1CY74FCT16444T/2 H244T Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered. CY74FCT16244T CY74FCT162244T CY74FCT162H244T 16-Bit Buffers/Line Drivers SCCS028B - December 1987 - Revised September 2001 Features Functional Description • Ioff supports partial-power-down mode operation • Edge-rate control circuitry for significantly improved noise characteristics • Typical output skew < 250 ps • ESD > 2000V • TSSOP (19.6-mil pitch) and SSOP (25-mil pitch) packages • Industrial temperature range of –40˚C to +85˚C • VCC = 5V ± 10% CY74FCT16244T Features: • 64 mA sink current, 32 mA source current • Typical VOLP (ground bounce) <1.0V at VCC = 5V, TA = 25˚C CY74FCT162244T Features: • Balanced output drivers: 24 mA • Reduced system switching noise • Typical VOLP (ground bounce) <0.6V at VCC = 5V, TA= 25˚C CY74FCT162H244T Features: • Bus hold on data inputs • Eliminates the need for external pull-up or pull-down resistors These 16-bit buffers/line drivers are designed for use in memory driver, clock driver, or other bus interface applications, where high-speed and low power are required. With flow-through pinout and small shrink packaging board layout is simplified. The three-state controls are designed to allow 4-bit, 8-bit or combined 16-bit operation. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The CY74FCT16244T is ideally suited for driving high-capacitance loads and low-impedance backplanes. The CY74FCT162244T has 24-mA balanced output drivers with current limiting resistors in the outputs. This reduces the need for external terminating resistors and provides for minimal undershoot and reduced ground bounce. The CY74FCT162244T is ideal for driving transmission lines. The CY74FCT162H244T is a 24-mA balanced output part that has “bus hold” on the data inputs. The device retains the input’s last state whenever the input goes to high impedance. This eliminates the need for pull-up/down resistors and prevents floating inputs. Logic Block Diagrams CY74FCT16244T, CY74FCT162244T, CY74FCT162H244T 1OE 3OE 1A1 3A1 1A2 1Y1 1Y2 3A2 Pin Configuration SSOP/TSSOP Top View 3Y1 3Y2 1OE 1 48 2OE 1Y1 2 47 1A1 1Y2 3 46 1A2 GND 4 45 GND 1Y3 1Y4 1A3 1Y3 3A3 3Y3 VCC 2Y1 2Y2 1A4 1Y4 3A4 FCT16244–1 2A2 2A3 2A4 FCT16244–2 4OE 2OE 2A1 3Y4 2Y1 4A1 2Y2 4A2 2Y3 4A3 2Y4 FCT16244–3 4A4 4Y1 4Y2 4Y3 4Y4 FCT16244–4 Copyright 5 16244T 44 162244T 6 162H244T43 42 7 1A3 8 41 2A1 1A4 VCC 9 40 2A2 GND 10 39 GND 2Y3 11 38 2A3 2Y4 37 36 2A4 3Y1 12 13 3Y2 14 35 3A2 GND 15 34 GND 3Y3 16 33 3A3 3Y4 17 32 3A4 VCC 4Y1 18 31 VCC 19 30 4A1 3A1 4Y2 20 29 4A2 GND 21 28 GND 4Y3 22 27 4A3 4Y4 23 26 4A4 4OE 24 25 3OE FCT16244–5 © 2001, Texas Instruments Incorporated CY74FCT16244T CY74FCT162244T CY74FCT162H244T Maximum Ratings [3,4] Pin Description Name (Above which the useful life may be impaired. For user guidelines, not tested.) Description OE Three-State Output Enable Inputs (Active LOW) Storage Temperature ................................. –55°C to +125°C A Data Inputs[1] Y Three-State Outputs Ambient Temperature with Power Applied............................................. –55°C to +125°C DC Input Voltage ........................................... –0.5V to +7.0V DC Output Voltage......................................... –0.5V to +7.0V [2] DC Output Current (Maximum Sink Current/Pin) ........................–60 to +120 mA Function Table Inputs Outputs OE A Y L L L L H H H X Z Power Dissipation .......................................................... 1.0W Static Discharge Voltage............................................>2001V (per MIL-STD-883, Method 3015) Ordering Range Ambient Temperature VCC – 40°C to +85°C 5V ± 10% Range Industrial Notes: 1. On CY74FCT162H244T these pins have “bus hold.” 2. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Importance. 3. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature range. 4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground. Electrical Characteristics Over the Operating Range Parameter Description VIH Input HIGH Voltage VIL Input LOW Voltage VH Input Hysteresis[6] VIK Input Clamp Diode Voltage IIH Input HIGH Current Test Conditions Min. Typ.[5] 2.0 0.8 100 VCC=Min., IIN=–18 mA Standard IIL Input LOW Current IBBH IBBL Bus Hold Sustain Current on Bus Hold Input[7] –0.7 VCC=Max., VI=VCC VCC=Max., VI=GND Bus Hold Bus Hold Overdrive Current on Bus Hold IOZH High Impedance Output Current (Three-State Output pins) IOZL IOS IOFF V mV –1.2 V ±1 µA ±100 Standard IBHHO IBHLO Unit V Bus Hold IO Max. VCC=Min. Input[7] VI=2.0V –50 VI=0.8V +50 ±1 µA ±100 µA µA TBD mA VCC=Max., VOUT=2.7V ±1 µA High Impedance Output Current (Three-State Output pins) VCC=Max., VOUT=0.5V ±1 µA Short Circuit Current[8] VCC=Max., VOUT=GND –80 –200 mA Current[8] VCC=Max., VOUT=2.5V –50 –180 mA ±1 µA Output Drive Power-Off Disable VCC=Max., VI=1.5V VCC=0V, VOUT 2 ≤4.5V[9] –140 CY74FCT16244T CY74FCT162244T CY74FCT162H244T Output Drive Characteristics for CY74FCT16244T Parameter VOH VOL Description Min. Typ.[5] VCC=Min., IOH=–3 mA 2.5 3.5 V VCC=Min., IOH=–15 mA 2.4 3.5 V VCC=Min., IOH=–32 mA 2.0 3.0 V Test Conditions Output HIGH Voltage Output LOW Voltage VCC=Min., IOL=64 mA 0.2 Max. Unit 0.55 V Output Drive Characteristics for CY74FCT162244T, CY74FCT162H244T Parameter IODL Description [8] Output LOW Current Current[8] Test Conditions Min. Typ.[5] Max. Unit VCC=5V, VIN=VIH or VIL, VOUT=1.5V 60 115 150 mA –150 mA IODH Output HIGH VCC=5V, VIN=VIH or VIL, VOUT=1.5V –60 –115 VOH Output HIGH Voltage VCC=Min., IOH=–24 mA 2.4 3.3 VOL Output LOW Voltage VCC=Min., IOL=24 mA 0.3 V 0.55 V Notes: 5. Typical values are at VCC=5.0V, TA = +25˚C ambient. 6. This parameter is specified but not tested. 7. Pins with bus hold are described in Pin Description. 8. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. 9. Tested at +25˚C. 3 CY74FCT16244T CY74FCT162244T CY74FCT162H244T Capacitance[6](TA = +25˚C, f = 1.0 MHz) Parameter Description Test Conditions Typ.[5] Max. Unit CIN Input Capacitance VIN = 0V 4.5 6.0 pF COUT Output Capacitance VOUT = 0V 5.5 8.0 pF Typ.[5] Max. Unit 5 500 µA 0.5 1.5 mA Power Supply Characteristics Parameter Description Test Conditions ICC Quiescent Power Supply Current VCC=Max. VIN≤0.2V, VIN≤VCC-0.2V ∆ICC Quiescent Power Supply Current VCC=Max. (TTL inputs HIGH) VIN=3.4V[10] ICCD Dynamic Power Supply Current[11] VCC=Max., One Input Toggling, VIN=VCC or 50% Duty Cycle, Outputs VIN=GND Open, OE=GND 60 100 µA/MHz IC Total Power Supply Current[12] VCC=Max., f1=10 MHz, 50% Duty Cycle, Outputs Open, One Bit Toggling, OE=GND VIN=VCC or VIN=GND 0.6 1.5 mA VIN=3.4V or VIN=GND 0.9 2.3 mA VIN=VCC or VIN=GND 2.4 4.5[13] mA VIN=3.4V or VIN=GND 6.4 16.5[13] mA VCC=Max., f1=2.5 MHz, 50% Duty Cycle, Outputs Open, Sixteen Bits Toggling, OE=GND Notes: 10. Per TTL driven input (VIN = 3.4V); all other inputs at VCC or GND. 11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations. 12. IC=IQUIESCENT + IINPUTS + IDYNAMIC IC = ICC+∆ICCDHNT+ICCD(f0/2 + f1N1) ICC = Quiescent Current with CMOS input levels ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V) = Duty Cycle for TTL inputs HIGH DH = Number of TTL inputs at DH NT ICCD = Dynamic Current caused by an input transition pair (HLH or LHL) = Clock frequency for registered devices, otherwise zero f0 = Input signal frequency f1 = Number of inputs changing at f1 N1 All currents are in milliamps and all frequencies are in megahertz. 13. Values for these conditions are examples of the ICC formula. These limits are specified but not tested. 4 CY74FCT16244T CY74FCT162244T CY74FCT162H244T Switching Characteristics Over the Operating Range[14] S CY74FCT16244T CY74FCT162244T Parameter Description CY74FCT16244AT CY74FCT162244AT CY74FCT162H244AT Min. Max. Min. Max. Unit Fig. No.[15] tPLH tPHL Propagation Delay Data to Output 1.5 6.5 1.5 4.8 ns 1, 3 tPZH tPZL Output Enable Time 1.5 8.0 1.5 6.2 ns 1, 7, 8 tPHZ tPLZ Output Disable Time 1.5 7.0 1.5 5.6 ns 1, 7, 8 tSK(O) Output Skew[16] 0.5 ns — 0.5 Switching Characteristics Over the Operating Range[14] (continued) CY74FCT16244CT CY74FCT162244CT CY74FCT162H244CT Parameter Description Min. Max. Unit Fig. No.[15] tPLH tPHL Propagation Delay Data to Output 1.5 4.1 ns 1, 3 tPZH tPZL Output Enable Time 1.5 5.8 ns 1, 7, 8 tPHZ tPLZ Output Disable Time 1.5 5.2 ns 1, 7, 8 tSK(O) Output Skew[16] 0.5 ns — Notes: 14. Minimum limits are specified but not tested on Propagation Delays. 15. See “Parameter Measurement Information” in the General Information section. 16. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design. 5 CY74FCT16244T CY74FCT162244T CY74FCT162H244T Ordering Information CY74FCT16244 Speed (ns) 4.1 4.8 6.5 Ordering Code Package Name Package Type CY74FCT16244CTPACT Z48 48-Lead (240-Mil) TSSOP CY74FCT16244CTPVC/PVCT O48 48-Lead (300-Mil) SSOP CY74FCT16244ATPACT Z48 48-Lead (240-Mil) TSSOP CY74FCT16244ATPVC/PVCT O48 48-Lead (300-Mil) SSOP CY74FCT16244TPACT Z48 48-Lead (240-Mil) TSSOP CY74FCT16244TPVC/PVCT O48 48-Lead (300-Mil) SSOP Operating Range Industrial Industrial Industrial Ordering Information CY74FCT162244 Speed (ns) 4.1 4.8 6.5 Ordering Code Package Name Package Type 74FCT162244CTPACT Z48 48-Lead (240-Mil) TSSOP CY74FCT162244CTPVC O48 48-Lead (300-Mil) SSOP 74FCT162244CTPVCT O48 48-Lead (300-Mil) SSOP 74FCT162244ATPACT Z48 48-Lead (240-Mil) TSSOP CY74FCT162244ATPVC O48 48-Lead (300-Mil) SSOP 74FCT162244ATPVCT O48 48-Lead (300-Mil) SSOP CY74FCT162244TPACT Z48 48-Lead (240-Mil) TSSOP CY74FCT162244TPVC/PVCT O48 48-Lead (300-Mil) SSOP Operating Range Industrial Industrial Industrial Ordering Information CY74FCT162H244 Speed (ns) Ordering Code Package Name Package Type Operating Range 4.1 74FCT162H244CTPVC/PVCT O48 48-Lead (300-Mil) SSOP Industrial 4.8 74FCT162H244ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial Document #: 38-00396-C 6 CY74FCT16244T CY74FCT162244T CY74FCT162H244T Package Diagrams 48-Lead Shrunk Small Outline Package O48 48-Lead Thin Shrunk SmallOutline Package Z48 7 PACKAGE OPTION ADDENDUM www.ti.com 24-Apr-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 74FCT162244ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162244A 74FCT162244ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162244A 74FCT162244ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162244A 74FCT162244CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162244C 74FCT162244CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162244C 74FCT162244CTPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162244C 74FCT162244ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI -40 to 85 74FCT162244ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI -40 to 85 74FCT162244TPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162244 74FCT16244ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT16244A 74FCT16244TPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT16244 74FCT162H244ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162H244A 74FCT162H244CTPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162H244C 74FCT162H244CTPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI -40 to 85 74FCT162H244ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI -40 to 85 74FCT162H244ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI -40 to 85 74FCT162H244ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI -40 to 85 74FCT162H244ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI -40 to 85 CY74FCT162244ATPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162244A CY74FCT162244CTPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162244C Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 24-Apr-2015 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CY74FCT162244ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI -40 to 85 CY74FCT162244ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI -40 to 85 CY74FCT162244TPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162244 CY74FCT162244TPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162244 CY74FCT162244TPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162244 CY74FCT16244ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT16244A CY74FCT16244ATPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT16244A CY74FCT16244CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT16244C CY74FCT16244CTPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT16244C CY74FCT16244ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI -40 to 85 CY74FCT16244ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI -40 to 85 CY74FCT16244ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI -40 to 85 CY74FCT16244ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI -40 to 85 CY74FCT16244TPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT16244 CY74FCT16244TPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT16244 CY74FCT16244TPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT16244 FCT162H244CTPVCTG4 ACTIVE SSOP DL 48 TBD Call TI Call TI -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 24-Apr-2015 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 18-Aug-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device 74FCT162244ATPACT Package Package Pins Type Drawing TSSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 74FCT162244ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 74FCT162244CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 74FCT162244CTPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 74FCT162H244ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 CY74FCT162244TPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 CY74FCT162244TPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 CY74FCT16244ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 CY74FCT16244CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 CY74FCT16244TPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 CY74FCT16244TPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 18-Aug-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74FCT162244ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0 74FCT162244ATPVCT SSOP DL 48 1000 367.0 367.0 55.0 74FCT162244CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0 74FCT162244CTPVCT SSOP DL 48 1000 367.0 367.0 55.0 74FCT162H244ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0 CY74FCT162244TPACT TSSOP DGG 48 2000 367.0 367.0 45.0 CY74FCT162244TPVCT SSOP DL 48 1000 367.0 367.0 55.0 CY74FCT16244ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0 CY74FCT16244CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0 CY74FCT16244TPACT TSSOP DGG 48 2000 367.0 367.0 45.0 CY74FCT16244TPVCT SSOP DL 48 1000 367.0 367.0 55.0 Pack Materials-Page 2 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated