Allegro CM1440-06CP 6 channel emi filter array with esd protection Datasheet

CM1440
6 Channel EMI Filter Array with ESD Protection
Features
Product Description
•
•
The CM1440 is a six channel low-pass EMI filter array
with ESD protection that reduces EMI/RFI emissions
while providing robust protection from ESD strikes.
Each EMI filter channel integrates a high quality pistyle filter (30pF-100Ω-30pF) which provides greater
than 30dB of attenuation in the 800MHz to 2.7GHz frequency range. The parts include avalanche-type ESD
diodes on every pin, which provide a very high level of
protection for sensitive electronic components that may
be subjected to electrostatic discharge (ESD). The
ESD protection diodes connected to the filter ports
safely dissipate ESD strikes of ±30kV, beyond the
maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
pins are protected for contact discharges at greater
than ±30kV.
•
•
•
•
•
•
•
Six channels of EMI filtering for data ports
Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
±30kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
±30kV ESD protection on each channel (HBM)
Greater than 35dB attenuation (typical) at 1 GHz
15-bump, 0.4mm pitch, 2.360mm x 1.053mm footprint Chip Scale Package (CSP)
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
OptiGuard™ coated for improved reliability at
assembly
Lead-free version available
Applications
•
•
•
•
•
•
This device is particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package and easy-to-use
pin assignments. In particular, the CM1440 is ideal for
EMI filtering and protecting data and control lines for
the I/O data ports, LCD display and camera interface in
mobile handsets.
LCD and Camera data lines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs or
notebook computers.
Wireless handsets
Handheld PCs/PDAs
LCD and camera modules
The CM1440 incorporates OptiGuard™ which results
in improved reliability at assembly. The CM1440 is
available in a space saving, low profile Chip Scale
Package with optional lead-free finishing. It is manufactured with a 0.40mm pitch and 0.25mm CSP solder
ball to provide up to 28% board space savings versus
competing CSP devices with 0.50mm pitch and
0.30mm CSP solder ball.
Electrical Schematic
100Ω
FILTERn*
FILTERn*
(Pins A1-A6)
(Pins C1-C6)
30pF
30pF
GND
(Pins B1-B3)
1 of 6 EMI/RFI + ESD Channels
* See Package/Pinout Diagram
for expanded pin information.
© 2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
1
CM1440
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
TOP VIEW
(Bumps Up View)
(Bumps Down View)
Orientation
Marking
(see note 2)
1
2
3
4
5
6
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
C1
C2
C3
C4
C5
C6
A
GND
N406
B
GND
B1
Orientation
Marking
C
GND
B2
B3
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
A1
A2
A3
A4
A5
A6
A1
CM1440-06CS/CP
Notes:
15 Bump CSP Package
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN(s)
NAME
DESCRIPTION
A1
FILTER1
Filter Channel 1
A2
FILTER2
Filter Channel 2
A3
FILTER3
Filter Channel 3
A4
FILTER4
Filter Channel 4
A5
FILTER5
Filter Channel 5
A6
FILTER6
Filter Channel 6
B1-B3
GND
Device Ground
C1
FILTER1
Filter Channel 1
C2
FILTER2
Filter Channel 2
C3
FILTER3
Filter Channel 3
C4
FILTER4
Filter Channel 4
C5
FILTER5
Filter Channel 5
C6
FILTER6
Filter Channel 6
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish2
Standard Finish
Pins
Package
Ordering Part
Number1
Part Marking
Ordering Part
Number1
Part Marking
15
CSP
CM1440-06CS
N406
CM1440-06CP
N406
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
11/08/05
CM1440
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
500
mW
RATING
UNITS
-40 to +85
°C
Storage Temperature Range
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1)
SYMBOL
R
PARAMETER
CONDITIONS
Resistance
MIN
TYP
MAX
UNITS
80
100
120
Ω
Total Channel Capacitance
At 2.5VDC Reverse
Bias, 1MHz, 30mVAC
48
60
72
pF
C
Capacitance C1
At 2.5VDC Reverse
Bias, 1MHz, 30mVAC
24
30
36
pF
VDIODE
Standoff Voltage
IDIODE=10μA
6.0
ILEAK
Diode Leakage Current (reverse bias)
VDIODE=+3.3V
0.1
1
μA
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
6.8
-0.8
9.0
-0.4
V
V
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883, Method
3015
b) Contact Discharge per IEC 61000-4-2 Level 4
Notes 2 and 3
CTOTAL
RDYN
fC
5.6
-1.5
V
±30
kV
±30
kV
Dynamic Resistance
Positive
Negative
2.3
0.9
Ω
Ω
60
MHz
R=100Ω, C=30pF
Cut-off Frequency
ZSOURCE=50Ω, ZLOAD=50Ω
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: These parameters are guaranteed by design and characterization.
© 2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
3
CM1440
Performance Information
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1)
Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1)
© 2005 California Micro Devices Corp. All rights reserved.
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490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
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11/08/05
CM1440
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2)
© 2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
5
CM1440
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3)
Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3)
© 2005 California Micro Devices Corp. All rights reserved.
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490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
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Fax: 408.263.7846
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11/08/05
CM1440
Performance Information (cont’d)
Capacitance (Normalized)
Typical Diode Capacitance vs. Input Voltage
DC Voltage
Figure 7. Filter Capacitance vs. Input Voltage
(normalized to capacitance at 2.5VDC and 25°C)
© 2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
7
CM1440
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.290mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Maximum Soldering Temperature for a Eutectic Device using Eutectic Solder Paste
240°C
Maximum Soldering Temperature for a Lead-free Device using Lead-free Solder Paste
260°C
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
Temperature (°C)
250
200
150
100
50
0
Figure 9. Eutectic (SnPb) Solder
Ball Reflow Profile
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 10. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
11/08/05
CM1440
Mechanical Details
CSP Mechanical Specifications
Mechanical Package Diagrams
CM1440 devices are supplied in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on CSP packaging, see the California Micro Devices CSP Package Information document.
BOTTOM VIEW
C1
C
B
Bumps
15
A
Millimeters
Nom
Inches
Max
Min
Nom
1
Max
A1
2.3150 2.3600 2.4050
0.911
A2
1.008
1.053
1.098
0.0397 0.0415 0.0432
B1
0.395
0.4000
0.405
0.0156 0.0157 0.0159
B2
0.195
0.2000
0.205
0.0076 0.0078 0.0080
B3
0.3415 0.3465 0.3515 0.0134 0.0136 0.0138
B4
0.3415 0.3465 0.3515 0.0134 0.0136 0.0138
C1
0.130
0.1800
0.230
0.0051 0.0071 0.0091
C2
0.130
0.1800
0.230
0.0051 0.0071 0.0091
D1
0.575
0.644
0.714
0.0226 0.0254 0.0281
D2
0.368
0.419
0.470
0.0145 0.0165 0.0185
# per tape and
reel
2
3
4
5
6
D1
D2
0.25 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
0.0929 0.0947
A2
Custom CSP
C2
Package
Min
B2
B1
B4
B3
PACKAGE DIMENSIONS
Dim
OptiGuardTM
Coating
A1
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1440 Chip Scale Package
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1440
2.36 X 1.053X 0.644
2.62 X 1.12X 0.76
8mm
178mm (7")
3500
4mm
4mm
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Po
Top
Cover
Tape
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
Ao
W
Bo
Ko
For Tape Feeder Reference
Only including Draft.
Concentric Around B.
Embossment
Center Lines
of Cavity
P1
User Direction of Feed
Figure 11. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
9
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