Preliminary Technical Data Complete Quad, 14-Bit, High Accuracy, Serial Input, Bipolar Voltage Output DAC AD5744R FEATURES GENERAL DESCRIPTION Complete quad, 14-bit digital-to-analog converter (DAC) Programmable output range: ±10 V, ±10.2564 V, or ±10.5263 V ±1 LSB max INL error, ±1 LSB max DNL error Low noise: 60 nV/√Hz Settling time: 10 μs max Integrated reference buffers Internal reference: 10 ppm/°C On-chip die temperature sensor Output control during power-up/brownout Programmable short-circuit protection Simultaneous updating via LDAC Asynchronous CLR to zero code Digital offset and gain adjust Logic output control pins DSP-/microcontroller-compatible serial interface Temperature range: −40°C to +85°C iCMOS™ process technology 1 The AD5744R is a quad, 14-bit, serial input, bipolar voltage output digital-to-analog converter that operates from supply voltages of ±11.4 V up to ±16.5 V. Nominal full-scale output range is ±10 V. The AD5744R provides integrated output amplifiers, reference buffers and proprietary power-up/powerdown control circuitry. The parts also feature a digital I/O port, which is programmed via the serial interface and an analog temperature sensor. The part incorporates digital offset and gain adjust registers per channel. APPLICATIONS Industrial automation Open-/closed-loop servo control Process control Data acquisition systems Automatic test equipment Automotive test and measurement High accuracy instrumentation The AD5744R is a high performance converter that offers guaranteed monotonicity, integral nonlinearity (INL) of ±1 LSB, low noise, and 10 μs settling time. The AD5744R includes an on-chip 5 V reference with a reference tempco of 10 ppm/°C maximum. During power-up (when the supply voltages are changing), VOUT is clamped to 0 V via a low impedance path. The AD5744R uses a serial interface that operates at clock rates of up to 30 MHz and is compatible with DSP and microcontroller interface standards. Double buffering allows the simultaneous updating of all DACs. The input coding is programmable to either twos complement or offset binary formats. The asynchronous clear function clears all DAC registers to either bipolar zero or zero scale depending on the coding used. The AD5744R is ideal for both closed-loop servo control and open-loop control applications. The AD5744R is available in a 32-lead TQFP, and offers guaranteed specifications over the −40°C to +85°C industrial temperature range. See Figure 1, the functional block diagram. 1 For analog systems designers within industrial/instrumentation equipment OEMs who need high performance ICs at higher voltage levels, iCMOS is a technology platform that enables the development of analog ICs capable of 30 V and operating at ±15 V supplies while allowing dramatic reductions in power consumption and package size, and increased ac and dc performance. Rev. PrA Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved. AD5744R Preliminary Technical Data TABLE OF CONTENTS Features .............................................................................................. 1 Asynchronous Clear (CLR)....................................................... 22 Applications....................................................................................... 1 Function Register ....................................................................... 23 General Description ......................................................................... 1 Data Register............................................................................... 24 Revision History ............................................................................... 2 Coarse Gain Register ................................................................. 24 Functional Block Diagram .............................................................. 3 Fine Gain Register...................................................................... 24 Specifications..................................................................................... 4 AD5744R Features.......................................................................... 25 AC Performance Characteristic...................................................... 6 Analog Output Control ............................................................. 25 Timing Characteristics..................................................................... 7 Programmable Short-Circuit Protection ................................ 25 Absolute Maximum Ratings.......................................................... 10 Digital I/O Port........................................................................... 25 ESD Caution................................................................................ 10 die Temperature Sensor............................................................. 25 Pin Configuration and Function Descriptions........................... 11 Local Ground Offset Adjust...................................................... 25 Terminology .................................................................................... 13 Applications Information .............................................................. 26 Typical Performance Characteristics ........................................... 15 Typical Operating Circuit ......................................................... 26 Theory of Operation ...................................................................... 20 Layout Guidelines........................................................................... 27 DAC Architecture....................................................................... 20 Galvanically Isolated Interface ................................................. 27 Reference Buffers........................................................................ 20 Microprocessor Interfacing....................................................... 27 Serial Interface ............................................................................ 20 Outline Dimensions ....................................................................... 30 Simultaneous Updating via LDAC........................................... 21 Ordering Guide .......................................................................... 30 Transfer Function ....................................................................... 22 REVISION HISTORY 4/06—Revision PrA: Preliminary Version Removed AD5744, AD5764, and AD5764R...................Universal Changes to Ordering Guide ............................................................ 2 Rev. PrA | Page 2 of 32 Preliminary Technical Data AD5744R FUNCTIONAL BLOCK DIAGRAM PGND AVDD AVSS AVDD AVSS DVCC DGND AD5744R SCLK SYNC SDO INPUT SHIFT REGISTER AND CONTROL LOGIC REFGND INPUT REG A DAC REG A RSTOUT REFAB REFERENCE BUFFERS 5V REFERENCE 14 SDIN REFOUT RSTIN VOLTAGE MONITOR AND CONTROL 14 ISCC G1 DAC A VOUTA G2 GAIN REG A AGNDA OFFSET REG A INPUT REG B DAC REG B 14 G1 DAC B VOUTB G2 GAIN REG B AGNDB OFFSET REG B D0 D1 INPUT REG C DAC REG C 14 G1 DAC C VOUTC G2 GAIN REG C AGNDC OFFSET REG C BIN/2sCOMP INPUT REG D DAC REG D 14 G1 DAC D VOUTD G2 GAIN REG D AGNDD OFFSET REG D REFERENCE BUFFERS TEMP SENSOR REFCD TEMP LDAC Figure 1. Functional Block Diagram Rev. PrA | Page 3 of 32 06065-001 CLR AD5744R Preliminary Technical Data SPECIFICATIONS AVDD = 11.4 V to 16.5 V, AVSS = −11.4 V to −16.5 V, AGND = DGND = REFGND = PGND = 0 V; REFAB = REFCD = 5 V external; DVCC = 2.7 V to 5.25 V, RLOAD = 10 kΩ, CL = 200 pF. All specifications TMIN to TMAX, unless otherwise noted. Table 1. B Grade 1 C Grade1 Unit 14 ±2 ±1 ±2 14 ±1 ±1 ±2 Bits LSB max LSB max mV max Bipolar Zero TC 2 Zero-Scale Error ±2 ±2 ±2 ±2 ppm FSR/°C max mV max Zero-Scale TC2 Gain Error ±2 ±0.02 ±2 ±0.02 ppm FSR/°C max % FSR max ±2 0.125 ±2 0.125 ppm FSR/°C max LSB max 5 1 ±10 1/7 5 1 ±10 1/7 V nominal MΩ min μA max V min/V max ±1% for specified performance Typically 100 MΩ Typically ±30 nA 4.997/5.003 ±10 1 18 4.997/5.003 ±10 1 18 V min/V max ppm/°C max MΩ min μV p-p typ At 25°C 75 75 nV/√Hz typ At 10 kHz ±10.5263 ±14 ±13 ±10.5263 ±14 ±13 AVDD/AVSS = ±11.4 V, REFIN = 5V AVDD/AVSS = ±16.5 V, REFIN = 7V ±15 ±15 10 ±1 10 ±1 V min/V max V min/V max ppm FSR/500 hours typ ppm FSR/1000 hours typ mA typ mA max 200 1000 0.3 200 1000 0.3 pF max pF max Ω max Parameter ACCURACY Resolution Relative Accuracy (INL) Differential Nonlinearity Bipolar Zero Error Gain TC2 DC Crosstalk2 REFERENCE INPUT/OUTPUT Reference Input2 Reference Input Voltage DC Input Impedance Input Current Reference Range Reference Output Output Voltage Reference TC Load2 Output Noise2 (0.1 Hz to 10 Hz) Noise Spectral Density2 OUTPUT CHARACTERISTICS2 Output Voltage Range 3 Output Voltage Drift vs. Time Short Circuit Current Load Current Capacitive Load Stability RL = ∞ RL = 10 kΩ DC Output Impedance Rev. PrA | Page 4 of 32 Test Conditions/Comments Outputs unloaded Guaranteed monotonic At 25°C; error at other temperatures obtained using bipolar zero TC At 25°C; error at other temperatures obtained using zero scale TC At 25°C; error at other temperatures obtained using gain TC RISCC = 6 kΩ, see Figure 31 For specified performance Preliminary Technical Data AD5744R Parameter DIGITAL INPUTS2 B Grade 1 C Grade1 Unit VIH, Input High Voltage VIL, Input Low Voltage Input Current Pin Capacitance DIGITAL OUTPUTS (D0, D1, SDO)2 Output Low Voltage Output High Voltage Output Low Voltage 2 0.8 ±1 10 2 0.8 ±1 10 V min V max μA max pF max 0.4 DVCC − 1 0.4 0.4 DVCC − 1 0.4 V max V min V max DVCC − 0.5 DVCC − 0.5 V min ±1 ±1 μA max DVCC = 5 V ± 5%, sinking 200 μA DVCC = 5 V ± 5%, sourcing 200 μA DVCC = 2.7 V to 3.6 V, sinking 200 μA DVCC = 2.7 V to 3.6 V, sourcing 200 μA SDO only 5 5 pF typ SDO only 1.4 5 1.175/1.9 200 80 1.4 5 1.175/1.9 200 80 V typ mV/°C typ V min/V max μA max ms typ Die temperature 11.4/16.5 2.7/5.25 11.4/16.5 2.7/5.25 V min/V max V min/V max −85 3.5 2.75 1.2 275 −85 3.5 2.75 1.2 275 dB typ mA/channel max mA/channel max mA max mW typ Output High Voltage High Impedance Leakage Current High Impedance Output Capacitance DIE TEMPERATURE SENSOR2 Output Voltage at 25°C Output Voltage Scale Factor Output Voltage Range Output Load Current Power-On Time POWER REQUIREMENTS AVDD/AVSS DVCC Power Supply Sensitivity2 ∆VOUT/∆ΑVDD AIDD AISS DICC Power Dissipation 1 2 3 Test Conditions/Comments DVCC = 2.7 V to 5.25 V, JEDEC compliant Per pin Per pin −40°C to 105°C Current source only Outputs unloaded Outputs unloaded VIH = DVCC, VIL = DGND, 750 μA typ ±12 V operation output unloaded Temperature range: −40°C to+85°C; typical at +25°C. Device functionality is guaranteed to +105°C with degraded performance. Guaranteed by design and characterization; not production tested. Output amplifier headroom requirement is 1.4 V minimum. Rev. PrA | Page 5 of 32 AD5744R Preliminary Technical Data AC PERFORMANCE CHARACTERISTIC AVDD = 11.4 V to 16.5 V, AVSS = −11.4 V to −16.5 V, AGND = DGND = REFGND = PGND = 0 V; REFAB = REFCD = 5 V external; DVCC = 2.7 V to 5.25 V, RLOAD = 10 kΩ, CL = 200 pF. All specifications TMIN to TMAX, unless otherwise noted. Guaranteed by design and characterization, not production tested. Table 2. Parameter DYNAMIC PERFORMANCE 1 Output Voltage Settling Time Slew Rate Digital-to-Analog Glitch Energy Glitch Impulse Peak Amplitude Channel-to-Channel Isolation DAC-to-DAC Crosstalk Digital Crosstalk Digital Feedthrough Output Noise (0.1 Hz to 10 Hz) Output Noise (0.1 Hz to 100 kHz) 1/f Corner Frequency Output Noise Spectral Density Complete System Output Noise Spectral Density 2 1 2 B Grade C Grade Unit Test Conditions/Comments 8 10 2 5 8 25 80 8 2 2 8 10 2 5 8 25 80 8 2 2 μs typ μs max μs typ V/μs typ nV-s typ mV max dB typ nV-s typ nV-s typ nV-s typ Full-scale step to ±1 LSB 0.025 45 1 60 80 0.025 45 1 60 80 LSB p-p typ μV rms max kHz typ nV/√Hz typ nV/√Hz typ Guaranteed by design and characterization; not production tested. Includes noise contributions from integrated reference buffers, 14-bit DAC and output amplifier. Rev. PrA | Page 6 of 32 512 LSB step settling Effect of input bus activity on DAC outputs Measured at 10 kHz Measured at 10 kHz Preliminary Technical Data AD5744R TIMING CHARACTERISTICS AVDD = 11.4 V to 16.5 V, AVSS = −11.4 V to −16.5 V, AGND = DGND = REFGND = PGND = 0 V; REFAB = REFCD = 5 V external; DVCC = 2.7 V to 5.25 V, RLOAD = 10 kΩ, CL = 200 pF. All specifications TMIN to TMAX, unless otherwise noted. Table 3. Parameter 1, 2, 3 t1 t2 t3 t4 t5 4 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 5, 6 t16 t17 t18 Limit at TMIN, TMAX 33 13 13 13 13 40 2 5 1.4 400 10 500 10 10 2 25 20 2 170 Unit ns min ns min ns min ns min ns min ns min ns min ns min μs min ns min ns min ns max μs max ns min μs max ns max ns min μs min ns min Description SCLK cycle time SCLK high time SCLK low time SYNC falling edge to SCLK falling edge setup time 24th SCLK falling edge to SYNC rising edge Minimum SYNC high time Data setup time Data hold time SYNC rising edge to LDAC falling edge (all DACs updated) SYNC rising edge to LDAC falling edge (single DAC updated) LDAC pulse width low LDAC falling edge to DAC output response time DAC output settling time CLR pulse width low CLR pulse activation time SCLK rising edge to SDO valid SYNC rising edge to SCLK rising edge SYNC rising edge to DAC output response time (LDAC = 0) LDAC falling edge to SYNC rising edge 1 Guaranteed by design and characterization; not production tested. All input signals are specified with tr = tf = 5 ns (10% to 90% of DVCC) and timed from a voltage level of 1.2 V. See Figure 2, Figure 3, and Figure 4. 4 Standalone mode only. 5 Measured with the load circuit of Figure 5. 6 Daisy-chain mode only. 2 3 Rev. PrA | Page 7 of 32 AD5744R Preliminary Technical Data t1 SCLK 1 2 24 t3 t6 t2 t4 t5 SYNC t8 t7 SDIN DB23 DB0 t10 t9 LDAC t10 t18 t12 t11 VOUT LDAC = 0 t12 t17 VOUT t13 CLR t14 06065-002 VOUT Figure 2. Serial Interface Timing Diagram t1 SCLK 24 t3 t6 48 t2 t5 t16 t4 SYNC t7 SDIN t8 DB23 DB0 INPUT WORD FOR DAC N DB23 DB0 t15 INPUT WORD FOR DAC N–1 DB23 SDO UNDEFINED DB0 INPUT WORD FOR DAC N t9 t10 06065-003 LDAC Figure 3. Daisy Chain Timing Diagram Rev. PrA | Page 8 of 32 Preliminary Technical Data AD5744R SCLK 24 48 SYNC DB23 DB0 DB23 DB0 NOP CONDITION INPUT WORD SPECIFIES REGISTER TO BE READ UNDEFINED DB0 SELECTED REGISTER DATA CLOCKED OUT Figure 4. Readback Timing Diagram 200µA TO OUTPUT PIN IOL VOH (MIN) OR VOL (MAX) CL 50pF 200µA IOH Figure 5. Load Circuit for SDO Timing Diagram Rev. PrA | Page 9 of 32 06065-004 DB23 SDO 06065-005 SDIN AD5744R Preliminary Technical Data ABSOLUTE MAXIMUM RATINGS TA = 25°C unless otherwise noted. Transient currents of up to 100 mA do not cause SCR latch-up. Table 4. Parameter AVDD to AGND, DGND AVSS to AGND, DGND DVCC to DGND Digital Inputs to DGND Digital Outputs to DGND REFIN to AGND, PGND REFOUT to AGND TEMP VOUTA, VOUTB, VOUTC, VOUTD to AGND AGND to DGND Operating Temperature Range Industrial Storage Temperature Range Junction Temperature (TJ max) 32-Lead TQFP θJA Thermal Impedance θJC Thermal Impedance Reflow Soldering Peak Temperature Time at Peak Temperature Rating −0.3 V to +17 V +0.3 V to −17 V −0.3 V to +7 V −0.3 V to DVCC + 0.3 V or 7 V (whichever is less) −0.3 V to DVCC + 0.3 V −0.3 V to AVDD + 0.3V AVSS to AVDD AVSS to AVDD AVSS to AVDD Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. −0.3 V to +0.3 V −40°C to +85°C −65°C to +150°C 150°C 65°C/W 12°C/W 220°C 10 sec to 40 sec ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. PrA | Page 10 of 32 Preliminary Technical Data AD5744R REFAB REFCD REFOUT REFGND TEMP AVSS AVDD BIN/2sCOMP PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 32 31 30 29 28 27 26 25 24 AGNDA 23 VOUTA 22 VOUTB 21 AGNDB 20 AGNDC LDAC 6 19 VOUTC D0 7 18 VOUTD D1 8 17 AGNDD SYNC 1 PIN 1 SDIN 3 AD5744R SDO 4 TOP VIEW (Not to Scale) CLR 5 ISCC AVSS PGND AVDD DVCC DGND 10 11 12 13 14 15 16 RSTIN RSTOUT 9 06065-006 SCLK 2 Figure 6. Pin Configuration Table 5. Pin Function Descriptions Pin No. 1 Mnemonic SYNC 2 SCLK 3 4 SDIN SDO 51 6 CLR1 LDAC 7, 8 D0, D1 9 RSTOUT 10 RSTIN 11 12 13, 31 14 15, 30 16 DGND DVCC AVDD PGND AVSS ISCC 17 18 AGNDD VOUTD Description Active Low Input. This is the frame synchronization signal for the serial interface. While SYNC is low, data is transferred in on the falling edge of SCLK. Serial Clock Input. Data is clocked into the shift register on the falling edge of SCLK. This operates at clock speeds up to 30 MHz. Serial Data Input. Data must be valid on the falling edge of SCLK. Serial Data Output. Used to clock data from the serial register in daisy-chain or readback mode. Negative Edge Triggered Input. Asserting this pin sets the DAC registers to 0x0000. Load DAC. Logic input. This is used to update the DAC registers and consequently the analog outputs. When tied permanently low, the addressed DAC register is updated on the rising edge of SYNC. If LDAC is held high during the write cycle, the DAC input register is updated but the output update is held off until the falling edge of LDAC. In this mode, all analog outputs can be updated simultaneously on the falling edge of LDAC. The LDAC pin must not be left unconnected. D0 and D1 form a digital I/O port. The user can set up these pins as inputs or outputs that are configurable and readable over the serial interface. When configured as inputs, these pins have weak internal pull-ups to DVCC. When programmed as outputs, D0 and D1 are referenced by DVCC and DGND. Reset Logic Output. This is the output from the on-chip voltage monitor used in the reset circuit. If desired, it can be used to control other system components. Reset Logic Input. This input allows external access to the internal reset logic. Applying a Logic 0 to this input clamps the DAC outputs to 0 V. In normal operation, RSTIN should be tied to Logic 1. Register values remain unchanged. Digital Ground Pin. Digital Supply Pin. Voltage ranges from 2.7 V to 5.25 V. Positive Analog Supply Pins. Voltage ranges from 11.4 V to 16.5 V. Ground Reference Point for Analog Circuitry. Negative Analog Supply Pins. Voltage ranges from –11.4 V to –16.5 V. This pin is used in association with an optional external resistor to AGND to program the short-circuit current of the output amplifiers. Refer to the Features section for further details. Ground Reference Pin for DAC D Output Amplifier. Analog Output Voltage of DAC D. Buffered output with a nominal full-scale output range of ±10 V. The output amplifier is capable of directly driving a 10 kΩ, 200 pF load. Rev. PrA | Page 11 of 32 AD5744R Pin No. 19 Mnemonic VOUTC 20 21 22 AGNDC AGNDB VOUTB 23 VOUTA 24 25 AGNDA REFAB 26 REFCD 27 REFOUT 28 29 REFGND TEMP 32 BIN/2sCOMP 1 Preliminary Technical Data Description Analog Output Voltage of DAC C. Buffered output with a nominal full-scale output range of ±10 V. The output amplifier is capable of directly driving a 10 kΩ, 200 pF load. Ground Reference Pin for DAC C Output Amplifier. Ground Reference Pin for DAC B Output Amplifier. Analog Output Voltage of DAC B. Buffered output with a nominal full-scale output range of ±10 V. The output amplifier is capable of directly driving a 10 kΩ, 200 pF load. Analog Output Voltage of DAC A. Buffered output with a nominal full-scale output range of ±10 V. The output amplifier is capable of directly driving a 10 kΩ, 200 pF load. Ground Reference Pin for DAC A Output Amplifier. External Reference Voltage Input for Channel A and Channel B. Reference input range is 1 V to 7 V; programs the full-scale output voltage. REFIN = 5 V for specified performance. External Reference Voltage Input for Channel C and Channel D. Reference input range is 1 V to 7 V; programs the full-scale output voltage. REFIN = 5 V for specified performance. Reference Output. This is the reference output from the internal voltage reference. The internal reference is 5 V ± 3 mV at 25°C, with a reference tempco of 10 ppm/°C. Reference Ground Return for the Reference Generator and Buffers. This pin provides an output voltage proportional to temperature. The output voltage is 1.4 V typical at 25°C die temperature; variation with temperature is 5 mV/°C. Determines the DAC Coding. This pin should be hardwired to either DVCC or DGND. When hardwired to DVCC, input coding is offset binary. When hardwired to DGND, input coding is twos complement (see Table 6). Internal pull-up device on this logic input. Therefore, it can be left floating and defaults to a logic high condition. Rev. PrA | Page 12 of 32 Preliminary Technical Data AD5744R TERMINOLOGY Relative Accuracy or Integral nonlinearity (INL) For the DAC, relative accuracy or integral nonlinearity (INL) is a measure of the maximum deviation, in LSBs, from a straight line passing through the endpoints of the DAC transfer function. Gain Error Gain error is a measure of the span error of the DAC. It is the deviation in slope of the DAC transfer characteristic from the ideal, expressed as a percentage of the full-scale range. A plot of gain error vs. temperature can be seen in Figure 23. Differential Nonlinearity (DNL) Differential nonlinearity is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1 LSB maximum ensures monotonicity. This DAC is guaranteed monotonic. Total Unadjusted Error Total unadjusted error (TUE) is a measure of the output error considering all the various errors. A plot of total unadjusted error vs. reference can be seen in Figure 19. Monotonicity A DAC is monotonic if the output either increases or remains constant for increasing digital input code. The AD5744R is monotonic over its full operating temperature range. Bipolar Zero Error Bipolar zero error is the deviation of the analog output from the ideal half-scale output of 0 V when the DAC register is loaded with 0x8000 (offset binary coding) or 0x0000 (twos complement coding). A plot of bipolar zero error vs. temperature can be seen in Figure 22. Bipolar Zero TC Bipolar zero TC is the measure of the change in the bipolar zero error with a change in temperature. It is expressed in ppm FSR/°C. Full-Scale Error Full-scale error is a measure of the output error when full-scale code is loaded to the DAC register. Ideally the output voltage should be 2 × VREF − 1 LSB. Full-scale error is expressed in percentage of full-scale range. Negative Full-Scale Error/Zero Scale Error Negative full-scale error is the error in the DAC output voltage when 0x0000 (offset binary coding) or 0x8000 (twos complement coding) is loaded to the DAC register. Ideally, the output voltage should be −2 × VREF. A plot of zero-scale error vs. temperature can be seen in Figure 21. Output Voltage Settling Time Output voltage settling time is the amount of time it takes for the output to settle to a specified level for a full-scale input change. Slew Rate The slew rate of a device is a limitation in the rate of change of the output voltage. The output slewing speed of a voltageoutput D/A converter is usually limited by the slew rate of the amplifier used at its output. Slew rate is measured from 10% to 90% of the output signal and is given in V/μs. Zero-Scale Error TC Zero-scale error TC is a measure of the change in zero-scale error with a change in temperature. Zero-scale error TC is expressed in ppm FSR/°C. Gain Error TC Gain error TC is a measure of the change in gain error with changes in temperature. Gain Error TC is expressed in (ppm of FSR)/°C. Digital-to-Analog Glitch Energy Digital-to-analog glitch impulse is the impulse injected into the analog output when the input code in the DAC register changes state. It is normally specified as the area of the glitch in nV secs and is measured when the digital input code is changed by 1 LSB at the major carry transition (0x7FFF to 0x8000) (see Figure 28). Digital Feedthrough Digital feedthrough is a measure of the impulse injected into the analog output of the DAC from the digital inputs of the DAC but is measured when the DAC output is not updated. It is specified in nV secs and measured with a full-scale code change on the data bus, that is, from all 0s to all 1s and vice versa. Power Supply Sensitivity Power supply sensitivity indicates how the output of the DAC is affected by changes in the power supply voltage. DC Crosstalk DC crosstalk is the dc change in the output level of one DAC in response to a change in the output of another DAC. It is measured with a full-scale output change on one DAC while monitoring another DAC, and is expressed in LSBs. DAC-to-DAC Crosstalk DAC-to-DAC crosstalk is the glitch impulse transferred to the output of one DAC due to a digital code change and subsequent output change of another DAC. This includes both digital and analog crosstalk. It is measured by loading one of the DACs with a full-scale code change (all 0s to all 1s and vice versa) with LDAC low and monitoring the output of another DAC. The energy of the glitch is expressed in nV-s. Rev. PrA | Page 13 of 32 AD5744R Preliminary Technical Data Channel-to-Channel Isolation Channel-to-channel isolation is the ratio of the amplitude of the signal at the output of one DAC to a sine wave on the reference input of another DAC. It is measured in dB. Reference TC Reference TC is a measure of the change in the reference output voltage with a change in temperature. It is expressed in ppm/°C. Digital Crosstalk Digital crosstalk is a measure of the impulse injected into the analog output of one DAC from the digital inputs of another DAC but is measured when the DAC output is not updated. It is specified in nV secs and measured with a full-scale code change on the data bus, that is, from all 0s to all 1s and vice versa. Rev. PrA | Page 14 of 32 Preliminary Technical Data AD5744R TYPICAL PERFORMANCE CHARACTERISTICS 0.20 0.15 0.10 0.10 DNL ERROR (LSB) 0.15 0.05 0 –0.05 –0.10 0.05 0 –0.05 –0.10 –0.15 –0.15 –0.20 –0.20 –0.25 0 2000 4000 6000 8000 1000 12000 14000 16000 CODE TA = 25°C VDD/VSS = ±12V REFIN = 5V 0.20 –0.25 06065-009 INL ERROR (LSB) 0.25 TA = 25°C VDD/VSS = ±15V REFIN = 5V 0 6000 8000 1000 12000 14000 16000 Figure 10. Differential Nonlinearity Error vs. Code, VDD/VSS = ±12 V 0.12 TA = 25°C VDD/VSS = ±12V REFIN = 5V 0.20 4000 CODE Figure 7. Integral Nonlinearity Error vs. Code, VDD/VSS = ±15 V 0.25 2000 06065-014 0.25 0.10 0.15 0.08 INL ERROR (LSB) INL ERROR (LSB) 0.10 0.05 0 –0.05 –0.10 0.06 0.04 0.02 0 –0.15 0 2000 4000 6000 8000 1000 12000 14000 16000 CODE –0.04 –40 06065-010 –0.25 20 40 60 80 100 Figure 11. Integral Nonlinearity Error vs. Temperature, VDD/VSS = ±15 V 0.12 TA = 25°C VDD/VSS = ±15V REFIN = 5V 0.20 0 TEMPERATURE (°C) Figure 8. Integral Nonlinearity Error vs. Code, VDD/VSS = ±12 V 0.25 –20 06065-015 –0.02 –0.20 0.10 0.08 INL ERROR (LSB) 0.10 0.05 0 –0.05 –0.10 0.04 0.02 0 2000 4000 6000 8000 1000 12000 14000 16000 CODE Figure 9. Differential Nonlinearity Error vs. Code, VDD/VSS = ±15 V –0.04 –40 –20 0 20 40 60 80 TEMPERATURE (°C) Figure 12. Integral Nonlinearity Error vs. Temperature, VDD/VSS = ±12 V Rev. PrA | Page 15 of 32 100 06065-016 –0.02 –0.20 –0.25 0.06 0 –0.15 06065-013 DNL ERROR (LSB) 0.15 AD5744R Preliminary Technical Data 0.04 0.15 0.03 TA = 25°C REFIN = 5V 0.10 0.02 DNL ERROR (LSB) DNL ERROR (LSB) 0.05 0.01 0 –0.01 –0.02 –0.03 0 –0.05 –0.10 –0.15 –0.04 –20 0 20 40 60 80 100 TEMPERATURE (°C) –0.25 11.4 06065-019 –0.06 –40 13.4 14.4 15.4 16.4 SUPPLY VOLTAGE (V) Figure 13. Differential Nonlinearity Error vs. Temperature, VDD/VSS = ±15 V Figure 16. Differential Nonlinearity Error vs. Supply Voltage 0.04 0.20 0.03 0.15 0.02 0.10 0 –0.01 –0.02 –0.03 0.05 0 –0.05 –0.10 –0.04 –0.15 –0.05 –0.20 –0.06 –40 –20 0 20 40 60 80 100 TEMPERATURE (°C) –0.25 1 2 3 4 5 6 7 REFERENCE VOLTAGE (V) 06065-027 INL ERROR (LSB) 0.01 06065-020 DNL ERROR (LSB) 12.4 06065-025 –0.20 –0.05 Figure 17. Integral Nonlinearity Error vs. Reference Voltage Figure 14. Differential Nonlinearity Error vs. Temperature, VDD/VSS = ±12 V 0.10 0.12 0.08 –0.10 0.06 DNL ERROR (LSB) –0.06 –0.04 –0.02 0 0.02 0 –0.02 –0.04 –0.08 –0.10 12.4 13.4 14.4 15.4 SUPPLY VOLTAGE (V) 16.4 1 2 3 4 5 6 7 REFERENCE VOLTAGE (V) Figure 18. Differential Nonlinearity Error vs. Reference Voltage Figure 15. Integral Nonlinearity Error vs. Supply Voltage Rev. PrA | Page 16 of 32 06065-031 –0.04 11.4 0.04 –0.06 –0.02 06065-023 INL ERROR (LSB) –0.08 Preliminary Technical Data 0.6 AD5744R 0.8 TA = 25°C 0.4 REFIN = 5V BIPOLAR ZERO ERROR (mV) 0 –0.2 TUE (mV) VDD/VSS = ±15V 0.6 0.2 –0.4 –0.6 –0.8 –1.0 –1.2 0.4 VDD/VSS = ±12V 0.2 0 –0.2 1 2 3 4 5 6 7 REFERENCE VOLTAGE (V) –0.4 –40 06065-035 –1.6 0 20 40 60 80 100 TEMPERATURE (°C) Figure 19. Total Unadjusted Error vs. Reference Voltage, VDD/VSS = ±16.5 V Figure 22. Bipolar Zero Error vs. Temperature 14 1.4 TA = 25°C REFIN = 5V REFIN = 5V 1.2 13 |IDD| 1.0 12 GAIN ERROR (mV) CURRENT (mA) –20 06065-039 –1.4 11 10 |ISS| VDD/VSS = ±12V 0.8 0.6 0.4 VDD/VSS = ±15V 0.2 9 13.4 14.4 15.4 16.4 VDD/VSS (V) –0.2 –40 06065-037 12.4 –20 REFIN = 5V 0.0014 60 80 100 TA = 25°C 0.0013 0.15 VDD/VSS = ±12V 0.10 5V 0.0012 0.0011 DICC (mA) 0.05 0 –0.05 0.0010 0.0009 –0.10 0.0008 –0.15 3V –0.25 –40 –20 0 20 40 60 80 TEMPERATURE (°C) 100 Figure 21. Zero-Scale Error vs. Temperature 0.0006 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 VLOGIC Figure 24. DICC vs. Logic Input Voltage Rev. PrA | Page 17 of 32 4.5 5.0 06065-041 0.0007 –0.20 06065-038 ZERO-SCALE ERROR (mV) 40 Figure 23. Gain Error vs. Temperature VDD/VSS = ±15V 0.20 20 TEMPERATURE (°C) Figure 20. IDD/ISS vs. VDD/VSS 0.25 0 06065-040 0 8 11.4 AD5744R –6 5000 VDD/VSS = ±15V –8 VDD/VSS = ±12V –10 –12 4000 VOUT (mV) OUTPUT VOLTAGE (µV) 6000 –4 TA = 25°C REFIN = 5V 3000 2000 –14 –16 –18 –20 1000 VDD/VSS = ±12V, REFIN = 5V, TA = 25°C, 0x8000 TO 0x7FFF, 500ns/DIV –22 0 –5 0 5 06065-042 –24 –1000 –10 10 SOURCE/SINK CURRENT (mA) Figure 25. Source and Sink Capability of Output Amplifier with Positive Full Scale Loaded –26 –2.0–1.5–1.0–0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 TIME (µs) Figure 28. Major Code Transition Glitch Energy, VDD/VSS = ±12 V 10000 TA = 25°C 9000 REFIN = 5V OUTPUT VOLTAGE (µV) 8000 VDD/VSS = ±15V MIDSCALE LOADED REFIN = 0V 15V SUPPLIES 7000 6000 12V SUPPLIES 5000 4000 4 3000 2000 1000 –2 3 50µV/DIV 06065-043 –7 8 SOURCE/SINK CURRENT (mA) CH4 50.0µV Figure 26. Source and Sink Capability of Output Amplifier with Negative Full Scale Loaded M1.00s CH4 26µV 06065-048 0 –1000 –12 Figure 29. Peak-to-Peak Noise (100 kHz Bandwidth) T VDD/VSS = ±15V TA = 25°C REFIN = 5V VDD/VSS = ±12V, REFIN = 5V, TA = 25°C, RAMP TIME = 100µs, LOAD = 200pF||10kΩ 1 2 1µs/DIV CH1 3.00V M1.00µs CH1 –120mV CH1 10.0V BW CH2 10.0V M100µs CH3 10.0mV BW T 29.60% A CH1 Figure 30. VOUT vs. VDD/VSS on Power-Up Figure 27. Full-Scale Settling Time Rev. PrA | Page 18 of 32 7.80mV 06065-055 1 06065-044 3 06065-047 7000 Preliminary Technical Data Preliminary Technical Data 10 AD5744R VDD/VSS = ±12V TA = 25°C, 10µF CAPACITOR ON REFOUT VDD/VSS = ±15V TA = 25°C REFIN = 5V 9 SHORT-CIRCUIT CURRENT (mA) 8 7 6 1 5 4 3 1 50µV/DIV 0 20 40 60 80 100 120 RISCC (kΩ) CH1 50.0µV 06065-050 0 Figure 31. Short-Circuit Current vs. RISCC T M1.00s A CH1 15µV 06065-052 2 Figure 33. REFOUT Output Noise 100 kHz Bandwidth VDD/VSS = ±12V TA = 25°C VDD/VSS = ±12V TA = 25°C 1 2 1 M400µs CH3 5.00V BW T 29.60% A CH1 7.80mV 5µV/DIV 06065-054 CH1 10.0V BW CH2 10.0V M1.00s Figure 32. REFOUT Turn-On Transient A CH1 18mV Figure 34. REFOUT Output Noise 0.1 Hz to 10 Hz Rev. PrA | Page 19 of 32 06065-053 3 AD5744R Preliminary Technical Data THEORY OF OPERATION The AD5744R is a quad, 14-bit, serial input, bipolar voltage output DAC and operates from supply voltages of ±11.4 V to ±16.5 V and has a buffered output voltage of up to ±10.5263 V. Data is written to the AD5744R in a 24-bit word format, via a 3-wire serial interface. The AD5744R also offers an SDO pin, which is available for daisy chaining or readback. SERIAL INTERFACE The AD5744R is controlled over a versatile 3-wire serial interface that operates at clock rates of up to 30 MHz and is compatible with SPI®, QSPI™, MICROWIRE™, and DSP standards. Input Shift Register The AD5744R incorporates a power-on reset circuit, which ensures that the DAC registers power up loaded with 0x0000. The AD5744R features a digital I/O port that can be programmed via the serial interface, an analog die temperature sensor, on-chip 10 ppm/°C voltage reference, on-chip reference buffers and per channel digital gain and offset registers. The input shift register is 24 bits wide. Data is loaded into the device MSB first as a 24-bit word under the control of a serial clock input, SCLK. The input register consists of a read/write bit, three register select bits, three DAC address bits and 14 data bits as shown in Table 7. The timing diagram for this operation is shown in Figure 2. DAC ARCHITECTURE The DAC architecture of the AD5744R consists of a 14-bit current mode segmented R-2R DAC. The simplified circuit diagram for the DAC section is shown in Figure 35. The four MSBs of the 14-bit data word are decoded to drive 15 switches, E1 to E15. Each of these switches connects one of the 15 matched resistors to either AGND or IOUT. The remaining 12 bits of the data word drive switches S0 to S11 of the 12-bit R2R ladder network. R VREF 2R 2R E15 E14 2R E1 R 2R S9 R 2R S8 2R 2R S0 Standalone Operation R/8 IOUT VOUT 06065-060 AGND 4 MSBs DECODED INTO 15 EQUAL SEGMENTS Upon power-up, the DAC registers are loaded with zero code (0x0000) and the outputs are clamped to 0 V via a low impedance path. The outputs can be updated with the zero code value by asserting either LDAC or CLR. The corresponding output voltage depends on the state of the BIN/2sCOMP pin. If the BIN/2sCOMP pin is tied to DGND, then the data coding is twos complement and the outputs update to 0 V. If the BIN/2sCOMP pin is tied to DVCC, then the data coding is offset binary and the outputs update to negative full scale. To have the outputs power-up with zero code loaded to the outputs, the CLR pin should be held low during power-up. 10-BIT, R-2R LADDER Figure 35. DAC Ladder Structure REFERENCE BUFFERS The AD5744R can operate with either an external or an internal reference. The reference inputs (REFAB and REFCD) have an input range up to 7 V. This input voltage is then used to provide a buffered positive and negative reference for the DAC cores. The positive reference is given by + VREF = 2 × VREF While the negative reference to the DAC cores is given by −VREF = −2 × VREF These positive and negative reference voltages (along with the gain register values) define the output ranges of the DACs. The serial interface works with both a continuous and noncontinuous serial clock. A continuous SCLK source can only be used if SYNC is held low for the correct number of clock cycles. In gated clock mode, a burst clock containing the exact number of clock cycles must be used and SYNC must be taken high after the final clock to latch the data. The first falling edge of SYNC starts the write cycle. Exactly 24 falling clock edges must be applied to SCLK before SYNC is brought back high again. If SYNC is brought high before the 24th falling SCLK edge, then the data written is invalid. If more than 24 falling SCLK edges are applied before SYNC is brought high, then the input data is also invalid. The input register addressed is updated on the rising edge of SYNC. In order for another serial transfer to take place, SYNC must be brought low again. After the end of the serial data transfer, data is automatically transferred from the input shift register to the addressed register. When the data has been transferred into the chosen register of the addressed DAC, all DAC registers and outputs can be updated by taking LDAC low. Rev. PrA | Page 20 of 32 Preliminary Technical Data AD5744R AD5744R1 68HC11 1 MOSI SDIN SCK SCLK PC7 SYNC PC6 LDAC MISO A continuous SCLK source can only be used if SYNC is held low for the correct number of clock cycles. In gated clock mode, a burst clock containing the exact number of clock cycles must be used and SYNC must be taken high after the final clock to latch the data. SDO Readback Operation Before a readback operation is initiated, the SDO pin must be enabled by writing to the function register and clearing the SDO DISABLE bit; this bit is cleared by default. Readback mode is invoked by setting the R/W bit = 1 in the serial input register write. With R/W = 1, Bit A2 to Bit A0, in association with Bit REG2, Bit REG1, and Bit REG0, select the register to be read. The remaining data bits in the write sequence are don’t care. During the next SPI write, the data appearing on the SDO output contain the data from the previously addressed register. For a read of a single register, the NOP command can be used in clocking out the data from the selected register on SDO. The readback diagram in Figure 4 shows the readback sequence. For example, to read back the fine gain register of Channel A on the AD5744R, the following sequence should be implemented: SDIN AD5744R1 SCLK SYNC LDAC SDO SDIN AD5744R1 SCLK SYNC LDAC SDO 06065-061 1ADDITIONAL PINS OMITTED FOR CLARITY 1. Write 0xA0XXXX to the AD5744R input register. This configures the AD5744R for read mode with the fine gain register of Channel A selected. Note that all the data bits, DB15 to DB0, are don’t care. Figure 36. Daisy Chaining the AD5744R Daisy-Chain Operation For systems that contain several devices, the SDO pin can be used to daisy chain several devices together. This daisy-chain mode can be useful in system diagnostics and in reducing the number of serial interface lines. The first falling edge of SYNC starts the write cycle. The SCLK is continuously applied to the input shift register when SYNC is low. If more than 24 clock pulses are applied, the data ripples out of the shift register and appears on the SDO line. This data is clocked out on the rising edge of SCLK and is valid on the falling edge. By connecting the SDO of the first device to the SDIN input of the next device in the chain, a multidevice interface is constructed. Each device in the system requires 24 clock pulses. Therefore, the total number of clock cycles must equal 24N, where N is the total number of AD5744R devices in the chain. When the serial transfer to all devices is complete, SYNC is taken high. This latches the input data in each device in the daisy chain and prevents any further data from being clocked into the input shift register. The serial clock can be a continuous or a gated clock. 2. Follow this with a second write, a NOP condition, 0x00XXXX. During this write, the data from the fine gain register is clocked out on the SDO line, that is, data clocked out contains the data from the fine gain register in Bit DB5 to Bit DB0. SIMULTANEOUS UPDATING VIA LDAC Depending on the status of both SYNC and LDAC, and after data has been transferred into the input register of the DACs, there are two ways in which the DAC registers and DAC outputs can be updated. Individual DAC Updating In this mode, LDAC is held low while data is being clocked into the input shift register. The addressed DAC output is updated on the rising edge of SYNC. Simultaneous Updating of All DACs In this mode, LDAC is held high while data is being clocked into the input shift register. All DAC outputs are updated by taking LDAC low any time after SYNC has been taken high. The update now occurs on the falling edge of LDAC. Rev. PrA | Page 21 of 32 AD5744R Preliminary Technical Data OUTPUT I/V AMPLIFIER 14-BIT DAC VREFIN VOUT The output voltage expression for the AD5744R is given by ⎡ D ⎤ VOUT = −2 × VREFIN + 4 × VREFIN ⎢ ⎣16384 ⎥⎦ DAC REGISTER LDAC where: D is the decimal equivalent of the code loaded to the DAC. VREFIN is the reference voltage applied at the REFAB/REFCD pins. SCLK SYNC SDIN INTERFACE LOGIC SDO 06065-062 INPUT REGISTER ASYNCHRONOUS CLEAR (CLR) Figure 37. Simplified Serial Interface of Input Loading Circuitry for One DAC Channel TRANSFER FUNCTION Table 6 shows the ideal input code to output voltage relationship for the AD5744R for both offset binary and twos complement data coding. Table 6. Ideal Output Voltage to Input Code Relationship for the AD5744R Digital Input Analog Output Offset Binary Data Coding MSB 11 10 10 01 00 1111 0000 0000 1111 0000 1111 0000 0000 1111 0000 LSB 1111 0001 0000 1111 0000 VOUT +2 VREF × (8191/8192) +2 VREF × (1/8192) 0V −2 VREF × (1/8192) −2 VREF × (8191/8192) CLR is a negative edge triggered clear that allows the outputs to be cleared to either 0 V (twos complement coding) or negative full scale (offset binary coding). It is necessary to maintain CLR low for a minimum amount of time (see Figure 3) for the operation to complete. When the CLR signal is returned high, the output remains at the cleared value until a new value is programmed. If at power-on CLR is at 0 V, then all DAC outputs are updated with the clear value. A clear can also be initiated through software by writing the command 0x04XXXX to the AD5744R. Twos Complement Data Coding MSB 01 00 00 11 10 1111 0000 0000 1111 0000 1111 0000 0000 1111 0000 LSB 1111 0001 0000 1111 0000 VOUT +2 VREF × (8191/8192) +2 VREF × (1/8192) 0V −2 VREF × (1/8192) −2 VREF × (8191/8192) Rev. PrA | Page 22 of 32 Preliminary Technical Data AD5744R Table 7. AD5744R Input Register Format MSB LSB DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 R/W 0 REG2 REG1 REG0 A2 A1 A0 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DATA Table 8. Input Register Bit Functions Register R/W REG2, REG1, REG0 Function Indicates a read from or a write to the addressed register. Used in association with the address bits to determine if a read or write operation is to the data register, offset register, gain register, or function register. REG2 REG1 REG0 Function 0 0 0 Function Register 0 1 0 Data Register 0 1 1 Coarse Gain Register 1 0 0 Fine Gain Register These bits are used to decode the DAC channels. A2 A1 A0 Channel Address 0 0 0 DAC A 0 0 1 DAC B 0 1 0 DAC C 0 1 1 DAC D 1 0 0 ALL DACs Data Bits. A2, A1, A0 D15:D0 FUNCTION REGISTER The function register is addressed by setting the three REG bits to 000. The values written to the address bits and the data bits determine the function addressed. The functions available via the function register are outlined in Table 9 and Table 10. Table 9. Function Register Options REG2 0 0 REG1 0 0 REG0 0 0 A2 0 0 A1 0 0 A0 0 1 0 0 0 0 0 0 1 1 0 0 0 1 DB15:DB6 DB5 Don’t Care LocalGroundOffset Adjust DB4 DB3 NOP, Data = Don’t Care D1 Direction D1 Value DB2 DB1 DB0 D0 Direction D0 Value SDO Disable CLR, Data = Don’t Care LOAD, Data = Don’t Care Table 10. Explanation of Function Register Options Option NOP Local-GroundOffset Adjust D0/D1 Direction D0/D1 Value SDO Disable CLR LOAD Description No operation instruction used in readback operations. Set by the user to enable local-ground-offset adjust function. Cleared by the user to disable local-ground-offset adjust function (default). Refer to Features section for further details. Set by the user to enable D0/D1 as outputs. Cleared by the user to enable D0/D1 as inputs (default). Refer to the Features section for further details. I/O Port Status Bits. Logic values written to these locations determine the logic outputs on the D0 and D1 pins when configured as outputs. These bits indicate the status of the D0 and D1 pins when the I/O port is active as an input. When enabled as inputs, these bits are don’t cares during a write operation. Set by the user to disable the SDO output. Cleared by the user to enable the SDO output (default). Addressing this function resets the DAC outputs to 0 V in twos complement mode and negative full scale in binary mode. Addressing this function updates the DAC registers and consequently the analog outputs. Rev. PrA | Page 23 of 32 DB0 AD5744R Preliminary Technical Data DATA REGISTER The data register is addressed by setting the three REG bits to 010. The DAC address bits select with which DAC channel the data transfer is to take place (see Table 8). The data bits are in positions DB15 to DB2 as shown in Table 11. Table 11. Programming the AD5744R Data Register REG2 REG1 0 REG0 1 A2 0 A1 A0 DB15 DB14 DB13 DB12 DB11 DB10 DAC Address DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 14-Bit DAC Data DB1 DB0 X X COARSE GAIN REGISTER The coarse gain register is addressed by setting the three REG bits to 011. The DAC address bits select with which DAC channel the data transfer is to take place (see Table 8). The coarse gain register is a 2-bit register and allows the user to select the output range of each DAC as shown in Table 13. Table 12. Programming the AD5744R Coarse Gain Register REG2 0 REG1 1 REG0 1 A2 A1 DAC Address A0 DB15 …. DB2 Don’t Care DB1 CG1 DB0 CG0 Table 13. Output Range Selection Output Range ±10 V (default) ±10.2564 V ±10.5263 V CG1 0 0 1 CG0 0 1 0 FINE GAIN REGISTER The fine gain register is addressed by setting the three REG bits to 100. The DAC address bits select with which DAC channel the data transfer is to take place (see Table 8). The AD5744R fine gain register is a 6-bit register and allows the user to adjust the gain of each DAC channel by −8 LSBs to +7.75 LSBs in 0.25 LSB steps as shown in Table 14 and Table 15. The adjustment is made to both the positive fullscale points and the negative full-scale points simultaneously, each point being adjusted by ½ of one step. The fine gain register coding is twos complement. Table 14. Programming AD5744R Fine Gain Register REG2 1 REG1 0 REG0 0 A2 A1 A0 DAC Address DB15:DB6 Don’t Care DB5 FG5 DB4 FG4 DB3 FG3 DB2 FG2 DB1 FG1 Table 15. AD5744R Fine Gain Register Options Gain Adjustment +7.75 LSBs +7.5 LSBs No Adjustment (default) −7.75 LSBs −8 LSBs FG5 0 0 0 1 1 FG4 1 1 0 0 0 FG3 1 1 0 0 0 Rev. PrA | Page 24 of 32 FG2 1 1 0 0 0 FG1 1 1 0 0 0 FG0 1 0 0 1 0 DB0 FG0 Preliminary Technical Data AD5744R AD5744R FEATURES ANALOG OUTPUT CONTROL In many industrial process control applications, it is vital that the output voltage be controlled during power-up and during brownout conditions. When the supply voltages are changing, the VOUT pins are clamped to 0 V via a low impedance path. To prevent the output amp being shorted to 0 V during this time, transmission gate G1 is also opened (see Figure 38). These conditions are maintained until the power supplies stabilize and a valid word is written to the DAC register. At this time, G2 opens and G1 closes. Both transmission gates are also externally controllable via the Reset In (RSTIN) control input. For instance, if RSTIN is driven from a battery supervisor chip, the RSTIN input is driven low to open G1 and close G2 on poweroff or during a brownout. Conversely, the on-chip voltage detector output (RSTOUT) is also available to the user to control other parts of the system. The basic transmission gate functionality is shown in Figure 38. RSTOUT RSTIN G1 VOUTA AGNDA 06065-063 G2 Figure 38. Analog Output Control Circuitry PROGRAMMABLE SHORT-CIRCUIT PROTECTION The short-circuit current of the output amplifiers can be programmed by inserting an external resistor between the ISCC pin and PGND. The programmable range for the current is 500 μA to 10 mA, corresponding to a resistor range of 120 kΩ to 6 kΩ . The resistor value is calculated as follows: 60 Isc DIGITAL I/O PORT The AD5744R contains a 2-bit digital I/O port (D1 and D0), these bits can be configured as inputs or outputs independently, and can be driven or have their values read back via the serial interface. The I/O port signals are referenced to DVCC and DGND. When configured as outputs, they can be used as control signals to multiplexers or can be used to control calibration circuitry elsewhere in the system. When configured as inputs, the logic signals from limit switches, for example can be applied to D0 and D1 and can be read back via the digital interface. DIE TEMPERATURE SENSOR VOLTAGE MONITOR AND CONTROL R= If the ISCC pin is left unconnected, the short circuit current limit defaults to 5 mA. It should be noted that limiting the short circuit current to a small value can affect the slew rate of the output when driving into a capacitive load, therefore, the value of short-circuit current programmed should take into account the size of the capacitive load being driven. The on-chip die temperature sensor provides a voltage output that is linearly proportional to the centigrade temperature scale. Its nominal output voltage is 1.4 V at +25°C die temperature, varying at 5 mV/°C, giving a typical output range of 1.175 V to 1.9 V over the full temperature range. Its low output impedance, and linear output simplify interfacing to temperature control circuitry and A/D converters. The temperature sensor is provided as more of a convenience rather than a precise feature; it is intended for indicating a die temperature change for recalibration purposes. LOCAL GROUND OFFSET ADJUST The AD5744R incorporates a local-ground-offset adjust feature which when enabled in the function register adjusts the DAC outputs for voltage differences between the individual DAC ground pins and the REFGND pin ensuring that the DAC output voltages are always with respect to the local DAC ground pin. For instance, if pin AGNDA is at +5 mV with respect to the REFGND pin and VOUTA is measured with respect to AGNDA then a −5mV error results, enabling the local-groundoffset adjust feature adjusts VOUTA by +5 mV, eliminating the error. Rev. PrA | Page 25 of 32 AD5744R Preliminary Technical Data APPLICATIONS INFORMATION TYPICAL OPERATING CIRCUIT Precision Voltage Reference Selection Figure 39 shows the typical operating circuit for the AD5744R. The only external components needed for this precision 14-bit DAC are decoupling capacitors on the supply pins and reference inputs, and an optional short-circuit current setting resistor. Because the AD5744R incorporates a voltage reference and reference buffers, it eliminates the need for an external bipolar reference and associated buffers. This leads to an overall savings in both cost and board space. To achieve the optimum performance from the AD5744R over its full operating temperature range, an external voltage reference must be used. Thought should be given to the selection of a precision voltage reference. The AD5744R has two reference inputs, REFAB and REFCD. The voltages applied to the reference inputs are used to provide a buffered positive and negative reference for the DAC cores. Therefore, any error in the voltage reference is reflected in the outputs of the device. In Figure 39, VDD and VSS are both connected to ±15 V, but VDD and VSS can operate with supplies from ±11.4 V to ±16.5 V. In Figure 39, AGNDA is connected to REFGND. There are four possible sources of error to consider when choosing a voltage reference for high accuracy applications: initial accuracy, temperature coefficient of the output voltage, long term drift, and output voltage noise. +15V –15V Initial accuracy error on the output voltage of an external reference could lead to a full-scale error in the DAC. Therefore, to minimize these errors, a reference with low initial accuracy error specification is preferred. Choosing a reference with an output trim adjustment, such as the ADR425, allows a system designer to trim system errors out by setting the reference voltage to a voltage other than the nominal. The trim adjustment can also be used at temperature to trim out any error. 10µF 10µF 100nF 10µF 100nF TEMP BIN/2sCOMP REFAB REFCD REFOUT REFGND AVSS TEMP AVDD BIN/2sCOMP 32 31 30 29 28 27 26 25 +5V SYNC 1 SYNC SCLK 2 SCLK VOUTA 23 VOUTA SDIN 3 SDIN VOUTB 22 VOUTB SDO 4 SDO AGNDB 5 CLR LDAC 6 LDAC VOUTC 19 VOUTC D0 7 D0 VOUTD 18 VOUTD D1 8 D1 AGNDD 17 The temperature coefficient of a reference’s output voltage affects INL, DNL, and TUE. A reference with a tight temperature coefficient specification should be chosen to reduce the dependence of the DAC output voltage on ambient conditions. ISCC AVSS AGNDC 20 PGND AVDD DVCC DGND Long term drift is a measure of how much the reference output voltage drifts over time. A reference with a tight long-term drift specification ensures that the overall solution remains relatively stable over its entire lifetime. 21 +5V 100nF 10µF +15V –15V 06065-064 10µF 10µF 100nF 10 11 12 13 14 15 16 100nF RSTIN RSTIN RSTOUT AD5744R 9 RSTOUT AGNDA 24 Figure 39. Typical Operating Circuit In high accuracy applications, which have a relatively low noise budget, reference output voltage noise needs to be considered. Choosing a reference with as low an output noise voltage as practical for the system resolution required is important. Precision voltage references such as the ADR435 (XFET design) produce low output noise in the 0.1 Hz to 10 Hz region. However, as the circuit bandwidth increases, filtering the output of the reference may be required to minimize the output noise. Table 16. Some Precision References Recommended for Use with the AD5744R Part No. ADR435 ADR425 ADR02 ADR395 AD586 Initial Accuracy(mV Max) ±6 ±6 ±5 ±6 ±2.5 Long-Term Drift (ppm Typ) 30 50 50 50 15 Temp Drift (ppm/°C Max) 3 3 3 25 10 Rev. PrA | Page 26 of 32 0.1 Hz to 10 Hz Noise (μV p-p Typ) 3.4 3.4 15 5 4 Preliminary Technical Data AD5744R LAYOUT GUIDELINES The power supply lines of the AD5744R should use as large a trace as possible to provide low impedance paths and reduce the effects of glitches on the power supply line. Fast switching signals, such as clocks, should be shielded with digital ground to avoid radiating noise to other parts of the board, and should never be run near the reference inputs. A ground line routed between the SDIN and SCLK lines helps reduce cross-talk between them (not required on a multilayer board, which has a separate ground plane, however, it is helpful to separate the lines). It is essential to minimize noise on the reference inputs, because it couples through to the DAC output. Avoid crossover of digital and analog signals. Traces on opposite sides of the board should run at right angles to each other. This reduces the effects of feed through on the board. A microstrip technique is recommended, but not always possible with a double-sided board. In this technique, the component side of the board is dedicated to ground plane, while signal traces are placed on the solder side. µCONTROLLER SERIAL CLOCK OUT SERIAL DATA OUT SYNC OUT CONTROL OUT 1ADDITIONAL ADuM14001 VIA VIB VIC VID ENCODE DECODE ENCODE DECODE ENCODE DECODE ENCODE DECODE VOA VOB VOC VOD TO SCLK TO SDIN TO SYNC TO LDAC PINS OMITTED FOR CLARITY 06065-065 In any circuit where accuracy is important, careful consideration of the power supply and ground return layout helps to ensure the rated performance. The printed circuit board on which the AD5744R is mounted should be designed so that the analog and digital sections are separated and confined to certain areas of the board. If the AD5744R is in a system where multiple devices require an AGND-to-DGND connection, the connection should be made at one point only. The star ground point should be established as close as possible to the device. The AD5744R should have ample supply bypassing of 10 μF in parallel with 0.1 μF on each supply located as close to the package as possible, ideally right up against the device. The 10 μF capacitors are the tantalum bead type. The 0.1 μF capacitor should have low effective series resistance (ESR) and low effective series inductance (ESI) such as the common ceramic types, which provide a low impedance path to ground at high frequencies to handle transient currents due to internal logic switching. Figure 40. Isolated Interface MICROPROCESSOR INTERFACING Microprocessor interfacing to the AD5744R is via a serial bus that uses standard protocol compatible with microcontrollers and DSP processors. The communications channel is a 3-wire (minimum) interface consisting of a clock signal, a data signal, and a synchronization signal. The AD5744R requires a 24-bit data-word with data valid on the falling edge of SCLK. For all the interfaces, the DAC output update can be done automatically when all the data is clocked in, or it can be done under the control of LDAC. The contents of the DAC register can be read using the readback function. AD5744R to MC68HC11 Interface Figure 41 shows an example of a serial interface between the AD5744R and the MC68HC11 microcontroller. The serial peripheral interface (SPI) on the MC68HC11 is configured for master mode (MSTR = 1), clock polarity bit (CPOL = 0), and the clock phase bit (CPHA = 1). The SPI is configured by writing to the SPI control register (SPCR) (see the 68HC11User Manual). SCK of the MC68HC11 drives the SCLK of the AD5744R, the MOSI output drives the serial data line (DIN) of the AD5744R, and the MISO input is driven from SDO. The SYNC is driven from one of the port lines, in this case PC7. GALVANICALLY ISOLATED INTERFACE In many process control applications, it is necessary to provide an isolation barrier between the controller and the unit being controlled to protect and isolate the controlling circuitry from any hazardous common-mode voltages that might occur. Isocouplers provide voltage isolation in excess of 2.5 kV. The serial loading structure of the AD5744R makes it ideal for isolated interfaces, because the number of interface lines is kept to a minimum. Figure 40 shows a 4-channel isolated interface to the AD5744R using an ADuM1400. For more information, go to www.analog.com. Rev. PrA | Page 27 of 32 AD5744R Preliminary Technical Data When data is being transmitted to the AD5744R, the SYNC line (PC7) is taken low and data is transmitted MSB first. Data appearing on the MOSI output is valid on the falling edge of SCK. Eight falling clock edges occur in the transmit cycle, so, in order to load the required 24-bit word, PC7 is not brought high until the third 8-bit word has been transferred to the DACs input shift register. AD5744R1 MISO SDO MOSI SDIN SCK SCLK PC7 SYNC 1ADDITIONAL PINS OMITTED FOR CLARITY AD5744R to ADSP2101/ADSP2103 Interface An interface between the AD5744R and the ADSP2101/ ADSP2103 is shown in Figure 43. The ADSP2101/ ADSP2103 should be set up to operate in the SPORT transmit alternate framing mode. The ADSP2101/ADSP2103 are programmed through the SPORT control register and should be configured as follows: internal clock operation, active low framing, and 24bit word length. 06065-066 MC68HC111 The 8XC51 transmits data in 8-bit bytes with only eight falling clock edges occurring in the transmit cycle. Because the DAC expects a 24-bit word, SYNC (P3.3) must be left low after the first eight bits are transferred. After the third byte has been transferred, the P3.3 line is taken high. The DAC can be updated using LDAC via P3.4 of the 8XC51. Figure 41. AD5744R to MC68HC11 Interface LDAC is controlled by the PC6 port output. The DAC can be updated after each 3-byte transfer by bringing LDAC low. This example does not show other serial lines for the DAC. For example, if CLR were used, it could be controlled by port output PC5. Transmission is initiated by writing a word to the TX register after the SPORT has been enabled. As the data is clocked out of the DSP on the rising edge of SCLK, no glue logic is required to interface the DSP to the DAC. In the interface shown, the DAC output is updated using the LDAC pin via the DSP. Alternatively, the LDAC input could be tied permanently low, and then the update takes place automatically when TFS is taken high. ADSP2101/ ADSP21031 AD5744R to 8XC51 Interface The AD5744R requires a clock synchronized to the serial data. For this reason, the 8XC51 must be operated in Mode 0. In this mode, serial data enters and exits through RXD, and a shift clock is output on TXD. AD5744R1 DR SDO DT SDIN SCLK TFS SCLK SYNC RFS 1ADDITIONAL AD5744R1 RxD SDIN TxD SCLK P3.3 SYNC P3.4 LDAC PINS OMITTED FOR CLARITY 1ADDITIONAL LDAC PINS OMITTED FOR CLARITY Figure 43. AD5744R to ADSP2101/ADSP2103 Interface AD5744R to PIC16C6x/7x Interface The PIC16C6x/7x synchronous serial port (SSP) is configured as an SPI master with the clock polarity bit set to 0. This is done by writing to the synchronous serial port control register (SSPCON). See the PIC16/17 Microcontroller User Manual. In this example, I/O port RA1 is being used to pulse SYNC and enable the serial port of the AD5744R. This microcontroller transfers only eight bits of data during each serial transfer operation; therefore, three consecutive write operations are needed. Figure 44 shows the connection diagram. 06065-067 8XC511 FO 06065-068 P3.3 and P3.4 are bit programmable pins on the serial port and are used to drive SYNC and LDAC, respectively. The 8CX51 provides the LSB of its SBUF register as the first bit in the data stream. The user must ensure that the data in the SBUF register is arranged correctly, because the DAC expects MSB first. When data is to be transmitted to the DAC, P3.3 is taken low. Data on RXD is clocked out of the microcontroller on the rising edge of TXD and is valid on the falling edge. As a result, no glue logic is required between this DAC and the microcontroller interface. Figure 42. AD5744R to 8XC51 Interface Rev. PrA | Page 28 of 32 Preliminary Technical Data AD5744R1 SDI/RC4 SDO SDO/RC5 SDIN SCLK/RC3 SCLK RA1 SYNC 1ADDITIONAL PINS OMITTED FOR CLARITY 06065-069 PIC16C6x/7x1 AD5744R Figure 44. AD5744R to PIC16C6x/7x Interface Rev. PrA | Page 29 of 32 AD5744R Preliminary Technical Data OUTLINE DIMENSIONS 0.75 0.60 0.45 1.20 MAX 9.00 BSC SQ 25 32 24 1 PIN 1 7.00 BSC SQ TOP VIEW 0° MIN 1.05 1.00 0.95 0.15 0.05 (PINS DOWN) 0.20 0.09 7° 3.5° 0° 0.08 MAX COPLANARITY SEATING PLANE 17 8 9 VIEW A VIEW A 16 0.80 BSC LEAD PITCH ROTATED 90° CCW 0.45 0.37 0.30 COMPLIANT TO JEDEC STANDARDS MS-026ABA Figure 45. 32-Lead Thin Plastic Quad Flat Package [TQFP] (SU-32-2) Dimensions shown in millimeters ORDERING GUIDE 1 Model AD5744RBSUZ 2 AD5744RBSUZ-REEL72 AD5744RCSUZ2 AD5744RCSUZ-REEL72 1 2 Function Quad 14-bit DAC Quad 14-bit DAC Quad 14-bit DAC Quad 14-bit DAC INL ±2 LSB max ±2 LSB max ±1 LSB max ±1 LSB max Temperature −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C Analog Devices reserves the right to ship higher grade devices in place of lower grade. Z= Pb-free part. Rev. PrA | Page 30 of 32 Internal Reference +5V +5V +5V +5V Package Description 32-lead TQFP 32-lead TQFP 32-lead TQFP 32-lead TQFP Package Option SU-32-2 SU-32-2 SU-32-2 SU-32-2 Preliminary Technical Data AD5744R NOTES Rev. PrA | Page 31 of 32 AD5744R Preliminary Technical Data NOTES ©2006 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. PR06065-0-4/06(PrA) Rev. PrA | Page 32 of 32