HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75 Red, Green, and Blue 5mm Standard Oval LEDs Data Sheet Description Features These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. The package epoxy contains UV inhibitor to reduce the effects of long term exposure to direct sunlight. Applications Full Color Signs CAUTION InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Avago Technologies -1- Well defined spatial radiation pattern High brightness material Available in red, green and blue color — Red AlInGaP 626 nm — Green InGaN 530 nm — Blue InGaN 470 nm Superior resistance to moisture Standoff and non-standoff Package Tinted and diffused Typical viewing angle 40° × 100° HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75 Data Sheet Package Dimensions Package Dimensions Package Drawing A 1.02 MAX. 0.040 MEASURED AT BASE OF LENS. 3.80 0.150 0.50 ±0.10 SQ. TYP. 0.020 ±0.004 0.70 MAX. 0.028 5.20 0.204 CATHODE LEAD 7.00 0.275 25.00 MIN. 0.984 1.00 MIN. 0.039 2.54 0.10 Package Drawing B 10.80 ± 0.50 0.425 ± 0.020 1.30 ± 0.20 0.051 ± 0.008 0.50 ± 0.10 SQ TYP. 0.020 ± 0.004 MEASURED AT BASE OF LENS. 3.80 ± 0.20 0.150 ± 0.008 0.70 MAX. Refer to Note 1 0.028 5.20 ± 0.20 0.205 ± 0.008 CATHODE LEAD 7.00 ± 0.20 0.276 ± 0.008 24.00 MIN. 0.945 1.02 MAX. 0.040 NOTE 1. 2. This dimension does not apply to the Red LED. All dimensions are in millimeters (inches). Avago Technologies -2- 1.00 MIN. 0.039 2.54 ± 0.30 0.10 ± 0.012 HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75 Data Sheet Device Selection Guide Device Selection Guide Part Number Luminous Intensity Iv (mcd) at 20 mAb,c,d Color and Dominant Wavelength d (nm) Typa Min Standoff Typical Viewing Angle (°)e Package Drawing Max HLMP-HG74-XY0DD Red 626 1660 2400 No HLMP-HG75-XY0DD Red 626 1660 2400 Yes B HLMP-HM74-34BDD Green 530 4200 6050 No A HLMP-HM75-34BDD Green 530 4200 6050 Yes B HLMP-HM74-34CDD Green 530 4200 6050 No A HLMP-HM75-34CDD Green 530 4200 6050 Yes B HLMP-HB74-UVBDD Blue 470 960 1380 No A HLMP-HB75-UVBDD Blue 470 960 1380 Yes B HLMP-HB74-UVCDD Blue 470 960 1380 No A HLMP-HB75-UVCDD Blue 470 960 1380 Yes B a. Dominant wavelength,d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. b. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. c. The optical axis is closely aligned with the package mechanical axis. d. Tolerance for each bin limit is ± 15%. e. ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. Avago Technologies -3- 40 × 100 A HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75 Data Sheet Part Numbering System Part Numbering System HLMP – H x xx – x x x x x Packaging Option DD: Ammopack Color Bin Selection 0 : Full Distribution B : Color Bin 2 & 3 C : Color Bin 3 & 4 Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Standoff/Non Standoff 74: Non Standoff 75: Standoff Color G : Red M : Green B : Blue Package H: 5 mm Standard Oval 40° x 100° Absolute Maximum Ratings at TJ = 25 °C Parameter Red Green/Blue Unit DC Forward Currenta 50 30 mA Peak Forward Current 100b 100c mA Power Dissipation 120 114 mW 130 110 °C –40 to +100 –40 to +85 °C LED Junction Temperature Operating Temperature Range Storage Temperature Range a. Derate linearly as shown in Figure 4 and Figure 8. b. Duty Factor 30%, frequency 1 KHz. c. Duty Factor 10%, frequency 1 KHz. –40 to +100 Avago Technologies -4- °C HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75 Data Sheet Electrical/Optical Characteristics at TJ = 25 °C Electrical/Optical Characteristics at TJ = 25 °C Parameter Symbol Forward Voltage Red Green Blue VF Reverse Voltagea Red Green and Blue VR Dominant Wavelengthb Red Green Blue d Peak Wavelength Red Green Blue PEAK Thermal Resistance RJ-PIN Luminous Efficacyc Red Green Blue V Min. Typ. Max. 1.8 2.8 2.8 2.1 3.2 3.2 2.4 3.8 3.8 Units V Test Conditions IF = 20 mA V 5 5 618 523 464 IR = 100 μA IR = 10 μA 626 530 470 nm IF = 20 mA nm Peak of Wavelength of Spectral Distribution at IF = 20 mA 630 535 476 634 521 464 240 °C/W LED Junction-to-Pin lm/W Emitted Luminous Power/Emitted Radiant Power 218 538 65 a. Indicates product final testing condition. Long term reverse bias is not recommended. b. The dominant wavelength is derived from the chromaticity diagram and represents the color of the lamp. c. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/V where IV is the luminous intensity in candelas and V is the luminous efficacy in lumens/watt. Avago Technologies -5- HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75 Data Sheet AlInGaP Red AlInGaP Red Figure 2 Forward Current vs. Forward Voltage 1 100 0.8 80 FORWARD CURRENT - mA RELATIVE INTENSITY Figure 1 Relative Intensity vs. Wavelength 0.6 0.4 0.2 0 550 600 650 WAVELENGTH - nm 0 20 40 60 DC FORWARD CURRENT-mA 20 0 1 2 FORWARD VOLTAGE - V 3 Figure 4 Maximum Forward Current vs. Ambient Temperature IF MAX - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 40 0 700 Figure 3 Relative Intensity vs. Forward Current 60 80 60 50 40 30 20 10 0 0 100 Avago Technologies -6- 20 40 60 80 TA - AMBIENT TEMPERATURE - °C 100 HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75 Data Sheet InGaN Green and Blue InGaN Green and Blue 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 Figure 6 Forward Current vs. Forward Voltage 100 BLUE FORWARD CURRENT - mA RELATIVE INTENSITY Figure 5 Relative Intensity vs. Wavelength GREEN 430 480 530 WAVELENGTH - nm 580 40 20 0 630 Figure 7 Relative Intensity vs. Forward Current 2 3 FORWARD VOLTAGE - V 4 5 35 IF - MAXIMUM FORWARD CURRENT - mA 3.0 Green 2.5 2.0 Blue 1.5 1.0 0.5 0.0 0 20 40 60 80 FORWARD CURRENT-mA 100 6 4 2 0 Blue -2 -4 Green -6 -8 20 40 60 80 FORWARD CURRENT-mA 100 30 25 20 15 10 5 0 120 Figure 9 Relative Dominant Wavelength vs. Forward Current 0 1 Figure 8 Maximum Forward Current vs. Ambient Temperature 3.5 RELATIVE INTENSITY (NORMALIZED AT 20mA) 60 0 380 RELATIVE DOMINANT WAVELENGTH-nm 80 120 Avago Technologies -7- 0 20 40 60 80 TA - AMBIENT TEMPERATURE - °C 100 HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75 Data Sheet InGaN Green and Blue Figure 11 Radiation Pattern – Minor Axis 1.0 1.0 0.8 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY Figure 10 Radiation Pattern – Major Axis 0.6 0.4 Red Green Blue 0.2 0.0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT (°) 60 0.4 0.2 -60 -30 0 30 ANGULAR DISPLACEMENT (°) 60 90 Figure 13 Forward Voltage Shift vs. Junction Temperature 0.5 10 Green Red Blue Green Red Blue 0.4 FORWARD VOLTAGE SHIFT-V RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25°C) 0.6 0.0 -90 90 Figure 12 Relative Light Output vs. Junction Temperature Red Green Blue 1 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 0.1 -0.4 -40 -20 0 20 40 60 80 100 TJ -JUNCTION TEMPERATURE 120 140 -40 Avago Technologies -8- -20 0 20 40 60 80 100 TJ -JUNCTION TEMPERATURE 120 140 HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75 Data Sheet Intensity Bin Limit Table (1.2: 1 lv Bin Ratio) Intensity Bin Limit Table (1.2: 1 lv Bin Ratio) Green Color Bin Table Bin Min Dom Max Dom 2 523 527 Intensity (mcd) at 20 mA Bin Min Max U 960 1150 V 1150 1380 W 1380 1660 X 1660 1990 Y 1990 2400 Z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040 4 5040 6050 3 4 Bin Min Dom Max Dom 2 464 468 3 Max VD 1.8 2.0 VA 2.0 2.2 VB 2.2 2.4 4 NOTE Tolerance for each bin limit is ±0.05V. VF binning only applicable to Red color. Red Color Range Min Dom Max Dom 630.0 0.1450 0.1711 0.1305 y 0.8316 0.7319 0.7218 0.8189 x 0.1305 0.1711 0.1967 0.1625 y 0.8189 0.7218 0.7077 0.8012 x 0.1625 0.1967 0.2210 0.1929 y 0.8012 0.7077 0.6920 0.7816 468 472 472 476 Chromaticity Coordinate x 0.1374 0.1766 0.1699 0.1291 y 0.0374 0.0966 0.1062 0.0495 x 0.1291 0.1699 0.1616 0.1187 y 0.0495 0.1062 0.1209 0.0671 x 0.1187 0.1616 0.1517 0.1063 y 0.0671 0.1209 0.1423 0.0945 Tolerance for each bin limit is ± 0.5 nm. NOTE 618.0 535 0.0979 Blue Color Bin Table VF Bin Table (V at 20mA) Min 531 531 x Tolerance for each bin limit is ± 0.5 nm. Tolerance for each bin limit is ± 15 %. Bin ID 527 Chromaticity Coordinate x 0.6872 0.6690 0.6890 0.7080 y 0.3126 0.3149 0.2943 0.2920 Tolerance for each bin limit is ± 0.5 nm. Avago Technologies -9- All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information. HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75 Data Sheet Avago Color Bin on CIE 1931 Chromaticity Diagram Avago Color Bin on CIE 1931 Chromaticity Diagram soldering iron tip closer than 1.59 mm might damage the LED. 1.59 mm 1.000 0.800 Green 2 3 4 Y 0.600 0.400 ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Refer to Avago application note AN 1142 for details. The soldering iron used should have a grounded tip to ensure that electrostatic charge is properly grounded. Recommended soldering condition follows. 0.200 Blue 4 3 2 0.000 0.000 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.800 X Pre-heat temperature 105 °C Max. — Preheat time 60 s Max — Peak temperature 260 °C Max. 260 °C Max. Dwell time 5 s Max. 5 s Max a. The above conditions refer to measurement with a thermocouple mounted at the bottom of PCB. b. It is recommended to use only bottom preheaters to reduce thermal stress experienced by the LED. Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. The customer is advised to perform a daily check on the soldering profile to ensure that it always conforms to the recommended soldering conditions. Precautions Lead Forming The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on the PC board. For better control, it is recommended to use the proper tool to precisely form and cut the leads to applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground that prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. NOTE 1. 2. Soldering and Handling Manual Solder Dipping Wave Solderinga, b Red Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. The LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances, such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using Avago Technologies - 10 - PCBs with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if the same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. Avago Technologies’ high brightness LEDs use a high efficiency LED die with single wire bond as shown on the next page. The customer is advised to take extra precautions during wave soldering to ensure that the maximum wave temperature does not exceed 260 °C and the solder contact time does not exceed 5 s. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75 Data Sheet Avago Technologies LED Configuration Avago Technologies LED Configuration The recommended PC board plated through holes (PTH) size for LED component leads follows. LED component lead size CATHODE ANODE 0.636 mm (0.025 in.) 0.98 mm to 1.08 mm (0.039 in. to 0.043 in.) 0.50 mm × 0.50 mm (0.020 in. × 0.020 in.) 0.707 mm (0.028 in.) 1.05 mm to 1.15 mm (0.041 in. to 0.045 in.) AlInGaP Device Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on the LED. Non-metal material is recommended because it will absorb less heat during wave soldering process. At elevated temperatures, the LED is more susceptible to mechanical stress. Therefore, the PCB must allowed to cool down to room temperature prior to handling, which includes removal of the alignment fixture or pallet. If the PCB board contains both through hole (TH) LEDs and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount must be on the bottom side, these components should be soldered using reflow soldering prior to insertion of the TH LED. Plated through hole diameter 0.45 mm × 0.45 mm (0.018 in. × 0.018 in.) InGaN Device Diagonal Over-sizing the PTH can lead to a twisted LED after clinching. On the other hand under-sizing the PTH can cause difficulty when inserting the TH LED. Refer to application note AN4334 for more information about soldering and handling of high brightness TH LED lamps. Application Precautions 1. The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance. 2. LEDs exhibit slightly different characteristics at different drive currents that might result in larger performance variation (i.e., intensity, wavelength, and forward voltage). The user is recommended to set the application current as close as possible to the test current to minimize these variations. 3. The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, it is crucial to ensure that the reverse bias voltage does not exceed the allowable limit of the LED. Avago Technologies - 11 - HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75 Data Sheet Example of Wave Soldering Temperature Profile for TH LED Example of Wave Soldering Temperature Profile for TH LED 260° C Max TEMPERATURE (° C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255° C ± 5° C (maximum peak temperature = 260° C) 105° C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5 sec) 60 sec Max Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (sec) Ammo Packs Drawing 6.35 ±1.30 0.25 ±0.0512 12.70 ±1.00 0.50 ±0.0394 CATHODE 20.50 ±1.00 0.8071 ±0.0394 9.125 ±0.625 0.3593 ±0.0246 18.00 ±0.50 0.7087 ±0.0197 12.70 ±0.30 0.50 ±0.0118 NOTE A 0.70 ±0.20 0.0276 ±0.0079 A VIEW A-A All dimensions in millimeters (inches). Avago Technologies - 12 - Ø 4.00 ±0.20 TYP 0.1575 ±0.008 HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75 Data Sheet Packaging Box for Ammo Packs Packaging Box for Ammo Packs FROM LEFT SIDE OF BOX ADHESIVE TAPE MUST BE FACING UPWARDS. LABEL ON THIS SIDE OF BOX + ANODE LEAD LEAVES THE BOX FIRST. NOTE – For the InGaN device, the ammo pack packaging box contains the ESD logo. Avago Technologies - 13 - HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75 Data Sheet Packaging Label Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 260C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Avago Technologies - 14 - Acronyms and Definition Example: BIN: (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR (ii) Color bin incorporated with VF Bin (i) Color bin only or VF bin only — BIN: 2 (represent color bin 2 only) — BIN: VB (represent VF bin “VB” only) (ii) Color bin incorporate with VF Bin — BIN: 2VB, where: 2 is color bin 2 only VB is VF bin "VB" (Applicable for part number that have both color bin and VF bin) DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago Technologies and the A logo are trademarks of Avago Technologies in the United States and other countries. All other brand and product names may be trademarks of their respective companies. Data subject to change. Copyright © 2012–2016 Avago Technologies. All Rights Reserved. AV02-2725EN – June 20, 2016