TI LP3990TL-1.35 Lp3990 150ma linear voltage regulator for digital application Datasheet

LP3990
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SNVS251I – MAY 2004 – REVISED MAY 2013
LP3990 150mA Linear Voltage Regulator for Digital Applications
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FEATURES
APPLICATIONS
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1
2
1% Voltage Accuracy at Room Temperature
Stable with Ceramic Capacitor
Logic Controlled Enable
No Noise Bypass Capacitor Required
Thermal-Overload and Short-Circuit Protection
DESCRIPTION
The LP3990 regulator is designed to meet the
requirements of portable, battery-powered systems
providing an accurate output voltage, low noise, and
low quiescent current. The LP3990 will provide a
0.8V output from the low input voltage of 2V at up to
150mA load current. When switched into shutdown
mode via a logic signal at the enable pin, the power
consumption is reduced to virtually zero.
KEY SPECIFICATIONS
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Cellular Handsets
Hand-Held Information Appliances
Input Voltage Range, 2.0 to 6.0V
Output Voltage Range, 0.8 to 3.3V
Output Current, 150mA
Output Stable - Capacitors, 1.0µF
Virtually Zero IQ (Disabled), <10nA
Very Low IQ (Enabled), 43µA
Low Output Noise, 150µVRMS
PSRR, 55dB at 1kHz
Fast Start Up, 105µs
The LP3990 is designed to be stable with space
saving ceramic capacitors as small as 1.0µF.
Performance is specified for a -40°C to 125°C
junction temperature range.
For output voltages other than 0.8V, 1.2, 1.35V, 1.5V,
1.8V, 2.5V, 2.8V, or 3.3V please contact your local
NSC sales office.
PACKAGE
All available in Lead Free option.
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4-Pin DSBGA, 1 mm x 1.3 mm
6-pin WQFN (SOT-23 Footprint)
SOT-23
For other package options contact your Texas Instruments sales
office.
Typical Application Circuit
LP3990
VIN
6
VIN
VOUT
1.0 PF
VOUT
1
1.0 PF
VEN
5
VEN
GND
2
(WQFN pin connections shown)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2013, Texas Instruments Incorporated
LP3990
SNVS251I – MAY 2004 – REVISED MAY 2013
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PIN DESCRIPTIONS
Pin No
Symbol
Name and Function
WQFN
DSBGA
SOT-23
5
A2
3
2
A1
1
B1
6
B2
1
VIN
Voltage Supply Input. A 1.0µF capacitor should be connected at this input.
4
N/C
No Connection. Do not connect to any other pin.
4
N/C
No Connection. Do not connect to any other pin.
Pad
GND
Common Ground. Connect to Pin 2.
3
VEN
Enable Input; Enables the Regulator when ≥ 0.95V.
Disables the Regulator when ≤ 0.4V.
Enable Input has 1MΩ pulldown resistor to GND.
2
GND
Common Ground. Connect to Pad.
5
VOUT
Voltage output. A 1.0µF Low ESR Capacitor should be connected to this Pin.
Connect this output to the load circuit.
Connection Diagram
VIN
VEN
VEN
VIN
B2
A2
A2
B2
B1
A1
GND
A1
GND
VOUT
VOUT
Bottom View
B1
Top View
DSBGA, 4 Bump Package
See Package Number YZR0004
VIN
VEN
N/C
N/C
VEN
VIN
6
5
4
4
5
6
GND
GND
1
2
3
3
2
1
VOUT
Gnd
N/C
N/C
Gnd
VOUT
Top View
Bottom View
WQFN-6 Package
See Package Number NGG0006A
2
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VEN
3
GND
2
VIN
1
4
5
N/C
VOUT
SOT-23 Package
See Package Number DBV
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2) (3)
Input Voltage
-0.3 to 6.5V
Output Voltage
-0.3 to (VIN + 0.3V) with 6.5V (max)
Enable Input Voltage
-0.3 to (VIN + 0.3V) with 6.5V (max)
Junction Temperature
Lead/Pad Temp.
150°C
(4)
WQFN/SOT-23
235°C
DSBGA
260°C
Storage Temperature
-65 to 150°C
Continuous Power Dissipation Internally Limited (5)
ESD (6)
Human Body Model
2KV
Machine Model
(1)
(2)
(3)
(4)
(5)
(6)
200V
All Voltages are with respect to the potential at the GND pin.
Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated
test conditions, see the Electrical Characteristics tables.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
For further information on these packages please refer to the following Application Notes; AN1112 DSBGA Package Wafer Level Chip
Scale Package, AN1187 Leadless Leadframe Package.
Internal thermal shutdown circuitry protects the device from permanent damage.
The human body model is 100pF discharged through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor
discharged directly into each pin.
Operating Ratings (1)
Input Voltage
2V to 6V
Enable Input Voltage
0 to (VIN + 0.3V) with 6.0V (max)
Junction Temperature
Ambient Temperature TA Range
(1)
(2)
-40°C to 125°C
(2)
-40°C to 85°C
Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated
test conditions, see the Electrical Characteristics tables.
The maximum ambient temperature (TA(max)) is dependant on the maximum operating junction temperature (TJ(max-op) = 125°C), the
maximum power dissipation of the device in the application (PD(max)), and the junction to ambient thermal resistance of the part/package
in the application (θJA), as given by the following equation: TA(max) = TJ(max-op) - (θJA × PD(max)).
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Thermal Properties (1)
Junction To Ambient Thermal Resistance (2)
θJA(WQFN-6)
88°C/W
θJA(DSBGA)
220°C/W
θJA(SOT-23)
220°C/W
(1)
(2)
4
Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated
test conditions, see the Electrical Characteristics tables.
Junction to ambient thermal resistance is dependant on the application and board layout. In applications where high maximum power
dissipation is possible, special care must be paid to thermal dissipation issues in board design.
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Electrical Characteristics
Unless otherwise noted, VEN =950mV, VIN = VOUT + 1.0V, or 2.0V, whichever is higher. CIN = 1 µF, IOUT = 1 mA, COUT =0.47
µF.
Typical values and limits appearing in normal type apply for TJ = 27°C. Limits appearing in boldface type apply over the full
junction temperature range for operation, −40 to +125°C. (1)
Symbol
Parameter
Conditions
(2)
VIN
Input Voltage
ΔVOUT
Output Voltage Tolerance
ILOAD = 1 mA
Over full line
and load
regulation.
VDO
Min
Max
2
6
DSBGA
-1
+1
WQFN
-1.5
+1.5
SOT-23
-1.5
+1.5
DSBGA
-2.5
+2.5
WQFN
-3
+3
SOT-23
-4
+4
VIN = (VOUT(NOM) + 1.0V) to 6.0V,
0.02
-0.1
0.1
Load Regulation Error
IOUT = 1mA
to 150mA
VOUT = 0.8 to 1.95V
DSBGA
0.002
-0.005
0.005
VOUT = 0.8 to 1.95V
WQFN, SOT-23
0.003
-0.008
0.008
VOUT = 2.0 to 3.3V
DSBGA
0.0005
-0.002
0.002
VOUT = 2.0 to 3.3V
WQFN, SOT-23
0.002
-0.005
0.005
IOUT = 150mA (3)
(4)
Load Current
See
IQ
Quiescent Current
VEN = 950mV, IOUT = 0mA
VEN = 0.4V
Short Circuit Current Limit
IOUT
Maximum Output Current
PSRR
Power Supply Rejection Ratio
Output noise Voltage
(4)
Thermal Shutdown
See
Units
V
%
%/V
%/mA
200
mV
0
VEN = 950mV, IOUT = 150mA
ISC
120
(5) (4)
ILOAD
TSHUTDOWN
Limit
Line Regulation Error
Dropout Voltage
en
Typ
(6)
µA
43
80
65
120
0.002
0.2
550
µA
1000
mA
150
f = 1kHz, IOUT = 1mA to 150mA
55
f = 10kHz, IOUT = 150mA
35
BW = 10Hz to
100kHz,
VOUT = 0.8
60
VOUT = 1.5
125
VOUT = 3.3
180
Temperature
155
Hysteresis
15
Maximum Input Current at VEN
Input
VEN = 0.0V
0.001
VIL
Low Input Threshold
VIN = 2V to 6V
VIH
High Input Threshold
VIN = 2V to 6V
mA
dB
µVRMS
°C
Enable Control Characteristics
IEN (7)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
VEN = 6V
6
0.1
2.5
10
0.4
0.95
µA
V
V
All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production at TJ = 25°C or
correlated using Statistical Quality Control methods. Operation over the temperature specification is guaranteed by correlating the
electrical characteristics to process and temperature variations and applying statistical process control.
VIN(MIN) = VOUT(NOM) + 0.5V, or 2.0V, whichever is higher.
Dropout voltage is voltage difference between input and output at which the output voltage drops to 100mV below its nominal value.
This parameter only for output voltages above 2.0V.
This electrical specification is guaranteed by design.
The device maintains the regulated output voltage without the load.
Short circuit current is measured with VOUT pulled to 0V and VIN worst case = 6.0V.
Enable Pin has 1MΩ typical, resistor connected to GND.
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Electrical Characteristics (continued)
Unless otherwise noted, VEN =950mV, VIN = VOUT + 1.0V, or 2.0V, whichever is higher. CIN = 1 µF, IOUT = 1 mA, COUT =0.47
µF.
Typical values and limits appearing in normal type apply for TJ = 27°C. Limits appearing in boldface type apply over the full
junction temperature range for operation, −40 to +125°C. (1)
Symbol
Parameter
Conditions
Typ
Limit
Min
Max
Units
Timing Characteristics
TON
Turn On Time
Transient
Response
(8)
(8)
To 95% Level
VIN(MIN) to 6.0V
Line Transient Response |δVOUT|
Trise = Tfall = 30µs
Load Transient Response |δVOUT|
Trise = Tfall = 1µs
COUT = 1µF
VOUT = 0.8
80
150
VOUT = 1.5
105
200
VOUT = 3.3
175
250
8
16
mV
(pk - pk)
55
100
mV
(8)
δVIN = 600mV
µs
(8)
IOUT = 1mA to 150mA
This electrical specification is guaranteed by design.
Output Capacitor, Recommended Specifications
Symbol
COUT
Parameter
Output Capacitance
Conditions
Capacitance (1)
ESR
(1)
6
Nom
1.0
Limit
Min
Max
0.7
5
Units
µF
500
mΩ
The full operating conditions for the application should be considered when selecting a suitable capacitor to ensure that the minimum
value of capacitance is always met. Recommended capacitor type is X7R. However, dependent on application, X5R, Y5V, and Z5U can
also be used. (See Application Hints)
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Typical Performance Characteristics
Unless otherwise specified, CIN = 1.0µF Ceramic, COUT = 0.47 µF Ceramic, VIN = VOUT(NOM) + 1.0V, TA = 25°C, VOUT(NOM) =
1.5V , Shutdown pin is tied to VIN.
Ground Current vs Load Current
80
1.50
70
TJ = 125°C
GROUND CURRENT (PA)
VOUT CHANGE (%)
Output Voltage Change vs Temperature
2.00
1.00
0.50
0.00
-0.50
-1.00
60
50
40
TJ = -40°C
30
TJ = 25°C
20
10
-1.50
-2.00
-40
0
-25
0
25
50
75
100
0
125
25
Ground Current vs VIN. ILOAD = 0mA
100
90
90
80
80
70
70
60
TJ = 125°C
125
150
60
TJ = 125°C
50
TJ = 25°C
TJ = 25°C
40
40
TJ = -40°C
30
TJ = -40°C
30
20
20
2
2.5
3
3.5
4
4.5
5
5.5
6
2
2.5
3
VIN
3.5
4
4.5
5
5.5
6
VIN
Ground Current vs VIN. ILOAD = 150mA
Short Circuit Current
100
VIN = 2.5V
800
80
CURRENT
(mA)
90
TJ = 125°C
70
TJ = 25°C
60
TJ = -40°C
50
600
400
200
0
VOUT
40
30
(1V/Div)
GND I (µA)
100
Ground Current vs VIN. ILOAD = 1mA
100
GND I (PA)
GND I (PA)
75
LOAD CURRENT (mA)
TEMPERATURE (°C)
50
50
20
TIME (100 Ps/DIV)
2
2.5
3
3.5
4
4.5
5
5.5
6
VIN
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Typical Performance Characteristics (continued)
Unless otherwise specified, CIN = 1.0µF Ceramic, COUT = 0.47 µF Ceramic, VIN = VOUT(NOM) + 1.0V, TA = 25°C, VOUT(NOM) =
1.5V , Shutdown pin is tied to VIN.
Short Circuit Current
Line transient
CIN = 1 PF
VIN = 6V
800
COUT = 0.47 PF
IL = 1 to 150 mA
VIN (V)
400
2.5
200
(1V/Div)
'VOUT
0
VOUT
3.1
(10 mV/Div)
CURRENT
(mA)
600
TIME (100 Ps/DIV)
TIME (100 Ps/DIV)
Power Supply Rejection Ratio
0
0
-10
-10
COUT = 0.47 PF
-30
IL = 1 mA
-40
-50
COUT = 1 PF
-60
-70
-80
-30
-40
-70
-80
1k
10k
100k
1M
100
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Enable Start-up Time
1M
VOUT
(500 mV/Div)
(1V/Div)
IL = 150 mA
VEN
(500 mV/Div)
(1V/Div)
1k
Enable Start-up Time
IL = 1 mA
VOUT
COUT = 0.47 PF
-60
-90
100
VEN
ILOAD = 150 mA
-50
-90
TIME (50 Ps/DIV)
8
COUT = 1 PF
-20
RIPPLE REJECTION (dB)
-20
RIPPLE REJECTION (dB)
Power Supply Rejection Ratio
TIME (50 Ps/DIV)
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Typical Performance Characteristics (continued)
Unless otherwise specified, CIN = 1.0µF Ceramic, COUT = 0.47 µF Ceramic, VIN = VOUT(NOM) + 1.0V, TA = 25°C, VOUT(NOM) =
1.5V , Shutdown pin is tied to VIN.
Load Transient
Noise Density
10
CIN = 1 PF
VOUT = 3.3V
1
NOISE (PV/ Hz)
'VOUT
LOAD CURRENT
(mA)
(50 mV/Div)
COUT = 0.47 PF
VOUT = 1.5V
0.1
150
1
0.01
TIME (20 Ps/DIV)
0.1
1
10
100
FREQUENCY (kHz)
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APPLICATION HINTS
EXTERNAL CAPACITORS
In common with most regulators, the LP3990 requires external capacitors for regulator stability. The LP3990 is
specifically designed for portable applications requiring minimum board space and smallest components. These
capacitors must be correctly selected for good performance.
INPUT CAPACITOR
An input capacitor is required for stability. It is recommended that a 1.0µF capacitor be connected between the
LP3990 input pin and ground (this capacitance value may be increased without limit).
This capacitor must be located a distance of not more than 1cm from the input pin and returned to a clean
analogue ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input.
Important: To ensure stable operation it is essential that good PCB design practices are employed to minimize
ground impedance and keep input inductance low. If these conditions cannot be met, or if long leads are used to
connect the battery or other power source to the LP3990, then it is recommended that the input capacitor is
increased. Also, tantalum capacitors can suffer catastrophic failures due to surge current when connected to a
low-impedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is used at the
input, it must be guaranteed by the manufacturer to have a surge current rating sufficient for the application.
There are no requirements for the ESR (Equivalent Series Resistance) on the input capacitor, but tolerance and
temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will remain
approximately 1.0µF over the entire operating temperature range.
OUTPUT CAPACITOR
The LP3990 is designed specifically to work with very small ceramic output capacitors. A 1.0µF ceramic
capacitor (temperature types Z5U, Y5V or X7R) with ESR between 5mΩ to 500mΩ, is suitable in the LP3990
application circuit.
For this device the output capacitor should be connected between the VOUT pin and ground.
It is also possible to use tantalum or film capacitors at the device output, COUT (or VOUT), but these are not as
attractive for reasons of size and cost (see CAPACITOR CHARACTERISTICS).
The output capacitor must meet the requirement for the minimum value of capacitance and also have an ESR
value that is within the range 5mΩ to 500mΩ for stability.
NO-LOAD STABILITY
The LP3990 will remain stable and in regulation with no external load. This is an important consideration in some
circuits, for example CMOS RAM keep-alive applications.
CAPACITOR CHARACTERISTICS
The LP3990 is designed to work with ceramic capacitors on the output to take advantage of the benefits they
offer. For capacitance values in the range of 0.47µF to 4.7µF, ceramic capacitors are the smallest, least
expensive and have the lowest ESR values, thus making them best for eliminating high frequency noise. The
ESR of a typical 1.0µF ceramic capacitor is in the range of 20mΩ to 40mΩ, which easily meets the ESR
requirement for stability for the LP3990.
For both input and output capacitors, careful interpretation of the capacitor specification is required to ensure
correct device operation. The capacitor value can change greatly, depending on the operating conditions and
capacitor type.
In particular, the output capacitor selection should take account of all the capacitor parameters, to ensure that the
specification is met within the application. The capacitance can vary with DC bias conditions as well as
temperature and frequency of operation. Capacitor values will also show some decrease over time due to aging.
The capacitor parameters are also dependant on the particular case size, with smaller sizes giving poorer
performance figures in general. As an example, Figure 1 shows a typical graph comparing different capacitor
case sizes in a Capacitance vs. DC Bias plot. As shown in the graph, increasing the DC Bias condition can result
10
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CAP VALUE (% OF NOM. 1 uF)
in the capacitance value falling below the minimum value given in the recommended capacitor specifications
table (0.7µF in this case). Note that the graph shows the capacitance out of spec for the 0402 case size
capacitor at higher bias voltages. It is therefore recommended that the capacitor manufacturers’ specifications for
the nominal value capacitor are consulted for all conditions, as some capacitor sizes (e.g. 0402) may not be
suitable in the actual application.
0603, 10V, X5R
100%
80%
60%
0402, 6.3V, X5R
40%_
20%
_
0
1.0
2.0
_
3.0
_
4.0
_
5.0
_
DC BIAS (V)
Figure 1. Graph Showing a Typical Variation in Capacitance vs DC Bias
The ceramic capacitor’s capacitance can vary with temperature. The capacitor type X7R, which operates over a
temperature range of -55°C to +125°C, will only vary the capacitance to within ±15%. The capacitor type X5R
has a similar tolerance over a reduced temperature range of -55°C to +85°C. Many large value ceramic
capacitors, larger than 1µF are manufactured with Z5U or Y5V temperature characteristics. Their capacitance
can drop by more than 50% as the temperature varies from 25°C to 85°C. Therefore X7R is recommended over
Z5U and Y5V in applications where the ambient temperature will change significantly above or below 25°C.
Tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more
expensive when comparing equivalent capacitance and voltage ratings in the 0.47µF to 4.7µF range.
Another important consideration is that tantalum capacitors have higher ESR values than equivalent size
ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the
stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic
capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum will increase about
2:1 as the temperature goes from 25°C down to -40°C, so some guard band must be allowed.
ENABLE CONTROL
The LP3990 features an active high Enable pin, VEN, which turns the device on when pulled high. When not
enabled the regulator output is off and the device typically consumes 2nA.
If the application does not require the Enable switching feature, the VEN pin should be tied to VIN to keep the
regulator output permanently on.
To ensure proper operation, the signal source used to drive the VEN input must be able to swing above and
below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section under VIL and VIH.
DSBGA MOUNTING
The DSBGA package requires specific mounting techniques, which are detailed in Application Note AN1112.
For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the
DSBGA device.
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DSBGA LIGHT SENSITIVITY
Exposing the DSBGA device to direct light may affect the operation of the device. Light sources, such as halogen
lamps, can affect electrical performance, if placed in close proximity to the device.
Light with wavelengths in the infra-red portion of the spectrum is the most detrimental, and so, fluorescent
lighting used inside most buildings, has little or no effect on performance.
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REVISION HISTORY
Changes from Revision H (May 2013) to Revision I
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 12
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PACKAGE OPTION ADDENDUM
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1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
LP3990MF-1.2/NOPB
Package Type Package Pins Package
Drawing
Qty
ACTIVE
SOT-23
DBV
5
1000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
SCDB
(4/5)
LP3990MF-1.8
NRND
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 125
SCFB
LP3990MF-1.8/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
SCFB
LP3990MF-2.5
NRND
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 125
SCJB
LP3990MF-2.5/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
SCJB
LP3990MF-2.8/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
SCKB
LP3990MF-3.3/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
SCLB
LP3990MFX-1.2/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
SCDB
LP3990MFX-1.8/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
SCFB
LP3990MFX-3.3
NRND
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 125
SCLB
LP3990MFX-3.3/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
SCLB
LP3990SD-1.2/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L086B
LP3990SD-1.5/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L087B
LP3990SD-1.8/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L088B
LP3990TL-0.8/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3990TL-1.2/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3990TL-1.35/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3990TL-1.5/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
1-Nov-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LP3990TL-1.8/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3990TL-2.5/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3990TL-2.8/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3990TLX-0.8/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3990TLX-1.2/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3990TLX-1.35/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3990TLX-1.5/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3990TLX-1.8/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3990TLX-2.5/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3990TLX-2.8/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
LP3990MF-1.2/NOPB
SOT-23
DBV
5
1000
178.0
8.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.2
3.2
1.4
4.0
8.0
Q3
LP3990MF-1.8
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP3990MF-1.8/NOPB
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP3990MF-2.5
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP3990MF-2.5/NOPB
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP3990MF-2.8/NOPB
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP3990MF-3.3/NOPB
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP3990MFX-1.2/NOPB
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP3990MFX-1.8/NOPB
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP3990MFX-3.3
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP3990MFX-3.3/NOPB
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP3990SD-1.2/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP3990SD-1.5/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP3990SD-1.8/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP3990TL-0.8/NOPB
DSBGA
YZR
4
250
178.0
8.4
1.09
1.35
0.76
4.0
8.0
Q1
LP3990TL-1.2/NOPB
DSBGA
YZR
4
250
178.0
8.4
1.09
1.35
0.76
4.0
8.0
Q1
LP3990TL-1.35/NOPB
DSBGA
YZR
4
250
178.0
8.4
1.09
1.35
0.76
4.0
8.0
Q1
LP3990TL-1.5/NOPB
DSBGA
YZR
4
250
178.0
8.4
1.09
1.35
0.76
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
LP3990TL-1.8/NOPB
DSBGA
YZR
4
250
178.0
8.4
LP3990TL-2.5/NOPB
DSBGA
YZR
4
250
178.0
8.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1.09
1.35
0.76
4.0
8.0
Q1
1.09
1.35
0.76
4.0
8.0
Q1
LP3990TL-2.8/NOPB
DSBGA
YZR
4
250
178.0
8.4
1.09
1.35
0.76
4.0
8.0
Q1
LP3990TLX-0.8/NOPB
DSBGA
YZR
4
3000
178.0
8.4
1.09
1.35
0.76
4.0
8.0
Q1
LP3990TLX-1.2/NOPB
DSBGA
YZR
4
3000
178.0
8.4
1.09
1.35
0.76
4.0
8.0
Q1
LP3990TLX-1.35/NOPB
DSBGA
YZR
4
3000
178.0
8.4
1.09
1.35
0.76
4.0
8.0
Q1
LP3990TLX-1.5/NOPB
DSBGA
YZR
4
3000
178.0
8.4
1.09
1.35
0.76
4.0
8.0
Q1
LP3990TLX-1.8/NOPB
DSBGA
YZR
4
3000
178.0
8.4
1.09
1.35
0.76
4.0
8.0
Q1
LP3990TLX-2.5/NOPB
DSBGA
YZR
4
3000
178.0
8.4
1.09
1.35
0.76
4.0
8.0
Q1
LP3990TLX-2.8/NOPB
DSBGA
YZR
4
3000
178.0
8.4
1.09
1.35
0.76
4.0
8.0
Q1
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP3990MF-1.2/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LP3990MF-1.8
SOT-23
DBV
5
1000
210.0
185.0
35.0
LP3990MF-1.8/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LP3990MF-2.5
SOT-23
DBV
5
1000
210.0
185.0
35.0
LP3990MF-2.5/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LP3990MF-2.8/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LP3990MF-3.3/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP3990MFX-1.2/NOPB
SOT-23
DBV
5
3000
210.0
185.0
35.0
LP3990MFX-1.8/NOPB
SOT-23
DBV
5
3000
210.0
185.0
35.0
LP3990MFX-3.3
SOT-23
DBV
5
3000
210.0
185.0
35.0
LP3990MFX-3.3/NOPB
SOT-23
DBV
5
3000
210.0
185.0
35.0
LP3990SD-1.2/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP3990SD-1.5/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP3990SD-1.8/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP3990TL-0.8/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LP3990TL-1.2/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LP3990TL-1.35/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LP3990TL-1.5/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LP3990TL-1.8/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LP3990TL-2.5/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LP3990TL-2.8/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LP3990TLX-0.8/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
LP3990TLX-1.2/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
LP3990TLX-1.35/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
LP3990TLX-1.5/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
LP3990TLX-1.8/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
LP3990TLX-2.5/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
LP3990TLX-2.8/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
Pack Materials-Page 3
MECHANICAL DATA
NGG0006A
SDE06A (Rev A)
www.ti.com
MECHANICAL DATA
YZR0004xxx
D
0.600±0.075
E
TLA04XXX (Rev D)
D: Max = 1.324 mm, Min =1.263 mm
E: Max = 1.045 mm, Min =0.984 mm
4215042/A
NOTES:
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
www.ti.com
12/12
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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