ETC1 HSML-C170 High performance chipled Datasheet

Agilent HSMx-C110/C170/C190/C191/C150
High Performance ChipLED
Data Sheet
HSMA-C110/C170/C190/C191/C150
HSML-C110/C170/C190/C191/C150
HSMC-C110/C170/C190/C191/C150
HSMZ-C110/C170/C190
Description
These chip-type LEDs utilize Aluminum Indium Gallium Phosphide
(AlInGaP) material technology.
The AlInGaP material has a very
high luminous efficiency, capable
of producing high light output
over a wide range of drive
currents. The available colors in
this surface mount series are
592 nm Amber, 605 nm Orange,
626 nm Red for AS AlInGaP and
631 nm red for TS AlInGaP.
All packages are binned by both
color and intensity, except for red
color.
These ChipLEDs come either in
two top emitting packages
(HSMx-C170/C190/C191/C150)
or in a side emitting package
(HSMx-C110). The right angle
ChipLEDs are suitable for
applications such as LCD backlighting. The top emitting
ChipLEDs with wide viewing
angle are suitable for light piping
and direct backlighting of
keypads and panels. In order to
facilitate pick and place operation, these ChipLEDs are shipped
in tape and reel, with 4000 units
per reel for HSMx-C170/C190/
C191 and 3000 units per reel for
HSMx-C110/C150.
These packages are compatible
with IR soldering process.
Features
• High brightness AlInGaP material
• Small size
• Industry standard footprint
• Diffused optics
• Top emitting or right angle
emitting
• Available in 3 colors
(red, orange, amber)
• Compatible with IR soldering
• Available in 8 mm tape on
7" diameter reel
• Reel sealed in zip locked moisture
barrier bags
Applications
• LCD backlighting
• Push button backlighting
• Front panel indicator
• Symbol indicator
• Microdisplays
• Small message panel signage
Package Dimensions
CATHODE
LINE
LED DIE
CATHODE
MARK
LED DIE
1.0 (0.039)
1.25 (0.049)
2.6 (0.102 )
0.62 (0.024)
2.0 (0.079 )
3.2 (0.126 )
POLARITY
CLEAR
EPOXY
1.4
(0.055)
DIFFUSED
EPOXY
1.5 (0.059)
PC BOARD
POLARITY
0.3 (0.012)
PC BOARD
1.6 (0.063 )
0.8 (0.031)
0.5 (0.020)
0.3 (0.012)
CATHODE LINE
3.2 (0.126 )
0.4 ± 0.15
(0.016 ± 0.006)
0.8 (0.031)
0.4 ± 0.15
(0.016 ± 0.006)
CATHODE LINE
1.0 (0.039)
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C110
HSMx-C170
CATHODE
MARK
LED DIE
CATHODE
MARK
LED DIE
0.8 (0.031)
0.8 (0.031)
0.4 (0.016)
1.6
(0.063 )
1.0
(0.039)
0.4 (0.016)
1.6
(0.063 )
1.0
(0.039)
POLARITY
0.3 (0.012)
0.3 (0.012)
DIFFUSED EPOXY
DIFFUSED EPOXY
POLARITY
PC BOARD
PC BOARD
CATHODE LINE
0.8 (0.031)
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
CATHODE LINE
0.6 (0.023)
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C190
HSMx-C191
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
2
0.7 (0.028) MIN.
CATHODE
MARK
LED DIE
Package Dimensions, continued
1.6 (0.063)
0.8 (0.031)
3.2 (0.126 )
DIFFUSED
EPOXY
POLARITY
2.0 (0.079)
0.6 (0.024)
1.1 (0.043)
PC BOARD
CATHODE LINE
0.50 ± 0.2
(0.020 ± 0.008)
SOLDERING
TERMINAL
HSMx-C150
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Device Selection Guide
Footprint
(mm) [1,2]
AS AlInGaP
Amber
AS AlInGaP
Orange
AS AlInGaP
Red
TS AlInGaP
Red
Package
Description
1.6 x 0.8 x 0.8
HSMA-C190
HSML-C190
HSMC-C190
HSMZ-C190
Untinted, Diffused
2.0 x 1.25 x 0.8
HSMA-C170
HSML-C170
HSMC-C170
HSMZ-C170
Untinted, Diffused
3.2 x 1.0 x 1.5
HSMA-C110
HSML-C110
HSMC-C110
HSMZ-C110
Untinted, Nondiffused
1.6 x 0.8 x 0.6
HSMA-C191
HSML-C191
HSMC-C191
Untinted, Diffused
3.2 x 1.6 x 1.1
HSMA-C150
HSML-C150
HSMC-C150
Untinted, Diffused
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
Absolute Maximum Ratings
TA = 25°C
Parameter
HSMA-C110/170/190/191/150
HSML-C110/170/190/191/150
HSMC-C110/170/190/191/150
HSMZ-C110/170/190
Units
DC Forward Current[1,2]
25
25
mA
Power Dissipation
60
65
mW
Reverse Voltage (I R = 100 µA)
5
5
V
LED Junction Temperature
95
95
°C
Operating Temperature Range
–30 to +85
–30 to +85
°C
Storage Temperature Range
–40 to +85
–40 to +85
°C
Soldering Temperature
See reflow soldering profile (Figure 7 & 8)
Notes:
1. Derate linearly as shown in Figure 4.
2. Drive currents above 5 mA are recommended for best long term performance.
3
Electrical Characteristics
TA = 25°C
Parameter Number
Forward Voltage
VF (Volts)
@ IF = 20 mA
Typ. Max.
Reverse Breakdown
VR (Volts)
@ IR = 100 µA
Min.
Capacitance C
(pF), VF = 0,
f = 1 MHz
Typ.
Thermal
Resistance
RθJ-PIN = (°C/W)
Typ.
HSMA-C110
1.9
2.4
5
45
600
HSML-C110
1.9
2.4
5
45
600
HSMC-C110
1.9
2.4
5
45
600
HSMZ-C110
2.2
2.6
5
35
600
HSMA-C170/190/191/150
1.9
2.4
5
45
300
HSML-C170/190/191/150
1.9
2.4
5
45
300
HSMC-C170/190/191/150
1.9
2.4
5
45
300
HSMZ-C170/190
2.2
2.6
5
35
300
Optical Characteristics
TA = 25°C
Part
Number
Color
Luminous
Intensity
Iv (mcd)
@ 20 mA[1]
Min.
Typ.
Peak
Wavelength
λpeak (nm)
Typ.
Color,
Dominant
Wavelength
λd[2] (nm)
Typ.
Viewing
Angle
2 θ1/2
Degrees[3]
Typ.
Luminous
Efficacy
ηv
(lm/w)
Typ.
HSMA-C110
AS Amber
28.5
95
595
592
130
480
HSMA-C170/190/191/150
AS Amber
28.5
90
595
592
170
480
HSML-C110
AS Orange
28.5
95
609
605
130
370
HSML-C170/190/191/150
AS Orange
28.5
90
609
605
170
370
HSMC-C110
AS Red
28.5
95
637
626
130
155
HSMC-C170/190/191/150
AS Red
28.5
90
637
626
170
155
HSMZ-C110
TS Red
45
170
643
631
130
122
HSMZ-C170/190
TS Red
45
165
643
631
170
122
Notes:
1. The luminous intensity, I v, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the
lamp package.
2. The dominant wavelength, λd , is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
4
Color Bin Limits [1]
Bin ID
A
B
C
D
E
F
Orange Color Bins[1]
Dom. Wavelength (nm)
Min.
Max.
597.0
600.0
600.0
603.0
603.0
606.0
606.0
609.0
609.0
612.0
612.0
615.0
Tolerance: ± 1 nm.
Bin ID
A
B
C
D
E
F
Yellow/Amber Color Bins[1]
Dom. Wavelength (nm)
Min.
Max.
582.0
584.5
584.5
587.0
587.0
589.5
589.5
592.0
592.0
594.5
594.5
597.0
Tolerance: ± 0.5 nm.
Note:
1. Bin categories are established for classification of products. Products
may not be available in all categories. Please contact your Agilent representative for information on currently available bins.
Light Intensity (Iv) Bin Limits[1]
Intensity (mcd)
Bin ID
Min.
Max.
A
0.11
0.18
B
0.18
0.29
C
0.29
0.45
D
0.45
0.72
E
0.72
1.10
F
1.10
1.80
G
1.80
2.80
H
2.80
4.50
J
4.50
7.20
K
7.20
11.20
L
11.20
18.00
M
18.00
28.50
Bin ID
N
P
Q
R
S
T
U
V
W
X
Y
Intensity (mcd)
Min.
Max.
28.50
45.00
45.00
71.50
71.50
112.50
112.50
180.00
180.00
285.00
285.00
450.00
450.00
715.00
715.00
1125.00
1125.00
1800.00
1800.00
2850.00
2850.00
4500.00
Tolerance: ± 15%.
Note:
1. Bin categories are established for classification of products. Products may not be available in all
categories. Please contact your Agilent representative for information on currently available bins.
5
1.0
AS AlInGaP
RED
RELATIVE INTENSITY
AS AlInGaP
AMBER
AS AlInGaP
ORANGE
0.5
TS AlInGaP
RED
0
500
550
600
650
700
750
WAVELENGTH – nm
1.4
AS AlInGaP
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
IF – FORWARD CURRENT – mA
100
10
TS AlInGaP
1
0.1
1.5
1.7
1.9
2.1
2.3
2.5
VF – FORWARD VOLTAGE – V
Figure 2. Forward current vs. forward voltage.
6
1.2
1.0
0.8
0.6
0.4
0.2
0
0
5
10
15
20
25
IF – FORWARD CURRENT – mA
Figure 3. Luminous intensity vs. forward
current.
30
IF MAX. – MAXIMUM FORWARD CURRENT – mA
Figure 1. Relative intensity vs. wavelength.
30
25
20
HSMx-C110
15
HSMx-C150/170/
190/191
10
5
0
0
20
40
60
80
100
TA – AMBIENT TEMPERATURE – °C
Figure 4. Maximum forward current vs.
ambient temperature.
1.00
RELATIVE INTENSITY – %
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
1.00
RELATIVE INTENSITY – %
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative intensity vs. angle for HSMx-C110.
1.00
RELATIVE INTENSITY – %
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 6. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150.
7
10 to 20 SEC.
255 °C (+5/-0)
TEMPERATURE
230°C MAX.
4°C/SEC. MAX.
140-160°C
–3°C/SEC. M
4°C/SEC.
MAX.
TEMPERATURE
217 °C
10 SEC. MAX.
3 °C/SEC. MAX.
6 °C/SEC. MAX.
100 - 150 °C
60 to 150 SEC.
MAX. 120 SEC.
OVER 2 MIN.
TIME
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 7. Recommended reflow soldering profile.
Figure 8. Recommended Pb-free reflow soldering profile.
5.0 (0.200)
0.9 (0.035)
0.9 (0.035)
1.2 (0.047)
1.0 (0.039)
1.2
(0.047)
0.2 (0.008)
CENTERING
BOARD
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
1.2
(0.047)
0.9
(0.035)
Figure 10. Recommended soldering pattern for HSMx-C170.
Figure 9. Recommended soldering pattern for HSMx-C110.
0.8 (0.031)
1.5 (0.059)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
Figure 11. Recommended soldering pattern for HSMx-C190 and C191.
Note: All dimensions in millimeters (inches).
8
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
Figure 12. Recommended soldering pattern for HSMx-C150.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 13. Reeling orientation.
8.0 ± 1.0 (0.315 ± 0.039)
10.50 ± 1.0 (0.413 ± 0.039)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
Figure 14. Reel dimensions.
Note: All dimensions in millimeters (inches).
9
6
PS
5.0 ± 0.5
(0.197 ± 0.020)
4.00 (0.157)
DIM. C
(SEE TABLE 1)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
CARRIER TAPE
USER FEED
DIRECTION
COVER TAPE
4.00 (0.157)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
HSMx-C110
POSITION IN
CARRIER TAPE
DIM. A
DIM. B
DIM. C
± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004)
PART NUMBER
DIM. A
(SEE TABLE 1)
HSMx-C191 SERIES
1.86 (0.073)
0.89 (0.035)
0.87 (0.034)
HSMx-C190 SERIES
1.80 (0.071)
0.95 (0.037)
0.87 (0.034)
HSMx-C170 SERIES
HSMx-C110 SERIES
2.30 (0.091)
3.40 (0.134)
1.45 (0.057)
1.70 (0.067)
0.95 (0.037)
1.20 (0.047)
HSMx-C150 SERIES
3.50 (0.138)
1.88 (0.074)
1.27 (0.050)
R 1.0 ± 0.05
(0.039 ± 0.002)
DIM. B
(SEE TABLE 1)
Figure 15. Tape dimensions.
END
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
START
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
Figure 16. Tape leader and trailer dimensions.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
10
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
Storage Condition: 5 to 30˚C
@ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 +/– 5˚C for 20 hours.
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For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
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(916) 788-6763
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Hong Kong: (+65) 6756 2394
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Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5988-5891EN
April 23, 2004
5989-0519EN
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