positioning dowel.
• Design the jig so that no unreasonable mechanical stress is applied to the semiconductor device.
f.
Heat sink screw holes
• Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used.
• When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used.
A hole diameter about 15% larger than the diameter of the screw is desirable.
• When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about
15% smaller than the diameter of the screw is desirable.
g.
There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not
recommended because of possible displacement due to fluctuation of the spring force with time or vibration.
No.A2141-11/12
LV5684PVD
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as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in
which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for
any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or
death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the
part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PS No.A2141-12/12