Material Content Data Sheet Sales Product Name BSC080N03LS G MA# MA001321316 Package PG-TDSON-8-5 Issued 5. February 2015 Weight* 118.64 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal non noble metal inorganic material non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper copper carbon black epoxy resin silicondioxide tin silver silver tin lead iron phosphorus copper iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7439-89-6 7723-14-0 7440-50-8 7439-89-6 7723-14-0 7440-50-8 0.804 0.68 0.038 0.03 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.68 6776 6776 319 0.011 0.01 37.762 31.84 31.88 318299 96 318714 0.059 0.05 0.05 497 497 0.087 0.07 735 6.188 5.22 37.304 31.44 36.73 314443 367340 1.452 1.22 1.22 12236 12236 0.166 0.14 0.14 1395 1395 0.028 0.02 0.022 0.02 1.060 0.89 0.011 0.01 0.003 0.00 11.320 9.54 0.022 0.02 0.007 0.01 22.292 18.79 52162 234 187 0.93 8936 29 9.55 95418 2. 3. 56 18.82 187898 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 95543 188 Important Remarks: 1. 9357 96 188142 1000000